EP1320890A2 - Radiation source and method for producing a lens mould - Google Patents
Radiation source and method for producing a lens mouldInfo
- Publication number
- EP1320890A2 EP1320890A2 EP01956408A EP01956408A EP1320890A2 EP 1320890 A2 EP1320890 A2 EP 1320890A2 EP 01956408 A EP01956408 A EP 01956408A EP 01956408 A EP01956408 A EP 01956408A EP 1320890 A2 EP1320890 A2 EP 1320890A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- radiation source
- semiconductor chips
- radiation
- microlenses
- source according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
- G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00278—Lenticular sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00365—Production of microlenses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Definitions
- the invention relates to a radiation source with a multiplicity of semiconductor chips arranged next to one another.
- the invention further relates to a method for producing a lens shape suitable for producing a field of microlenses.
- Radiation sources such as, for example, luminescent diodes, generally have a semiconductor chip cast into a transparent lens body. It is also known to increase the radiation power of such radiation sources by providing a large number of semiconductor chips. Such radiation sources usually have condenser optics which consist of a lens. However, the radiation density of such radiation sources is often unsatisfactory when it is important to create a luminous radiation source with a small spatial extent.
- the object of the invention is to create a radiation source of high radiance.
- This object is achieved in that a field of lenses forming a hexagonal grid is arranged in the radiation direction in front of the semiconductor chips.
- the hexagonal arrangement of the lenses enables a high areal density of the associated semiconductor chips to be achieved.
- the radiance of the radiation source is correspondingly high. Since the lenses are usually formed by spherical segments, spherical segments with a large radius can be used for the lenses. be chosen. As a result, the radiation-emitting active layer of the semiconductor chips can for the most part be arranged within the egg strass associated with the respective sphere. This results in a high radiation yield with respect to the individual semiconductor chips.
- the invention is also based on the object of providing a rational method for producing a lens shape which is suitable for producing a field of lenses.
- This object is achieved in that the lens shape is molded on a set of balls held by a hexagonal frame.
- the set of balls is, as it were, brought into a hexagonal lattice structure when the balls are close together. It is therefore sufficient to ensure that the socket is completely filled with the balls to be molded.
- Figure 1 is a plan view of a semiconductor chip equipped and already bonded circuit board for the radiation source according to the invention
- Figure 2 is an enlarged cross-sectional view of the circuit board of Figure 1;
- Figure 3 is a plan view of a field of lenses
- FIG. 4 shows a cross section through a casting mold that can be used to produce a microlens field
- Figure 5 is a plan view of the casting mold from Figure 4.
- FIG. 6 shows a cross section through a further device used for the production of the casting mold
- FIG. 7 shows a cross section through the casting device used to produce the microlens field
- Figure 8 is a diagram showing the radiation power as a function of the distance between the top edge of the semiconductor chip and the associated hemispherical microlens.
- Figure 1 shows a plan view of a circuit board 1, which is made of Al 2 0 3 or Si.
- circuit board 1 which is made of Al 2 0 3 or Si.
- connection contacts 2 are formed, of which conductor tracks 3 to
- Semiconductor chips 7 are attached to the chip contact areas 6 and bonded in rows in each case.
- FIG. 2 shows an enlarged detail from a cross section through the printed circuit board 1 provided with microlenses 8. It can be seen that the semiconductor chips 7 are each attached to the chip contact surfaces 6 with an underside 9. The bond wires 5, which lead to an adjacent chip contact area 6 or to one of the contact points 4, are respectively attached to an upper side 10 of the semiconductor chips 7.
- the microlenses 8 are hemispheres with a radius R.
- the geometric center of the microlenses 8 is located at a distance .DELTA.x from the top of the semiconductor chips 7.
- the distance .DELTA.x is selected so that the radiation in each case emitting active layer of the semiconductor chips 7 is located at least half within the Weierstrass' sphere with radius R / n, where n is the refractive index of the material used for the micro lens 8.
- the centers of the egg strass 'spheres coincide with the centers of the microlenses 8. Radiation generated within the Weierstrass' sphere can exit the microlens 8.
- microlenses 8 are expediently cast from synthetic resin.
- the manufacturing process is carried out as follows:
- a first mold plate 11 is produced, which, as shown in FIG. 4, has a central mandrel 12 with a hexagonal cross section which can be seen in FIG.
- the mandrel 12 is arranged on a base 13.
- Dowel pins 14 are located in the vicinity of the base 13.
- a holding frame 15, which has depressions 16 on its inside, is also attached to the first mold plate 11.
