EP1528968B1 - Process gas and method for laser hard soldering - Google Patents
Process gas and method for laser hard soldering Download PDFInfo
- Publication number
- EP1528968B1 EP1528968B1 EP03784108A EP03784108A EP1528968B1 EP 1528968 B1 EP1528968 B1 EP 1528968B1 EP 03784108 A EP03784108 A EP 03784108A EP 03784108 A EP03784108 A EP 03784108A EP 1528968 B1 EP1528968 B1 EP 1528968B1
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- European Patent Office
- Prior art keywords
- solder
- volume
- process gas
- brazing
- laser
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- 238000000034 method Methods 0.000 title claims abstract description 80
- 230000008569 process Effects 0.000 title claims abstract description 64
- 238000005476 soldering Methods 0.000 title abstract description 28
- 239000007789 gas Substances 0.000 claims description 85
- 229910000679 solder Inorganic materials 0.000 claims description 70
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 36
- 238000005219 brazing Methods 0.000 claims description 29
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 18
- 239000001569 carbon dioxide Substances 0.000 claims description 18
- 230000004907 flux Effects 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 10
- 239000001301 oxygen Substances 0.000 claims description 10
- 229910052760 oxygen Inorganic materials 0.000 claims description 10
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 6
- 229910052796 boron Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 150000002431 hydrogen Chemical class 0.000 claims 1
- 238000003466 welding Methods 0.000 description 9
- 238000005304 joining Methods 0.000 description 8
- 230000008901 benefit Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000003993 interaction Effects 0.000 description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 150000001639 boron compounds Chemical class 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- VNWKTOKETHGBQD-AKLPVKDBSA-N carbane Chemical compound [15CH4] VNWKTOKETHGBQD-AKLPVKDBSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229960003753 nitric oxide Drugs 0.000 description 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 1
- 239000001272 nitrous oxide Substances 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 150000002835 noble gases Chemical class 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
- B23K2101/35—Surface treated articles
Definitions
- the invention relates to a process gas for laser steel brazing and a method for Laserstrahlhartlöten with a focused on a solder joint or in the vicinity of the soldering laser beam, wherein the solder is melted at the solder joint of the laser beam.
- brazing with soldering in a brazing furnace is the most commonly used of all brazing processes. More recently, arc brazing has been increasingly used to join components. Laser brazing is also finding increasing interest, although there are still many problems to overcome in carrying out this process. While brazing in the brazing furnace melts the solder by the heat input in the furnace, it liquefies when soldering with an arc or laser beam at the point of energy input.
- brazing unlike welding, does not melt the base material. Only the material additionally added as solder melts due to the energy input. By interaction of the molten solder with the base material, the compound is formed. The melting temperature of the solder is therefore always below the melting temperature of the components to be joined during brazing; however, the solder solidus temperature of brazing is well above the liquefaction temperature of a solder used for soft soldering. Due to the lower soldering temperature compared to welding, the components are less affected during soldering than during welding.
- soldering also allows the joining of materials with different heat conduction coefficients and different heat capacity, since during soldering only the solder, but not the base material is melted.
- welding of components made of different materials is extremely problematic because these properties play a crucial role in the melting of the materials. Due to the differences, therefore, arise in soldering and welding completely different requirements for the technical design.
- Laser brazing and arc brazing in turn differ in energy input and show a different problem.
- the energy is introduced over a large area compared to laser brazing and the stability of the arc is of great importance.
- soldering with a laser beam as an energy source shows the advantages of laser technology. So the energy input with the laser beam is locally very limited and the solder solidifies very quickly after the soldering process. As a result, the distortion caused by the heating of the component is minimized and also the joining of highly heat-sensitive materials is possible.
- Laser manufacturing methods are associated with high investment costs and are mainly used in automated processes in manufacturing.
- process gases serve to control the plasma formed during evaporation by evaporation and ionization of the base material and to prevent shielding of the laser beam by the plasma cloud. Furthermore, it is known to admix the process gases active gases as a component. The active gases provide effective plasma control, increase welding speed and improve quality.
- a flux is usually used, which is usually applied as a solder paste before the soldering process.
- the flux acts on the surface of the component, cleans it and prepares the interaction with the solder.
- the flux thus decisively influences the interaction of solder and base material. It has effects on the flowability of the solder, on the surface tension of the molten solder and also on the ability of the base material to wet.
- the use of flux has numerous disadvantages. Fluxes contain toxic and polluting substances and are therefore problematic in use.
- solder In brazing, as with soldering in general, the addition of solder is an inherent necessity. There are several options for adding the lot.
- the solder is in the form of a wire and this wire is continuously brought to the location of the soldering process by means of a wire feed device.
- Lotform The use of Lotform sculpture is possible.
- the component to be soldered is equipped with the solder preforms before they are melted by means of the laser beam and forms the solder seam.
- solder foils is possible, which are also attached before the soldering process.
- the US 4,906,812 includes a method for laser processing, including laser brazing, in which for the discharge of fumes and smoke, a gas, preferably an inert gas is passed to the processing site over.
- the present invention is therefore based on the object to provide a method and a process gas, which allow a high-quality Laserstrahlhartlöten.
- a process gas stream is directed to the solder joint, wherein in the process gas at least one active gas at least 0.01 vol .-% and as active gas carbon dioxide, oxygen, hydrogen or a mixture of these gases and / or one or more boron-containing gases is / are included.
- the process gas now contains according to the invention - in contrast to the purely inert noble gases - at least one active gas.
- Active gases in the context of the present invention are, for example, carbon dioxide and oxygen.
- the active gases affect the solder and the base material. The active gases lower the surface tension of the solder and increase the fluidity of the solder. The lot becomes thinner and runs better. Thus, the solder penetrates more easily into the gap to be joined and spreads evenly there.
- the base material is prepared by the active gases during the soldering process for the formation of the solder seam.
