EP1305585A1 - Capacitive pressure sensor - Google Patents

Capacitive pressure sensor

Info

Publication number
EP1305585A1
EP1305585A1 EP01943401A EP01943401A EP1305585A1 EP 1305585 A1 EP1305585 A1 EP 1305585A1 EP 01943401 A EP01943401 A EP 01943401A EP 01943401 A EP01943401 A EP 01943401A EP 1305585 A1 EP1305585 A1 EP 1305585A1
Authority
EP
European Patent Office
Prior art keywords
membrane
base body
pressure
joint
pressure sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP01943401A
Other languages
German (de)
French (fr)
Other versions
EP1305585B1 (en
Inventor
Ulfert Drewes
Andreas Rossberg
Frank Hegner
Elke Schmidt
Jürgen BREME
Thomas Velten
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser SE and Co KG
Original Assignee
Endress and Hauser SE and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2000136433 external-priority patent/DE10036433A1/en
Application filed by Endress and Hauser SE and Co KG filed Critical Endress and Hauser SE and Co KG
Publication of EP1305585A1 publication Critical patent/EP1305585A1/en
Application granted granted Critical
Publication of EP1305585B1 publication Critical patent/EP1305585B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0075—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a ceramic diaphragm, e.g. alumina, fused quartz, glass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G01L9/0048—Details about the mounting of the diaphragm to its support or about the diaphragm edges, e.g. notches, round shapes for stress relief
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm

Definitions

  • the invention relates to a capacitive pressure sensor.
  • Such pressure sensors are widely used in process automation to measure the pressure of different process media, which can be present as liquids, gases or vapors.
  • Such pressure sensors essentially consist of a base body and a membrane, both of which are preferably made of a ceramic or single-crystal
  • a flat recess which is also referred to as a membrane bed and which is completely covered by the membrane, is provided on the base body.
  • the membrane bed and the membrane delimit a measuring chamber which is separated from the actual process medium and which is usually filled with air or with a silicone oil as the pressure transmission medium.
  • the pressure chamber is gas and liquid tight. This requires a considerable effort in the production of the connection membrane base body.
  • Electrodes are provided on the membrane bed and on the underside of the membrane facing the membrane bed, which are mostly used in sputtering, vapor deposition or z. B. in the screen printing process, such as. B. described in US-A 50 50 035, applied. These two electrodes together form the actual measuring capacitor, the measuring signal of which is evaluated.
  • a reference pressure PR acts on the membrane and if this pressure differs from the pressure prevailing in the pressure chamber, the membrane deforms elastically. This leads to a change in the distance between the two electrodes and thus to a change in the capacitance of the measuring capacitor.
  • the capacitance of the measuring capacitor is a measure of the pressure difference. It is used as a measurement signal with the help of a
  • Evaluation electronics to which both electrodes are connected, recorded and evaluated.
  • pressure sensors for relative pressure, absolute pressure and differential pressure, depending on which reference pressure is present in the pressure chamber or on the outside of the membrane.
  • differential pressure sensors In addition to simple pressure sensors, so-called differential pressure sensors are also known which detect the difference between two process pressures. Such differential pressure sensors exist, for. B. from two such described
  • Pressure sensors with the difference that they have a common base body.
  • the measuring chambers are located on the opposite sides of the body. They are connected to each other by a connecting channel that serves to equalize the pressure.
  • two measuring chambers are separated from one another in a base body by a common membrane.
  • the pressure difference between the process pressures prevailing on the two sides of the base body is the measured variable of interest.
  • the membrane and base body are connected to one another by a joint.
  • the joining can e.g. using active solder or a glass frit.
  • a sensor made of monocrystalline material e.g. For example, eutectic bonding, anodic bonding or fusion bonding can be used as the joining technique.
  • the membrane, base body and the joint itself are very heavily stressed by a stress concentration due to notch stresses when there is high pressure in one of the measuring chambers or in both measuring chambers.
  • the membrane or the base body may crack or the membrane-base body connection may tear apart, which leads to a failure of the pressure sensor.
  • a pressure sensor is known from US 5520054, in which the wall in the area of the joint is widened in order to reduce the load on the joint. This measure is very expensive to manufacture.
  • the rigidity of the areas of the ceramic adjoining the joint is reduced. This only reduces the tension directly at the joint. The stress maximum is still in the area of the joint.
  • the object of the invention is to provide a pressure sensor which shifts the stress concentrations arising as a result of notch stresses at the root of the joint into the base body, since the connection of the membrane base body is usually weaker than the bulk material of the base body.
  • Another object of the invention is not only to shift the location of the stress concentration, but to reduce the maximum stresses.
