EP1318371A3 - Heat exchange surface with galvanized microstructures with protrusions - Google Patents

Heat exchange surface with galvanized microstructures with protrusions Download PDF

Info

Publication number
EP1318371A3
EP1318371A3 EP02027031A EP02027031A EP1318371A3 EP 1318371 A3 EP1318371 A3 EP 1318371A3 EP 02027031 A EP02027031 A EP 02027031A EP 02027031 A EP02027031 A EP 02027031A EP 1318371 A3 EP1318371 A3 EP 1318371A3
Authority
EP
European Patent Office
Prior art keywords
micro
galvanized
microstructures
protrusions
heat exchange
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP02027031A
Other languages
German (de)
French (fr)
Other versions
EP1318371B1 (en
EP1318371A2 (en
Inventor
Dieter Dr. Gollan
Jovan Prof. Dr.-Ing Mitrovic
Andreas Dr. Schulz
Helmut Pietsch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MICRYON TECHNIK GMBH
Original Assignee
SDK-Technik GmbH
SDK Technik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SDK-Technik GmbH, SDK Technik GmbH filed Critical SDK-Technik GmbH
Publication of EP1318371A2 publication Critical patent/EP1318371A2/en
Publication of EP1318371A3 publication Critical patent/EP1318371A3/en
Application granted granted Critical
Publication of EP1318371B1 publication Critical patent/EP1318371B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/124—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and being formed of pins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/905—Materials of manufacture

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Geometry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

The heat transfer surface (3), on a plate or tube body (4), has a galvanized projecting micro-structure extending from the base surface (3a) with a minimum height of 10 mu m. The base surface is covered with projections (6), wholly or partially, as pin-shaped micro-structures. The longitudinal axes (6c) of the micro-pins are either at right angles to the surface or they are pitched at an angle of 30-90 degrees to the surface. The micro-pins have a thickness (d) of 0.2-100.0 mu m, with a pin density of 10<2>-10<8> per cm<2>. The structures are galvanized on to the surface using a polymer membrane with micro-pores.
EP02027031A 2001-12-06 2002-12-03 Use of a surface for heat transfer, more especially for fluid evaporation and condensation process Expired - Lifetime EP1318371B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10159860 2001-12-06
DE10159860A DE10159860C2 (en) 2001-12-06 2001-12-06 Heat transfer surface with an electroplated microstructure of protrusions

Publications (3)

Publication Number Publication Date
EP1318371A2 EP1318371A2 (en) 2003-06-11
EP1318371A3 true EP1318371A3 (en) 2005-07-13
EP1318371B1 EP1318371B1 (en) 2008-01-16

Family

ID=7708207

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02027031A Expired - Lifetime EP1318371B1 (en) 2001-12-06 2002-12-03 Use of a surface for heat transfer, more especially for fluid evaporation and condensation process

Country Status (6)

Country Link
US (1) US6736204B2 (en)
EP (1) EP1318371B1 (en)
AT (1) ATE384237T1 (en)
DE (2) DE10159860C2 (en)
ES (1) ES2300414T3 (en)
PT (1) PT1318371E (en)