- the active gases react with impurities on the surface of the base material. Due to this cleaning of the base material results in a better wetting of the base material with the solder. The better one Wettability leads to an effective and even distribution of the solder, thus suppressing the formation of pores.
- the active gases generate small cracks in the base material during the soldering process at the soldering point, into which the liquid solder penetrates.
- the gases and gas mixtures according to the invention ensure the advantages mentioned in a special way.
- oxygen in particular, increases the flow rate of the solder and particularly lowers the surface tension of the solder, while hydrogen mainly reacts with and removes the oxides on the surface of the base material.
- Carbon dioxide acts much like oxygen, but the effect on the solder is less.
- Nitrogen acts as an active gas and in particular influences the base material. Which or which active gases are best suited for the specific application, the expert can find out by simple trial and error.
- Other active gases can also be used in the context of the invention. These include nitrogen monoxide, nitrous oxide, fluorocarbons and chlorinated fluorocarbons and CF 4 and SF 6 .
- carbon dioxide, oxygen and / or hydrogen in the process gas at 0.01 vol .-% to 30 vol .-%, preferably 0.1 vol .-% to 20 vol .-%, particularly preferably 1 vol. % to 10% by volume.
- the upper limit to be preferred is already 20% by volume owing to its explosiveness.
- At least 35% by volume, preferably at least 50% by volume, of carbon dioxide is present as the active gas.
- High volume fractions of carbon dioxide in the process gas lead to an extremely effective and very well controllable energy coupling. This leads to rapid liquefaction of the solder, whereas the base material is heated only to a small extent. This may be based on the dipole character of the carbon dioxide molecule in the process gas.
- This special and additional mode of action of carbon dioxide is only apparent at volume fractions of more than 35% and is more noticeable at volume fractions of more than 50%. In the case of carbon dioxide, no negative consequences for base material or solder are to be noted even with such high volume fractions.
- the process gas consists of a binary gas mixture of carbon dioxide and oxygen or carbon dioxide and nitrogen or carbon dioxide and argon.
- the process gas according to the invention may contain a boron-containing gas or gases containing boron.
- a boron-containing gas or gases containing boron By adding one or more boron compounds, for example Borestem, the surface of the base material is particularly well prepared. The surface is freed of impurities and the interaction of the surface with the molten solder is optimized. The resulting good flow of the solder almost completely suppresses the pore formation. The excess boron compounds and also the products formed on the surface escape into the environment with the used process gas.
- the boron-containing gases serve as a kind of flux and are therefore suitable to replace the flux at least partially, but often completely. An elaborate rework, with which the excess flux is removed after the soldering process, therefore deleted.
- the boron-containing gas is contained in a proportion of 0.01% by volume to 3% by volume, preferably 0.1% by volume to 1.5% by volume. In these proportions, on the one hand, interaction with the base material and, on the other hand, volatilization are ensured.
- the use of the process gas according to the invention is suitable for all solder forms.
- the process gas according to the invention is particularly advantageous when using wire-shaped solder.
- soldered fluxless In an advantageous embodiment of the method according to the invention is soldered fluxless. This eliminates the labor-intensive reworking of the solder seam for removing flux residues. Furthermore, it is advantageous that these environmentally harmful and toxic substances no longer need to be used. Even subsequent changes in the solder joint due to the action of the flux on solder and / or base material accounts.
- the process gas according to the invention is particularly advantageous for joining coated materials, in particular for joining galvanized steels. Furthermore, the process gas according to the invention is also suitable for aluminum and aluminum alloys.
- the process gas according to the invention shows its advantages.
- the joined braze joints show excellent quality despite the different material properties, such as different heat conduction coefficients and different heat capacities.
- the joining of aluminum and aluminum alloys with (galvanized) steels or the joining of different aluminum alloys is made possible with the process gas according to the invention.
- FIG. 1 and 2 show a process gas nozzle 1, a laser beam 2, a solder wire 3, a solder seam 4 and components 5 to be soldered. Furthermore, FIG. 2 shows a wire deflection device 6 and a wire feed device 7.
- a joint is brazed to the laser steel.
- the components 5 are arranged so that a V-shaped joint results.
- the laser beam 2 is focused on the top of the component and liquefies the wire added solder 3. Should the focal spot too small or the energy density in the focal spot be too high, a defocused laser beam must be used.
- the focus of the laser is then preferably above the component s.
- the solder 3 liquefies at the soldering point by the energy of the laser beam 2. Behind the soldering solidifies the solder and the solder seam 4 is formed.
- the solder is fed to the soldering process at an angle of 15 ° to 45 °.
- the process gas stream is directed by means of the process gas nozzle 1 to the solder joint.
- the process gas stream encases the laser beam.
- a source for the laser beam is preferably a diode laser, but also a solid-state laser (for example, a Nd: YAG laser) or a CO 2 laser is used.
- the coupling of the laser beam into the process gas nozzle is determined by the laser type. When using a diode laser, this will preferably be connected directly to the process gas nozzle. If, however, a glass fiber is used for transporting the laser radiation into the process gas nozzle, the fiber advantageously ends in or close to the process gas nozzle.
- the process gas nozzle 1 ensures the flow of the process gas to the solder joint.
- a mixture of 3 vol .-% oxygen and 97 vol .-% argon is used with particular advantage.
- This gas mixture is particularly suitable for joining galvanized steels.
- the components of the process gas are preferably fed as gas mixture into the process gas nozzle. However, it is also possible to use the components in the process gas nozzle to swirl.
- the solder seams are free of splashes and irregularities, so that a rework is not necessary.
- FIG. 2 shows an advantageous embodiment for the use of wire-shaped solder.
- the solder wire 3 is continuously fed by the Drahtvorschubein device 7 and guided by the wire guide 6 to the processing site. There, the solder wire 3 melts in the laser beam 2 and forms the solder seam 4 after solidification.
- the process gas is guided with the process gas nozzle 1 to the solder joint and interacts there with the molten solder and the base material.
- the components 5 consist in one embodiment of different materials.