- the interior delimited by the holding frame 15 is filled with silicone. This forms a silicone frame 17, the one in the center
- Cross section has hexagonal opening.
- the silicone frame 17 engages in the recesses 16 and can therefore be simple Be attached together with the holding frame 15 to a second mold plate 19 shown in Figure 6.
- the dowel pins 14 also present here serve to align the holding frame 15 and the silicone frame 17 on the second mold plate 19.
- the silicone frame 17 comes to rest on the second mold plate 19 in such a way that the opening 18 of the silicone frame 17 with a socket 20 in the second Form plate 19 is aligned.
- the frame 20 occupies the space of the base 13 of the first mold plate 11 with its side webs 21. It also has a hexagonal cross section. Beads 22 are placed in the holder 20 in a tightly lying manner.
- the spheres 22 have a radius which essentially corresponds to the radius of the microlenses 8 to be produced. Since the holder 20 has a hexagonal cross section and since the beads 22 lie close together, the beads 22 are arranged according to a hexagonal lattice structure.
- the opening 18 is then filled with silicone.
- the casting device 23 has a suction nozzle 25, on which a base plate 26 is attached, which holds the circuit board 1.
- a central suction opening 27 is provided, which leads to the printed circuit board 1.
- the holding frame 15 with the microlens shape 24 is located above the base plate 26. Both are partially covered by a press plate 28, which is connected to the base plate 26 via a screw connection (not shown) and ensures the secure fit of the microlens shape 24 on the base plate 26.
- the dowel pins 14 have left passages 29 in the microlens mold 24 which serve to introduce the synthetic resin into the cavity of the microlens mold 24 above the printed circuit board 1. It should be noted that the circuit board 1 is of course already provided with the semiconductor chips 3 under the microlens mold 24 and is fully bonded.
- FIG. 8 shows a diagram in which the radiation power ⁇ is shown in a solid angle with a half opening angle of 60 °, that is to say an opening angle of 120 ° as a function of the distance ⁇ x.
- the diameters of the microlens 8 were 500 ⁇ m, 600 ⁇ m and 700 ⁇ m. It is clear from FIG. 8 that the radiation power takes the greatest values in the detected solid angle at a distance ⁇ x of 0.1 mm. There is the radiation line power approximately twice as large as without microlenses 8. At this distance, a large part of the active layer of the semiconductor chip 7 also lies within the Weierstrass' see ball of the microlenses 8.
- microlenses 8 For practical reasons, it can nevertheless be advantageous if a diameter of 700 ⁇ m is selected for the microlenses 8, since otherwise problems can occur when bonding the semiconductor chips 7 on the chip contact surfaces 6 and when bonding the bonding wires 5.
- conventional casting resins shrink during curing, which is why the cured microlenses anyway are about 6% smaller than the corresponding shapes of the microlens mold 24.
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10038213A DE10038213A1 (en) | 2000-08-04 | 2000-08-04 | Radiation source and method of making a lens mold |
DE10038213 | 2000-08-04 | ||
PCT/DE2001/002874 WO2002013231A2 (en) | 2000-08-04 | 2001-07-30 | Radiation source and method for producing a lens mould |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1320890A2 true EP1320890A2 (en) | 2003-06-25 |
Family
ID=7651403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01956408A Withdrawn EP1320890A2 (en) | 2000-08-04 | 2001-07-30 | Radiation source and method for producing a lens mould |
Country Status (7)
Country | Link |
---|---|
US (2) | US7262437B2 (en) |
EP (1) | EP1320890A2 (en) |
JP (2) | JP2004506321A (en) |
CN (2) | CN101219568A (en) |
DE (1) | DE10038213A1 (en) |
TW (1) | TW538255B (en) |
WO (1) | WO2002013231A2 (en) |
Families Citing this family (64)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2329756A (en) | 1997-09-25 | 1999-03-31 | Univ Bristol | Assemblies of light emitting diodes |