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US20070028588A1 (en) * 2005-08-03 2007-02-08 General Electric Company Heat transfer apparatus and systems including the apparatus
TWI276396B (en) * 2006-01-13 2007-03-11 Ind Tech Res Inst Closed-loop latent heat cooling method, and capillary force or non-nozzle module thereof
US7743821B2 (en) 2006-07-26 2010-06-29 General Electric Company Air cooled heat exchanger with enhanced heat transfer coefficient fins
US20080078535A1 (en) * 2006-10-03 2008-04-03 General Electric Company Heat exchanger tube with enhanced heat transfer co-efficient and related method
DE202007013730U1 (en) 2007-10-01 2008-07-31 Hellwig, Udo, Prof. Dr. Treated surface solid rod for use of chemical reactions in a reactor as a catalyst
DE202007014218U1 (en) 2007-10-10 2008-07-10 Hellwig, Udo, Prof. Dr.-Ing. Device for tempering liquid or gaseous media in solar-thermal plants
DE102008030423B4 (en) * 2007-12-05 2016-03-03 GIB - Gesellschaft für Innovation im Bauwesen mbH Pipe with a surface profile-modified outer surface by pimples
DE102007059153A1 (en) 2007-12-06 2009-06-10 Erk Eckrohrkessel Gmbh Process for increasing the efficiency of the heat and mass transport and the chemical reactivity and selectivity of systems for the transfer of heat energy and systems for technical reaction, in particular heterogeneous catalysis, used with formed structures molded components and methods for the production of microstructures on these components
DE202007018013U1 (en) 2007-12-22 2008-07-03 Hellwig, Udo, Prof. Dr. solar pump
DE102008025544A1 (en) 2008-05-27 2009-12-03 Thomas Endrullat Electronic component cooling method for use in e.g. network blade server system, involves controlling fast initiation of condensation through surface structure of used unit by control unit
US8266802B2 (en) * 2008-06-18 2012-09-18 International Business Machines Corporation Cooling apparatus and method of fabrication thereof with jet impingement structure integrally formed on thermally conductive pin fins
US9163883B2 (en) 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
US20100263842A1 (en) * 2009-04-17 2010-10-21 General Electric Company Heat exchanger with surface-treated substrate
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FR2950134B1 (en) * 2009-09-14 2011-12-09 Commissariat Energie Atomique THERMAL EXCHANGE DEVICE WITH ENHANCED CONVECTIVE BOILING AND IMPROVED EFFICIENCY
FR2950133B1 (en) * 2009-09-14 2011-12-09 Commissariat Energie Atomique THERMAL EXCHANGE DEVICE WITH IMPROVED EFFICIENCY
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WO2011162849A2 (en) * 2010-04-01 2011-12-29 The Board Of Regents Of The Nevada System Of Higher Education, On Behalf Of The University Of Nevada, Reno Device having nano-coated porous integral fins
JP4964327B2 (en) * 2010-04-28 2012-06-27 株式会社神戸製鋼所 Original plate material for heat exchange plate and method for producing original plate material for heat exchange plate
CN102466424A (en) * 2010-11-10 2012-05-23 珠海格力节能环保制冷技术研究中心有限公司 Heat transfer pipe, falling film evaporator, and falling film evaporator heat transfer pipe
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US9417017B2 (en) 2012-03-20 2016-08-16 Thermal Corp. Heat transfer apparatus and method
US20140000857A1 (en) * 2012-06-19 2014-01-02 William P. King Refrigerant repelling surfaces
DE102013018203A1 (en) 2012-10-30 2014-04-30 Josch Strahlschweißtechnik GmbH Method of modifying the surfaces of metallic materials
EP2978941B1 (en) * 2013-03-26 2018-08-22 United Technologies Corporation Turbine engine and turbine engine component with improved cooling pedestals
JP2015010749A (en) * 2013-06-28 2015-01-19 株式会社日立製作所 Heat transfer device
US10371466B2 (en) * 2013-10-15 2019-08-06 Natomics Co., Ltd. Method of preserving heat exchange surface and method of cooling moist air
DE102014002829A1 (en) * 2014-02-27 2015-08-27 Wieland-Werke Ag Metallic heat exchanger tube
JP6219199B2 (en) * 2014-02-27 2017-10-25 株式会社神戸製鋼所 Base plate material to be heat exchange plate, and method for manufacturing the base plate material
CN103900245A (en) * 2014-03-22 2014-07-02 张子春 Multifunctional, efficient, energy-saving and environment-friendly boiler for both heating and steaming
US11092391B2 (en) 2014-04-18 2021-08-17 Rochester Institute Of Technology Enhanced boiling with selective placement of nucleation sites
JP6470135B2 (en) * 2014-07-14 2019-02-13 ユナイテッド テクノロジーズ コーポレイションＵｎｉｔｅｄ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏｒｐｏｒａｔｉｏｎ Additional manufactured surface finish
WO2016014961A1 (en) 2014-07-24 2016-01-28 The University Of Florida Research Foundation, Inc. Cryogenic heat transfer by a nanoporous surface
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
CN106794562B (en) 2014-09-17 2019-07-23 科罗拉多州立大学董事会法人团体 Enable the hot ground plane of microtrabeculae
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes
US20180371631A1 (en) * 2015-11-18 2018-12-27 University Of Houston System Exposed segmented nanostructure arrays
US11015878B2 (en) * 2015-12-16 2021-05-25 Carrier Corporation Heat transfer tube for heat exchanger
US12104856B2 (en) 2016-10-19 2024-10-01 Kelvin Thermal Technologies, Inc. Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems
CN116936500A (en) * 2016-11-08 2023-10-24 开尔文热技术股份有限公司 Method and apparatus for spreading high heat flux in a thermal ground plane
CN107148201B (en) * 2017-07-14 2020-03-31 四川大学 Cooling device utilizing micro boiling high-efficiency heat exchange technology
US11566856B2 (en) * 2017-10-13 2023-01-31 Extractcraft, Llc Heat transfer for extract distillation
US10907480B2 (en) * 2018-09-28 2021-02-02 Raytheon Technologies Corporation Ribbed pin fins
CN115997099A (en) 2020-06-19 2023-04-21 开尔文热技术股份有限公司 Folding thermal ground plane
US20230092781A1 (en) * 2021-09-20 2023-03-23 Apple Inc. Porous oxide for improved titanium-polymer bonding