- the solder seam 4 is formed for example between an aluminum and a steel component.
- the process gas used is advantageously a mixture of 85% by volume of carbon dioxide and 15% by volume of argon.
Abstract
Description
Die Erfindung betrifft ein Prozessgas zum Laserstahlhartlöten sowie ein Verfahren zum Laserstrahlhartlöten mit einem auf eine Lötstelle oder in die Nähe der Lötstelle fokussierten Laserstrahl, wobei das Lot an der Lötstelle von dem Laserstrahl aufgeschmolzen wird.The invention relates to a process gas for laser steel brazing and a method for Laserstrahlhartlöten with a focused on a solder joint or in the vicinity of the soldering laser beam, wherein the solder is melted at the solder joint of the laser beam.
Das Verfahren des Hartlötens mit Lötprozess im Lötofen ist von allen Lötverfahren das am häufigsten verwendete. In jüngerer Zeit kommt auch das Hartlöten mit Lichtbogen beim Fügen von Bauteilen vermehrt zum Einsatz. Auch das Hartlöten mit Laserstrahl findet zunehmend Interesse, obwohl bei der Durchführung von diesem Verfahren noch viele Probleme zu überwinden sind. Während beim Hartlöten im Lötofen das Lot durch die Wärmezufuhr im Ofen aufschmilzt, verflüssigt es sich beim Löten mit Lichtbogen oder Laserstrahl an der Stelle des Energieeintrags.The process of brazing with soldering in a brazing furnace is the most commonly used of all brazing processes. More recently, arc brazing has been increasingly used to join components. Laser brazing is also finding increasing interest, although there are still many problems to overcome in carrying out this process. While brazing in the brazing furnace melts the solder by the heat input in the furnace, it liquefies when soldering with an arc or laser beam at the point of energy input.
Hartlöten und Schweißen weisen auf den ersten Blick viele Ähnlichkeiten miteinander auf, jedoch unterscheiden sich Hartlöten und Schweißen fundamental: Beim Hartlöten wird, im Gegensatz zum Schweißen, der Grundwerkstoff nicht aufgeschmolzen. Lediglich das als Lot zusätzlich zugegebene Material schmilzt durch die Energieeinbringung. Durch Wechselwirkung des geschmolzenen Lots mit dem Grundwerkstoff entsteht die Verbindung. Die Schmelztemperatur des Lots liegt folglich beim Hartlöten immer unterhalb der Schmelztemperatur der zu fügenden Bauteile; jedoch liegt die Solidustemperatur des Lots beim Hartlöten deutlich über der Verflüssigungstemperatur eines Lots, welches zum Weichlöten benutzt wird. Aufgrund der im Vergleich zum Schweißen niedrigeren Temperatur beim Löten werden die Bauteile beim Löten geringer beeinflusst als beim Schweißen. Des Weiteren ermöglicht das Löten auch das Fügen von Materialien mit unterschiedlichen Wärmeleitungskoeffizienten und unterschiedlicher Wärmekapazität, da beim Löten nur das Lot, nicht jedoch der Grundwerkstoff aufgeschmolzen wird. Dagegen ist das Schweißen von Bauteilen aus unterschiedlichen Materialien äußerst problematisch, da diese Eigenschaften beim Aufschmelzen der Werkstoffe eine entscheidende Rolle spielen. Aufgrund der Unterschiede ergeben sich folglich beim Löten und beim Schweißen völlig unterschiedliche Anforderungen an die technische Ausführung.Brazing and welding have many similarities at first glance, but brazing and welding are fundamentally different: brazing, unlike welding, does not melt the base material. Only the material additionally added as solder melts due to the energy input. By interaction of the molten solder with the base material, the compound is formed. The melting temperature of the solder is therefore always below the melting temperature of the components to be joined during brazing; however, the solder solidus temperature of brazing is well above the liquefaction temperature of a solder used for soft soldering. Due to the lower soldering temperature compared to welding, the components are less affected during soldering than during welding. Furthermore, the soldering also allows the joining of materials with different heat conduction coefficients and different heat capacity, since during soldering only the solder, but not the base material is melted. In contrast, the welding of components made of different materials is extremely problematic because these properties play a crucial role in the melting of the materials. Due to the differences, therefore, arise in soldering and welding completely different requirements for the technical design.
Laserstrahlhartlöten und Lichtbogenlöten wiederum unterscheiden sich durch die Energieeinbring ung und zeigen eine unterschiedliche Problematik. Beim Lichtbogenlöten wird im Vergleich zum Laserlöten die Energie großflächig eingebracht und der Stabilität des Lichtbogens kommt eine hohe Bedeutung zu. Demgegenüber zeigt das Löten mit einem Laserstrahl als Energiequelle die Vorteile der Lasertechnik. So ist die Energieeinbringung mit dem Laserstrahl örtlich sehr stark begrenzt und das Lot erstarrt nach dem Lötprozess sehr rasch. Dadurch wird der durch das Erwärmen des Bauteils entstehende Verzug minimiert und auch das Fügen von stark wärmeempfindlichen Materialien ist möglich. Laserfertigungs methoden sind mit hohen Investitionskosten verbunden und werden vor allem bei automatisierten Vorgängen in der Fertigung eingesetzt.Laser brazing and arc brazing in turn differ in energy input and show a different problem. In arc brazing, the energy is introduced over a large area compared to laser brazing and the stability of the arc is of great importance. In contrast, soldering with a laser beam as an energy source shows the advantages of laser technology. So the energy input with the laser beam is locally very limited and the solder solidifies very quickly after the soldering process. As a result, the distortion caused by the heating of the component is minimized and also the joining of highly heat-sensitive materials is possible. Laser manufacturing methods are associated with high investment costs and are mainly used in automated processes in manufacturing.
