EP1408318A1 - Sensor - Google Patents

Sensor Download PDF

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Publication number
EP1408318A1
EP1408318A1 EP03015742A EP03015742A EP1408318A1 EP 1408318 A1 EP1408318 A1 EP 1408318A1 EP 03015742 A EP03015742 A EP 03015742A EP 03015742 A EP03015742 A EP 03015742A EP 1408318 A1 EP1408318 A1 EP 1408318A1
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EP
European Patent Office
Prior art keywords
module
sensor
sensor head
interface
transmitter
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03015742A
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German (de)
French (fr)
Inventor
Hartmut Damm
Ralph Rapp
Thiemo Rössle
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Sick AG
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Sick AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sick AG filed Critical Sick AG
Publication of EP1408318A1 publication Critical patent/EP1408318A1/en
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C19/00—Electric signal transmission systems

Definitions

  • the invention relates to a sensor according to the preamble of claim 1.
  • Sensors for example for optoelectronic monitoring of a given one Surrounding area have a transmitter, a receiver and an electronics unit for controlling the transmitter and for evaluating the received signals on. Furthermore, an I / O unit (input / output unit) is provided, which has an external interface for connecting external devices to the sensor.
  • the disadvantage of the known sensors is that all of the aforementioned Elements are firmly arranged in a housing, so that an individual adjustment to external devices in the sense of a change or extension or a individual adaptation to operational purposes is not easily possible.
  • a completely differently configured sensor can be used, such as for using the sensor on a self-driving vehicle, e.g. for material transport. There is a separate sensor for each application to provide the configured sensor.
  • the object of the invention is to improve the functionality of the sensor.
  • the basic idea of the sensor according to the invention is to split it into two modules to divide, namely on the one hand into a sensor head module with transmitter, receiver and associated electronics unit for the control and provision of signals and on the other hand in an I / O module with an internal interface to the sensor head as well as with one or more external interfaces for connecting external Equipment.
  • the I / O module is designed to be exchangeable, i.e. it is on the sensor head module arranged.
  • the sensor head module thus forms together with the I / O module an entire unit, the sensor head module without the I / O module is not functional.
  • the I / O module determines the external wiring options.
  • the I / O module contains the electrical signals from the sensor head module are delivered, evaluated according to the respective application and implemented, for example to output switching signals. In one application, in which the sensor is used to monitor an area, such Switching signals e.g. the presence of objects in the surveillance area specify.
  • the modular design creates a sensor in which the functionality is significantly increased.
  • the sensor head module with transmitter, receiver and associated electronics, which is the essential element of the sensor, always designed and the same also be configured immediately. So with just a few sensor head modules and a few I / O modules a large variety of different sensors for the most varied Applications and uses can be obtained, which has significant cost advantages offers.
  • I / O module can operate simultaneously has one or more external interfaces, which is therefore very simple are designed to be interchangeable with the I / O module, so that the most varied external devices can be connected without a completely new one Sensor configured with the appropriate interface in software and / or hardware would have to be constructed.
  • the internal interface can advantageously designed as a direct connector using a plug and socket his.
  • I / O module is arranged in a housing recess of the sensor head module. This means that the I / O module is easily inserted into the sensor housing is activated and the plug connection is activated. This makes it compact Unit of the sensor consisting of the sensor head module and the I / O module created, which can also be designed visually appealing.
  • the training according to claim 5 proposes that to the external Interface of the I / O module a system module can be connected.
  • this system module is a so-called system connector, which the individual Customer cable connection and device replacement easier can. It may be advantageous to have different I / O modules with different external ones Provide interfaces to connect different system plugs to be able to increase the variety and functionality.
  • An embodiment of a sensor according to the invention is based on the drawing described, which the three modules of the Sensor represents perspective.
  • the sensor has two basic modules, namely a sensor head module 1 and one I / O module 2.
  • the sensor head module 1 has a housing 3, in which (in the representation of the Drawing not visible) a transmitter, a receiver and an electronics unit for the control of the sensor and the provision of the received Electrical signals corresponding to light signals are arranged.
  • the in the Drawing visible rear of the housing 3 has a housing recess 4th on, in which a plug or socket of an internal interface 5 in the lower Area is arranged.
  • the I / O module 2 also has a housing 6. Inside is located a corresponding electronics unit for the evaluation of those received from the sensor head Signals. On the back of the sensor head module 1 I / O module is (not visible) a socket or a plug of the internal Interface 5. The top of the I / O module 2 also has an external interface 7 on, for example, a system module 8 in the form of a so-called system connector can be connected to the I / O module 2.
  • the I / O module 2 can be replaced and be inserted into the housing recess 4 of the housing 3.
  • the internal Interface 5 between these two modules 1, 2 contacted.
  • the one used I / O module 2 corresponds to the desired application, so that only through the Combination of sensor head 1 and I / O module 2 a certain desired sensor variant with certain properties.

