EP1529297A1 - Micromechanical switch - Google Patents
Micromechanical switchInfo
- Publication number
- EP1529297A1 EP1529297A1 EP03709654A EP03709654A EP1529297A1 EP 1529297 A1 EP1529297 A1 EP 1529297A1 EP 03709654 A EP03709654 A EP 03709654A EP 03709654 A EP03709654 A EP 03709654A EP 1529297 A1 EP1529297 A1 EP 1529297A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- spring element
- mass
- contact
- spring
- deflection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H35/00—Switches operated by change of a physical condition
- H01H35/14—Switches operated by change of acceleration, e.g. by shock or vibration, inertia switch
Definitions
- the invention is based on a micromechanical switch according to the preamble of the main claim.
- Micromechanical switches are generally known, a mass being held elastically by a spring element. When a force acts, for example an acceleration force, the mass is moved and the spring element is thus deflected.
- the micromechanical switch according to the invention also has the advantage of bringing about miniaturization compared to known switches and of suppressing switch bounces. The smaller implementation enables considerable cost savings. Furthermore, it is to be regarded as an advantage that, in the micromechanical switch according to the invention, there is a saving in the evaluation electronics compared to an expanded acceleration sensor system. Furthermore, the micromechanical switch according to the invention can advantageously be operated without a voltage supply, so that it actually only functions as a switch element. Advantageous further developments and improvements of the micromechanical switch specified in the main claim are possible through the measures listed in the subclaims.
- the at least one contact element is provided to be movable and connected to a second spring element.
- the switch bounce is effectively reduced because a certain contact pressure of the contact element against the mass is brought about by the second spring element.
- the spring constant of the second spring element is provided to be significantly smaller than the spring constant of the first spring element.
- a third spring element is provided, which has a stabilizing effect on the movement of the mass. This makes it advantageously possible to
- the spring constant of the third spring element is provided to be significantly smaller than the spring constant of the first spring element. This makes it possible that the movement of the mass is not significantly changed by the third spring element and the movement of the mass is essentially predetermined by the second spring element.
- Figure 1 shows a micromechanical switch according to the invention in plan view
- FIG. 2 shows the micromechanical switch according to the invention in a sectional illustration along a section line AA from FIG. 1.
- the micromechanical switch according to the invention is shown in FIG.
- the micromechanical switch comprises a movable mass 1, which is provided in particular as a seismic mass 1.
- the micromechanical switch which is also referred to below as an acceleration switch, comprises a spring element 2, which is referred to below as the first spring element 2.
- the mass 1 is connected to the first spring element 2.
- the mass 1 is also provided movably, the first spring element 2 being deflected when the mass 1 moves. Due to the deflection of the first spring element 2, a restoring force is exerted on the mass 1 by the first spring element 2.
- the mass 1 is only provided such that it can move in a linear direction of movement. This direction of movement is provided in FIG. 1 along the section line AA.
- the mass 1 is provided such that it is provided such that it can move in several directions of movement.
- a third spring element 4 is also provided, which stabilizes the movement of the mass 1.
- the first spring element 2 is provided on the one side of the mass 1 along the direction of movement of the mass 1 and that the third spring element 4 is provided opposite the first spring element 2 along the direction of movement of the mass 1.
- the first spring element 2 and the third spring element 4 comprise, in particular, U-spring elements, which can be produced micromechanically as standard.
- the micromechanical switch comprises at least one contact element 3, which according to the invention is provided in particular connected to a second spring element 30.
- the contact element 3 is provided in particular as a contact mass and, in an advantageous embodiment, is connected in one piece to the second spring element 30.
- the arrangement of the micromechanical switch according to the invention is provided such that the mass 1 can be moved a first distance along its direction of movement, during which the first spring element 2 is deflected to a certain predetermined degree. At this predetermined degree of deflection of the first spring element 2, the mass 1 touches the contact element 3 or the contact mass.
- the mass 1 and the first spring element 2 are provided such that movement of the mass 1 beyond the predetermined degree of deflection of the first spring element 2 is also possible.