  • the pressure sensor should be simple and inexpensive to manufacture.
  • a pressure sensor with a base body, a membrane connected to the base body via a joint, a measuring capacitor for generating a measurement signal with a first and second electrode, which are respectively applied opposite one another on the membrane or on the base body, where at the end of the joint root in the base body connects a groove.
  • the groove reduces stress concentrations in the joint area.
  • FIG. 2 enlargement section A of FIG. 1 according to a first
  • FIG. 3 detail enlargement A according to FIG. 1 according to a second
  • a first capacitive pressure sensor 10 is shown in supervision, which essentially consists of a cylindrical base body 20 and a circular membrane 30.
  • the membrane 30, which covers a pressure chamber 40, is connected to the base body 20.
  • the connection between the underside 32 of the membrane 30 and the base body 20 takes place along a joint F.
  • FIG. 1b shows a second capacitive pressure sensor 10 in top view, which essentially consists of a cylindrical base body 20 and a circular membrane 30.
  • the membrane 30, which covers a pressure chamber 40, is connected to the base body 20.
  • the underside 32 of the membrane 30 and the base body 20 are firmly connected to one another by bonding.
  • a third capacitive pressure sensor 10 is shown in supervision, which essentially consists of a cylindrical base body 20 and a circular membrane 30.
  • Covered membrane bed 22 is connected to the base body 20.
  • the connection between the underside 32 of the membrane 30 and the base body 20 takes place along a joint F.
  • Base body 20 and membrane 30 consist of a brittle ceramic or single-crystalline material, e.g. Alumina ceramic (Fig. 1a, Fig. 1c) or silicon material (Fig. 1 b).
  • a gas- and liquid-tight joint is z.
  • B. an active braze joint is conceivable, which is produced under vacuum at about 900 C.
  • silicon for example. Fusion bonding can be selected as the connection technique.
  • the membrane 30 and the base body 20 delimit a pressure chamber 40, which either with air or with an almost incompressible liquid such. B. is filled with a silicone oil.
  • the reference pressure PR prevails in the pressure chamber 40 in the unloaded state.
  • the pressure chamber 40 is pressurized via a channel 42.
  • a first electrode 40a is applied to the underside 32 of the membrane 30.
  • a second electrode 40b is applied to the membrane bed 22.
  • the application can e.g. B, by sputtering, vapor deposition or using screen printing technology. If the membrane and base body consist of a semiconductor material, the semiconductor material can be used directly as an electrode without applying a metal layer.
  • the second electrode 40b essentially covers the concave central surface 60. However, it does not necessarily have to cover this completely.
  • the two opposite electrodes 40a, 40b form a measuring capacitor, the capacitance of which depends on the prevailing process pressure P.
  • the layer thicknesses of the electrodes 40a and 40b are exaggerated for clarity.
  • the electrodes 40a, 40b are connected to evaluation electronics, also not shown, via connecting lines (not shown in more detail).
  • a groove 26 adjoins the end of the joint (joint of the joint). In the exemplary embodiment shown, the groove 26 is approximately 1 mm wide and 1 mm deep.
  • the ceramic sensor consists of an active hard solder connection 50. The distance between the membrane 30 and the base body 20 is the smallest in the area of the web 24.
  • the membrane bed 22 is ground and is only a few micrometers deep.
  • U is the outer peripheral line of the membrane bed 22. It runs parallel to the membrane 30.
  • the center line M of the groove 26 is perpendicular to the circumferential line U.
  • the groove shown in FIG. 2 can be easily pressed into ceramic and can therefore be produced practically free of charge when pressing the ceramic base body. By means of an etching process, this shape of the groove can also easily be converted into monocrystalline material, e.g. Silicon.
  • FIGS. 3 to 5 show further preferred exemplary embodiments of the invention which differ only in the respective shape of the groove 26.
  • Fig. 3 and Fig. 4 show grooves with a bulbous or elongated cross section, which can be subsequently worked into a pressed ceramic green body. These grooves are therefore more expensive than the groove shown in FIG. 1, but solve the problem better than the groove from FIG. 2, as simulations using the finite element method show.
  • Fig. 5 shows a groove with a circular cross section, which can be easily introduced into the silicon base body by isotropic etching. According to simulations using the finite element method, the groove shown in FIG. 5 does the job better than the groove from FIG. 2.
  • the fluid in the pressure chamber 40 is pressurized via the channel 42. This increases the pressure in the pressure chamber 40. As the pressure P increases, the membrane 30 will bulge outwards. This creates considerable tension in the base body, in the membrane and in the area of the joint F preferably at the root of the joint. However, these tensions are derived through the groove 26 away from the joint in the direction of the interior of the base body 20. The joint, which often withstands a lower load than the base body, is relieved. In addition, voltage peaks are reduced by the grooves shown in Figures 2, 3, 4, 5. That means the tensions are distributed over a larger area.

