EP1433741A3 - Method for the closure of openings in a film - Google Patents

Method for the closure of openings in a film Download PDF

Info

Publication number
EP1433741A3
EP1433741A3 EP03079178A EP03079178A EP1433741A3 EP 1433741 A3 EP1433741 A3 EP 1433741A3 EP 03079178 A EP03079178 A EP 03079178A EP 03079178 A EP03079178 A EP 03079178A EP 1433741 A3 EP1433741 A3 EP 1433741A3
Authority
EP
European Patent Office
Prior art keywords
micro
openings
cavities
encapsulation
controlled atmosphere
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP03079178A
Other languages
German (de)
French (fr)
Other versions
EP1433741A2 (en
EP1433741B1 (en
Inventor
Cristina Rusu
Ann Witvrouw
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interuniversitair Microelektronica Centrum vzw IMEC
Original Assignee
Interuniversitair Microelektronica Centrum vzw IMEC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP02447270A external-priority patent/EP1433740A1/en
Application filed by Interuniversitair Microelektronica Centrum vzw IMEC filed Critical Interuniversitair Microelektronica Centrum vzw IMEC
Priority to EP20030079178 priority Critical patent/EP1433741B1/en
Publication of EP1433741A2 publication Critical patent/EP1433741A2/en
Publication of EP1433741A3 publication Critical patent/EP1433741A3/en
Application granted granted Critical
Publication of EP1433741B1 publication Critical patent/EP1433741B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00293—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS maintaining a controlled atmosphere with processes not provided for in B81C1/00285
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0136—Growing or depositing of a covering layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0145—Hermetically sealing an opening in the lid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

A method is described for closing openings in a film, for example, in microelectronic process technology, whereby substantially no deposition material passes through the openings, which can be important if fragile micro devices are positioned under the openings. The closure of these openings can cause an underlying cavity to be hermetically sealed, in which an object can be located. In particular the method provides a way for hermetically sealing cavities under controlled atmosphere and pressure in the encapsulation and sealing processes of cavities comprising fragile content. The cavities may comprise for example Micro Electro Mechanical Systems (MEMS). The method may be used for encapsulating devices which may require a controlled atmosphere and pressure encapsulation such as micro accelerometers, micro gyroscopes, micro tubes, vibration micro sensors, micro mirrors, micro mechanical resonators or "resonant strain gauges", micro mechanical filters, micro switches, micro electrical circuits, micro relays, Integrated Circuits with air gaps etc.
EP20030079178 2002-12-24 2003-12-23 Method for the closure of openings in a film Expired - Lifetime EP1433741B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP20030079178 EP1433741B1 (en) 2002-12-24 2003-12-23 Method for the closure of openings in a film

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP02447270A EP1433740A1 (en) 2002-12-24 2002-12-24 Method for the closure of openings in a film
EP02447270 2002-12-24
US43957903P 2003-01-09 2003-01-09
US439579P 2003-01-09
EP20030079178 EP1433741B1 (en) 2002-12-24 2003-12-23 Method for the closure of openings in a film

Publications (3)

Publication Number Publication Date
EP1433741A2 EP1433741A2 (en) 2004-06-30
EP1433741A3 true EP1433741A3 (en) 2004-07-07
EP1433741B1 EP1433741B1 (en) 2006-10-18

Family

ID=32474914

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20030079178 Expired - Lifetime EP1433741B1 (en) 2002-12-24 2003-12-23 Method for the closure of openings in a film

Country Status (1)

Country Link
EP (1) EP1433741B1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7292111B2 (en) * 2004-04-26 2007-11-06 Northrop Grumman Corporation Middle layer of die structure that comprises a cavity that holds an alkali metal
US8062497B2 (en) 2006-03-28 2011-11-22 Imec Method for forming a hermetically sealed cavity
EP2327659B1 (en) 2009-11-30 2018-07-11 IMEC vzw Method of manufacturing a semiconductor device and semiconductor devices resulting therefrom
JP5760502B2 (en) * 2011-02-25 2015-08-12 富士通株式会社 Electronic device and manufacturing method thereof
JP2012218147A (en) 2011-04-11 2012-11-12 Imec Method for sealing microcavity
WO2015082951A1 (en) 2013-12-06 2015-06-11 Commissariat à l'énergie atomique et aux énergies alternatives Method of hermetically sealing a hole with a fuse material
US9975757B2 (en) * 2015-06-03 2018-05-22 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer Level Hermetic Seal Process for microelectromechanical systems (MEMS) devices
CN113912000A (en) * 2021-11-10 2022-01-11 无锡韦感半导体有限公司 Micromechanical structure and method of fabrication

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0783108A1 (en) * 1996-01-08 1997-07-09 Siemens Aktiengesellschaft Micromechanical element with planarized cover over a cavity and method of fabrication
US5654232A (en) * 1994-08-24 1997-08-05 Intel Corporation Wetting layer sidewalls to promote copper reflow into grooves
WO1999058985A1 (en) * 1998-05-08 1999-11-18 Infineon Technologies Ag Method for producing micromechanical components
US20010002510A1 (en) * 1997-04-22 2001-06-07 Wei-Yung Hsu Cavity-filling method for reducing surface topography and roughness
WO2001058804A2 (en) * 2000-02-09 2001-08-16 Robert Bosch Gmbh Micromechanical component and corresponding production method
DE10052419A1 (en) * 2000-10-23 2002-05-16 Infineon Technologies Ag Production of micromechanical component comprises applying auxiliary layer and membrane layer on substrate, applying spacer layer, back-etching spacer layer, etching auxiliary layer and applying sealing layer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5654232A (en) * 1994-08-24 1997-08-05 Intel Corporation Wetting layer sidewalls to promote copper reflow into grooves
EP0783108A1 (en) * 1996-01-08 1997-07-09 Siemens Aktiengesellschaft Micromechanical element with planarized cover over a cavity and method of fabrication
US20010002510A1 (en) * 1997-04-22 2001-06-07 Wei-Yung Hsu Cavity-filling method for reducing surface topography and roughness
WO1999058985A1 (en) * 1998-05-08 1999-11-18 Infineon Technologies Ag Method for producing micromechanical components
WO2001058804A2 (en) * 2000-02-09 2001-08-16 Robert Bosch Gmbh Micromechanical component and corresponding production method
DE10052419A1 (en) * 2000-10-23 2002-05-16 Infineon Technologies Ag Production of micromechanical component comprises applying auxiliary layer and membrane layer on substrate, applying spacer layer, back-etching spacer layer, etching auxiliary layer and applying sealing layer

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
RUSU C ET AL: "PLANARIZATION OF DEEP TRENCHES", MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS, MATERIALS RESEARCH SOCIETY, PITTSBURG, PA, US, VOL. 4557, PAGE(S) 49-57, ISSN: 0272-9172, XP009008550 *

Also Published As

Publication number Publication date
EP1433741A2 (en) 2004-06-30
EP1433741B1 (en) 2006-10-18

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