DE10051159C2 (en) * | 2000-10-16 | 2002-09-19 | Osram Opto Semiconductors Gmbh | LED module, e.g. White light source |
ES2378067T3 (en) | 2002-05-08 | 2012-04-04 | Phoseon Technology, Inc. | High efficiency solid state light source and methods of use and manufacturing |
WO2006072071A2 (en) | 2004-12-30 | 2006-07-06 | Phoseon Technology Inc. | Methods and systems relating to light sources for use in industrial processes |
US8063575B2 (en) | 2002-07-04 | 2011-11-22 | Tridonic Jennersdorf Gmbh | Current supply for luminescent diodes |
DE10230103B4 (en) * | 2002-07-04 | 2012-10-31 | Tridonic Ag | Power supply for light-emitting diodes |
CA2493130A1 (en) | 2002-07-25 | 2004-02-05 | Jonathan S. Dahm | Method and apparatus for using light emitting diodes for curing |
AU2003298561A1 (en) | 2002-08-23 | 2004-05-13 | Jonathan S. Dahm | Method and apparatus for using light emitting diodes |
RU2295174C2 (en) | 2002-08-29 | 2007-03-10 | Широ САКАИ | Light-emitting device incorporating light-emitting components (alternatives) |
US7300182B2 (en) * | 2003-05-05 | 2007-11-27 | Lamina Lighting, Inc. | LED light sources for image projection systems |
US7777235B2 (en) * | 2003-05-05 | 2010-08-17 | Lighting Science Group Corporation | Light emitting diodes with improved light collimation |
US7633093B2 (en) * | 2003-05-05 | 2009-12-15 | Lighting Science Group Corporation | Method of making optical light engines with elevated LEDs and resulting product |
US7095053B2 (en) * | 2003-05-05 | 2006-08-22 | Lamina Ceramics, Inc. | Light emitting diodes packaged for high temperature operation |
US7528421B2 (en) * | 2003-05-05 | 2009-05-05 | Lamina Lighting, Inc. | Surface mountable light emitting diode assemblies packaged for high temperature operation |
US7819550B2 (en) | 2003-10-31 | 2010-10-26 | Phoseon Technology, Inc. | Collection optics for led array with offset hemispherical or faceted surfaces |
US7964883B2 (en) * | 2004-02-26 | 2011-06-21 | Lighting Science Group Corporation | Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb |
EP1735844B1 (en) | 2004-03-18 | 2019-06-19 | Phoseon Technology, Inc. | Use of a high-density light emitting diode array comprising micro-reflectors for curing applications |
US20050225222A1 (en) * | 2004-04-09 | 2005-10-13 | Joseph Mazzochette | Light emitting diode arrays with improved light extraction |
MXPA06014522A (en) * | 2004-06-15 | 2007-03-23 | Henkel Corp | High power led electro-optic assembly. |
US7252408B2 (en) * | 2004-07-19 | 2007-08-07 | Lamina Ceramics, Inc. | LED array package with internal feedback and control |
JP3802910B2 (en) * | 2004-09-13 | 2006-08-02 | ローム株式会社 | Semiconductor light emitting device |
US20090057697A1 (en) * | 2004-10-28 | 2009-03-05 | Henkel Corporation | Led assembly with led-reflector interconnect |
US7821023B2 (en) | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
US9793247B2 (en) | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
DE102005041064B4 (en) * | 2005-08-30 | 2023-01-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Surface-mountable optoelectronic component and method for its production |
JP4521350B2 (en) * | 2005-10-13 | 2010-08-11 | オリンパス株式会社 | Lens array mold and method for manufacturing lens array mold |
TW200741134A (en) * | 2005-12-12 | 2007-11-01 | Koninkl Philips Electronics Nv | Optical device for creating an illumination window |
US9335006B2 (en) | 2006-04-18 | 2016-05-10 | Cree, Inc. | Saturated yellow phosphor converted LED and blue converted red LED |
US10295147B2 (en) * | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
US8115213B2 (en) | 2007-02-08 | 2012-02-14 | Phoseon Technology, Inc. | Semiconductor light sources, systems, and methods |
JP5193490B2 (en) | 2007-04-20 | 2013-05-08 | 株式会社ミツトヨ | Measuring method using tracking laser interferometer |
JP2009099925A (en) * | 2007-09-27 | 2009-05-07 | Tokyo Electron Ltd | Annealing apparatus |
WO2009041466A1 (en) * | 2007-09-27 | 2009-04-02 | Tokyo Electron Limited | Annealing apparatus |