Beim Laserschweißen ist die Verwendung von Prozessgasen bekannt. Die Prozess gase dienen dazu, das beim Schweißen durch Verdampfen und Ionisieren des Grundwerkstoffs entstehende Plasma zu kontrollieren und eine Abschirmung des Laserstrahls durch die Plasmawolke zu verhindern. Weiterhin ist es bekannt, den Prozessgasen aktive Gase als Bestandteil zu zumischen. Die aktiven Gase bewirken eine effektive Plasmakontrolle, erhöhen die Schweißgeschwindigkeit und verbessern die Qualität.In laser welding, the use of process gases is known. The process gases serve to control the plasma formed during evaporation by evaporation and ionization of the base material and to prevent shielding of the laser beam by the plasma cloud. Furthermore, it is known to admix the process gases active gases as a component. The active gases provide effective plasma control, increase welding speed and improve quality.
Beim Lötvorgang wird normalerweise ein Flussmittel eingesetzt, welches in der Regel vor dem Lötprozess als Lötpaste aufgebracht wird. Das Flussmittel wirkt auf die Ob erfläche des Bauteils ein, reinigt diese und bereitet die Wechselwirkung mit dem Lot vor. Das Flussmittel beeinflusst somit das Zusammenwirken von Lot und Grundwerkstoff entscheidend. Es zeigen sich Auswirkungen auf die Fließfähigkeit des Lots, auf die Oberflächenspannung des geschmolzenen Lots und auch auf die Fähigkeit des Grundwerkstoffs zur Benetzung. Die Verwendung von Flussmitteln bringt jedoch zahlreich Nachteile mit sich. Flussmittel enthalten giftige und umweltschädliche Substanzen und sind folglich problematisch im Einsatz. Nach dem Lötvorgang vorhandene Flussmittelrückstände müssen aufwendig entfernt werden, da diese nicht nur das Aussehen, sondern auch die Qualität der Lötnaht negativ beeinflussen, da die aggressiven Bestandteile des Flussmittels auf lang e Sicht hin Grundwerkstoff und Lotnaht angreifen und so die Anfälligkeit für Korrosion erhöhen.During the soldering process, a flux is usually used, which is usually applied as a solder paste before the soldering process. The flux acts on the surface of the component, cleans it and prepares the interaction with the solder. The flux thus decisively influences the interaction of solder and base material. It has effects on the flowability of the solder, on the surface tension of the molten solder and also on the ability of the base material to wet. However, the use of flux has numerous disadvantages. Fluxes contain toxic and polluting substances and are therefore problematic in use. After the soldering process existing flux residues must be removed consuming, since they adversely affect not only the appearance, but also the quality of the Lötnaht, as the aggressive components of the flux on a long e view base material and solder seam attack and so increase the susceptibility to corrosion.
Beim Hartlöten ist, wie beim Löten generell, die Zugabe von Lot eine immanente Notwendigkeit. Für die Zugabe des Lots gibt es verschiedene Möglichkeiten. Das Lot liegt drahtförmig vor und dieser Draht wird mittels einer Drahtvorschubeinrichtung kontinuierlich an die Stelle des Lötprozesses gebracht. Auch die Verwendung von Lotformteilen ist möglich. Dazu wird das zu verlötende Bauteil mit den Lotformteilen bestückt bevor diese mittels des Laserstrahls aufgeschmolzen werden und sich die Lotnaht bildet. Weiterhin ist auch die Verwendung von Lotfolien möglich, welche ebenfalls vor dem Lötprozess angebracht werden.In brazing, as with soldering in general, the addition of solder is an inherent necessity. There are several options for adding the lot. The solder is in the form of a wire and this wire is continuously brought to the location of the soldering process by means of a wire feed device. The use of Lotformteilen is possible. For this purpose, the component to be soldered is equipped with the solder preforms before they are melted by means of the laser beam and forms the solder seam. Furthermore, the use of solder foils is possible, which are also attached before the soldering process.
Die
Trotz der zahlreichen, postiven Perspektiven des Laserstrahllötens wird diese Technik bisher wenig eingesetzt, da sich in der Praxis erheblich Probleme ergeben. So weisen die Lotnähte häufig eine Vielzahl von Poren auf, so dass die Qualität leidet und die notwendige Zug- und Druckfestigkeit nicht gegeben ist. Die vorliegenden Probleme sind dabei so gravierend, dass sie den Einsatz des Laserstrahllötens stark beeinschränken und größtenteils sogar vollständig verhindern. Problematisch ist ferner der Einsatz von Flussmitteln. Auch Vor- und Nacharbeiten sollten möglichst gering sein bzw. entfallen, um einen wirtschaftlichen Einsatz des Laserhartlötens zu ermöglichen.Despite the numerous, positive perspectives of laser beam soldering, this technique has hitherto been of little use, since there are considerable problems in practice. Thus, the solder seams often have a variety of pores, so that the quality suffers and the necessary tensile and compressive strength is not given. The present problems are so serious that they greatly impair the use of the laser beam brazing and largely prevent even completely. Another problem is the use of flux. Pre- and rework should also be as small as possible or eliminated in order to enable economical use of laser brazing.
Der vorliegende Erfindung liegt daher die Aufgabe zugrunde, ein Verfahren und ein Prozessgas anzugeben, welche ein qualitativ hochwertiges Laserstrahlhartlöten ermöglichen.The present invention is therefore based on the object to provide a method and a process gas, which allow a high-quality Laserstrahlhartlöten.
