EP1277278A4 - Ensemble de protection conditionneur d'energie a isolation - Google Patents

Ensemble de protection conditionneur d'energie a isolation

Info

Publication number
EP1277278A4
EP1277278A4 EP01922559A EP01922559A EP1277278A4 EP 1277278 A4 EP1277278 A4 EP 1277278A4 EP 01922559 A EP01922559 A EP 01922559A EP 01922559 A EP01922559 A EP 01922559A EP 1277278 A4 EP1277278 A4 EP 1277278A4
Authority
EP
European Patent Office
Prior art keywords
conditioner
energy
conductive
conductor
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01922559A
Other languages
German (de)
English (en)
Other versions
EP1277278A1 (fr
Inventor
Anthony A Anthony
William M Anthony
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
X2Y Attenuators LLC
Original Assignee
X2Y Attenuators LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by X2Y Attenuators LLC filed Critical X2Y Attenuators LLC
Publication of EP1277278A1 publication Critical patent/EP1277278A1/fr
Publication of EP1277278A4 publication Critical patent/EP1277278A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0018—Casings with provisions to reduce aperture leakages in walls, e.g. terminals, connectors, cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/102—Varistor boundary, e.g. surface layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/35—Feed-through capacitors or anti-noise capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H01L2223/6622—Coaxial feed-throughs in active or passive substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Definitions

  • Filters and filter assemblies used with electrical connectors are normally provided for the purpose of protecting sensitive electrical components from transient currents and voltages which develop in a transmission cable due to electromagnetic and radio frequency interference. Such transients are generally high frequency waveforms, and therefore capacitive or tuned pi circuits may be used to shunt the transients to ground without affecting the primary signal carried by the cable.
  • tubular capacitors are normally mounted on the same side of a common ground area within an electrical circuit or electronic device and are primarily effective against common mode noise. Combining these components on the same side of a common ground plane or external conductive area yields a circuit that is susceptible to EMI problems such as ground bounce and cross talk.
  • EMI problems such as ground bounce and cross talk.
  • the claimed invention provides such a filter assembly by arranging the conventional materials and energy conditioners into a two or three energy pathway system and filter structure to accommodate today's EMI/EMC requirements as well as industry economics.
  • FIG. 1 is a cross-sectional side view of common conductive substrate assembly 10 comprising paired multilayer energy conditioners arranged in a conductive substrate assembly and located on opposite sides of a grounding configuration in accordance with the present invention.
  • FIG. 2 is a cross-sectional side view of common conductive substrate assembly 20 comprised of paired monolithic energy conditioners arranged in a conductive substrate assembly and located on opposite sides of a grounding configuration now placed in a connector assembly called connector assembly 30 in accordance with the present invention.
  • FIG. 3 is a cross-sectional top view of FIG. 2 taken along dotted line "A" showing common conductive substrate assembly 20 comprising tubular energy conditioners arranged in a conductive substrate assembly and located on opposite sides of a grounding configuration now placed in a connector assembly called connector assembly 30 in accordance with the present invention.
  • FIG. 4 is a cross-sectional top view of FIG. 2 taken along dotted line "A” showing common conductive substrate assembly 20 comprising tubular energy conditioners arranged in a conductive substrate assembly and located on opposite sides of a grounding configuration now placed in a connector assembly called connector assembly 30 in accordance with the present invention.
  • the new invention is created when prior art components are placed and combined together in a new way which yields unique and unexpected results when configured into a paired or multiple-paired filter assembly for paired or multiple- paired differential energy conditioning along circuit lines.
  • paired or multiple- paired elements of prior art such as conductive pin electrodes which are considered herein as differential energy conductors 100A and 100B are combined and amalgamated either before coupling with sleeve 109 or after within standard tubular shaped or rolled tubular elements.
  • the filter assembly When energized these combined or amalgamated elements with a few others, will create with the use of a coupled external conductive area, an image plane or voltage reference node, as well as a low impedance path for portions of propagating energies to move.
  • the filter assembly is practicable for such functions as physically opposing and electrically complementary energy field portion cancellations and/or suppressions, cancellations of mutually coupled inductance fields as well as substantial elimination and/or prevention of ground bounce and cross talk between the differential lines in terms of cross-talk and the between each differential unit and the low impedance energy pathway in terms of ground bounce blocking and prevention.