Abstract

A sensor has an electro optical sensor head (1) with recess (4) for and input-output (2) module connected by an internal cable or connector interface (5) with a system module (8) connected through the external interface (7).

Description

Die Erfindung betrifft einen Sensor nach dem Oberbegriff des Anspruchs 1.The invention relates to a sensor according to the preamble of claim 1.

Sensoren beispielsweise zur optoelektronischen Überwachung eines vorgegebenen Umgebungsbereiches weisen einen Sender, einen Empfänger sowie eine Elektronik-Einheit zum Ansteuern des Senders sowie zur Auswertung der Empfangssignale auf. Weiterhin ist eine I/O-Einheit (Input/Output-Einheit) vorgesehen, welche eine externe Schnittstelle zum Anschluss externer Geräte an den Sensor aufweist.Sensors for example for optoelectronic monitoring of a given one Surrounding area have a transmitter, a receiver and an electronics unit for controlling the transmitter and for evaluating the received signals on. Furthermore, an I / O unit (input / output unit) is provided, which has an external interface for connecting external devices to the sensor.

Der Nachteil bei den bekannten Sensoren besteht darin, dass sämtlich vorgenannten Elemente fest in einem Gehäuse angeordnet sind, so dass eine individuelle Anpassung an externe Geräte im Sinne einer Veränderung oder Erweiterung oder eine individuelle Anpassung an Einsatzzwecke nicht ohne weiteres möglich ist.The disadvantage of the known sensors is that all of the aforementioned Elements are firmly arranged in a housing, so that an individual adjustment to external devices in the sense of a change or extension or a individual adaptation to operational purposes is not easily possible.

So muss beispielsweise in stationärer Anwendung zur Überwachung eines Raumbereichs ein vollständig anders konfigurierter Sensor eingesetzt werden, wie beispielsweise für den Einsatz des Sensors an einem selbstfahrenden Fahrzeug, z.B. zum Materialtransport. Für jeden Einsatzzweck ist ein eigener Sensor bzw. ein eigens dafür konfigurierter Sensor bereitzustellen.For example, in a stationary application to monitor a room area a completely differently configured sensor can be used, such as for using the sensor on a self-driving vehicle, e.g. for material transport. There is a separate sensor for each application to provide the configured sensor.

Davon ausgehend liegt der Erfindung die Aufgabe zugrunde, die Funktionalität des Sensors zu verbessern. Based on this, the object of the invention is to improve the functionality of the sensor.

Die technische Lösung ist gekennzeichnet durch die Merkmale im Kennzeichen des Anspruchs 1.The technical solution is characterized by the features in the characterizing part of claim 1.

Die Grundidee des erfindungsgemäßen Sensors besteht darin, ihn in zwei Module zu unterteilen, nämlich einerseits in ein Sensorkopf-Modul mit Sender, Empfänger und zugehöriger Elektronik-Einheit für die Ansteuerung und Bereitstellung von Signalen und andererseits in ein I/O-Modul mit einer internen Schnittstelle zum Sensorkopf sowie mit einer oder mehreren externen Schnittstellen zum Anschluss externer Geräte. Dabei ist das I/O-Modul tauschbar gestaltet, d.h. es ist an dem Sensorkopf-Modul anordenbar. Das Sensorkopf-Modul bildet somit zusammen mit dem I/O-Modul eine Gesamteinheit, wobei das Sensorkopf-Modul ohne das I/O-Modul nicht funktionsfähig ist. Das I/O-Modul bestimmt die externen Beschaltungsmöglichkeiten. Im I/O-Modul werden die elektrischen Signale, die vom Sensorkopf-Modul geliefert werden, entsprechend der jeweiligen Anwendung ausgewertet und umgesetzt, beispielsweise um Schaltsignale auszugeben. In einer Anwendung, in der der Sensor zur Überwachung eines Bereichs eingesetzt ist, können derartige Schaltsignale z.B. das Vorhandensein von Objekten in dem Überwachungsbereich angeben.The basic idea of the sensor according to the invention is to split it into two modules to divide, namely on the one hand into a sensor head module with transmitter, receiver and associated electronics unit for the control and provision of signals and on the other hand in an I / O module with an internal interface to the sensor head as well as with one or more external interfaces for connecting external Equipment. The I / O module is designed to be exchangeable, i.e. it is on the sensor head module arranged. The sensor head module thus forms together with the I / O module an entire unit, the sensor head module without the I / O module is not functional. The I / O module determines the external wiring options. The I / O module contains the electrical signals from the sensor head module are delivered, evaluated according to the respective application and implemented, for example to output switching signals. In one application, in which the sensor is used to monitor an area, such Switching signals e.g. the presence of objects in the surveillance area specify.

