EP1417786A1 - Liaisons optiques de donnees a grande vitesse - Google Patents

Liaisons optiques de donnees a grande vitesse

Info

Publication number
EP1417786A1
EP1417786A1 EP02752408A EP02752408A EP1417786A1 EP 1417786 A1 EP1417786 A1 EP 1417786A1 EP 02752408 A EP02752408 A EP 02752408A EP 02752408 A EP02752408 A EP 02752408A EP 1417786 A1 EP1417786 A1 EP 1417786A1
Authority
EP
European Patent Office
Prior art keywords
asic
optical
signals
circuit board
system circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02752408A
Other languages
German (de)
English (en)
Inventor
Wenbin Jiang
Hsing-Chung Lee
Michael J. Hartmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/185,091 external-priority patent/US6665498B1/en
Application filed by Individual filed Critical Individual
Publication of EP1417786A1 publication Critical patent/EP1417786A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
    • H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/50—Transmitters
    • H04B10/501—Structural aspects
    • H04B10/503—Laser transmitters

Definitions

  • This invention relates to optical transmitters, receivers, and transceivers.
  • this invention relates to data links in optical transmitters, receivers, and transceivers.
  • an optical transmitter includes a light source, such as a laser driver and a laser diode
  • an optical receiver includes a light conversion device, such as a post amplifier, a trans-impedance amplifier and a PIN photodiode or an APD.
  • the transmitter or receiver is generally mounted on a network circuit board to interface with other data processing IC chips, such as a serializer or de-serializer, a data framer for coding, such as 8B/10B coding, and a higher level data control IC.
  • This type of structure fails to perform when the data transport rate reaches around 10 Gbps or beyond, as the electric traces on the printed circuit board introduce noises and jitters and distort the signal integrity at such a high frequency.
  • serializer and deserializer be integrated into the transmitter and receiver module or modules to allow electrical interfaces to operate at lower frequency.
  • the electrical interfaces for the data link module will require 16 channels of 622 Mbps.
  • the module which is called a fiber optical transponder, can then be mounted onto the board to interface with other IC chips to fulfill the network management function. Consequently, the module requires many electrical interfaces, typically with more than 50 pins . The large number of pins and the extra internal circuitry dictates that the module size is large.
  • the power consumption is also a serious issue.
  • Another object of the present invention is to provide a new and improved high-speed optical data link capable of conveying data at around 10 Gbps rates or beyond. And another object of the present invention is to provide a new and improved high-speed optical data link that is simple and relatively inexpensive to manufacture.
  • Still another object of the present invention is to provide a new and improved high-speed optical data link that is smaller than prior art devices and less electrical pin counts capable of conveying information at similar rates.
  • a high-speed optical data link including a system board with first and second ASICs mounted thereon.
  • the first ASIC includes a clocking and an equalization function for recovering distorted data.
  • the second ASIC is electrically coupled to the first ASIC for conveying electrical signals therebetween and the second ASIC includes one of a clocking and an equalization function for recovering distorted data.
  • a high-speed optical data link includes a first ASIC coupled to convey electrical information to a remote circuit and a second ASIC electrically coupled to the first ASIC for conveying electrical signals therebetween.
  • a fiber optic receiver module is mounted on the system circuit board and includes a photo diode positioned to receive optical signals from a remote source, a trans-impedance amplifier electrically coupled to the photo diode, and a post-amplifier, such as a limiting amplifier or an auto-gain control circuitry, electrically coupled to the trans-impedance amplifier and to the second ASIC.
  • the second ASIC includes a clocking and an equalization function for data integrity and the first ASIC includes a function for recovering distorted data through the same clocking and an equalization scheme as provided by the second ASIC.
  • a high-speed optical data link also includes a first ASIC coupled to receive electrical information form a remote circuit and a second ASIC electrically coupled to the first ASIC for conveying electrical signals therebetween.
  • a fiber optic transmitter module mounted on the system circuit board includes a laser positioned to convey optical signals to a remote source and a laser driver electrically coupled to the laser and to the second ASIC.
  • the first ASIC includes a clocking and may include an equalization function for data transmission and the second ASIC includes an equalization function for recovering distorted data through the same clocking. It should be noted that both of the last two embodiments described can, optionally, be packaged and included on a common board with the first and second ASICs being common.