  • paired energy conditioners such as 500A and 500B and 600A and 600B of FIGS. 1 and 2 are separated physically from one another on either side of an external conductive area, when energized will become isolated from each other electrically, and thus, an image or ground plane is created with the conductive substrate 111 serving as that function.
  • circuit energy is able to utilize the filters' ability to provide portions of these propagating electrically differential energies the function of conditioning of both differential and common mode noise, simultaneously.
  • Each set of oppositely paired, complementary, energy conditioners such as 500A and 500B and 600A and 600B of FIGS. 1 and 2 and their respective differential electrodes, will operate electrically approximately 180 degrees out of phase to the other during energized operations.
  • the physical element arrangement, as well as the electrical circuit arrangement includes a state or a condition that is called "opposite sides of an image reference or reference ground" Opposite sides of the conductive substrate 111 refers to both physically opposite in a static state, and will be referred to as an electrically opposite positioning in an energized state.
  • the new energy conditioner filter array or assembly comprises a singular conductive structure 111 that is configured to allow for at least one selective isolation function to be created or operable after this energy conditioning element is mounted with and conductively coupled to the energy conditioners during a non-energized state.
  • the singular conductive structure 111 will also be operable for an additional, selective isolation function during energized operations. Both selective isolation functions will then carry forward simultaneously, in an energized circuit operation.
  • the selective isolation functions will have energy conditioning effects upon propagating energies that are moving along and/or through the various energy conditioners and the differential energy conductors that are amalgamated or combined within portions of the conductive structure 111.
  • This concept is a keystone for providing predetermined electrical and physical isolation of paired energy pathways located both, physically and electrically (when energized) on the opposite side of ground or the conductive substrate.
  • This conductive substrate 111 also serves as a conductive shielding structure mated with at least the paired energy conditioners to comprise a grouped, electronic circuit conditioning assembly that is physically or structurally, symmetrical, and balanced in terms of the conductive structural elements.
  • This invention is used to provide a multitude of line conditioning functions such as, but not limited to providing power and signal line filtering, minimizing cross talk, the availability of at least three isolating energy pathways for circuit connection, a portion of energized circuitry that is practicable for performing simultaneous differential and common mode filtering of power and/or signal lines, a wide ranging filtering characteristic for electromagnetic interference (EMI) protection and/or the ability to provide protection from surge events.
  • line conditioning functions such as, but not limited to providing power and signal line filtering, minimizing cross talk, the availability of at least three isolating energy pathways for circuit connection, a portion of energized circuitry that is practicable for performing simultaneous differential and common mode filtering of power and/or signal lines, a wide ranging filtering characteristic for electromagnetic interference (EMI) protection and/or the ability to provide protection from surge events.
  • EMI electromagnetic interference
  • this invention includes the ability of the user to have a predetermined and pre-positioned selection opportunity for various energy conditioning element configurations that allow for accommodating relatively high pulse currents without degradation or failure in either a by-pass or feed-through configuration by converging the three distinct and electrically isolated energy propagational pathways within a single filter assembly device amalgamation.
  • the conductive substrate 111 also serves as at least the third energy pathway of the three existing isolating energy pathways to be practicable when the assembly is energized to become the isolated third energy pathway or third conductive energy pathway that will provide portions of propagating energies and energy pathway of least or low impedance, due to the extraordinarily, low inductance created within the filter assembly during energized operations.
  • conductive substrate 111 of the filter assembly like those shown in FIGS. 1 and 2 has the ability to offer a blocking function to portions of energies that have left the assembly's area of convergence (AOC) and is now under the influence of the external common conductive energy pathway from attempting to return.
  • AOC area of convergence
  • the conductive substrate 111 is primarily used as a third conductive energy pathway , it will not normally be electrically connected to either a portion of the first conductive energy pathway 112 (not fully shown) or a portion of the second conductive energy pathway 102 (not fully shown), which are serving as the complementary energy pathways during differential energy operations.
  • tubular energy conditioners or tubular capacitors 500A and 500B and 600A and 600B (as used in this variation) of FIG. 1 and FIG. 2 or the energy conditioners or passive components will now be described.
  • the tubular capacitors are generally known in the art for their use in a wide range of electronic circuit applications. For example, these uses include, use as charge storage device, a circuit coupling or decoupling device, a filtering device, feed thru, etc.