Abstract

A diaphragm 30 and basic body 20 of a pressure sensor 10 are interconnected via a joint F. A groove 26 is provided in the basic body 20 in order to reduce the stress concentration in the region of the joint F.

Description

Kapazitiver Drucksensor Capacitive pressure sensor
Die Erfindung betrifft einen kapazitiven Drucksensor.The invention relates to a capacitive pressure sensor.
Derartige Drucksensoren werden vielfach in der Prozeßautomation eingesetzt, um den Druck von unterschiedlichen Prozeßmedien zu messen, die als Flüssigkeiten, Gase oder Dämpfe vorliegen können.Such pressure sensors are widely used in process automation to measure the pressure of different process media, which can be present as liquids, gases or vapors.
Im wesentlichen bestehen derartige Drucksensoren aus einem Grundkörper und einer Membran, welche beide vorzugsweise aus einem keramischen oder einkristallinenSuch pressure sensors essentially consist of a base body and a membrane, both of which are preferably made of a ceramic or single-crystal
Material bestehen. Am Grundkörper ist eine flache Ausnehmung vorgesehen, die auch als Membranbett bezeichnet wird und die von der Membran vollständig überdeckt wird.Material. A flat recess, which is also referred to as a membrane bed and which is completely covered by the membrane, is provided on the base body.
Das Membranbett und die Membran begrenzen eine Messkammer, die vom eigentlichen Prozeßmedium getrennt ist und die in der Regel mit Luft oder mit einem Silikonöl als Druckübertragungsmedium gefüllt ist. Die Druckkammer ist gas- bzw. flüssigkeitsdicht. Dies erfordert einen erheblichen Aufwand bei der Herstellung der Verbindung Membran Grundkörper.The membrane bed and the membrane delimit a measuring chamber which is separated from the actual process medium and which is usually filled with air or with a silicone oil as the pressure transmission medium. The pressure chamber is gas and liquid tight. This requires a considerable effort in the production of the connection membrane base body.
Am Membranbett und der dem Membranbett zugewandten Unterseite der Membran sind jeweils Elektroden vorgesehen, die meist in Sputtertechnik, Aufdampfverfahren oder z. B. im Siebdruckverfahren, wie z. B. in der US-A 50 50 035 beschrieben, aufgebracht werden. Diese beiden Elektroden bilden zusammen den eigentlichen Meßkondensator, dessen Meßsignal ausgewertet wird.Electrodes are provided on the membrane bed and on the underside of the membrane facing the membrane bed, which are mostly used in sputtering, vapor deposition or z. B. in the screen printing process, such as. B. described in US-A 50 50 035, applied. These two electrodes together form the actual measuring capacitor, the measuring signal of which is evaluated.
Wirkt auf die Membran ein Referenzdruck PR und ist dieser Druck unterschiedlich zu dem in der Druckkammer herrschenden Druck, so verformt sich die Membran elastisch. Dies führt zur Änderung des Abstandes der beiden Elektroden und damit zu einer Kapazitätsänderung des Meßkondensators. Die Kapazität des Meßkondensators ist ein Maß für die Druckdifferenz. Sie wird als Meßsignal mit Hilfe einerIf a reference pressure PR acts on the membrane and if this pressure differs from the pressure prevailing in the pressure chamber, the membrane deforms elastically. This leads to a change in the distance between the two electrodes and thus to a change in the capacitance of the measuring capacitor. The capacitance of the measuring capacitor is a measure of the pressure difference. It is used as a measurement signal with the help of a
Auswerteelektronik, an die beide Elektroden angeschlossen sind, erfaßt und ausgewertet. Man unterscheidet zwischen Drucksensoren für Relativdruck, Absolutdruck und Differenzdruck, je nachdem welcher Referenzdruck in der Druckkammer bzw. an der Membranaußenseite vorliegt.Evaluation electronics, to which both electrodes are connected, recorded and evaluated. A distinction is made between pressure sensors for relative pressure, absolute pressure and differential pressure, depending on which reference pressure is present in the pressure chamber or on the outside of the membrane.
Meist spricht man einfach nur vom Druck, der gemessen wird und nicht von der Druckdifferenz, wie es eigentlich zutreffend wäre.Most of the time, one simply speaks of the pressure that is being measured and not of the pressure difference as it would actually be.