- the first spring element 1 is deflected even further than the predetermined degree of deflection and the contact between the mass 1 and the contact element 3 remains during this movement component.
- it is provided in particular to connect the contact element 3 to a second spring element 30, so that during the movement of the mass 1 in contact with the contact element 3, in addition to the deflection of the first spring element 2, the second spring element is also deflected beyond the predetermined degree of its deflection 30 is provided, whereby the contact element 3 is pressed against the mass 1 in particular.
- the micromechanical switch has stops 7 which prevent the mass 1 from carrying out an excessive movement in the direction of movement.
- the stop 7 thus prevents the first spring element 2 from being deflected beyond a predetermined maximum degree of deflection.
- the predetermined maximum degree of deflection of the first spring element 2 is provided above the predetermined degree of deflection of the first spring element 2, at which the first contact between the contact element 3 and the mass 1 takes place.
- the micromechanical switch also has an example
- the invention micromechanical switch also a second bond pad 5a and a conductor pad 6a, which serves to contact the second bond pad 5a with the suspensions of the first spring element 2.
- the micromechanical switch also has a third bond pad 5b and a third conductor pad 6b, which is used to contact the third bond pad 5b with the suspension of a further contact element 3b.
- the further contact element 3b and its contacting devices are optionally provided.
- the micromechanical switch according to the invention it is essential for the function of the micromechanical switch according to the invention as a switch that at least two contacts are available by means of at least two bond pads 5, 5a, 5b and corresponding conductor tracks 6, 6a, 6b, which when the mass 1 is moved accordingly such that the first Spring element 2 is deflected beyond the predetermined degree of deflection, are in electrical contact with each other with low resistance.
- Contact element 3 takes place via mass 1 to the further contact element 3 b and to the third conductor track 6b and the third bond pad 5b, or else two switches are implemented simultaneously by providing both the first contact element 3 and the further contact element 3b and the seismic mass 1 are electrically connected via the second bond pad 5a and the second conductor track 6a.
- these springs or spring elements 2, 30, 4 can be adapted to the requirements as linear or non-linear springs become.
- the mass 1 is accelerated in the direction of the first spring element 2.
- the stabilizing spring 4 or also the third spring element 4 is used in this case in the example shown in FIG. 1 and should be chosen so that it only insignificantly hinders the movement of the mass 1.
- the spring constant of the third spring element 4 is provided to be significantly smaller than the spring constant of the first spring element 2. From a defined position of the mass 1, the mass 1 strikes the contact element 3 or the contact element 3b, so that the switch is closed, ie that contact is established between the electrical connections of the contact element 3, 3 b and the mass 1 or between the electrical connections of the contact element 3 and the further contact element 3 b and optionally additionally the mass 1 is closed.
- This defined position of the mass 1 corresponds to a predetermined degree of deflection of the first spring element 2, where contact of the mass with the at least one contact element 3 is provided.
- this predetermined degree of deflection of the first spring element 2 corresponds to a defined force effect on the mass 1, which is caused, for example, by a defined acceleration of the entire micromechanical switch in such a way that the mass 1 in the direction of the contact element 3 up to the predetermined degree of deflection of the first Spring element 2 is deflected.
- the contact elements 3, 3b With a greater deflection or a greater acceleration to the mass 1, the contact elements 3, 3b remain connected to the mass 1.
- the second spring element 30 presses the contact element 3 against the mass 1. This effectively prevents the switch from bouncing.
- the second spring element 30 of the contact element 3 should slow down the movement of the mass 1 only insignificantly, ie the switch or the mass is nevertheless contact of the mass 1 with the contact element 3 further in motion against the restoring force of the first spring element 2.
- This is particularly advantageous according to the invention ensures that the spring constant of the second spring element 30 is provided to be significantly smaller than the spring constant of the first spring element 2.
- the force curve does not become linear due to the contact of the mass 1 with the contact elements 2.
