EP1509069A3 - Double-sided wiring circuit board and process for producing the same - Google Patents

Double-sided wiring circuit board and process for producing the same Download PDF

Info

Publication number
EP1509069A3
EP1509069A3 EP04019719A EP04019719A EP1509069A3 EP 1509069 A3 EP1509069 A3 EP 1509069A3 EP 04019719 A EP04019719 A EP 04019719A EP 04019719 A EP04019719 A EP 04019719A EP 1509069 A3 EP1509069 A3 EP 1509069A3
Authority
EP
European Patent Office
Prior art keywords
hole
insulating layer
double
circuit board
wiring circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04019719A
Other languages
German (de)
French (fr)
Other versions
EP1509069A2 (en
Inventor
Toshiki Nitto Denko Corporation Naito
Toshihiko Nitto Denko Corporation Omote
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of EP1509069A2 publication Critical patent/EP1509069A2/en
Publication of EP1509069A3 publication Critical patent/EP1509069A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Abstract

The invention provides a double-sided wiring circuit board (100) which comprises: an insulating layer (10a) having a through-hole (10V) formed therein and having a first side and a second side; a conductor layer (10b) formed on the first side of the insulating layer (10a); a thin metal film (12) formed on the second side of the insulating layer (10a), on the inner circumferential surface of the through-hole (10V), and on the part of the conductor layer (10b) that is located in the through-hole (10V); and a deposit layer (10M) formed by electroplating on the thin metal film (12), wherein the through-hole (10V) has an inner circumferential wall which inclines so that the inner diameter of the hole gradually increases from the first side to the second side of the insulating layer (10a), and wherein the angle of the inclination between the first side of the insulating layer and the inner circumferential wall being from 40° to 70°. Also disclosed is a production process thereof.
EP04019719A 2003-08-22 2004-08-19 Double-sided wiring circuit board and process for producing the same Withdrawn EP1509069A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003298283A JP2005072168A (en) 2003-08-22 2003-08-22 Double-sided wiring circuit substrate and its manufacturing method
JP2003298283 2003-08-22

Publications (2)

Publication Number Publication Date
EP1509069A2 EP1509069A2 (en) 2005-02-23
EP1509069A3 true EP1509069A3 (en) 2006-12-06

Family

ID=34056258

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04019719A Withdrawn EP1509069A3 (en) 2003-08-22 2004-08-19 Double-sided wiring circuit board and process for producing the same

Country Status (6)

Country Link
US (1) US20050062160A1 (en)
EP (1) EP1509069A3 (en)
JP (1) JP2005072168A (en)
KR (1) KR20050020699A (en)
CN (1) CN1585594A (en)
TW (1) TW200517023A (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI246384B (en) * 2004-11-22 2005-12-21 Benq Corp Multi-layer printed circuit board layout and manufacturing method thereof
KR100588770B1 (en) 2004-12-14 2006-06-12 디케이 유아이엘 주식회사 Double side flexible printed circuit board and manufacturing method thereof
JP5021216B2 (en) * 2006-02-22 2012-09-05 イビデン株式会社 Printed wiring board and manufacturing method thereof
CN101945533B (en) * 2006-05-17 2013-04-03 三菱制纸株式会社 Circuit substrate
TWI468093B (en) * 2008-10-31 2015-01-01 Princo Corp Via structure in multi-layer substrate and manufacturing method thereof
KR100958023B1 (en) * 2008-11-04 2010-05-17 삼성모바일디스플레이주식회사 Organic Light emitting Display device
JP5561591B2 (en) * 2010-03-17 2014-07-30 大日本印刷株式会社 Wiring circuit board and method for manufacturing wiring circuit board
CN102413639B (en) * 2011-07-27 2015-04-15 深南电路有限公司 Manufacturing method of circuit board
TWI437137B (en) * 2012-06-29 2014-05-11 Viking Tech Corp Metal plating deposition method
JP6027819B2 (en) * 2012-08-20 2016-11-16 日東電工株式会社 Printed circuit board
FR3006549B1 (en) * 2013-06-03 2016-10-14 Linxens Holding METHOD FOR PRODUCING AN ELECTRICAL CIRCUIT AND ELECTRIC CIRCUIT CARRIED OUT BY THIS METHOD
CN104425229A (en) * 2013-09-10 2015-03-18 中国科学院微电子研究所 Fin manufacturing method
CN103987198B (en) * 2014-05-27 2017-02-01 中国科学院微电子研究所 Manufacturing method for coreless substrate without auxiliary structure
CN109788661B (en) * 2017-11-10 2021-08-24 宏启胜精密电子(秦皇岛)有限公司 Flexible circuit board and preparation method thereof
CN111508926B (en) 2019-01-31 2022-08-30 奥特斯(中国)有限公司 Component carrier and method for producing a component carrier