Durch die modulare Ausbildung ist ein Sensor geschaffen, bei welchem die Funktionalität erheblich erhöht ist. So kann beispielsweise für verschiedene Varianten des Sensors das Sensorkopf-Modul, mit Sender, Empfänger und zugehöriger Elektronik, der das wesentliche Element des Sensors bildet, immer gleich gestaltet und auch gleich konfiguriert sein. So kann mit wenigen Sensorkopf-Modulen und wenigen I/O-Modulen eine große Vielzahl unterschiedlicher Sensoren für die verschiedensten Anwendungen und Einsatzzwecke erhalten werden, was erhebliche Kostenvorteile bietet.The modular design creates a sensor in which the functionality is significantly increased. For example, for different variants of the Sensors the sensor head module, with transmitter, receiver and associated electronics, which is the essential element of the sensor, always designed and the same also be configured immediately. So with just a few sensor head modules and a few I / O modules a large variety of different sensors for the most varied Applications and uses can be obtained, which has significant cost advantages offers.

Verschiedene Sensorvarianten, beispielsweise für die verschiedenen Einsatzarten, können nun in einfachster Weise durch verschiedene I/O-Module gebildet sein.Different sensor variants, for example for the different types of use, can now be formed in the simplest way by different I / O modules.

Auf diese Weise können die Herstellkosten reduziert werden, da die Variantenvielfalt durch vergleichsweise einfache und tausch bare I/O-Module erzeugbar ist. In this way, the manufacturing costs can be reduced, since the variety of variants can be generated by comparatively simple and exchangeable I / O modules.

Ein weiterer Vorteil des tauschbaren I/O-Moduls ist, dass das I/O-Modul gleichzeitig eine oder mehrere externe Schnittstellen aufweist, die somit in einfachster Weise zusammen mit dem I/O-Modul tauschbar ausgebildet sind, so dass verschiedenste externe Geräte anschließbar sind und zwar ohne dass jeweils ein komplett neuer Sensor mit der passenden Schnittstelle softwaremäßig konfiguriert und/oder hardwaremäßig konstruiert werden müsste.Another advantage of the interchangeable I / O module is that the I / O module can operate simultaneously has one or more external interfaces, which is therefore very simple are designed to be interchangeable with the I / O module, so that the most varied external devices can be connected without a completely new one Sensor configured with the appropriate interface in software and / or hardware would have to be constructed.

Gemäß der Weiterbildung in Anspruch 2 kann die interne Schnittstelle vorteilhafterweise als Direktsteckverbindung unter Verwendung von Stecker und Buchse ausgebildet sein.According to the development in claim 2, the internal interface can advantageously designed as a direct connector using a plug and socket his.

In diesem Fall ist es zweckmäßig, dass gemäß der Weiterbildung in Anspruch 4 das I/O-Modul in einer Gehäuseaussparung des Sensorkopf-Moduls angeordnet ist. Dies bedeutet, dass das I/O-Modul auf einfache Weise in das Sensorgehäuse eingefügt wird und dabei die Steckverbindung aktiviert wird. Dadurch ist eine kompakte Einheit des Sensors bestehend aus dem Sensorkopf-Modul und dem I/O-Modul geschaffen, die auch optisch ansprechend ausgestaltet sein kann.In this case, it is expedient that according to the further development in claim 4 I / O module is arranged in a housing recess of the sensor head module. This means that the I / O module is easily inserted into the sensor housing is activated and the plug connection is activated. This makes it compact Unit of the sensor consisting of the sensor head module and the I / O module created, which can also be designed visually appealing.

