EP1368136A4 - Methods for cleaning microelectronic structures - Google Patents

Methods for cleaning microelectronic structures

Info

Publication number
EP1368136A4
EP1368136A4 EP02724947A EP02724947A EP1368136A4 EP 1368136 A4 EP1368136 A4 EP 1368136A4 EP 02724947 A EP02724947 A EP 02724947A EP 02724947 A EP02724947 A EP 02724947A EP 1368136 A4 EP1368136 A4 EP 1368136A4
Authority
EP
European Patent Office
Prior art keywords
methods
microelectronic structures
cleaning microelectronic
cleaning
structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02724947A
Other languages
German (de)
French (fr)
Other versions
EP1368136A1 (en
Inventor
James P Deyoung
Stephen M Gross
James B Mcclain
Michael E Cole
David E Brainard
Joseph M Desimone
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MiCell Technologies Inc
Original Assignee
MiCell Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/932,063 external-priority patent/US6562146B1/en
Priority claimed from US09/951,249 external-priority patent/US6641678B2/en
Priority claimed from US09/951,259 external-priority patent/US6596093B2/en
Priority claimed from US09/951,092 external-priority patent/US6613157B2/en
Priority claimed from US09/951,247 external-priority patent/US6602351B2/en
Application filed by MiCell Technologies Inc filed Critical MiCell Technologies Inc
Publication of EP1368136A1 publication Critical patent/EP1368136A1/en
Publication of EP1368136A4 publication Critical patent/EP1368136A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
EP02724947A 2001-02-15 2002-02-14 Methods for cleaning microelectronic structures Withdrawn EP1368136A4 (en)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
US951259 1992-09-25
US26902601P 2001-02-15 2001-02-15
US269026P 2001-02-15
US932063 2001-08-17
US09/932,063 US6562146B1 (en) 2001-02-15 2001-08-17 Processes for cleaning and drying microelectronic structures using liquid or supercritical carbon dioxide
US09/951,249 US6641678B2 (en) 2001-02-15 2001-09-13 Methods for cleaning microelectronic structures with aqueous carbon dioxide systems
US09/951,259 US6596093B2 (en) 2001-02-15 2001-09-13 Methods for cleaning microelectronic structures with cyclical phase modulation
US951092 2001-09-13
US951249 2001-09-13
US09/951,092 US6613157B2 (en) 2001-02-15 2001-09-13 Methods for removing particles from microelectronic structures
US09/951,247 US6602351B2 (en) 2001-02-15 2001-09-13 Methods for the control of contaminants following carbon dioxide cleaning of microelectronic structures
US951247 2001-09-13
PCT/US2002/004398 WO2002066176A1 (en) 2001-02-15 2002-02-14 Methods for cleaning microelectronic structures

Publications (2)

Publication Number Publication Date
EP1368136A1 EP1368136A1 (en) 2003-12-10
EP1368136A4 true EP1368136A4 (en) 2005-10-12

Family

ID=27559475

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02724947A Withdrawn EP1368136A4 (en) 2001-02-15 2002-02-14 Methods for cleaning microelectronic structures

Country Status (5)

Country Link
EP (1) EP1368136A4 (en)
JP (1) JP2004527110A (en)
KR (1) KR20030075185A (en)
CN (1) CN1628000A (en)
WO (1) WO2002066176A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6905555B2 (en) * 2001-02-15 2005-06-14 Micell Technologies, Inc. Methods for transferring supercritical fluids in microelectronic and other industrial processes
US7267727B2 (en) 2002-09-24 2007-09-11 Air Products And Chemicals, Inc. Processing of semiconductor components with dense processing fluids and ultrasonic energy
US6989172B2 (en) 2003-01-27 2006-01-24 Micell Technologies, Inc. Method of coating microelectronic substrates
US20050029492A1 (en) 2003-08-05 2005-02-10 Hoshang Subawalla Processing of semiconductor substrates with dense fluids comprising acetylenic diols and/or alcohols
KR100597656B1 (en) * 2003-10-02 2006-07-07 그린텍이십일 주식회사 Cleaning method and apparatus for manufacturing semiconductor device
US7141496B2 (en) 2004-01-22 2006-11-28 Micell Technologies, Inc. Method of treating microelectronic substrates
WO2005113167A1 (en) * 2004-05-07 2005-12-01 Advanced Technology Materials, Inc. Compositions and methods for drying patterned wafers during manufacture of integrated circuitry products
US7195676B2 (en) 2004-07-13 2007-03-27 Air Products And Chemicals, Inc. Method for removal of flux and other residue in dense fluid systems
KR100708773B1 (en) 2006-01-21 2007-04-17 서강대학교산학협력단 Cleaning process
US8084367B2 (en) 2006-05-24 2011-12-27 Samsung Electronics Co., Ltd Etching, cleaning and drying methods using supercritical fluid and chamber systems using these methods
CN102371254B (en) * 2010-08-11 2013-08-14 中国科学院微电子研究所 Cleaning system
WO2013158526A1 (en) * 2012-04-17 2013-10-24 Praxair Technology, Inc. System for delivery of purified multiple phases of carbon dioxide to a process tool
CN103962345B (en) * 2013-01-29 2017-02-08 无锡华润上华科技有限公司 Method for removing debris of wafer
US20180323063A1 (en) * 2017-05-03 2018-11-08 Applied Materials, Inc. Method and apparatus for using supercritical fluids in semiconductor applications
KR20190138743A (en) * 2018-06-06 2019-12-16 도오꾜오까고오교 가부시끼가이샤 Method for treating substrate and rinsing liquid
KR102378329B1 (en) 2019-10-07 2022-03-25 세메스 주식회사 Apparatus and method for treating substrate
US11239071B1 (en) * 2020-12-03 2022-02-01 Nanya Technology Corporation Method of processing semiconductor device
CN113436998B (en) * 2021-07-02 2022-02-18 江苏鑫华半导体材料科技有限公司 Supercritical carbon dioxide silicon block cleaning device, silicon block processing system and method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330266A (en) * 1995-05-31 1996-12-13 Texas Instr Inc <Ti> Method of cleansing and processing surface of semiconductor device or the like
US5783082A (en) * 1995-11-03 1998-07-21 University Of North Carolina Cleaning process using carbon dioxide as a solvent and employing molecularly engineered surfactants
US6306564B1 (en) * 1997-05-27 2001-10-23 Tokyo Electron Limited Removal of resist or residue from semiconductors using supercritical carbon dioxide
US6067728A (en) * 1998-02-13 2000-05-30 G.T. Equipment Technologies, Inc. Supercritical phase wafer drying/cleaning system
US6242165B1 (en) * 1998-08-28 2001-06-05 Micron Technology, Inc. Supercritical compositions for removal of organic material and methods of using same
US6277753B1 (en) * 1998-09-28 2001-08-21 Supercritical Systems Inc. Removal of CMP residue from semiconductors using supercritical carbon dioxide process

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *

Also Published As

Publication number Publication date
WO2002066176A1 (en) 2002-08-29
CN1628000A (en) 2005-06-15
JP2004527110A (en) 2004-09-02
EP1368136A1 (en) 2003-12-10
KR20030075185A (en) 2003-09-22

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20030916

AK Designated contracting states

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Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Extension state: AL LT LV MK RO SI

A4 Supplementary search report drawn up and despatched

Effective date: 20050831

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20051118