  • the embodiments described above include a novel method of electrically communicating information at 10-gigabits per second or beyond on a circuit board.
  • the method includes the steps of providing a system circuit board including a first position and a second position, receiving electrical signals from an external source at the first position on the system circuit board, clocking and equalizing the electrical signals on the system circuit board for providing signals with integrity, conveying the equalized signals to the second position on the system circuit board, and receiving the equalized signals at the second position and recovering distorted signals using a de-clocking and re-timing step.
  • FIG. 1 is a simplified block diagram/top plan of a prior art optical data link
  • FIG. 2 is a simplified high speed optical data link in accordance with the present invention.
  • Data link 100 includes a system board 101 with a fiber optic transponder 110 mounted thereon. Electrical connections for the various components of transponder 110 are not illustrated since they are provided, in a well-known manner, through internal connections in the mounting structure.
  • Transponder 110 includes a serializer/deserializer 112 electrically connected to a transimpedance amplifier and post-amplifier 114, which is in turn electrically connected to PIN photodiode 116.
  • Photodiode 116 is positioned to receive modulated light signals from an optical fiber, represented by an arrow 140.
  • Serializer/deserializer 112 is also electrically connected to a laser driver 118, which is in turn connected to drive a laser diode 120.
  • Input and output electrical signals for transponder 110 are supplied by an electric interface, including connectors and printed circuit board copper traces designated 160, from board level
  • IC chips generally designated 150.
  • the connectors and traces of electrical interface 160 on printed circuit board 101 introduce noises and jitters that distort the signal integrity, at high frequencies (e.g., in the 10-gigabits per second range or above), of signals communicated between transponder 110 and board level IC chips 150. Because of this distortion, electrical interface 160 must operate at lower frequencies, which requires a large number of channels. For example, a 10 Gbps signal is converted by serializer/deserializer 112 into 16 channels of differential signals 622 Mbps . However, the use of serializer/deserializer 112 in transponder 110 and the 16 channels, greatly increases the number of pins or connections in electrical interface 160. The 16 channels and associated connections greatly increases the size and power requirements of transponder 110.
  • Data link 200 includes a system board 201 with a fiber optic transceiver 210 mounted thereon. Electrical connections for the various components of transceiver 210 are not illustrated since they are provided, in a well-known manner, through internal connections in the mounting structure.
  • Transceiver 210 includes a first ASIC 212 electrically connected to a light converting device, illustrated herein for exemplary purposes as a transimpedance/post amplifier 214 electrically connected to a PIN photodiode 216.
  • Photodiode 216 is positioned to receive modulated light signals from an optical fiber, represented by an arrow 240.
  • ASIC 212 is also electrically connected to a light generating device, herein illustrated for exemplary purposes only as a laser driver 218 connected to drive a laser diode 220.
  • Laser diode 220 is positioned to supply modulated output light to an optical fiber, represented by an arrow 230.
  • Input and output electrical signals for transceiver 210 are supplied by an electric interface, including connectors and printed circuit board copper traces and the like designated 260.
  • Board level IC chips, generally designated 250 include a second ASIC 252, which is connected by electrical interface 260 to first ASIC 212 in transceiver 210.
  • transceiver incorporating both an optical transmitter and an optical receiver is illustrated in this example for purposes of explanation, it will be understood that the pair of ASICs can be used with single optical transmitters, single optical receivers, optical transceivers, or any combination of these devices.
  • a 10 Gbps or higher serial electrical interface can be established directly between transceiver 210 and system board 250 through normal electrical interfaces 260, such as pin-grid-array, ball- grid-array, edge connectors, etc.
  • a clock data recovery (CDR) is built into each of the ASICs 212 and 252.
  • each of the ASICs 212 and 252 operate to receive electrical signals from interface 260 and to transmit electrical signals through interface 260.
  • Either ASIC 212 or ASIC 252 retimes and clocks the signal and provides driving power for the transmitting portion.
  • the clock and equalization/retiming can be performed using a variety of techniques, one of which is described in detail in a paper by Abhijit Phanse presented to the IEEE in