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JPS5956697A (en) * 1982-05-06 1984-04-02 Agency Of Ind Science & Technol Manufacture of heat transfer surface boiling at low degree of superheat
JPS6066094A (en) * 1983-09-22 1985-04-16 Ishikawajima Harima Heavy Ind Co Ltd Formation of heat transfer pipe wall
DE19650881A1 (en) * 1996-12-07 1998-06-10 Schwerionenforsch Gmbh Producing plastic foils which are electrically conductive in the z=direction and non:conductive in the x= and y= directions
EP1041407A1 (en) * 1999-04-01 2000-10-04 Canon Kabushiki Kaisha Microstructure array, and methods of fabricating a microstructure array, a mold for forming a microstructure array, and a microlens array
US6197180B1 (en) * 1996-02-09 2001-03-06 Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College High aspect ratio, microstructure-covered, macroscopic surfaces
DE10021489A1 (en) * 1999-10-20 2001-06-07 Lin Ching Bin Micro-production process comprises forming electrolyte solution, treating polymer substrate, micro-processing, and contacting with plate cathode

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JPS5956697A (en) * 1982-05-06 1984-04-02 Agency Of Ind Science & Technol Manufacture of heat transfer surface boiling at low degree of superheat
JPS6066094A (en) * 1983-09-22 1985-04-16 Ishikawajima Harima Heavy Ind Co Ltd Formation of heat transfer pipe wall
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DE19650881A1 (en) * 1996-12-07 1998-06-10 Schwerionenforsch Gmbh Producing plastic foils which are electrically conductive in the z=direction and non:conductive in the x= and y= directions
EP1041407A1 (en) * 1999-04-01 2000-10-04 Canon Kabushiki Kaisha Microstructure array, and methods of fabricating a microstructure array, a mold for forming a microstructure array, and a microlens array
DE10021489A1 (en) * 1999-10-20 2001-06-07 Lin Ching Bin Micro-production process comprises forming electrolyte solution, treating polymer substrate, micro-processing, and contacting with plate cathode

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Also Published As

Publication number Publication date
DE10159860A1 (en) 2003-07-24
PT1318371E (en) 2008-04-22
ATE384237T1 (en) 2008-02-15
US6736204B2 (en) 2004-05-18
US20030136547A1 (en) 2003-07-24
DE50211546D1 (en) 2008-03-06
EP1318371B1 (en) 2008-01-16
EP1318371A2 (en) 2003-06-11
DE10159860C2 (en) 2003-12-04
ES2300414T3 (en) 2008-06-16

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