- the mass 1 remains in motion as long as sufficient acceleration is applied to the system of the micromechanical switch or the mass 1 strikes the stop 7 when the acceleration is too great.
- the second spring element 30 of the contact element 3 serves here, on the one hand, as a protection against bouncing and, on the other hand, serves to extend the switching time of the acceleration switch, since in the event of a decreasing external acceleration and a reverse movement of the mass 1 towards smaller deflections of the first spring element 2, the contact remains closed until the second spring element 30 of the contact element 3 is completely relaxed.
- This has the advantage that reliable detection by the acceleration switch is possible, in particular because of the longer switching time.
- This behavior according to the invention of the micromechanical switch and the movement of the mass in spite of a closed circuit, ie the movement of the mass 1 when the first spring element 2 is deflected above the predetermined degree of deflection, can be interpreted as a “moving switch”.
- FIG. 2 shows a sectional illustration of the micromechanical switch according to the invention along the section line AA from FIG. 1.
- the illustration in FIG. 1 is slightly enlarged and somewhat distorted compared to the illustration in FIG. 1.
- Figure 2 as in Figure 1, the mass 1 and the first spring element 2 is shown.
- the third in FIG. 2 is on the side of the first spring element 2 opposite the mass 1
- FIG. 2 shows the suspension 2a of the first spring element 2, which is electrically connected to the second bond pad 5a by means of the second conductor track 6a.
- the frame 8 of the micromechanical switch can also be seen in FIG.
- the entire micromechanical switch is provided on a substrate 10 and the moving parts of the micromechanical switch, i. H. in particular the mass 1 and the spring elements 2, 30, 3, 4 are covered by a cover 9.
- the cover 9 is not shown in Figure 1.
- the substrate 10 is provided in particular as a semiconductor substrate, for example a silicon substrate.
- switches are also provided in particular in semiconductor material, for example silicon.
- semiconductor material for example silicon
- other materials can also be provided according to the invention, in particular [please add further alternatives here].
- Spring element 30 or generally all elements which serve to conduct electricity when the switch is made contact.
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Micromachines (AREA)
- Switches Operated By Changes In Physical Conditions (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10235369A DE10235369A1 (en) | 2002-08-02 | 2002-08-02 | Micromechanical switch for acceleration sensor system, has spring element for inertia mass deflected by acceleration force to allow inertia mass to contact contact element |
DE10235369 | 2002-08-02 | ||
PCT/DE2003/000592 WO2004019357A1 (en) | 2002-08-02 | 2003-02-25 | Micromechanical switch |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1529297A1 true EP1529297A1 (en) | 2005-05-11 |
EP1529297B1 EP1529297B1 (en) | 2011-05-18 |
Family
ID=30469359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03709654A Expired - Lifetime EP1529297B1 (en) | 2002-08-02 | 2003-02-25 | Micromechanical switch |
Country Status (5)
Country | Link |
---|---|
US (1) | US7081592B2 (en) |
EP (1) | EP1529297B1 (en) |
JP (1) | JP4327722B2 (en) |
DE (1) | DE10235369A1 (en) |
WO (1) | WO2004019357A1 (en) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8775997B2 (en) | 2003-09-15 | 2014-07-08 | Nvidia Corporation | System and method for testing and configuring semiconductor functional circuits |
US8732644B1 (en) | 2003-09-15 | 2014-05-20 | Nvidia Corporation | Micro electro mechanical switch system and method for testing and configuring semiconductor functional circuits |
US8872833B2 (en) | 2003-09-15 | 2014-10-28 | Nvidia Corporation | Integrated circuit configuration system and method |
US6880940B1 (en) * | 2003-11-10 | 2005-04-19 | Honda Motor Co., Ltd. | Magnesium mirror base with countermeasures for galvanic corrosion |