Neben einfachen Drucksensoren sind auch sogenannte Differenzdrucksensoren bekannt, die die Differenz zweier Prozeßdrücke erfassen. Derartige Differenzdrucksensoren bestehen z. B. aus zwei solchen beschriebenenIn addition to simple pressure sensors, so-called differential pressure sensors are also known which detect the difference between two process pressures. Such differential pressure sensors exist, for. B. from two such described
Drucksensoren mit dem Unterschied, daß sie einen gemeinsamen Grundkörper aufweisen. Die Meßkammern befinden sich an den gegenüberliegenden Seiten des Grundkörpers. Sie sind durch einen Verbindungskanal, der dem Druckausgleich dient, miteinander verbunden.Pressure sensors with the difference that they have a common base body. The measuring chambers are located on the opposite sides of the body. They are connected to each other by a connecting channel that serves to equalize the pressure.
Bei einem weiteren Differenzdrucksensor sind in einem Grundkörper zwei Messkammern durch eine gemeinsame Membran voneinander getrennt.In a further differential pressure sensor, two measuring chambers are separated from one another in a base body by a common membrane.
In beiden Fällen ist jeweils die Druckdifferenz der an den beiden Seiten des Grundkörpers herrschenden Prozeßdrücke die interessierende Meßgröße.In both cases, the pressure difference between the process pressures prevailing on the two sides of the base body is the measured variable of interest.
Membran und Grundkörper sind über eine Fügung miteinander verbunden. Bei einem keramischen Sensor kann die Fügung z.B. mittels Aktivlot oder einer Glasfritte erfolgen. Bei einem Sensor aus monokristallinem Material kann z. Bsp. eutektisches Bonden, anodisches Bonden oder Fusion Bonden als Fügetechnik verwendet werden.The membrane and base body are connected to one another by a joint. In the case of a ceramic sensor, the joining can e.g. using active solder or a glass frit. With a sensor made of monocrystalline material, e.g. For example, eutectic bonding, anodic bonding or fusion bonding can be used as the joining technique.
An der Fügestelle werden Membran, Grundkörper sowie die Fügestelle selbst durch eine Spannungskonzentration infolge von Kerbspannungen sehr stark belastet, wenn in einer der Meßkammern oder auch in beiden Meßkammern ein hoher Druck herrscht. Im Extremfall kann es zur Rißbildung in der Membran oder in dem Grundkörper oder zu einem Auseinanderreißen der Verbindung Membran-Grundkörper kommen, was zu einem Ausfall des Drucksensors führt. Aus der US 5520054 ist ein Drucksensor bekannt, bei dem zur Verringerung der Belastung der Fügestelle, die Wandung im Bereich der Fügestelle verbreitert wird. Diese Maßnahme ist herstellungstechnisch sehr aufwendig. Außerdem verringert sich die Steifigkeit der an die Fügestelle angrenzenden Bereiche der Keramik. Dadurch wird nur die Spannung unmittelbar an der Fügestelle verringert. Das Spannungsmaximum befindet sich trotzdem weiterhin im Bereich der Fügestelle.At the joint, the membrane, base body and the joint itself are very heavily stressed by a stress concentration due to notch stresses when there is high pressure in one of the measuring chambers or in both measuring chambers. In extreme cases, the membrane or the base body may crack or the membrane-base body connection may tear apart, which leads to a failure of the pressure sensor. A pressure sensor is known from US 5520054, in which the wall in the area of the joint is widened in order to reduce the load on the joint. This measure is very expensive to manufacture. In addition, the rigidity of the areas of the ceramic adjoining the joint is reduced. This only reduces the tension directly at the joint. The stress maximum is still in the area of the joint.
Aufgabe der Erfindung ist es, einen Drucksensor zu schaffen, der die infolge von Kerbspannungen an der Fügestellenwurzel entstehenden Spannungskonzentrationen in den Grundkörper verlagert, da die Verbindung Membran-Grundkörper meistens schwächer ist als das Bulk-Material des Grundkörpers. Eine weitere Aufgabe der Erfindung ist es, nicht nur den Ort der Spannungskonzentration zu verlagern, sondern die maximalen Spannungen zu reduzieren. Außerdem soll der Drucksensor einfach und kostengünstig herstellbar sein.The object of the invention is to provide a pressure sensor which shifts the stress concentrations arising as a result of notch stresses at the root of the joint into the base body, since the connection of the membrane base body is usually weaker than the bulk material of the base body. Another object of the invention is not only to shift the location of the stress concentration, but to reduce the maximum stresses. In addition, the pressure sensor should be simple and inexpensive to manufacture.
