EP1451831A4 - THIN FLEXIBLE LADDER - Google Patents
THIN FLEXIBLE LADDERInfo
- Publication number
- EP1451831A4 EP1451831A4 EP02771903A EP02771903A EP1451831A4 EP 1451831 A4 EP1451831 A4 EP 1451831A4 EP 02771903 A EP02771903 A EP 02771903A EP 02771903 A EP02771903 A EP 02771903A EP 1451831 A4 EP1451831 A4 EP 1451831A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- conductor
- flexible
- mould
- layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
Definitions
- This invention relates to the fabrication of conductors in micro devices particularly implantable devices.
- USA patent 5403700 discloses a biocompatible thin film electrical component formed by depositing a metal conductor onto a polyamic acid substrate and depositing a separate insulating layer onto the conductor.
- USA patent 5888577 discloses an electrode deposited on the outer surface of a catheter which does not impede the flexibility of the catheter.
- USA patent 5634462 discloses a corrugated cuff electrode for nerve implantation.
- USA patent 5720099 is directed to an implantable electrode assembly formed using photolithography by depositing electrode pads onto a sacrificial layer, adding wires to the pad, embedding the pads and wires in a carrier and removing the sacrificial layer.
- an implantable stimulator unit is often positioned remote from the region to be stimulated, such as in a recess in the skull, whilst the stimulating electrodes are positioned within the cochlear to apply the appropriate stimulation.
- Each of the electrodes positioned within the cochlea require electrical connection to the electronic circuitry housed in the stimulator unit. This electrical connection has traditionally been in the form of a wire welded at one end to the stimulator unit and at the other end to the stimulating electrode, with each of these wires bundled together to form a lead connecting the stimulating electrode array to the stimulator unit.
- such a lead is as thin and flexible as possible, to allow for easy manipulation and positioning of the electrode array during implantation as well as to accommodate any geometrical changes in the region of implantation over the patient's life.
- the stiffness, and size of the connecting lead and electrode array As the number of stimulating electrodes increases, and hence the number of conducting wires increases, so too does the stiffness, and size of the connecting lead and electrode array.
- the area within the cochlea which receives the stimulating electrode array is of a particularly small size and shape, and as such the array needs to be of a shape that is as unobtrusive as possible on the sensitive structures of the cochlea.
- the present invention provides a flexible conductor consisting of a conductive layer on a flexible substrate in which the conductive layer forms a three dimensional surface so that the current capacity of the conductor is increased relative to the current capacity of a conductor of the same size that is not on a three dimensional surface.
- the three dimensional shape may be corrugations, textured or concertina shapes that maximise cross sectional area for a given external size.
- the term textured means any three dimensional surface effect which increases surface area. Texturing may be achieved by embossing, corrugating or moulding.
- the three dimensional conductive surface is formed on a 3 dimensional surface of a flexible substrate by any suitable surface deposition technique.
- this invention provides a flexible conductor consisting of a conductive layer on a flexible substrate in which the flexible substrate has been shaped to form a three dimensional surface and a conductive layer has been formed on the substrate surface.
- the flexible substrate is preferably silicone which serves as electrical insulation around the conductor.
- An example of a typical application of the present invention is for a cochlear hearing implant.
- the present invention can be applied to the conductors connecting the stimulating pads of a cochlear implant to the electronics housed in an implanted stimulator housing.
- the present invention provides a method of forming a conductor in which a conductive metal layer is deposited onto a moulded three dimensionally textured surface and a flexible electrically insulating substrate is coated on to the metal surface.
- the fabrication methods used can be any combination of known metal deposition and photo lithographic methods. These methods are adaptable to automated manufacturing with a consequent reduction in costs, production time and skill required.
- This invention preferably uses a technique for fabrication using a selection of the following thin film processes: laser micromachining thin film deposition techniques (electroplating, electroless plating, sputtering, CVD, PVD etc..) moulding sacrificial layers chemical/electrical dissolution electrical debonding • lift-off layers polishing liquid nitrogen cooled flexible substrate and laser patterning
- Step 1 Use of laser micromachining, chemical etching, plasma etching or other lithographic patterning methods to machine a mould with surfaces of dimensions equal to the desired conductor dimensions, such surfaces being recessed or raised (with respect to a reference mould surface) if necessary, and being textured or corrugated if necessary.
- Step 2 If desired, use of a thin film deposition technique to deposit a seed layer on the mould and to electroplate the aforementioned seed layer, to thereby produce a complementary mould.
- Step 3 If desired, application of a lift-off layer (eg sticky tape) to the mould and laser patterning to remove the lift-off layer in the region of conductors.
- a lift-off layer eg sticky tape
- Step 4 If desired, use of a thin film deposition technique to coat the mould with a thin film sacrificial layer.
- Step 5 If desired, use of a thin film deposition technique to coat the mould with platinum thin film.
- Step 6 If desired, use of laser patterning or polishing or lift-off layer removal or any other means to electrically isolate the conductors by removing unwanted platinum film from the mould.
- Step 7 Use of the mould to mould the silicone rubber.
