EP1377933A1 - Carrier foil for electronic components, for laminating inside chip cards - Google Patents
Carrier foil for electronic components, for laminating inside chip cardsInfo
- Publication number
- EP1377933A1 EP1377933A1 EP02719638A EP02719638A EP1377933A1 EP 1377933 A1 EP1377933 A1 EP 1377933A1 EP 02719638 A EP02719638 A EP 02719638A EP 02719638 A EP02719638 A EP 02719638A EP 1377933 A1 EP1377933 A1 EP 1377933A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- carrier film
- conductive material
- connection
- areas
- partial
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
Definitions
- the invention relates to a carrier film for electronic components for lamination in chip cards with at least one connection area arranged on a carrier film body and having connection areas made of conductive material
- the invention relates to a chip card with a
- Chip card body at least one electronic component (chip) and a carrier film laminated in the chip card body for electronic components with at least one arranged on a carrier film body, with conductive
- the invention relates to a method for producing the carrier film according to the invention.
- the carrier film mentioned can be used in particular as
- Antenna carrier foil for contactless chip cards are used, in which
- the conductor track is designed as an antenna coil.
- chip cards which are already used in a wide range and for different purposes in the prior art, for example as telephone cards, access authorization cards, cash cards or the like
- data exchange between the electronic component arranged on the chip card (chip ) and any other components such as displays or buttons with external readers between three different embodiments.
- the data exchange with external readers takes place via contact areas which are located on the outside of the chip card. exchanges are carried out with the help of readers that work with contactless data transmission.
- the chip card has a corresponding component for contactless data transmission in its chip card body, for example an antenna in the form of an antenna coil.
- antenna coils are accommodated separately in the chip card body, the manufacturing process providing for arranging the antenna coil together with the chip or separately on a special antenna carrier film, which is produced in a separate operation and then implanted into the chip card body by means of a lamination process.
- the top and bottom of the carrier film is covered with one or more plastic layers and added to the chip card body by means of pressure and heat.
- chip cards exist which have both contact areas for contact-based data exchange and antenna coils for contactless data exchange.
- connection areas made of conductive material which connect with the one or more conductor tracks, which form the actual antenna coil and further electrical connections between the components , are connected.
- connection areas are usually designed as rectangular solid areas, like the conductor tracks, preferably consist of a copper layer and usually have side dimensions of approximately 0.5 x 0.5 mm or larger.
- connection areas can also have a round or oval shape, the area dimension being in the range of 0.25 mm 2 or larger.
- the object of the invention is to remedy both the improvement in the end quality of the chip cards and the improvement in the holding forces between the connection areas of the carrier film and the plastic layer surrounding it.
- the carrier film according to the invention can be produced by a method according to the subordinate method.
- connection regions have a plurality of interconnected partial surfaces consisting of the conductive material and free surfaces which are arranged between these partial surfaces and are not coated with the conductive material.
- the connection areas therefore no longer consist of a full surface, as is known from the prior art, but are provided with a plurality of openings, which on the one hand considerably reduces the expansion of the connection areas as a result of the supply of heat becomes.
- the design of the connection areas according to the invention for the plastic layer covering the carrier film offers the possibility that the areas of the connection areas not coated with the conductive material can enter into a much better adhesion with the latter.
- connection areas provided for connection to chip modules it has proven to be advantageous in particular in the case of the connection areas provided for connection to chip modules to design these connection areas as rectangular sections made of conductive material and adjoining free areas surrounded by a conductor track connected to this section.
- adhesion of the covering plastic layer can be significantly increased, in particular in the edge region of the partial areas consisting of conductive material, by the large openings in the area ratio.
- FIG. 1 shows a top view of a carrier film according to the invention with an antenna coil arranged thereon
- FIG. 1 a shows an enlarged illustration of the carrier film from FIG. 1 in the area of connection areas and provided for a connecting bridge
- FIG. 1b shows an enlarged illustration of the carrier film from FIG. 1 in the area of connection areas provided for connection to a chip module.
- the carrier film shown in a plan view in FIG. 1 consists of a carrier film body 1 made of plastic, on which one or more conductor tracks 2 are arranged essentially in an annular manner as an antenna for contactless data transmission.