US8711161B1 (en) | 2003-12-18 | 2014-04-29 | Nvidia Corporation | Functional component compensation reconfiguration system and method |
DE102004040886A1 (en) * | 2004-08-24 | 2006-03-02 | Volkswagen Ag | Operating device for a motor vehicle |
US8723231B1 (en) * | 2004-09-15 | 2014-05-13 | Nvidia Corporation | Semiconductor die micro electro-mechanical switch management system and method |
US8711156B1 (en) | 2004-09-30 | 2014-04-29 | Nvidia Corporation | Method and system for remapping processing elements in a pipeline of a graphics processing unit |
US8021193B1 (en) | 2005-04-25 | 2011-09-20 | Nvidia Corporation | Controlled impedance display adapter |
US7793029B1 (en) | 2005-05-17 | 2010-09-07 | Nvidia Corporation | Translation device apparatus for configuring printed circuit board connectors |
US8417838B2 (en) | 2005-12-12 | 2013-04-09 | Nvidia Corporation | System and method for configurable digital communication |
US8412872B1 (en) | 2005-12-12 | 2013-04-02 | Nvidia Corporation | Configurable GPU and method for graphics processing using a configurable GPU |
US7716816B2 (en) * | 2006-09-22 | 2010-05-18 | Rockwell Automation Technologies, Inc. | Method of manufacturing a switch assembly |
US8724483B2 (en) | 2007-10-22 | 2014-05-13 | Nvidia Corporation | Loopback configuration for bi-directional interfaces |
FR2950194B1 (en) * | 2009-09-11 | 2011-09-02 | Commissariat Energie Atomique | ELECTROMECHANICAL ACTUATOR WITH INTERDIGITED ELECTRODES |
US9331869B2 (en) | 2010-03-04 | 2016-05-03 | Nvidia Corporation | Input/output request packet handling techniques by a device specific kernel mode driver |
GB2521990A (en) * | 2013-03-22 | 2015-07-15 | Schrader Electronics Ltd | A microelectromechanical switch and related fabrication method |
DE102022200336A1 (en) * | 2022-01-13 | 2023-07-13 | Robert Bosch Gesellschaft mit beschränkter Haftung | Contact element of a MEMS relay |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6295870B1 (en) * | 1991-02-08 | 2001-10-02 | Alliedsignal Inc. | Triaxial angular rate and acceleration sensor |
US5712609A (en) * | 1994-06-10 | 1998-01-27 | Case Western Reserve University | Micromechanical memory sensor |
US5992233A (en) * | 1996-05-31 | 1999-11-30 | The Regents Of The University Of California | Micromachined Z-axis vibratory rate gyroscope |
US5828138A (en) * | 1996-12-02 | 1998-10-27 | Trw Inc. | Acceleration switch |
JP2000065855A (en) | 1998-08-17 | 2000-03-03 | Mitsubishi Electric Corp | Semiconductor acceleration switch and manufacture thereof |
US6370937B2 (en) * | 2000-03-17 | 2002-04-16 | Microsensors, Inc. | Method of canceling quadrature error in an angular rate sensor |
KR100331453B1 (en) * | 2000-07-18 | 2002-04-09 | 윤종용 | Position sensing apparatus for an electrostatic XY-stage using time-division multiplexing |
WO2002088631A2 (en) * | 2001-05-02 | 2002-11-07 | The Regents Of The University Of California | Non-resonant four degrees-of-freedom micromachined gyroscope |
US6765160B1 (en) * | 2002-08-21 | 2004-07-20 | The United States Of America As Represented By The Secetary Of The Army | Omnidirectional microscale impact switch |
AU2003302144A1 (en) * | 2002-11-15 | 2004-06-15 | The Regents Of The University Of California | Dynamically amplified dual mass mems gyroscope |
US6845670B1 (en) * | 2003-07-08 | 2005-01-25 | Freescale Semiconductor, Inc. | Single proof mass, 3 axis MEMS transducer |
US6843127B1 (en) * | 2003-07-30 | 2005-01-18 | Motorola, Inc. | Flexible vibratory micro-electromechanical device |
-
2002
- 2002-08-02 DE DE10235369A patent/DE10235369A1/en not_active Ceased
-
2003
- 2003-02-25 EP EP03709654A patent/EP1529297B1/en not_active Expired - Lifetime
- 2003-02-25 US US10/517,978 patent/US7081592B2/en not_active Expired - Fee Related
- 2003-02-25 WO PCT/DE2003/000592 patent/WO2004019357A1/en active Application Filing
- 2003-02-25 JP JP2004529671A patent/JP4327722B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
See references of WO2004019357A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2004019357A1 (en) | 2004-03-04 |