Gelöst wird diese Aufgabe durch einen Drucksensor mit einem Grundkörper , einer mit dem Grundkörper über eine Fügung verbundenen Membran, einem Meßkondensator zur Erzeugung eines Meßsignals mit einer ersten und zweiten Elektrode, die jeweils einander gegenüberliegend an der Membran bzw. am Grundkörper aufgebracht sind, wobei sich am Ende der Fugestellenwurzel im Grundkörper eine Nut anschließt.This object is achieved by a pressure sensor with a base body, a membrane connected to the base body via a joint, a measuring capacitor for generating a measurement signal with a first and second electrode, which are respectively applied opposite one another on the membrane or on the base body, where at the end of the joint root in the base body connects a groove.
Durch die Nut werden Spannungskonzentrationen im Bereich der Fügung verringert.The groove reduces stress concentrations in the joint area.
Vorteilhafte Weiterentwicklungen der Erfindung sind in den Unteransprüchen angegeben.Advantageous further developments of the invention are specified in the subclaims.
Die nachfolgenden Ausführungen gelten für kapazitive Drucksensoren und kapazitive Differenzdrucksensoren entsprechend, so daß der Einfachheit halber nur noch kapazitive Drucksensoren behandelt werden.The following explanations apply accordingly to capacitive pressure sensors and capacitive differential pressure sensors, so that, for the sake of simplicity, only capacitive pressure sensors are dealt with.
Nachfolgend ist die Erfindung anhand eines in der Zeichnung dargestellten Ausführungsbeispiels näher beschrieben. Es zeigen: Fig. 1 schematische Aufsicht dreier kapazitiver Drucksensoren,The invention is described in more detail below with reference to an embodiment shown in the drawing. Show it: 1 schematic plan view of three capacitive pressure sensors,
Fig. 2 Ausschnittvergrößerung A gemäß Fig. 1 gemäß einem erstenFig. 2 enlargement section A of FIG. 1 according to a first
Ausführungsbeispielembodiment
Fig. 3 Ausschnittvergrößerung A gemäß Fig. 1 gemäß einem zweitenFig. 3 detail enlargement A according to FIG. 1 according to a second
Ausführungsbeispielembodiment
Fig. 4 Ausschnittvergrößerung A gemäß Fig. 1 gemäß einem dritten4 detail enlargement A according to FIG. 1 according to a third
Ausführungsbeispielembodiment
Fig. 5 Ausschnittvergrößerung A gemäß Fig. 1 gemäß einem vierten5 detail enlargement A according to FIG. 1 according to a fourth
Ausführungsbeispielembodiment
In Fig. 1a ist ein erster kapazitiver Drucksensor 10 in Aufsicht dargestellt, der im wesentlichen aus einem zylinderförmigen Grundkörper 20 und einer kreisförmigen Membran 30 besteht. Die Membran 30, die eine Druckkammer 40 überdeckt, ist mit dem Grundkörper 20 verbunden. Die Verbindung zwischen der Unterseite 32 der Membran 30 und dem Grundkörper 20 erfolgt entlang einer Fügung F.In Fig. 1a, a first capacitive pressure sensor 10 is shown in supervision, which essentially consists of a cylindrical base body 20 and a circular membrane 30. The membrane 30, which covers a pressure chamber 40, is connected to the base body 20. The connection between the underside 32 of the membrane 30 and the base body 20 takes place along a joint F.
In Fig. 1b ist ein zweiter kapazitiver Drucksensor 10 in Aufsicht dargestellt, der im wesentlichen aus einem zylinderförmigen Grundkörper 20 und einer kreisförmigen Membran 30 besteht. Die Membran 30, die eine Druckkammer 40 überdeckt, ist mit dem Grundkörper 20 verbunden. Die Unterseite 32 der Membran 30 und der Grundkörper 20 sind durch Bonden fest miteinander verbunden.1b shows a second capacitive pressure sensor 10 in top view, which essentially consists of a cylindrical base body 20 and a circular membrane 30. The membrane 30, which covers a pressure chamber 40, is connected to the base body 20. The underside 32 of the membrane 30 and the base body 20 are firmly connected to one another by bonding.
In Fig. 1c ist ein dritter kapazitiver Drucksensor 10 in Aufsicht dargestellt, der im wesentlichen aus einem zylinderförmigen Grundkörper 20 und einer kreisförmigen Membran 30 besteht. Die Membran 30, die ein am Grundkörper vorgesehenes1c, a third capacitive pressure sensor 10 is shown in supervision, which essentially consists of a cylindrical base body 20 and a circular membrane 30. The membrane 30, which is provided on the base body
Membranbett 22 überdeckt, ist mit dem Grundkörper 20 verbunden. Die Verbindung zwischen der Unterseite 32 der Membran 30 und dem Grundkörper 20 erfolgt entlang einer Fügung F.Covered membrane bed 22 is connected to the base body 20. The connection between the underside 32 of the membrane 30 and the base body 20 takes place along a joint F.