- a connection area 3 or 4 is arranged on each side of the conductor track 2.
- the connection areas 3, 4 are essentially rectangular with respect to their base area and are used to create a so-called connection bridge between the connection areas, the connection bridge establishing an electrical connection between the connection areas 3, 4 without at the same time the conductor track or connection located between the connection areas To connect conductor tracks.
- the connecting bridge is preferably designed as a two-part web, a non-conductive insulating layer being arranged on the conductor track 2 between the connection regions 3, 4 during manufacture, and a bridge made of conductive paste is then placed over this insulating layer.
- the carrier film has two further connection areas 5, 6, which are used to connect an electronic component, not shown here, for example the chip module of a chip card, into which the antenna carrier film is laminated.
- connection regions 3 to 6 mentioned have a substantially larger surface area than the associated conductor tracks arranged on the antenna carrier film. Since the coefficient of expansion between the connection areas / conductor track material, which is usually copper, and the material of the carrier film is different, when the carrier film is laminated into a chip card body, there is a risk that in the area of the connection areas 3 to 6 in the area of the connection areas 3 to 6 Ripples occur that are still present in the finished chip card body as such are recognizable. In order to remedy this, the mentioned connection surfaces 3, 4 are designed according to the invention in such a way that they have a plurality of interconnected partial surfaces 7 consisting of the conductive material and free surfaces 8 arranged between these partial surfaces and not coated with the conductive material.
- the special design is particularly evident from the enlarged detailed representation of the figure la.
- the partial areas 7 in connection with the areas 8 form a network pattern in the exemplary embodiment shown, the partial areas 7 connected to one another being designed as intersecting conductor tracks with rectangular free areas 8 lying therebetween.
- the free areas 8 lying between the interconnected partial surfaces 7 with a circular plan. It is essential in the design according to the invention that in the case of a base surface which is still approximately the same size as in connection areas of a conventional type, there is no longer a coherent surface made of conductive material, which in turn means a better covering with the plastic film body 1 on the free surfaces of a covering plastic layer enables and at the same time significantly reduces the effect of the different thermal expansion (e.g. bending of the chip card) of the connection areas 3 and 4 and the carrier film, in particular in the lamination process.
- the different thermal expansion e.g. bending of the chip card
- FIG. 1b shows another possible embodiment of the subject matter of the invention.
- the connection areas 5, 6 shown here a certain size of the connection area is necessary due to the technical framework for the connection of the chip modules provided here.
- the connection areas 5, 6 In order to increase the adhesion between the material of the connection areas and the covering plastic in this area as well, the connection areas 5, 6 likewise have free areas 9 which are not coated with the conductive material and which are enclosed by conductor tracks 10, which in turn are covered with the conductor tracks 2 belonging to the coil ring are connected.
- This design also results in an increase in liability for the connection areas 5, 6 in order to improve the card structure of the chip cards provided with the antenna coils according to the invention. LIST OF REFERENCE NUMBERS
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10117994A DE10117994A1 (en) | 2001-04-10 | 2001-04-10 | Carrier foil for electronic components to be laminated into smart cards, includes inter-joined part surfaces of connection zones made of conductive material |
DE10117994 | 2001-04-10 | ||
PCT/DE2002/000686 WO2002084585A1 (en) | 2001-04-10 | 2002-02-26 | Carrier foil for electronic components, for laminating inside chip cards |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1377933A1 true EP1377933A1 (en) | 2004-01-07 |