- Step 8 Separation of moulded silicone rubber from the mould, using mechanical force or electrical/chemical dissolution of sacrificial layer or electrical debonding or cryogenic shock or any other means.
- Step 9 If desired, application of a lift-off layer (eg sticky tape) to the moulded silicone and laser patterning to remove the lift-off layer in the region of conductors.
- Step 10 If desired, use of a thin film deposition technique to coat the moulded silicone rubber with platinum thin film.
- a lift-off layer eg sticky tape
- Step 11 If desired, use of polishing or laser patterning or lift-off layer removal or any other means to electrically isolate the conductors by removing unwanted platinum film from the moulded rubber.
- Step 12 Application of another layer of silicone to encapsulate the isolated conductors.
- the developed technique thus has many alternative embodiments, each being defined by a fabrication route that is characterised by a selection of the above steps.
- figure 1 is a cross sectional view of a machined polycarbonate mould and illustrates step 1
- figure 2 is a cross sectional view of a complementary nickel mould and illustrates step 2
- figure 3 is a cross sectional view of a platinum coated silicone casting and illustrates steps 7, 8 and 10
- figure 4 is a cross sectional view of a platinum coated silicone casting after polishing and encapsulation and illustrates steps 11 and 12
- figure 5 is a cross sectional view of a machined polycarbonate mould and illustrates another version of step 1
- figure 6 is a cross sectional view of silicone rubber moulded on a platinum coated polycarbonate mould and illustrates steps 5 and 7
- figure 7 is a cross sectional view of a platinum coated silicone casting after polishing and encapsulation and illustrates steps 8, 11 and 12
- figure 8 a cross sectional view of a machined polycarbonate mould and illustrates another version of step 1
- figure 9 is a cross sectional view of a complementary copper mould and illustrates another version of step 2
- PVD Physical vapour deposition
- the nickel mould is used to make a silicone rubber casting.
- Electroless plating is used to deposit a poorly adhered platinum seed layer onto the polycarbonate mould. The seed layer is electroplated to build up the platinum layer to a thickness of a few microns. Silicone adhesive is applied to the platinum film. The silicone rubber is moulded on the platinum-coated mould.
- Mechanical force is used to remove the silicone casting together with the platinum film from the mould. The platinum-coated silicone casting is cooled with liquid nitrogen and polished, to remove unwanted platinum and electrically isolate the conductors. Another layer of silicone is applied to encapsulate the conductors. Refer to Figure 7.
- Example 3 - Sacrificial Layer Approach a) Excimer laser is used to micromachine a polycarbonate mould consisting of recessed corrugated surfaces. Each surface is 20 mm long (desired length of conductor) and 40 microns wide (desired width of conductor) and recessed by 70 microns. Each surface consists of eight triangular corrugations, each corrugation being 5 microns wide and 5 microns deep. Refer to Figure 8. This method also applies to the case where the height of the corrugations is almost equal to the depth of the trench that is where the conductors are laid onto a series of ribs or ridges. b) Physical vapour deposition (PVD) is used to deposit a copper seed layer onto the aforementioned polycarbonate mould.
- PVD Physical vapour deposition
- the seed layer is electroplated with copper to make a complementary copper mould. Thermal techniques are used to separate the two moulds. Refer to Figure 9. c) The copper mould is electroplated with a layer of platinum, a few microns thick. Silicone adhesive is applied to the platinum, and the silicone is moulded. Refer to Figure 10. d) The copper is then chemically or electrically dissolved, leaving the platinum- coated silicone casting. The platinum-coated silicone casting is cooled with liquid nitrogen and polished, to remove unwanted platinum and electrically isolate the conductors. Another layer of silicone is applied to encapsulate the conductors. Refer to Figure 11.
- the conductors of the present invention can be incorporated into a lead for use in an implantable device, such as a cochlear implant or other implantable device delivering electrical stimulation from a stimulator unit to an electrode.
- the lead is made from a flexible, insulating material, that is compatible with the body, for example a silicone rubber.
- a number of conductor elements extend through the lead and are connected at one end of the lead to an implantable stimulator unit which is capable of generating electrical signals and delivering the electrical signals to be carried by any one of the conductor elements.
- the conductor elements can be connected to a stimulating electrode to allow for the delivery of the electrical signal to the tissue surrounding the stimulating electrode in the form of electrical stimulation.