  • each fiber optic data link includes a fiber optic transmitter module with a first ASIC to equalize/retime and recover electric data distorted by the electric traces on the system board and a second ASIC mounted in the system printed circuit board to clock and equalize the electric data and provide driving power for transmitting to the optical transmitter module through electric traces on the printed circuit board.
  • the described fiber optic data link system operates at a data rate of more than 5 Gbps.
  • the second ASIC on the system board includes a clocking and equalization function for data transmission over printed circuit traces and the first ASIC in the transmitter module includes a function for recovering the distorted data through the same coding and clocking scheme provided by the second ASIC.
  • the second ASIC on the system board includes a serializer for data serialization, a clocking, and an equalization function, and the driving power for data transmission over printed circuit traces
  • the first ASIC in the transmitter module includes a function for recovering the distorted data through the same clocking scheme provided by the second ASIC.
  • the fiber optic data link includes a fiber optic receiver module mounted on a system printed circuit board.
  • the fiber optic receiver module includes a photo diode, a trans-impedance amplifier, a post- amplifier, and a first ASIC to clock and equalize electric data and provide electric driving power for transmitting to the system printed circuit board through electrical traces on the printed circuit board.
  • the system printed circuit board includes a second ASIC connected and designed to recover electric data distorted by the electric traces on the system printed circuit board.
  • the first ASIC on the receiver module includes a clocking and retiming function for data transmission and provides electric signal driving power
  • the second ASIC on the system board includes a function for recovering the distorted data through the same clocking scheme provided by the first ASIC.
  • the first ASIC on the receiver module includes a clocking and equalization function for data transmission
  • the second ASIC on the system board includes a function for recovering the distorted data through the same clocking scheme provided by the said first ASIC and may further include a de-serializer for data de-serialization.
  • a fiber optic data link system includes a fiber optic transceiver module mounted on a system printed circuit board, the fiber optic transceiver module includes a transmitter, including a laser diode and a laser driver, a receiver and a first ASIC.
  • the receiver includes a photo diode, a trans-impedance amplifier and a post-amplifier.
  • the first ASIC performs clocking and equalization/retiming functions to the data coming from the receiver and provides driving power for transmitting to the system board through electric traces on the printed circuit board.
  • the first ASIC also performs the function of recovering distorted electric data coming from the system board through the electric traces on the printed circuit board for transmitting to the transmitter.
  • the system printed circuit board includes a second ASIC for recovering electric data coming from the optical transceiver and distorted by the electric traces on the system printed circuit board and clocking and equalizing the electric data and providing driving power for transmission on the printed circuit board to the optical transceiver module.
  • the first ASIC on the transceiver module also includes a clocking and equalization/retiming function for data transmission on the receiver side, a function for recovering the distorted data through the same clocking scheme as provided by the second ASIC on the system board, and the second ASIC on the system board includes a function for recovering the distorted data through the same clocking scheme provided by the first ASIC and clocking functions for transmitting data to the transceiver through the electric traces on the circuit board.
  • the first ASIC on the transceiver module also includes a clocking function and coding function for data equalization on the receiver side, a function for recovering the distorted data through the same coding scheme as provided by the second ASIC on the system board.
  • the second ASIC on the system board includes a function for recovering the distorted data through the same retiming and clocking scheme provided by the first ASIC, a clocking and equalization function for transmitting data to the transceiver through the electric traces on the circuit board, a serializer function for data serialization and deserializer for data de-serialization.
  • a new and improved high speed optical data link which includes a pair of ASICs that provide clocking and equalization functions for transmitting data through system boards at rates in the 10-Gbps range or above.
  • the fiber optic module such as transmitter, receiver or transceiver, will have smaller size, lower power consumption, and less electrical pin counts. It is also easier to make the transceiver pluggable.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Optics & Photonics (AREA)
  • Optical Communication System (AREA)
  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)