Die Aufgabe wird erfindungsgemäß dadurch gelöst, dass ein Prozessgasstrom auf die Lötstelle gelenkt wird, wobei im Prozessgas mindestens ein aktives Gas mit mindestens 0,01 Vol.-% und als aktives Gas Kohlendioxid, Sauerstoff, Wasserstoff oder eine Mischung aus diesen Gasen oder/und ein oder mehrere borhaltige Gase enthalten ist/sind. Das Prozessgas enthält nun erfindungsgemäß - gegensätzlich zu den rein inerten Edelgasen - mindestens ein aktives Gas. Aktive Gase im Sinne der vorliegenden Erfindung sind beispielsweise Kohlendioxid und Sauerstoff. Die aktiven Gase beeinflussen das Lot und den Grundwerkstoff. Die aktiven Gase erniedrigen die Oberflächenspannung des Lots und erhöhen die Fließfähigkeit des Lots. Das Lot wird dünnflüssiger und verläuft besser. Damit dringt das Lot leichter in den zu fügenden Spalt ein und verteilt sich dort gleichmäßig. Eine gleichförmige Verteilung des Lots ohne Aussparungen und Blasenbildung vor dem anschließenden Erstarren des Lots ist die wichtigste Grundvoraussetzung für porenfreie Lotnähte. Der Grundwerkstoff wird von den aktiven Gasen während des Lötprozesses für die Ausbildung der Lotnaht präpariert. Die aktiven Gase reagieren mit Verunreinigungen an der Oberfläche des Grundwerkstoffs. Aufgrund dieser Reinigung des Grundwerkstoffs ergibt sich eine bessere Benetzung des Grundwerkstoffs mit dem Lot. Die bessere Benetzbarkeit führt zu einer effektiven und gleichmäßigen Verteilung des Lots und unterdrückt somit das Entstehen von Poren. Des Weiteren erzeugen die aktiven Gase kleine Risse im Grundwerkstoff während des Lötprozesses an der Lötstelle, in welche das flüssige Lot eindringt. Diese durch die Risse entstehende Verklammerung von Lot und Grundwerkstoff unterstützt das Entstehen der stoffschlüssigen Verbindung, welche endgültig durch Diffusionsprozesse der beteiligten Partner entsteht. Auch aus diesem Grund erhöhen die aktiven Gasse die Qualität der Lötverbindung signifikant. Negative Einflüsse auf Grundwerkstoff oder Lot zeigen sich bei der Nutzung des erfindungsgemäßen Prozessgases nicht. Ein Teil der genannten Auswirkungen, die das erfindungsgemäße Prozessgas auf den Lötprozess ausübt, stimmen mit den Auswirkungen des Flussmittels überein. Deshalb werden die Aufgaben des Flussmittels zumindest teilweise von dem erfindungsgemäßen Prozessgas mit übernommen. Das Prozessgas kann folglich die Menge des benötigten Flussmittel reduzieren und dieses u.U. sogar vollständig ersetzen.The object is achieved in that a process gas stream is directed to the solder joint, wherein in the process gas at least one active gas at least 0.01 vol .-% and as active gas carbon dioxide, oxygen, hydrogen or a mixture of these gases and / or one or more boron-containing gases is / are included. The process gas now contains according to the invention - in contrast to the purely inert noble gases - at least one active gas. Active gases in the context of the present invention are, for example, carbon dioxide and oxygen. The active gases affect the solder and the base material. The active gases lower the surface tension of the solder and increase the fluidity of the solder. The lot becomes thinner and runs better. Thus, the solder penetrates more easily into the gap to be joined and spreads evenly there. A uniform distribution of the solder without recesses and blistering before the subsequent solidification of the solder is the most important prerequisite for non-porous solder seams. The base material is prepared by the active gases during the soldering process for the formation of the solder seam. The active gases react with impurities on the surface of the base material. Due to this cleaning of the base material results in a better wetting of the base material with the solder. The better one Wettability leads to an effective and even distribution of the solder, thus suppressing the formation of pores. Furthermore, the active gases generate small cracks in the base material during the soldering process at the soldering point, into which the liquid solder penetrates. This brazing of solder and base material caused by the cracks supports the creation of the material connection, which finally results from diffusion processes of the partners involved. Also for this reason, the active lane significantly increases the quality of the solder joint. Negative influences on base material or solder do not show up when using the process gas according to the invention. Part of the mentioned effects which the process gas according to the invention exerts on the soldering process are in accordance with the effects of the flux. Therefore, the tasks of the flux are at least partially taken over by the process gas according to the invention. The process gas can thus reduce the amount of flux required and may even replace it completely.
Die Gase und Gasmischungen gemäß der Erfindung gewährleisten die genannten Vorteile in besonderer Weise. Prinzipiell zeigen sich mit allen aktiven Gasen die genannten Vorteile, jedoch treten bei den verschiedenen Gasen unterschiedliche Effekte in den Vordergrund. Sauerstoff beispielsweise erhöht insbesondere die Fließgeschwindigkeit des Lots und erniedrigt die Oberflächenspannung des Lots besonders effektiv, während Wasserstoff v.a. mit den Oxiden an der Oberfläche des Grundwerkstoffs reagiert und diese entfernt. Kohlendioxid wirkt ähnlich wie Sauerstoff, jedoch ist der Einfluss auf das Lot geringer. Stickstoff wirkt als aktives Gas und beeinflusst insbeso n-dere den Grundwerkstoff. Welches bzw. welche aktive Gase für den speziellen Anwendungsfall am besten geeignet sind, kann der Fachmann durch einfache Ausprobieren herausfinden. Andere aktive Gase können ebenfalls im Sinne der Erfindung eingesetzt werden. Dazu zu nennen sind Stickstoffmonoxid, Distickstoffmonoxid, Flourkohlenwasserstoffe und chlorierte Flourkohlenwasserstoffe sowie CF4 und SF6.The gases and gas mixtures according to the invention ensure the advantages mentioned in a special way. In principle, with all the active gases mentioned advantages, but different effects come in the foreground with the different gases. In particular, oxygen, in particular, increases the flow rate of the solder and particularly lowers the surface tension of the solder, while hydrogen mainly reacts with and removes the oxides on the surface of the base material. Carbon dioxide acts much like oxygen, but the effect on the solder is less. Nitrogen acts as an active gas and in particular influences the base material. Which or which active gases are best suited for the specific application, the expert can find out by simple trial and error. Other active gases can also be used in the context of the invention. These include nitrogen monoxide, nitrous oxide, fluorocarbons and chlorinated fluorocarbons and CF 4 and SF 6 .