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4714516A (en) * 1986-09-26 1987-12-22 General Electric Company Method to produce via holes in polymer dielectrics for multiple electronic circuit chip packaging
US4940881A (en) * 1989-09-28 1990-07-10 Tamarack Scientific Co., Inc. Method and apparatus for effecting selective ablation of a coating from a substrate, and controlling the wall angle of coating edge portions
US5066357A (en) * 1990-01-11 1991-11-19 Hewlett-Packard Company Method for making flexible circuit card with laser-contoured vias and machined capacitors
US6127633A (en) * 1995-04-28 2000-10-03 Victor Company Of Japan, Ltd. Multilayer print circuit board having a blind hole in an insulation layer with a roughened surface formed by application of an oxidizing agent and method of production
US20010002625A1 (en) * 1999-06-24 2001-06-07 Nec Corporation Wiring substrate, multi-layered wiring substrate and method of fabricating those
US20020056192A1 (en) * 2000-09-27 2002-05-16 Tokihito Suwa Method of producing multilayer printed wiring board and multilayer printed wiring board
US20030039106A1 (en) * 2000-04-14 2003-02-27 Tatsunori Koyanagi Double-sided wiring board and its manufacture method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6858937B2 (en) * 2000-03-02 2005-02-22 Micron Technology, Inc. Backend metallization method and device obtained therefrom
JP2002043456A (en) * 2000-07-24 2002-02-08 Victor Co Of Japan Ltd Multi-layer printed wiring board
JP2002176259A (en) * 2000-09-27 2002-06-21 Hitachi Ltd Multilayer printed wiring board and method of manufacturing the same
JP2002353160A (en) * 2001-05-28 2002-12-06 Murata Mfg Co Ltd Circuit substrate and manufacturing method therefor
US6413815B1 (en) * 2001-07-17 2002-07-02 Macronix International Co., Ltd. Method of forming a MIM capacitor
US6828639B2 (en) * 2002-07-17 2004-12-07 Micron Technology, Inc. Process flow for building MRAM structures
JP2004247391A (en) * 2003-02-12 2004-09-02 Toray Ind Inc Method for manufacturing circuit board

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4714516A (en) * 1986-09-26 1987-12-22 General Electric Company Method to produce via holes in polymer dielectrics for multiple electronic circuit chip packaging
US4940881A (en) * 1989-09-28 1990-07-10 Tamarack Scientific Co., Inc. Method and apparatus for effecting selective ablation of a coating from a substrate, and controlling the wall angle of coating edge portions
US5066357A (en) * 1990-01-11 1991-11-19 Hewlett-Packard Company Method for making flexible circuit card with laser-contoured vias and machined capacitors
US6127633A (en) * 1995-04-28 2000-10-03 Victor Company Of Japan, Ltd. Multilayer print circuit board having a blind hole in an insulation layer with a roughened surface formed by application of an oxidizing agent and method of production
US20010002625A1 (en) * 1999-06-24 2001-06-07 Nec Corporation Wiring substrate, multi-layered wiring substrate and method of fabricating those
US20030039106A1 (en) * 2000-04-14 2003-02-27 Tatsunori Koyanagi Double-sided wiring board and its manufacture method
US20020056192A1 (en) * 2000-09-27 2002-05-16 Tokihito Suwa Method of producing multilayer printed wiring board and multilayer printed wiring board

Also Published As

Publication number Publication date
JP2005072168A (en) 2005-03-17
EP1509069A2 (en) 2005-02-23
KR20050020699A (en) 2005-03-04
TW200517023A (en) 2005-05-16
CN1585594A (en) 2005-02-23
US20050062160A1 (en) 2005-03-24

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