Alternativ zur vorerwähnten Direktsteckverbindung ist es gemäß der Weiterbildung in Anspruch 3 auch möglich, die interne Schnittstelle durch ein Kabel zu bilden.According to the further development, it is an alternative to the aforementioned direct plug connection in claim 3 also possible to form the internal interface by a cable.

Schließlich schlägt die Weiterbildung gemäß Anspruch 5 vor, dass an die externe Schnittstelle des I/O-Moduls ein System-Modul anschließbar ist. Bei diesem System-Modul handelt es sich um einen sogenannten Systemstecker, welcher den individuellen Kabelanschluss durch den Kunden sowie den Gerätetausch erleichtern kann. Es kann vorteilhaft sein, verschiedene I/O-Module mit verschiedenen externen Schnittstellen bereitzustellen, um unterschiedliche Systemstecker anschließen zu können und so die Variantenvielfalt und Funktionalität weiter zu erhöhen.Finally, the training according to claim 5 proposes that to the external Interface of the I / O module a system module can be connected. With this system module is a so-called system connector, which the individual Customer cable connection and device replacement easier can. It may be advantageous to have different I / O modules with different external ones Provide interfaces to connect different system plugs to be able to increase the variety and functionality.

Ein Ausführungsbeispiel eines erfindungsgemäßen Sensors wird anhand der Zeichnung beschrieben, welche in einer Art Explosionsdarstellung die drei Module des Sensors perspektivisch darstellt.An embodiment of a sensor according to the invention is based on the drawing described, which the three modules of the Sensor represents perspective.

Der Sensor weist zwei Basis-Module auf, nämlich ein Sensorkopf-Modul 1 sowie ein I/O-Modul 2. The sensor has two basic modules, namely a sensor head module 1 and one I / O module 2.

Das Sensorkopf-Modul 1 besitzt ein Gehäuse 3, in welchem (in der Darstellung der Zeichnung nicht sichtbar) ein Sender, ein Empfänger sowie eine Elektronik-Einheit für die Ansteuerung des Sensors und die Bereitstellung von den empfangenen Lichtsignalen entsprechenden elektrischen Signalen, angeordnet sind. Die in der Zeichnung sichtbare Rückseite des Gehäuses 3 weist eine Gehäuseaussparung 4 auf, in welcher ein Stecker oder eine Buchse einer internen Schnittstelle 5 im unteren Bereich angeordnet ist.The sensor head module 1 has a housing 3, in which (in the representation of the Drawing not visible) a transmitter, a receiver and an electronics unit for the control of the sensor and the provision of the received Electrical signals corresponding to light signals are arranged. The in the Drawing visible rear of the housing 3 has a housing recess 4th on, in which a plug or socket of an internal interface 5 in the lower Area is arranged.

Das I/O-Modul 2 besitzt ebenfalls ein Gehäuse 6. In dessen Inneren befindet sich eine entsprechende Elektronik-Einheit für die Auswertung der vom Sensorkopf erhaltenen Signale. Auf der dem Sensorkopf-Modul 1 zugewandten Rückseite des I/O-Moduls befindet sich (nicht sichtbar) eine Buchse bzw. ein Stecker der internen Schnittstelle 5. Oberseitig weist das I/O-Modul 2 noch eine externe Schnittstelle 7 auf, über die beispielsweise ein System-Modul 8 in Form eines sogenannten Systemsteckers mit dem I/O-Modul 2 verbindbar ist.The I / O module 2 also has a housing 6. Inside is located a corresponding electronics unit for the evaluation of those received from the sensor head Signals. On the back of the sensor head module 1 I / O module is (not visible) a socket or a plug of the internal Interface 5. The top of the I / O module 2 also has an external interface 7 on, for example, a system module 8 in the form of a so-called system connector can be connected to the I / O module 2.