Abstract

L'invention concerne une liaison optique de données à grande vitesse, qui comprend une carte imprimée système (200), un premier circuit intégré spécifique (212) couplé pour la transmission/réception d'informations à destination/en provenance de circuits de gestion de données de niveau supérieur, et un second circuit intégré spécifique (252) couplé au premier. Un module de fibres optiques monté sur la carte imprimée système comprend un récepteur, un émetteur et le second circuit intégré spécifique Le récepteur est équipé d'une photodiode (216) recevant des signaux optiques, d'un amplificateur d'adaptation d'impédance couplé à la photodiode, et d'un post-amplificateur couplé à l'amplificateur d'adaptation d'impédance et au second circuit intégré spécifique. L'émetteur est équipé d'un laser (220) transmettant des signaux optiques à un récepteur optique distant et d'un circuit d'attaque de laser (218) couplé au laser et au second circuit intégré spécifique. Les deux circuits intégrés spécifiques ont des fonctions de synchronisation et d'égalisation/de réajustement du rythme permettant de récupérer les données échangées qui sont affectées de distorsions, sur la base des traces électriques laissées dans la carte imprimée système, moyennant quoi il est possible d'assurer la transmission de données à un débit égal ou supérieur à 10-20 Gbps.
EP02752408A 2001-07-20 2002-07-17 Liaisons optiques de donnees a grande vitesse Withdrawn EP1417786A1 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US185091 1994-01-21
US30669701P 2001-07-20 2001-07-20
US306697P 2001-07-20
US10/185,091 US6665498B1 (en) 2001-07-20 2002-06-28 High-speed optical data links
PCT/US2002/022726 WO2003009497A1 (fr) 2001-07-20 2002-07-17 Liaisons optiques de donnees a grande vitesse

Publications (1)

Publication Number Publication Date
EP1417786A1 true EP1417786A1 (fr) 2004-05-12

Family

ID=29714775

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02752408A Withdrawn EP1417786A1 (fr) 2001-07-20 2002-07-17 Liaisons optiques de donnees a grande vitesse

Country Status (3)

Country Link
EP (1) EP1417786A1 (fr)
JP (1) JP2004537894A (fr)
CN (1) CN1529955A (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1028456C2 (nl) * 2005-03-03 2006-09-06 Draka Comteq Bv Werkwijze voor het gebruik van een glasvezelnetwerk voor een beperkt werkgebied voor gegevenscommunicatie met een bitsnelheid van ten minste 30 Gbps, werkwijze voor het aanpassen van een glasvezelnetwerk alsmede een glasvezelnetwerk.
CN102496614A (zh) * 2011-11-25 2012-06-13 深圳市易飞扬通信技术有限公司 平行光器件的封装结构及封装方法
US9048958B2 (en) * 2012-04-30 2015-06-02 Avago Technologies General Ip (Singapore) Pte. Ltd. High-speed optical fiber link and a method for communicating optical data signals
US9236946B2 (en) 2012-04-30 2016-01-12 Avago Technologies General Ip (Singapore) Pte. Ltd. Method and apparatus for performing data rate conversion and phase alignment
CN104247306B (zh) 2012-08-28 2017-06-06 华为技术有限公司 光接收器
US9781495B2 (en) * 2014-08-14 2017-10-03 Huawei Technologies Co., Ltd. Optical switch architecture

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO03009497A1 *

Also Published As

Publication number Publication date
JP2004537894A (ja) 2004-12-16
CN1529955A (zh) 2004-09-15

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