JP4327722B2 (en) | 2009-09-09 |
EP1529297B1 (en) | 2011-05-18 |
US20050173233A1 (en) | 2005-08-11 |
DE10235369A1 (en) | 2004-02-19 |
US7081592B2 (en) | 2006-07-25 |
JP2005535100A (en) | 2005-11-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1529297B1 (en) | Micromechanical switch | |
EP0050231B1 (en) | Switching component with variable resistance | |
WO2005001864A1 (en) | Pressure sensor in the form of a film | |
EP2984667A1 (en) | Device for operating multiple functions in a motor vehicle | |
DE3003764A1 (en) | KEY SWITCH AND METHOD FOR GENERATING ELECTRICAL SIGNALS | |
EP2984668A1 (en) | Device for operating multiple functions in a motor vehicle | |
DE102006043795B3 (en) | Electric microswitch | |
DE2058743A1 (en) | Electric switch | |
DE10191618B3 (en) | Pressure switch with an improved click spring | |
DE4022388A1 (en) | ACCELERATION SWITCH WITH SNAP SPRING | |
EP3301696A2 (en) | Switch unit | |
DE102012219961A1 (en) | Switch e.g. contactors for switching electrical circuits for use in e.g. electric vehicle, has contact chamber that comprises lower switch contact and upper switch contact which are made into contact by moving shaft | |
EP1360709A1 (en) | Switching contact arrangement | |
WO2005024870A2 (en) | Mechanical control elements for organic polymer electronic devices | |
DE102004029172B3 (en) | Electric control panel | |
EP1137029B1 (en) | Apparatus for proximity switching of an electrical contact and pressure measuring apparatus | |
DE102015219348B3 (en) | BUTTON FOR A CONTACT DEVICE | |
DE10304794A1 (en) | Electrically conducting, magnetic powder for electrical part for transmitting electrical signal/voltage/current between contacts contains or consists of electrically conducting and magnetic particles | |
DE102016010971A1 (en) | Input device with two-part force sensor for actuating input and method for its production | |
WO2020025374A1 (en) | Electrical component for the surface mounting, or electronic assembly having a monitoring structure | |
DE102023104181A1 (en) | Arrangement and method for status monitoring of a switch for high currents and/or high voltages | |
DD141443A1 (en) | ELECTRIC SWITCH OR SIGNALING DEVICE | |
DE10323765A1 (en) | Electrically conducting, magnetic powder for electrical part for transmitting electrical signal/voltage/current between contacts contains or consists of electrically conducting and magnetic particles | |
DE102019111952A1 (en) | Input device for a motor vehicle for recognizing a pressure input | |
DE10155860A1 (en) | Arrangement for entering and reading out data, especially tactile display, has output element(s), especially Braille element, elastic element(s) that can be deformed to input data |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20050302 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT SE SI SK TR |
|
RBV | Designated contracting states (corrected) |
Designated state(s): DE FR GB |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): DE FR GB |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D Free format text: NOT ENGLISH |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R096 Ref document number: 50313701 Country of ref document: DE Effective date: 20110630 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed |
Effective date: 20120221 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20120228 Year of fee payment: 10 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 50313701 Country of ref document: DE Effective date: 20120221 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20120222 Year of fee payment: 10 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20130225 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST Effective date: 20131031 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20130225 Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20130228 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20140417 Year of fee payment: 12 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R119 Ref document number: 50313701 Country of ref document: DE |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20150901 |