DE102007059548A1 (en) * | 2007-09-28 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Optoelectronic component and coupling-out lens for an optoelectronic component |
TWI384651B (en) * | 2008-08-20 | 2013-02-01 | Au Optronics Corp | A light emitting diodes structure and a light emitting diodes structure forming method |
US9425172B2 (en) | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
KR100998017B1 (en) * | 2009-02-23 | 2010-12-03 | 삼성엘이디 주식회사 | Lens for Light Emitting Diode Package and Light Emitting Diode Package Having The Same |
US8678612B2 (en) | 2009-04-14 | 2014-03-25 | Phoseon Technology, Inc. | Modular light source |
US8653737B2 (en) | 2009-04-14 | 2014-02-18 | Phoseon Technology, Inc. | Controller for semiconductor lighting device |
BR112012005826A2 (en) * | 2009-09-17 | 2016-08-09 | Koninkl Philips Electronics Nv | light emitting module, light emitting device and lighting device |
US8657475B2 (en) | 2009-10-14 | 2014-02-25 | 3M Innovative Properties Company | Light source |
US8465172B2 (en) | 2009-12-17 | 2013-06-18 | Phoseon Technology, Inc. | Lighting module with diffractive optical element |
JP5526876B2 (en) * | 2010-03-09 | 2014-06-18 | 東京エレクトロン株式会社 | Heating device and annealing device |
US8669697B2 (en) | 2010-03-11 | 2014-03-11 | Phoseon Technology, Inc. | Cooling large arrays with high heat flux densities |
DE102010027875A1 (en) | 2010-04-16 | 2011-10-20 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for producing an optoelectronic component |
US8591078B2 (en) | 2010-06-03 | 2013-11-26 | Phoseon Technology, Inc. | Microchannel cooler for light emitting diode light fixtures |
CN203192853U (en) * | 2010-10-26 | 2013-09-11 | 东芝照明技术株式会社 | Light emitting device and illumination device |
US9357592B2 (en) | 2010-11-18 | 2016-05-31 | Phoseon Technology, Inc. | Light source temperature monitor and control |
US9786811B2 (en) | 2011-02-04 | 2017-10-10 | Cree, Inc. | Tilted emission LED array |
US10842016B2 (en) | 2011-07-06 | 2020-11-17 | Cree, Inc. | Compact optically efficient solid state light source with integrated thermal management |
US8872137B2 (en) | 2011-09-15 | 2014-10-28 | Phoseon Technology, Inc. | Dual elliptical reflector with a co-located foci for curing optical fibers |
US9126432B2 (en) | 2011-09-20 | 2015-09-08 | Phoseon Technology, Inc. | Differential Ultraviolet curing using external optical elements |
EP2766762B1 (en) | 2011-10-12 | 2019-07-17 | Phoseon Technology, Inc. | Multiple light collection and lens combinations with co-located foci for curing optical fibers |
US8823279B2 (en) | 2011-10-27 | 2014-09-02 | Phoseon Technology, Inc. | Smart FET circuit |
US8931928B2 (en) | 2011-11-01 | 2015-01-13 | Phoseon Technology, Inc. | Removable window frame for lighting module |
US8851715B2 (en) | 2012-01-13 | 2014-10-07 | Phoseon Technology, Inc. | Lamp ventilation system |
US8888336B2 (en) | 2012-02-29 | 2014-11-18 | Phoseon Technology, Inc. | Air deflectors for heat management in a lighting module |
US8678622B2 (en) | 2012-04-27 | 2014-03-25 | Phoseon Technology, Inc. | Wrap-around window for lighting module |
CN104566210A (en) * | 2013-10-25 | 2015-04-29 | 浚洸光学科技股份有限公司 | Micro structure ranging method |
CN103511975A (en) * | 2013-10-25 | 2014-01-15 | 浙江晶日照明科技有限公司 | Light-emitting device suitable for LED wash wall lamp |
WO2020225195A1 (en) * | 2019-05-09 | 2020-11-12 | Signify Holding B.V. | Improved thermal management in laser-based lighting using a truncated ball lens |
US11149936B2 (en) * | 2020-02-18 | 2021-10-19 | Exposure Illumination Architects, Inc. | Uniformly lit planar field of illumination |
CN111169058B (en) * | 2020-04-13 | 2020-07-03 | 成都菲斯特科技有限公司 | Fresnel lens mold and preparation method thereof and preparation method of Fresnel lens |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1203357A (en) | 1968-12-13 | 1970-08-26 | Rlm Res Corp | Production of lenticular sheets for integral photography |
US4022855A (en) * | 1975-03-17 | 1977-05-10 | Eastman Kodak Company | Method for making a plastic optical element having a gradient index of refraction |