Die Funktionsweise ist wie folgt:It works as follows:

Bei einer gegebenen Sensorkopf-Modul-Variante 1 kann das I/O-Modul 2 ausgewechselt und in die Gehäuseaussparung 4 des Gehäuses 3 eingesetzt werden. Beim Einsetzen dieses I/O-Moduls 2 in das Sensorkopf-Modul 1 wird die interne Schnittstelle 5 zwischen diesen beiden Modulen 1, 2 kontaktiert. Das jeweils eingesetzte I/O-Modul 2 entspricht der gewünschten Anwendung, so dass erst durch die Kombination von Sensorkopf 1 und I/O-Modul 2 eine bestimmte gewünschte Sensorvariante mit bestimmten Eigenschaften erhalten ist.Given a sensor head module variant 1, the I / O module 2 can be replaced and be inserted into the housing recess 4 of the housing 3. When this I / O module 2 is inserted into the sensor head module 1, the internal Interface 5 between these two modules 1, 2 contacted. The one used I / O module 2 corresponds to the desired application, so that only through the Combination of sensor head 1 and I / O module 2 a certain desired sensor variant with certain properties.

Weiter können an die externe Schnittstelle die gewünschten externen Geräten bzw. externen Verbindungen angesteckt werden. Dadurch ist auch der Kabelanschluss erleichtert.Furthermore, the desired external devices or external connections. This is also the cable connection facilitated.

Claims (5)

Sensor
mit einem Sender, einem Empfänger, einer Elektronik-Einheit zum Betreib von Sender und Empfänger sowie mit einer I/O-Einheit mit einer externen Schnittstelle (7) zum Anschluss externer Geräte an den Sensor,
dadurch gekennzeichnet, dass der Sensor wenigstens zwei Module (1, 2) aufweist, nämlich
ein Sensorkopf-Modul (1), umfassend den Sender, den Empfänger und die zugehörige Elektronik-Einheit sowie
ein I/O-Modul (2), umfassend die I/O-Einheit mit der externen Schnittstelle (7) und eine Auswerteeinheit, wobei das I/O-Modul (2) auswechselbar am Sensorkopf-Modul (1) über eine interne Schnittstelle (5) anschließbar ist.sensor
with a transmitter, a receiver, an electronics unit for operating the transmitter and receiver, and with an I / O unit with an external interface (7) for connecting external devices to the sensor,
characterized in that the sensor has at least two modules (1, 2), namely
a sensor head module (1) comprising the transmitter, the receiver and the associated electronics unit and
an I / O module (2) comprising the I / O unit with the external interface (7) and an evaluation unit, the I / O module (2) being exchangeable on the sensor head module (1) via an internal interface (5) can be connected. Sensor nach Anspruch 1,
dadurch gekennzeichnet, dass die interne Schnittstelle (5) als Direktsteckverbindung ausgebildet ist.Sensor according to claim 1,
characterized in that the internal interface (5) is designed as a direct plug connection. Sensor nach Anspruch 1,
dadurch gekennzeichnet, dass die interne Schnittstelle (5) durch ein Kabel gebildet ist.Sensor according to claim 1,
characterized in that the internal interface (5) is formed by a cable. Sensor nach einem der vorhergehenden Ansprüche,
dadurch gekennzeichnet, dass das I/O-Modul (2) in einer Gehäuseaussparung (4) des Sensorkopf-Moduls (1) angeordnet ist.Sensor according to one of the preceding claims,
characterized in that the I / O module (2) is arranged in a housing recess (4) of the sensor head module (1). Sensor nach einem der vorhergehenden Ansprüche,
dadurch gekennzeichnet, dass an die externe Schnittstelle des I/O-Moduls (2) ein System-Modul (8) anschließbar ist.Sensor according to one of the preceding claims,
characterized in that a system module (8) can be connected to the external interface of the I / O module (2).
EP03015742A 2002-10-11 2003-07-10 Sensor Withdrawn EP1408318A1 (en)

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DE20215631U 2002-10-11
DE20215631U DE20215631U1 (en) 2002-10-11 2002-10-11 sensor

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US11703569B2 (en) 2017-05-08 2023-07-18 Velodyne Lidar Usa, Inc. LIDAR data acquisition and control
US11082010B2 (en) 2018-11-06 2021-08-03 Velodyne Lidar Usa, Inc. Systems and methods for TIA base current detection and compensation
US11885958B2 (en) 2019-01-07 2024-01-30 Velodyne Lidar Usa, Inc. Systems and methods for a dual axis resonant scanning mirror
US11933967B2 (en) 2019-08-22 2024-03-19 Red Creamery, LLC Distally actuated scanning mirror

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