Grundkörper 20 und Membran 30 bestehen aus einem spröden keramischen oder einkristallinen Material, z.Bsp. Aluminiumoxid-Keramik (Fig. 1a, Fig. 1c) bzw. Silizium- Material (Fig. 1 b). Als gas- und flüssigkeitsdichte Fügung ist bei Keramik z. B. eine Aktivhartlotverbindung denkbar, die unter Vakuum bei ca. 900 C hergestellt wird. Bei Silizium kann z.Bsp. Fusion Bonden als Verbindungstechnik gewählt werden. Im verbundenen Zustand begrenzen die Membran 30 und der Grundkörper 20 eine Druckkammer 40, die entweder mit Luft oder mit einer nahezu inkompressiblen Flüssigkeit z. B. einem Silikonöl gefüllt ist. In der Druckkammer 40 herrscht im unbelasteten Zustand der Referenzdruck PR. Die Druckkammer 40 wird über einen Kanal 42 mit Druck beaufschlagt.Base body 20 and membrane 30 consist of a brittle ceramic or single-crystalline material, e.g. Alumina ceramic (Fig. 1a, Fig. 1c) or silicon material (Fig. 1 b). As a gas- and liquid-tight joint is z. B. an active braze joint is conceivable, which is produced under vacuum at about 900 C. For silicon, for example. Fusion bonding can be selected as the connection technique. In the connected state, the membrane 30 and the base body 20 delimit a pressure chamber 40, which either with air or with an almost incompressible liquid such. B. is filled with a silicone oil. The reference pressure PR prevails in the pressure chamber 40 in the unloaded state. The pressure chamber 40 is pressurized via a channel 42.
Auf der Unterseite 32 der Membran 30 ist eine erste Elektrode 40a aufgebracht. Eine zweite Elektrode 40b ist auf das Membranbett 22 aufgebracht. Das Aufbringen kann z. B, durch Sputtern, Aufdampfen oder in Siebdrucktechnik erfolgen. Bestehen Membran und Grundkörper aus einem Halbleitermaterial, so kann das Halbleitermaterial direkt, ohne Aufbringen einer Metallschicht, als Elektrode verwendet werden. Die zweite Elektrode 40b überdeckt im wesentlichen die konkave Zentralfläche 60. Sie muß diese aber nicht notwendigerweise vollständig überdecken.A first electrode 40a is applied to the underside 32 of the membrane 30. A second electrode 40b is applied to the membrane bed 22. The application can e.g. B, by sputtering, vapor deposition or using screen printing technology. If the membrane and base body consist of a semiconductor material, the semiconductor material can be used directly as an electrode without applying a metal layer. The second electrode 40b essentially covers the concave central surface 60. However, it does not necessarily have to cover this completely.
Die beiden sich gegenüberliegenden Elektroden 40a, 40b bilden einen Meßkondensator, dessen Kapazität vom herrschenden Prozeßdruck P abhängt. Die Schichtdicken der Elektroden 40a bzw. 40b sind zur Verdeutlichung übertrieben stark dargestellt. Die Elektroden 40a, 40b sind über nicht näher dargestellte Anschlußleitungen mit einer ebenfalls nicht dargestellten Auswerteelektronik verbunden.The two opposite electrodes 40a, 40b form a measuring capacitor, the capacitance of which depends on the prevailing process pressure P. The layer thicknesses of the electrodes 40a and 40b are exaggerated for clarity. The electrodes 40a, 40b are connected to evaluation electronics, also not shown, via connecting lines (not shown in more detail).
Die Auswerteelektronik für das Meßsignals des Meßkondensators ist Stand derThe evaluation electronics for the measuring signal of the measuring capacitor is state of the art
Technik. Die Auswerteelektronik, die nicht Gegenstand dieser Erfindung ist, ist deshalb nicht beschrieben.Technology. The evaluation electronics, which is not the subject of this invention, is therefore not described.
Fig. 2 zeigt eine Ausschnittvergrößerung im Bereich der Fügung F gemäß einem ersten Ausführungsbeispiel. Unmittelbar an das Ende der Fügestelle (Fügestellenwurzel) schließt sich eine Nut 26 an. Die Nut 26 ist im dargestellten Ausführungsbeispiel etwa 1mm breit und 1 mm tief. Die Fügung des keramischen Sensors besteht aus einer Aktivhartlotverbindung 50. Im Bereich des Steges 24 ist der Abstand Membran 30 und Grundkörper 20 am geringsten.2 shows an enlarged detail in the area of the joint F according to a first exemplary embodiment. A groove 26 adjoins the end of the joint (joint of the joint). In the exemplary embodiment shown, the groove 26 is approximately 1 mm wide and 1 mm deep. The ceramic sensor consists of an active hard solder connection 50. The distance between the membrane 30 and the base body 20 is the smallest in the area of the web 24.