  • this passive component conventionally comprises a plurality of alternating, or interleaved electrode layers 107 and 108 respectively, that are almost totally encased within in material of predetermined electrical properties 105, most notably a dielectric material 105 in a tubular shaped appearance containing alternating layers at a predetermined spacing within a predetermined selected conductive casing material or structures 102 and 112, which are the two conductive electrodes that serve as the boundary or conductive casing of a typical capacitor structure.
  • a material of predetermined electrical properties 105 can be formulated to have a selected dielectric constant.
  • paired, differential electrodes 100A and 100B and common conductive substrate 111 will be connected to appropriate conductive termination points (not shown) or surfaces that include circuit connections(not shown). Conductive terminations are applied to the respective exposed conductive portions or at any appropriate area of the filter energy conditioner elements when placement into circuitry is desired.
  • symbol 114 represents continuation of conductive substrate 111.
  • certain conductive terminations or structures may be formed in a host of many known industry possibilities or manners to provide electrical, material coupling or mechanical bonding, conductive coupling, conductive fusing, combined conductive amalgamation of predetermined and selected conductive portions or areas on or within the surface of the invention elements to enable attachment or integration into a circuit for energization.
  • These conductive terminations may extend beyond the end margins of a device when surface mounting is desired.
  • Alternative conductive termination methods including applications of layers of conductive material elements that are compatible with available and future processing technology, can be used.
  • the present invention overcomes the problems and disadvantages encountered in the prior art by providing an improved circuit conditioning function with a tubular component containing an embedded electrode layer/plate pattern that is capable of handling significantly higher current loads in certain applications. [0037] All this is accomplished not by requiring a significant increase in the volumetric size, but by modifying attachment to a conductive ground area which becomes a "0" reference ground and low impedance path for cancellation of inductance and noise.
  • Each energy-conditioning element 500A and 500B and 600A and 600B comprises second conductive portions and first conductive portions or electrode portions 102 and 112, which second conductive portions 102 are available for coupling or contacting to the conductive sleeve 109 of conductive substrate 111 or the differential energy conductor's 100A and 100B, respectively. [0039] Specifically, this is a configuration that will be the converse or opposite or even considered, complementary for elements like the second conductive portions and first conductive portions 102 and 112, with respect to how these isolated conductive portions are related to each other.
  • Isolated second conductive portions 112 serve as the primary conductive contact-coupling element with respective to the solder material 101 to coupling the various differential energy conductor pins 100"A" and 100"B", respectively, which are located primarily internal within the aperture or cavity (not shown) created in tubes 500A and 500B and 600A and 600B during their particular manufacturing process. It should be noted that the inserting or hole-making manufacturing processes is not considered part of the invention. [0040] With the addition of conductive solder material 101 or solder reflow material 101 , conductive epoxy 101 , or any other conductive securing medium commonly known and used in the art of assembling of the tubular devices 500A and 500B and 600A and 600B with differential conductive pins 100A and 100B for further processing is substantially complete.
  • Energy conditioners 500A and 500B can be identical in conductive material composition. This potential limitation is different upon the non-conductive passive or inductive materials energy conditioning values that are used to rate or give value to each pin 100's energy conditioning contribution to a specific and circuit portion.
  • These balanced conductive elements include the alternating multi-layered electrode plates or layers 107,108, which are comprised of noble metal materials or deposits that are separated by a material 105 with predetermined electrode properties such as a dielectric. Each electrode 107 and 108, undergo application, amalgamation, deposit, fusing or attachment to external conductive portions, which are the second conductive portions and first conductive portions or electrode portions 102 and 112 of each respective energy-conditioning unit.
  • Each energy- conditioning unit 500 comprises at least one hole or aperture practicable for receiving the energy conductor or contact pins 100A and 100B (which are identical), there through.
  • Energy conductor or connector pin 100A and 100B are energy conductors that allow transfer or propagations of energies from an energy source to an energy utilizing load and often require the aid of multiple energy conditioning devices to make the transfer or propagation of these energies more efficient, less noisy, or debilitating.
  • Conductive solder, solder reflow material 101 , conductive epoxy, or any other known conductive securing medium 101 is deposited or applied to securely connected as well as fight structural support for contact pins 100A and 100B that are positioned therethrough.
  • Various insulating structures such as band 104 are predetermined and selectively applied or positioned at locations found external to each external electrode 102 and 112 of each energy conditioners 500A and 500B. These insulated bands or applications provide separations between second conductive portions and first conductive portions or electrode portions 102 and 112 so that a capacitance can be developed with between all the electrodes connected, respectively to each second conductive portions and first conductive portions or electrode portions 102 and 112.
