EP1548150A4 - Plasma processing system and its substrate processing process, plasma enhanced chemical vapor deposition system and its film deposition process - Google Patents
Plasma processing system and its substrate processing process, plasma enhanced chemical vapor deposition system and its film deposition processInfo
- Publication number
- EP1548150A4 EP1548150A4 EP03748631A EP03748631A EP1548150A4 EP 1548150 A4 EP1548150 A4 EP 1548150A4 EP 03748631 A EP03748631 A EP 03748631A EP 03748631 A EP03748631 A EP 03748631A EP 1548150 A4 EP1548150 A4 EP 1548150A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- plasma
- chemical vapor
- enhanced chemical
- vapor deposition
- substrate processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
- H01J37/32183—Matching circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32541—Shape
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002288997 | 2002-10-01 | ||
JP2002288997A JP3872741B2 (en) | 2002-10-01 | 2002-10-01 | Plasma chemical vapor deposition equipment |
PCT/JP2003/012563 WO2004031442A1 (en) | 2002-10-01 | 2003-10-01 | Plasma processing system and its substrate processing process, plasma enhanced chemical vapor deposition system and its film deposition process |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1548150A1 EP1548150A1 (en) | 2005-06-29 |
EP1548150A4 true EP1548150A4 (en) | 2012-05-30 |
Family
ID=32063702
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03748631A Withdrawn EP1548150A4 (en) | 2002-10-01 | 2003-10-01 | Plasma processing system and its substrate processing process, plasma enhanced chemical vapor deposition system and its film deposition process |
Country Status (4)
Country | Link |
---|---|
US (1) | US20050223990A1 (en) |
EP (1) | EP1548150A4 (en) |
JP (1) | JP3872741B2 (en) |
WO (1) | WO2004031442A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7205034B2 (en) * | 2002-10-29 | 2007-04-17 | Mitsubishi Heavy Industries, Ltd. | Method and device for generating uniform high-frequency plasma over large surface area used for plasma chemical vapor deposition apparatus |
JP4088616B2 (en) * | 2004-08-30 | 2008-05-21 | 三菱重工業株式会社 | Plasma CVD apparatus, substrate processing system, and film forming / self-cleaning method |
JP4884793B2 (en) * | 2006-02-09 | 2012-02-29 | 三菱重工業株式会社 | Thin film manufacturing apparatus and solar cell manufacturing method |
JP4817923B2 (en) * | 2006-03-29 | 2011-11-16 | 三井造船株式会社 | Plasma generating apparatus and plasma generating method |
JP5039476B2 (en) * | 2007-08-09 | 2012-10-03 | 三菱重工業株式会社 | Vacuum processing apparatus and method for adjusting vacuum processing apparatus |
DE102009014414A1 (en) | 2008-10-29 | 2010-05-12 | Leybold Optics Gmbh | VHF electrode assembly, apparatus and method |
JP2013004172A (en) * | 2011-06-10 | 2013-01-07 | Tokyo Electron Ltd | High-frequency power distribution device, and substrate processing device using the same |
HUP1100436A2 (en) * | 2011-08-15 | 2013-02-28 | Ecosolifer Ag | Gas flow system for using in reaction chamber |
CN103943449B (en) * | 2013-06-28 | 2016-08-17 | 厦门天马微电子有限公司 | The measuring method of a kind of radio frequency cross talk, equipment and system |
CN110029328B (en) * | 2019-05-22 | 2024-06-18 | 上海稷以科技有限公司 | Box-type electrode for improving deposition uniformity of front and back planes |
KR102593141B1 (en) * | 2020-11-05 | 2023-10-25 | 세메스 주식회사 | Apparatus for treating substrate and method for treating apparatus |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0955665A2 (en) * | 1998-04-28 | 1999-11-10 | Mitsubishi Heavy Industries, Ltd. | Plasma chemical vapor deposition apparatus |
EP1107653A1 (en) * | 1999-06-17 | 2001-06-13 | Mitsubishi Heavy Industries, Ltd. | Discharge electrode, high-frequency plasma generator, method of power feeding, and method of manufacturing semiconductor device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2816365B2 (en) * | 1990-09-19 | 1998-10-27 | 株式会社 ユーハ味覚糖精密工学研究所 | Strain-free precision processing equipment by radical reaction |
JP3697110B2 (en) * | 1998-05-29 | 2005-09-21 | 三菱重工業株式会社 | Plasma chemical vapor deposition equipment |
JP4286404B2 (en) * | 1999-10-15 | 2009-07-01 | 東京エレクトロン株式会社 | Matching device and plasma processing apparatus |
TW507256B (en) * | 2000-03-13 | 2002-10-21 | Mitsubishi Heavy Ind Ltd | Discharge plasma generating method, discharge plasma generating apparatus, semiconductor device fabrication method, and semiconductor device fabrication apparatus |
JP3377773B2 (en) * | 2000-03-24 | 2003-02-17 | 三菱重工業株式会社 | Power supply method to discharge electrode, high-frequency plasma generation method, and semiconductor manufacturing method |
JP3418590B2 (en) * | 2000-05-17 | 2003-06-23 | 日本高周波株式会社 | Uniform electric field distribution type plasma processing system |
-
2002
- 2002-10-01 JP JP2002288997A patent/JP3872741B2/en not_active Expired - Fee Related
-
2003
- 2003-10-01 WO PCT/JP2003/012563 patent/WO2004031442A1/en active Application Filing
- 2003-10-01 US US10/519,475 patent/US20050223990A1/en not_active Abandoned
- 2003-10-01 EP EP03748631A patent/EP1548150A4/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0955665A2 (en) * | 1998-04-28 | 1999-11-10 | Mitsubishi Heavy Industries, Ltd. | Plasma chemical vapor deposition apparatus |
EP1107653A1 (en) * | 1999-06-17 | 2001-06-13 | Mitsubishi Heavy Industries, Ltd. | Discharge electrode, high-frequency plasma generator, method of power feeding, and method of manufacturing semiconductor device |
Non-Patent Citations (1)
Title |
---|
See also references of WO2004031442A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP2004124153A (en) | 2004-04-22 |
JP3872741B2 (en) | 2007-01-24 |
EP1548150A1 (en) | 2005-06-29 |
WO2004031442A1 (en) | 2004-04-15 |
US20050223990A1 (en) | 2005-10-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20050121 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): CH DE GB LI |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20120503 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 21/205 20060101ALI20120425BHEP Ipc: H01J 37/32 20060101ALI20120425BHEP Ipc: H05H 1/46 20060101ALI20120425BHEP Ipc: C23C 16/509 20060101AFI20120425BHEP Ipc: B01J 19/08 20060101ALI20120425BHEP |
|
17Q | First examination report despatched |
Effective date: 20121004 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20130215 |