In vorteilhafter Ausgestaltung sind Kohlendioxid, Sauerstoff und/oder Wasserstoff in dem Prozessgas mit 0,01 Vol.-% bis 30 Vol.-%, vorzugsweise 0,1 Vol.-% bis 20 Vol.-%, besonders bevorzugt 1 Vol.-% bis 10 Vol.-% enthalten. In diesen Volumenanteilen ist einerseits die Wirkung der aktiven Gase sichergestellt und anderseits kommt es nicht zu schädlichen Veränderungen in Grundwerkstoff oder Lot. Für den Wasserstoffanteil liegt die zu bevorzugende Obergrenze aufgrund seiner Explosivität bereits bei 20 Vol.-%.In an advantageous embodiment, carbon dioxide, oxygen and / or hydrogen in the process gas at 0.01 vol .-% to 30 vol .-%, preferably 0.1 vol .-% to 20 vol .-%, particularly preferably 1 vol. % to 10% by volume. In these proportions of volume, on the one hand the effect of the active gases is ensured and on the other hand it does not lead to harmful changes in base material or solder. For the hydrogen content, the upper limit to be preferred is already 20% by volume owing to its explosiveness.
In einer alternativen vorteilhaften Ausgestaltung ist als aktives Gas mindestens 35 Vol.-%, vorzugsweise mindestens 50 Vol.-% Kohlendioxid enthalten. Hohe Volumenanteile an Kohlendioxid im Prozessgas führen zu einer außerordentlich effektiven und sehr gut beherrschbaren Energieeinkopplung. Dies führt zur schnellen Verflüssigung des Lots, während hingegen der Grundwerkstoff nur in geringen Maße erwärmt wird. Möglicherweise basiert dies auf dem Dipolcharakter des Kohlendioxid-Moleküls im Prozessgas. Diese spezielle und zusätzliche Wirkungsweise von Kohlendioxid zeigt sich erst bei Volumenanteilen von mehr als 35 % und deutlicher ist sie bei Volumenanteilen von über 50 % zu bemerken. Bei Kohlendioxid sind auch bei solch hohen Volumenanteilen keine negativen Folgen für Grundwerkstoff oder Lot zu bemerken.In an alternative advantageous embodiment, at least 35% by volume, preferably at least 50% by volume, of carbon dioxide is present as the active gas. High volume fractions of carbon dioxide in the process gas lead to an extremely effective and very well controllable energy coupling. This leads to rapid liquefaction of the solder, whereas the base material is heated only to a small extent. This may be based on the dipole character of the carbon dioxide molecule in the process gas. This special and additional mode of action of carbon dioxide is only apparent at volume fractions of more than 35% and is more noticeable at volume fractions of more than 50%. In the case of carbon dioxide, no negative consequences for base material or solder are to be noted even with such high volume fractions.
In Weiterbildung besteht das Prozessgas aus einem binären Gasgemisch aus Kohlendioxid und Sauerstoff oder Kohlendioxid und Stickstoff oder Kohlendioxid und Argon. Durch das Mischen des Kohlendioxids mit einem dieser Gase entstehen binäre Prozessgase mit hervorragenden Eigenschaften. In speziellen Anwendungsfällen kommen jedoch besser ternäre Mischungen aus diesen Gasen oder gar die quaternäre Mischung aus allen vier Gaskomponenten zum Einsatz.In a further development, the process gas consists of a binary gas mixture of carbon dioxide and oxygen or carbon dioxide and nitrogen or carbon dioxide and argon. By mixing the carbon dioxide with one of these gases, binary process gases with excellent properties are created. In special applications, however, better ternary mixtures of these gases or even the quaternary mixture of all four gas components are used.
Ferner kann das Prozessgas gemäß der Erfindung ein borhaltiges Gas oder mehrere borhaltige Gase enthalten. Durch die Zugabe einer oder verschiedener Borverbindungen, beispielsweise von Borestem, wird die Oberfläche des Grundwerkstoffs besonders gut vorbereitet. Die Oberfläche wird von Verunreinigungen befreit und die Wechselwirkung der Oberfläche mit dem geschmolzenen Lot wird optimiert. Das daraus resultierende gute Verlaufen des Lots unterdrückt die Porenbildung nahezu vollständig. Die überschüssigen Borverbindungen und auch die an der Oberfläche entstehenden Produkte entweichen mit dem verbrauchten Prozessgas in die Umgebung. Die borhaltigen Gase dienen als ein Art Flussmittel und sind deshalb geeignet die Flussmittel zumindest teilweise, oft aber auch vollständig zu ersetzen. Ein aufwändiges Nacharbeiten, mit welchem das überschüssige Flussmittel nach dem Lötprozess wieder entfernt wird, entfällt deshalb.Further, the process gas according to the invention may contain a boron-containing gas or gases containing boron. By adding one or more boron compounds, for example Borestem, the surface of the base material is particularly well prepared. The surface is freed of impurities and the interaction of the surface with the molten solder is optimized. The resulting good flow of the solder almost completely suppresses the pore formation. The excess boron compounds and also the products formed on the surface escape into the environment with the used process gas. The boron-containing gases serve as a kind of flux and are therefore suitable to replace the flux at least partially, but often completely. An elaborate rework, with which the excess flux is removed after the soldering process, therefore deleted.
Mit besonderem Vorteil ist das borhaltige Gas dabei in einem Anteil von 0,01 Vol.-% bis 3 Vol.-%, vorzugsweise 0,1 Vol.-% bis 1,5 Vol.-% enthalten. In diesen Anteilen ist einerseits die Wechselwirkung mit dem Grundwerkstoff und anderseits die Verflüchtigung gewährleistet.With particular advantage, the boron-containing gas is contained in a proportion of 0.01% by volume to 3% by volume, preferably 0.1% by volume to 1.5% by volume. In these proportions, on the one hand, interaction with the base material and, on the other hand, volatilization are ensured.