  • Non-conductive void or band 104 located between outer conductive portions of multi-layer tubular energy conditioners 500A and 500B or monolithic tubular energy conditioners 600A and 600B comprises a void or insulation material that provides separation of the electrically conductive second conductive portions and first conductive portions or electrode portions 102 and 112 from each other of multi-layer tubular energy conditioners 500A and 500B or monolithic tubular energy conditioners 600A and 600B.
  • Solder material 101 servers to physically couple isolated first conductive portions 112 to the various differential energy conductor pins 100"A" and 100"B" in a manner that allows electrical energy to propagate within a circuit.
  • Isolated second conductive portions 102 serve as the primary conductive contact-coupling element with respective to the physical and conductive coupling to sleeve 109, respectively.
  • Conductive sleeves 109 are normally found as paired elements, that are primarily located either contiguously coupled as a result of the machine operation upon the conductive substrate, thus forming a monolithic substrate that includes the conductive sleeves 109.
  • Conductive sleeves 109 are in other cases, separate, discrete elements that are selectively in a predetermined manner coupled to the conductive substrate 111.
  • Conductive substrate 111 is initially manufactured with holes or apertures that are either processed, stamped, or machined, to receive conductive sleeves that are to be conductively coupled to form a singular integral amalgamation of conductive materials or one, unified conductive structure. It should be noted that discrete or separately applied or coupled sleeves 109 are not necessary, and that certain manufacturing techniques not part of the invention, can allow conductive substrate 111 to be stamped or punched with holes (not shown) created in the form of sleeves 109 and formed continuously or contiguously from the one original stamped metal portion 111.
  • Discrete conductive sleeves or holders 109 are first respectively seated, positioned or located primarily within a pre-positioned hole, aperture or cavity (not fully shown) that was created before mounting of holders 109. With the aid of conductive sleeve lip 113 of holders 109, (which serves in this purpose, as a temporary alignment guide), the primary bonding mechanism, solder material 101 can easily be applied.
  • Solder material 101 also server, in this case, as the primary electrical coupling mechanism that bridges conductive sleeve 109 to conductive substrate 111 for eventual electrical operations.
  • Various strategically located insulating portions 110 are selectively placed upon or around predetermined portions of conductive substrate 111 to facilitate the conductive amalgamation of conductive sleeve 109 with conductive substrate 111 for the purposes of forming a monolithic conductive substrate structure and to facilitate the concept that each paired energy conditioning tubular pair is to be separated between conductive substrate 111 from each other. It should be noted that insulating portions 110 are not always needed as long as the attaching soldering material provides an acceptable amalgamation between the substrate 111 and the conductive sleeves 109.
  • the physical coupling of isolated conductive portions 102 with conductive sleeve 109 can be accomplished through an interference fit in some cases, and can be also done with conductive epoxy in others, but regardless of the coupling technique used to create physical bonding, the result should allow isolated second conductive portion 102 and conductive sleeve 109, to freely exchange electrical energy as part of a circuit.
  • isolation structures or insulated materials portions shown as 103 and the 104 materials which are located on conditioners 500A and 500B and 600A and 600B are simply non-conductive voids or insulating material banding of insulating material deposits selectively positioned to separate outer isolated second conductive portion 102 of multi-layer tubular energy conditioner 500A and 500B or monolithic tubular energy conditioners 600A and 600B from internally located isolated conductive portions 112 of multi-layer tubular energy conditioners 500A and 500B or monolithic tubular energy conditioners 600A and 600B.
  • the insulative material 103 deposited or used as insulating filler 103 or "globing" or “goo” can be is applied for the purposes of preventing direct electrical contact between either first conductive portion 112 and second conductive portion 102 as well the purposes of preventing direct electrical contact between second conductive portion 102 and third conductive portions or various differential energy conductor pins 100"A" and 100"B” which will serve to isolate all of the second conductive portions found on either conditioners 500A and 500B and/or conditioners 600A and 600B from any of the additional conductive portions shown or not shown of any other energy conditioners.