- the present invention allows for the size of the lead and the associated electrode array to be significantly minimised without increasing the impedance of the conducting elements. It should also be appreciated that any number of conducting elements could be implemented and arranged in any orientation and still fall within the scope of the present invention. It should also be appreciated that the lead could have any cross sectional shape, for example circular, rectangular, square or oval, and still fall within the scope of the present invention.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrotherapy Devices (AREA)
- Manufacturing Of Electric Cables (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AUPR864501 | 2001-11-05 | ||
AUPR8645A AUPR864501A0 (en) | 2001-11-05 | 2001-11-05 | Thin flexible conductors |
PCT/AU2002/001505 WO2003041092A1 (en) | 2001-11-05 | 2002-11-04 | Thin flexible conductors |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1451831A1 EP1451831A1 (en) | 2004-09-01 |
EP1451831A4 true EP1451831A4 (en) | 2006-11-02 |
Family
ID=3832467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP02771903A Withdrawn EP1451831A4 (en) | 2001-11-05 | 2002-11-04 | THIN FLEXIBLE LADDER |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1451831A4 (ja) |
JP (1) | JP2005509251A (ja) |
AU (1) | AUPR864501A0 (ja) |
WO (1) | WO2003041092A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2211325B1 (es) | 2002-12-18 | 2005-12-16 | Instituto Cientifico Y Tecnologico De Navarra, S.A. | Guia portadora de electrodos, especialmente para implantes cocleares, implante coclear provisto de dicha guia, y procedimiento de fabricacion de guias portadoras de electrodos. |
WO2011075480A2 (en) | 2009-12-18 | 2011-06-23 | Advanced Bionics, Llc | Cochlear electrode array |
RU2678637C2 (ru) * | 2013-10-07 | 2019-01-30 | Конинклейке Филипс Н.В. | Структура на основе гибких токопроводящих дорожек и способ ее изготовления |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3438127A (en) * | 1965-10-21 | 1969-04-15 | Friden Inc | Manufacture of circuit modules using etched molds |
US4403818A (en) * | 1980-06-26 | 1983-09-13 | General Motors Corporation | Instrument panel for vehicles |
US4604799A (en) * | 1982-09-03 | 1986-08-12 | John Fluke Mfg. Co., Inc. | Method of making molded circuit board |
US5390412A (en) * | 1993-04-08 | 1995-02-21 | Gregoire; George D. | Method for making printed circuit boards |
WO1999045752A1 (en) * | 1998-03-05 | 1999-09-10 | Obducat Ab | Electric conductor with a surface structure in the form of flanges and etched grooves |
WO2001050825A1 (de) * | 2000-01-04 | 2001-07-12 | Elmicron Ag | Verfahren, anlage und vorrichtung zur herstellung eines elektrischen verbindungselementes sowie elektrisches verbindungselement und halbzeug |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2288531A1 (fr) * | 1974-10-22 | 1976-05-21 | Mattei Josette | Dispositif d'electrodes adaptables a la morphologie corporelle |
US4367755A (en) * | 1979-01-31 | 1983-01-11 | Stimtech, Inc. | Stimulating electrode |
US4497974A (en) * | 1982-11-22 | 1985-02-05 | Exxon Research & Engineering Co. | Realization of a thin film solar cell with a detached reflector |
US4808462A (en) * | 1987-05-22 | 1989-02-28 | Glasstech Solar, Inc. | Solar cell substrate |
JP2000347592A (ja) * | 1999-06-09 | 2000-12-15 | Fujitsu Ltd | 平面表示パネルの電極端子接続方法 |
JP3694825B2 (ja) * | 1999-11-18 | 2005-09-14 | 日本航空電子工業株式会社 | 導体パターンの形成方法及びコネクタ、フレキシブルプリント配線板、異方導電性部材 |
JP2001291436A (ja) * | 2000-04-05 | 2001-10-19 | Showa Electric Wire & Cable Co Ltd | ケーブル用遮水テープおよび遮水ケーブル |
-
2001
- 2001-11-05 AU AUPR8645A patent/AUPR864501A0/en not_active Abandoned
-
2002
- 2002-11-04 JP JP2003543040A patent/JP2005509251A/ja active Pending
- 2002-11-04 WO PCT/AU2002/001505 patent/WO2003041092A1/en active Application Filing
- 2002-11-04 EP EP02771903A patent/EP1451831A4/en not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3438127A (en) * | 1965-10-21 | 1969-04-15 | Friden Inc | Manufacture of circuit modules using etched molds |
US4403818A (en) * | 1980-06-26 | 1983-09-13 | General Motors Corporation | Instrument panel for vehicles |
US4604799A (en) * | 1982-09-03 | 1986-08-12 | John Fluke Mfg. Co., Inc. | Method of making molded circuit board |
US5390412A (en) * | 1993-04-08 | 1995-02-21 | Gregoire; George D. | Method for making printed circuit boards |
WO1999045752A1 (en) * | 1998-03-05 | 1999-09-10 | Obducat Ab | Electric conductor with a surface structure in the form of flanges and etched grooves |
WO2001050825A1 (de) * | 2000-01-04 | 2001-07-12 | Elmicron Ag | Verfahren, anlage und vorrichtung zur herstellung eines elektrischen verbindungselementes sowie elektrisches verbindungselement und halbzeug |
Non-Patent Citations (1)
Title |
---|
See also references of WO03041092A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2003041092A1 (en) | 2003-05-15 |
AUPR864501A0 (en) | 2001-11-29 |
JP2005509251A (ja) | 2005-04-07 |
EP1451831A1 (en) | 2004-09-01 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 20040519 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR |
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AX | Request for extension of the european patent |
Extension state: AL LT LV MK RO SI |
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A4 | Supplementary search report drawn up and despatched |
Effective date: 20060928 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01B 5/14 20060101ALI20060922BHEP Ipc: H05K 3/20 20060101ALI20060922BHEP Ipc: H05K 1/02 20060101AFI20060922BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20081021 |