Dies bedeutet auch, daß hier die Aktivhartlotverbindung extrem dünn ist.This also means that the active braze joint is extremely thin.
Das Membranbett 22 wird geschliffen und ist nur wenig Mikrometer tief. Mit U ist die äußere Umfangsiinie des Membranbetts 22 bezeichnet. Sie verläuft parallel zur Membran 30. Im dargestellten Fall steht die Mittellinie M der Nut 26 senkrecht auf die Umfangsiinie U. Die in Fig. 2 dargestellte Nut läßt sich leicht in Keramik einpressen und kann daher praktisch kostenlos beim Pressen der Keramik-Grundkörper hergestellt werden. Mittels eines Ätzprozesses kann diese Form der Nut auch leicht in monokristallines Material, wie z.Bsp. Silizium, eingearbeitet werden.The membrane bed 22 is ground and is only a few micrometers deep. U is the outer peripheral line of the membrane bed 22. It runs parallel to the membrane 30. In the case shown, the center line M of the groove 26 is perpendicular to the circumferential line U. The groove shown in FIG. 2 can be easily pressed into ceramic and can therefore be produced practically free of charge when pressing the ceramic base body. By means of an etching process, this shape of the groove can also easily be converted into monocrystalline material, e.g. Silicon.
In den Figuren 3 bis 5 sind weitere bevorzugte Ausführungsbeispiele der Erfindung dargestellt, die sich nur in der jeweiligen Form der Nut 26 unterscheiden.FIGS. 3 to 5 show further preferred exemplary embodiments of the invention which differ only in the respective shape of the groove 26.
Fig. 3 und Fig. 4 zeigen Nuten mit bauchigen bzw. länglichen Querschnitt, die nachträglich in einen gepreßten Keramik-Grünling eingearbeitet werden kann. Dies Nuten sind daher kostenintensiver als die in Fig. 1 gezeigte Nut, lösen aber die gestellte Aufgabe besser als die Nut aus Fig. 2 wie Simulationen nach der Finite- Elemente Methode zeigen.Fig. 3 and Fig. 4 show grooves with a bulbous or elongated cross section, which can be subsequently worked into a pressed ceramic green body. These grooves are therefore more expensive than the groove shown in FIG. 1, but solve the problem better than the groove from FIG. 2, as simulations using the finite element method show.
Fig. 5 zeigt eine Nut mit kreisförmigem Querschnitt, die durch isotropes Ätzen leicht in Silizium-Grundkörper eingebracht werden kann. Laut Simulationen nach der Finite- Elemente Methode löst die in Fig. 5 gezeigte Nut die gestellte Aufgabe besser als die Nut aus Abb. 2.Fig. 5 shows a groove with a circular cross section, which can be easily introduced into the silicon base body by isotropic etching. According to simulations using the finite element method, the groove shown in FIG. 5 does the job better than the groove from FIG. 2.
Nachfolgend ist die Funktion der Erfindung anhand eines Drucksensors mit Membranbett näher erläutert.The function of the invention is explained in more detail below with the aid of a pressure sensor with a membrane bed.
Das sich in der Druckkammer 40 befindliche Fluid wird über den Kanal 42 mit Druck beaufschlagt. Dadurch steigt der Druck in der Druckkammer 40 an. Bei wachsendem Druck P wird sich die Membran 30 nach außen ausbeulen. Dadurch entstehen erhebliche Spannungen im Grundkörper, in der Membran sowie im Bereich der Fügung F vorzugsweise an der Fugestellenwurzel. Diese Spannungen werden jedoch durch die Nut 26 von der Fügestelle weg in Richtung des Inneren des Grundkörpers 20 abgeleitet. Die Fügung, welche oft einer geringeren Belastung standhält als der Grundkörper, wird dadurch entlastet. Außerdem werden durch die in den Figuren 2, 3, 4, 5 dargestellten Nuten Spannungsspitzen abgebaut. Das heißt die Spannungen werden über einen größeren Bereich verteilt.The fluid in the pressure chamber 40 is pressurized via the channel 42. This increases the pressure in the pressure chamber 40. As the pressure P increases, the membrane 30 will bulge outwards. This creates considerable tension in the base body, in the membrane and in the area of the joint F preferably at the root of the joint. However, these tensions are derived through the groove 26 away from the joint in the direction of the interior of the base body 20. The joint, which often withstands a lower load than the base body, is relieved. In addition, voltage peaks are reduced by the grooves shown in Figures 2, 3, 4, 5. That means the tensions are distributed over a larger area.