US4165474A (en) * | 1977-12-27 | 1979-08-21 | Texas Instruments Incorporated | Optoelectronic displays using uniformly spaced arrays of semi-sphere light-emitting diodes |
JPS6179269A (en) | 1984-09-26 | 1986-04-22 | Hitachi Micro Comput Eng Ltd | Optical communication equipment |
JPS62262023A (en) | 1986-05-09 | 1987-11-14 | Hitachi Ltd | Liquid crystal display device |
JPS6332972A (en) | 1986-07-26 | 1988-02-12 | Mitsubishi Cable Ind Ltd | Lamp |
DE3827083A1 (en) | 1988-08-10 | 1990-02-15 | Telefunken Electronic Gmbh | AREA SPOTLIGHT |
JPH038204A (en) | 1989-06-05 | 1991-01-16 | Nippon Denyo Kk | Led lamp device |
JP2626305B2 (en) | 1991-04-23 | 1997-07-02 | 日本ビクター株式会社 | How to make a fly-eye lens plate stamper |
JP2900000B2 (en) | 1991-07-12 | 1999-06-02 | タキロン株式会社 | Light emitting display and method of manufacturing the same |
US5439621A (en) * | 1993-04-12 | 1995-08-08 | Minnesota Mining And Manufacturing Company | Method of making an array of variable focal length microlenses |
US5396350A (en) * | 1993-11-05 | 1995-03-07 | Alliedsignal Inc. | Backlighting apparatus employing an array of microprisms |
US5528474A (en) | 1994-07-18 | 1996-06-18 | Grote Industries, Inc. | Led array vehicle lamp |
JP3818320B2 (en) | 1994-09-09 | 2006-09-06 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴイ | Method for producing a mold used for the production of optical elements having optical sub-elements arranged in a pattern with respect to each other and apparatus for carrying out such a method |
JP2951858B2 (en) | 1994-10-17 | 1999-09-20 | シャープ株式会社 | Projection type color liquid crystal display |
US5600148A (en) | 1994-12-30 | 1997-02-04 | Honeywell Inc. | Low power infrared scene projector array and method of manufacture |
JPH08227603A (en) | 1995-02-21 | 1996-09-03 | Koito Mfg Co Ltd | Display lamp for vehicle |
DE19621148A1 (en) * | 1996-05-14 | 1997-12-04 | Magna Reflex Holding Gmbh | Lighting element, especially e.g. for use in motor vehicles |
JPH1012926A (en) * | 1996-06-20 | 1998-01-16 | Toyoda Gosei Co Ltd | Full color emission diode lamp and display |
EP0976589A4 (en) * | 1997-03-18 | 2006-11-08 | Acol Technologies S A | Luminescent diode |
JP4171933B2 (en) | 1997-09-12 | 2008-10-29 | ソニー株式会社 | Planar lens manufacturing method |
JP2001517875A (en) | 1997-09-25 | 2001-10-09 | ユニバーシティ オブ ブリストル | Light irradiation device |
US6339503B1 (en) * | 1998-11-06 | 2002-01-15 | Oni Systems Corp. | Optical interconnect using microlens/minilens relay |
US6665060B1 (en) * | 1999-10-29 | 2003-12-16 | Cytyc Corporation | Cytological imaging system and method |
DE10051159C2 (en) | 2000-10-16 | 2002-09-19 | Osram Opto Semiconductors Gmbh | LED module, e.g. White light source |
US6715901B2 (en) * | 2002-08-15 | 2004-04-06 | Shi-Hwa Huang | Image projector system having a light source that includes at least four light emitting diode modules |
-
2000
- 2000-08-04 DE DE10038213A patent/DE10038213A1/en not_active Withdrawn
-
2001
- 2001-07-17 TW TW090117424A patent/TW538255B/en not_active IP Right Cessation
- 2001-07-30 JP JP2002518497A patent/JP2004506321A/en active Pending
- 2001-07-30 US US10/343,819 patent/US7262437B2/en not_active Expired - Fee Related
- 2001-07-30 CN CNA2008100012624A patent/CN101219568A/en active Pending
- 2001-07-30 CN CNB018137725A patent/CN100517706C/en not_active Expired - Fee Related
- 2001-07-30 WO PCT/DE2001/002874 patent/WO2002013231A2/en active Application Filing
- 2001-07-30 EP EP01956408A patent/EP1320890A2/en not_active Withdrawn
-
2006
- 2006-11-08 JP JP2006302593A patent/JP2007112134A/en active Pending
-
2007
- 2007-08-20 US US11/894,569 patent/US20070290383A1/en not_active Abandoned
Non-Patent Citations (1)
Title |
---|
See references of WO0213231A2 * |
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JP2007112134A (en) | 2007-05-10 |
CN1447983A (en) | 2003-10-08 |
JP2004506321A (en) | 2004-02-26 |
CN100517706C (en) | 2009-07-22 |
WO2002013231A3 (en) | 2002-06-20 |
TW538255B (en) | 2003-06-21 |
DE10038213A1 (en) | 2002-03-07 |
US20070290383A1 (en) | 2007-12-20 |
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