Prinzipiell ist die Verwendung des erfindungsgemäßen Prozessgases für alle Lotformen geeignet. Besonders vorteilhaft ist das erfindungsgemäße Prozessgas jedoch bei der Verwendung von drahtförmigen Lot.In principle, the use of the process gas according to the invention is suitable for all solder forms. However, the process gas according to the invention is particularly advantageous when using wire-shaped solder.
In einer vorteilhaften Ausgestaltung des erfindungsgemäßen Verfahrens wird flussmittelfrei gelötet. Damit entfällt das arbeitsintensive Nacharbeiten der Lotnaht zum Entfernen von Flussmittelresten. Weiterhin ist es von Vorteil, das diese umweltschädlichen und giftigen Substanzen nicht mehr verwendet werden müssen. Auch nachträgliche Veränderungen der Lötverbindung aufgrund des Einwirken des Flussmittels auf Lot und/oder Grundwerkstoff entfallen.In an advantageous embodiment of the method according to the invention is soldered fluxless. This eliminates the labor-intensive reworking of the solder seam for removing flux residues. Furthermore, it is advantageous that these environmentally harmful and toxic substances no longer need to be used. Even subsequent changes in the solder joint due to the action of the flux on solder and / or base material accounts.
Das erfindungsgemäße Prozessgas eignet sich mit besonderen Vorteilen zum Fügen von beschichtete Werkstoffen, insbesondere zum Fügen von verzinkten Stählen. Des Weiteren eignet sich das erfindungsgemäße Prozessgas auch für Aluminium und Aluminiumlegierungen.The process gas according to the invention is particularly advantageous for joining coated materials, in particular for joining galvanized steels. Furthermore, the process gas according to the invention is also suitable for aluminum and aluminum alloys.
Aber auch beim Fügen von heterogen Werkstoffverbindungen zeigt das erfindungsgemäße Prozessgas seine Vorteile. Die gefügten Hartlotverbindungen zeigen trotz der unterschiedlichen Materialeigenschaften, wie unterschiedliche Wärmeleitungskoeffizienten und verschiedene Wärmekapazitäten eine hervorragende Qualität. So wird mit dem erfindungsgemäßen Prozessgas beispielsweise das Fügen von Aluminium und Aluminiumlegierungen mit (verzinkten) Stählen oder das Fügen von unterschiedlichen Aluminiumlegierungen ermöglicht.But even when joining heterogeneous material compounds, the process gas according to the invention shows its advantages. The joined braze joints show excellent quality despite the different material properties, such as different heat conduction coefficients and different heat capacities. Thus, for example, the joining of aluminum and aluminum alloys with (galvanized) steels or the joining of different aluminum alloys is made possible with the process gas according to the invention.
Die Erfindung sowie weitere Einzelheiten der Erfindung werden im Folgenden anhand von in den Zeichnungen dargestellten Ausführungsbeispielen näher erläutert. Hierbei zeigen:
Figur 1- das Verfahren zum Laserstrahlhartlöten mit einem mittels einer Düse auf die Bauteile gerichteten Prozessgasstrom und
Figur 2- das Verfahren mit drahtförmiger Lotzugabe.
- FIG. 1
- the method for laser beam brazing with a directed by means of a nozzle on the components process gas stream and
- FIG. 2
- the method with wire-shaped solder addition.
Figur 1 und 2 zeigen eine Prozessgasdüse 1, einen Laserstrahl 2, einen Lotdraht 3, eine Lotnaht 4 und zu verlötende Bauteile 5. Des Weiteren zeigt Figur 2 eine Drahtlenkeinrichtung 6 und eine Drahtvorschubeinrichtung 7.1 and 2 show a
In dem Ausführungsbeispiel gemäß Figur 1 wird eine Fuge mit dem Laserstahl hartgelötet. Dazu sind die Bauteile 5 so angeordnet, dass sich eine V-förmige Fuge ergibt. Der Laserstahl 2 wird auf die Oberseite der Bauteil fokussiert und verflüssigt das drahtförmig zugegebene Lot 3. Sollte der Brennfleck zu klein oder die Energiedichte im Brennfleck zu hoch sein, muss ein defokussierter Laserstrahl verwendet werden. Der Fokus des Lasers liegt dann vorzugsweise oberhalb des Bauteil s. Das Lot 3 verflüssigt sich an der Lötstelle durch die Energie des Laserstrahls 2. Hinter der Lötstelle erstarrt das Lot und die Lotnaht 4 bildet sich aus. Vorteilhafterweise wird das Lot in einem Winkel von 15° bis 45° dem Lötprozess zugeführt. Der Prozessgasstrom wird mittels der Prozessgasdüse 1 auf die Lötstelle gelenkt. Der Prozessgasstrom ummantelt dabei den Laserstrahl. Als Quelle für den Laserstrahl dient vorzugsweise ein Diodenlaser, aber auch ein Festkörperlaser (beispielsweise ein Nd:YAG Laser) oder ein CO2-Laser wird eingesetzt. Die Einkopplung des Laserstrahls in die Prozes sgasdüse wird durch den Lasertyp bestimmt. Bei Verwendung eines Diodenlasers wird dieser vorzugsweise direkt mit der Prozessgasdüse verbunden sein. Wird hingegen eine Glasfaser für den Transport der Laserstrahlung in die Prozessgasdüse verwendet, endet die Faser vorteilhafterweise in oder nahe an der Prozessgasdüse. Die Prozessgasdüse 1 sorgt für das Strömen des Prozessgases an die Lötstelle. Als Prozessgas wird mit besonderem Vorteil eine Mischung aus 3 Vol.-% Sau erstoff und 97 Vol.-% Argon verwendet. Diese Gasmischung eignet sich insbesondere zum Fügen von verzinkten Stählen. Die Komponenten des Prozessgases werden vorzugsweise als Gasmischung in die Prozessgasdüse geführt. Es ist jedoch auch möglich, die Komponenten in der Prozessgasdüse zu verwirbeln. Die Lotnähte sind frei von Spritzern und Unregelmäßigkeiten, so dass ein Nacharbeiten nicht notwendig ist.In the embodiment according to FIG. 1, a joint is brazed to the laser steel. For this purpose, the
Figur 2 zeigt eine vorteilhaft Ausgestaltung für die Verwendung von drahtförmigen Lot. Der Lotdraht 3 wird von der Drahtvorschubein richtung 7 kontinuierlich gefördert und von der Drahtlenkeinrichtung 6 an die Bearbeitungsstelle geführt. Dort schmilzt der Lotdraht 3 im Laserstrahl 2 und bildet nach Erstarrung die Lotnaht 4. Das Prozessgas wird mit der Prozessgasdüse 1 an die Lötstelle geführt und wechselwirkt dort mit dem geschmolzenen Lot und dem Grundwerkstoff. Die Bauteile 5 bestehen in einer Ausgestaltung aus unterschiedlichen Materialien. Die Lotnaht 4 entsteht so beispielsweise zwischen einem Aluminium- und einem Stahlbauteil. Als Prozessgas wird vorteilhafterweise eine Mischung aus 85 Vol.-% Kohlendioxid und 15 Vol.-% Argon verwendet.FIG. 2 shows an advantageous embodiment for the use of wire-shaped solder. The
Claims (8)
- Method for laser brazing with a laser beam focussed on a brazing point or near the brazing point, the solder being melted at the brazing point by the laser beam, characterized in that a stream of process gas is directed onto the brazing point, at least one active gas being contained in the process gas in at least 0.01% by volume, and carbon dioxide, oxygen, hydrogen, or a mixture of these gases being contained as the active gas.