Weiterhin wird durch den in der Druckkammer herrschenden Druck P der äußere Rand der Nut in Richtung Rand 21 gedrückt, dadurch wird die Membran 30 etwas gespannt.Furthermore, the pressure P prevailing in the pressure chamber pushes the outer edge of the groove in the direction of edge 21, as a result of which the membrane 30 is somewhat stretched.
Dieser Effekt läßt sich insbesondere bei Differenzdrucksensoren wirkungsvoll einsetzen. Da bei zwei Kammern Differenzdrucksensoren durch den in den Druckkammern herrschenden Druck die Membran im Bereich der Umfangsiinie U gestaucht wird, was gerade zu einer Verringerung der Spannung in der Membran 30 führt. Diese beiden gegenläufigen Effekte können in ihrer Stärke so gewählt werden, daß sie sich gerade kompensieren. In diesem Fall ist die Membran 30 bei jedem Nenndruck P spannungsfrei. Der Nenndruck hat dann keinen Einfluß mehr auf die Sensorempfindlichkeit. This effect can be used effectively, particularly in the case of differential pressure sensors. Since in two chambers, differential pressure sensors are compressed by the pressure prevailing in the pressure chambers, the membrane in the region of the circumferential line U, which leads to a reduction in the tension in the membrane 30. The strength of these two opposing effects can be chosen in such a way that they compensate each other. In this case, the membrane 30 is free of tension at every nominal pressure P. The nominal pressure then has no influence on the sensor sensitivity.

Claims

Patentansprüche claims
1. Drucksensor mit einem Grundkörper (20) einer mit dem Grundkörper (20) über eine Fügung verbundenen Membran (30), einem Meßkondensator zur Erzeugung eines Meßsignals mit einer ersten und zweiten Elektrode (40a, 40b), die jeweils einander gegenüberliegend am Grundkörper (20) bzw. an der Unterseite (32) der Membran (30) aufgebracht sind, wobei sich an das Ende der Fügung im Grundkörper (20) eine Nut (26) zum Meßkondensator hin anschließt.1. Pressure sensor with a base body (20) of a membrane (30) connected to the base body (20) via a joint, a measuring capacitor for generating a measurement signal with a first and second electrode (40a, 40b), each of which is located opposite one another on the base body ( 20) or on the underside (32) of the membrane (30), with a groove (26) adjoining the measuring capacitor at the end of the joint in the base body (20).
2. Drucksensor nach Anspruch 1 , dadurch gekennzeichnet, daß die Nut (26) einen bauchigen Querschnitt aufweist.2. Pressure sensor according to claim 1, characterized in that the groove (26) has a bulbous cross section.
3. Drucksensor nach Anspruch 1 , dadurch gekennzeichnet, daß die Nut (26) einen länglichen Querschnit aufweist.3. Pressure sensor according to claim 1, characterized in that the groove (26) has an elongated cross section.
4. Drucksensor nach Anspruch 1 , dadurch gekennzeichnet, daß die Nut (26) einen kreisförmigen Querschnit aufweist.4. Pressure sensor according to claim 1, characterized in that the groove (26) has a circular cross-section.
5. Drucksensor nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß der Grundkörper (20) ein Membranbett (22) aufweist.5. Pressure sensor according to one of the preceding claims, characterized in that the base body (20) has a membrane bed (22).
6. Drucksensor nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß der Grundkörper (20) aus keramischen oder monokristallinem Material ist. 6. Pressure sensor according to one of the preceding claims, characterized in that the base body (20) is made of ceramic or monocrystalline material.
EP01943401A 2000-07-26 2001-05-18 Capacitive pressure sensor Expired - Lifetime EP1305585B1 (en)

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DE10036433 2000-07-26
DE2000136433 DE10036433A1 (en) 2000-07-26 2000-07-26 Capacitive pressure sensor has membrane connected to base body via joint and groove to measurement capacitor connects to end of joint in base body
US26403201P 2001-01-26 2001-01-26
US264032P 2001-01-26
PCT/EP2001/005695 WO2002008712A1 (en) 2000-07-26 2001-05-18 Capacitive pressure sensor

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EP (1) EP1305585B1 (en)
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DE50114896D1 (en) 2009-06-25
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ATE431548T1 (en) 2009-05-15
WO2002008712A1 (en) 2002-01-31
AU2001265986A1 (en) 2002-02-05

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