Family
ID=7681166
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP02719638A Withdrawn EP1377933A1 (en) | 2001-04-10 | 2002-02-26 | Carrier foil for electronic components, for laminating inside chip cards |
Country Status (7)
Country | Link |
---|---|
US (1) | US20040173377A1 (en) |
EP (1) | EP1377933A1 (en) |
CN (1) | CN1286058C (en) |
BR (1) | BR0208833A (en) |
DE (1) | DE10117994A1 (en) |
RU (1) | RU2255374C1 (en) |
WO (1) | WO2002084585A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010034156A1 (en) | 2010-08-11 | 2012-02-16 | Ovd Kinegram Ag | film element |
DE102011114635A1 (en) * | 2011-10-04 | 2013-04-04 | Smartrac Ip B.V. | Chip card and method for producing a chip card |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4416697A1 (en) * | 1994-05-11 | 1995-11-16 | Giesecke & Devrient Gmbh | Data carrier with integrated circuit |
DE4437721A1 (en) * | 1994-10-21 | 1996-04-25 | Giesecke & Devrient Gmbh | Contactless electronic module |
DE19527359A1 (en) * | 1995-07-26 | 1997-02-13 | Giesecke & Devrient Gmbh | Circuit unit and method for manufacturing a circuit unit |
DE19538233A1 (en) * | 1995-10-13 | 1997-04-17 | Siemens Ag | Carrier element for installation in a chip card |
DE69702399T2 (en) * | 1996-08-02 | 2001-02-15 | Schlumberger Systems & Service | COMBINED CHIP CARD |
DE19640260A1 (en) * | 1996-09-30 | 1998-04-02 | Siemens Ag | Contactless chip card |
DE29703548U1 (en) * | 1997-02-27 | 1997-04-10 | Michalk Manfred Dr | Plastic card for an electronic combi card module |
US6651891B1 (en) * | 1997-11-04 | 2003-11-25 | Elke Zakel | Method for producing contactless chip cards and corresponding contactless chip card |
CN1217396C (en) * | 1998-02-13 | 2005-08-31 | 新光电气工业株式会社 | IC card and its frame |
FR2778308B1 (en) * | 1998-04-30 | 2006-05-26 | Schlumberger Systems & Service | METHOD FOR PRODUCING AN ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT |
KR20010085811A (en) * | 1998-09-17 | 2001-09-07 | 엔도 마사루 | Multilayer build-up wiring board |
US6404643B1 (en) * | 1998-10-15 | 2002-06-11 | Amerasia International Technology, Inc. | Article having an embedded electronic device, and method of making same |
JP3513452B2 (en) * | 1999-07-02 | 2004-03-31 | 新光電気工業株式会社 | Non-contact IC card, method of manufacturing non-contact IC card, and planar coil for non-contact IC card |
FR2801709B1 (en) * | 1999-11-29 | 2002-02-15 | A S K | CONTACTLESS OR CONTACT-FREE HYBRID CHIP CARD TO REDUCE THE RISK OF FRAUD |
DE10105163A1 (en) * | 2000-11-06 | 2002-05-16 | Cubit Electronics Gmbh | Process for contacting metallic contact fields arranged on substrate foils comprises preparing contact fields with a lattice structure, positioning the regions to be contacted and pressing together with a light-permeable pressing piece |
-
2001
- 2001-04-10 DE DE10117994A patent/DE10117994A1/en not_active Withdrawn
-
2002
- 2002-02-26 EP EP02719638A patent/EP1377933A1/en not_active Withdrawn
- 2002-02-26 RU RU2003132474/09A patent/RU2255374C1/en not_active IP Right Cessation
- 2002-02-26 US US10/474,357 patent/US20040173377A1/en not_active Abandoned
- 2002-02-26 BR BR0208833-9A patent/BR0208833A/en not_active IP Right Cessation
- 2002-02-26 WO PCT/DE2002/000686 patent/WO2002084585A1/en not_active Application Discontinuation
- 2002-02-26 CN CNB028103920A patent/CN1286058C/en not_active Expired - Fee Related
Non-Patent Citations (2)
Title |
---|
None * |
See also references of WO02084585A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2002084585A8 (en) | 2003-08-07 |
DE10117994A1 (en) | 2002-10-24 |
US20040173377A1 (en) | 2004-09-09 |
RU2255374C1 (en) | 2005-06-27 |
CN1286058C (en) | 2006-11-22 |
BR0208833A (en) | 2005-01-11 |
CN1511302A (en) | 2004-07-07 |
WO2002084585A1 (en) | 2002-10-24 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20031016 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
AX | Request for extension of the european patent |
Extension state: AL LT LV MK RO SI |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: SENGE, CARSTEN |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: SAGEM ORGA GMBH |
|
17Q | First examination report despatched |
Effective date: 20061103 |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: SAGEM ORGA GMBH |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
18W | Application withdrawn |
Effective date: 20070322 |