- Method according to Claim 1, characterized in that 0.01% by volume to 30% by volume, preferably 0.1% by volume to 20% by volume, with particular preference 1% by volume to 10% by volume, of carbon dioxide, oxygen and/or hydrogen is contained.
- Method according to Claim 1, characterized in that at least 35% by volume, preferably at least 50% by volume, of carbon dioxide is contained as the active gas.
- Method according to Claim 3, characterized in that the process gas comprises a binary gas mixture of carbon dioxide and oxygen/nitrogen/argon.
- Method according to one of Claims 1 to 4, characterized in that 0.01% by volume to 3% by volume, preferably 0.1% by volume to 1.5% by volume, of boron-containing gas is contained.
- Method according to one of Claims 1 to 5, characterized in that brazing is carried out without any flux.
- Method according to one of Claims 1 to 6, characterized in that coated materials, in particular galvanized steels, are joined.
- Method according to one of Claims 1 to 6, characterized in that heterogeneous material combinations are joined.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10235821 | 2002-08-05 | ||
| DE10235821A DE10235821A1 (en) | 2002-08-05 | 2002-08-05 | Process gas for laser hard soldering galvanized steel or heterogeneous material compounds contains active gas |
| PCT/EP2003/008372 WO2004014599A1 (en) | 2002-08-05 | 2003-07-29 | Process gas and method for laser hard soldering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1528968A1 EP1528968A1 (en) | 2005-05-11 |
| EP1528968B1 true EP1528968B1 (en) | 2007-12-26 |
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ID=30775016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP03784108A Expired - Lifetime EP1528968B1 (en) | 2002-08-05 | 2003-07-29 | Process gas and method for laser hard soldering |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1528968B1 (en) |
| AT (1) | ATE381974T1 (en) |
| AU (1) | AU2003255317A1 (en) |
| DE (2) | DE10235821A1 (en) |
| ES (1) | ES2298603T3 (en) |
| WO (1) | WO2004014599A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2898529B1 (en) * | 2006-03-15 | 2008-04-25 | Air Liquide | SOUDO-BRAZING OF STEEL PARTS WITH COPPER WIRE AND OXIDIZING GAS MIXTURE |
| DE102006012064B4 (en) * | 2006-03-16 | 2016-12-15 | Audi Ag | Feeding device for a filler material and method for its supply in a soldering process |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4906812A (en) * | 1988-12-22 | 1990-03-06 | General Electric Company | Fiber optic laser joining apparatus |
| JP2736182B2 (en) * | 1991-02-28 | 1998-04-02 | ファナック株式会社 | Laser device and laser welding method |
| DE19901900A1 (en) * | 1999-01-19 | 2000-07-20 | Linde Tech Gase Gmbh | Laser welding with process gas |
| DE10032975B4 (en) * | 2000-07-06 | 2005-09-08 | Behr Gmbh & Co. Kg | Method of brazing aluminum parts |
| WO2002070192A1 (en) * | 2001-03-06 | 2002-09-12 | Linde Aktiengesellschaft | Laser welding of nonferrous metals by using laser diodes and process gas |
-
2002
- 2002-08-05 DE DE10235821A patent/DE10235821A1/en not_active Withdrawn
-
2003
- 2003-07-21 AU AU2003255317A patent/AU2003255317A1/en not_active Abandoned
- 2003-07-29 DE DE50308891T patent/DE50308891D1/en not_active Expired - Lifetime
- 2003-07-29 ES ES03784108T patent/ES2298603T3/en not_active Expired - Lifetime
- 2003-07-29 EP EP03784108A patent/EP1528968B1/en not_active Expired - Lifetime
- 2003-07-29 AT AT03784108T patent/ATE381974T1/en not_active IP Right Cessation
- 2003-07-29 WO PCT/EP2003/008372 patent/WO2004014599A1/en active Search and Examination
Also Published As
| Publication number | Publication date |
|---|---|
| ATE381974T1 (en) | 2008-01-15 |
| DE50308891D1 (en) | 2008-02-07 |
| EP1528968A1 (en) | 2005-05-11 |
| AU2003255317A1 (en) | 2004-02-25 |
| ES2298603T3 (en) | 2008-05-16 |
| DE10235821A1 (en) | 2004-02-26 |
| WO2004014599A1 (en) | 2004-02-19 |
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