  • differential energy conductor 100A or 100B of each multi-layer tubular energy conditioners 500A and 500B or monolithic tubular energy conditioners 600A and 600B is desired to be coupled for electrical dynamics to the first conductive portion 112 or isolated electrode portion 112 that further comprise assembly 10 of FIG. 1 and assembly 20 of FIG. 2, once again solder material 101 can be used.
  • both portions are now considered to be physically and electrically (when charged) isolated from the other, despite their close proximity.
  • Multi-layer tubular energy 500A is paired with another multi-layer tubular energy 500B.
  • One of the multi-layer tubular energy conditioners 500A and 500B devices is inverted in such a manner as to be turned completely end for end with respect to the other and becomes a opposite mirror of it's counterpart.
  • Multi-layer tubular energy conditioners 500A and 500B comprises material 105 having predetermined electrical properties such as a dielectric material, dielectric material composite, ferro-electrical dielectric material found in both of multi-layer tubular energy conditioners 500A and 500B or monolithic tubular energy conditioners 600A and 600B. (shown in Fig 2).
  • Energy conditioners 500A and 500B contain a plurality of interleaved electrode layers 107 and 108 which are formed in a conventional manner by printing electrode layers 107 and 108 between layers of an unfired or green ceramic material 105, with openings in the electrodes 107,108 being aligned to form contact openings 104.
  • Electrode layers 107 form energy return electrodes for the conductive substrate 111 with filter array 10.
  • Each of electrodes 107 and 108 is connected to a metal strip, (or to multiple strips, layers, coatings or the like) 109 on at least one and preferably all sides of the multi-layer tubular energy conditioners 500A and 500B to form terminals which can be electrically connected to energy return by any convenient means such as conductive solder 101.
  • electrodes 107 and 108 are connected to energy return through layers 102, conductive sleeve structures 109, conductive solder 101 and conductive substrate 111.
  • conductive sleeve structures 109 conductive solder 101
  • conductive substrate 111 conductive solder 101
  • the monolithic tubular capacitors 600A and 600B are arranged to accommodate a dielectric main body 105, a central opening and second conductive portion 102 and first conductive portion 112 within the central opening (not numbered) for receiving differential energy conditioner 100A or 100B.
  • FIG. 2 a cross-sectional side view of common conductive substrate assembly 20 comprised of paired monolithic energy conditioners arranged in a conductive substrate assembly 20 and located on opposite sides of a grounding configuration now placed in a connector assembly called connector assembly 30 in accordance with the present invention is shown. Rather than repeat the same structural elements again, only the differences and the setting will be discussed in detail.
  • FIG. 2 illustrates the universal adaptability of the filter assembly as part of a small, differential 2-Pin assembly 30 situated inside connector assembly 30 almost completely encased in insulative potting material 106 or insulating filler material 106 to complete discrete two piece connector assembly 30.
  • FIG. 3 is showing the top only view of FIG. 2, with no cut away portion
  • FIG. 4 is showing a cut away perspective view of FIG. 2 slightly below the top level of connector filter assembly 30 and monolithic tubular energy conditioner 600A and 600B contained within connector filter assembly 30.
  • the outer edge 118 of the connector filter assembly 30 is shown which contains common conductive substrate assembly 20 including monolithic tubular energy conditioner 600A and 600B structures as they are coupled to conductive substrate 111 within filter assembly 30.
  • connector assembly 30 contains common conductive substrate assembly 20 within.
  • the entire common conductive substrate assembly 20 is not shown because insulative potting material or insulating filler material 106 for assembly 30 is filled in this diagram.
  • Connector assembly 30 shows only differential energy conductors or contact pins 100A and 100B as they are shown projecting out of insulative potting material 106 (which is removed for explanation purposes in FIG. 4) for further availability for usage in an electrical application.
  • FIG. 4 is showing an overhead cutaway view of connector filter assembly 30. Shown are differential energy conductor pins 100"A" and 100"B" as they project from the connector assembly 30 for allowing propagation of energies to enter or leave common conductive substrate assembly 20 for eventual conditioning of portions of electrically complementary energies propagating in opposite directions, electrically out of phase with each other in the AOC, simultaneously.
  • Monolithic tubular energy conditioners 600A and 600B are coupled at predetermined portions to sleeves 109 and then to conductive substrate 111 of common conductive substrate assembly 20 by solder means 101.
  • insulating material 103 Moving out and away from the third conductive portion or central positioned differential conductor 100B of 600B is insulating material 103, which acts as a spacer between the third conductive portion, or central positioned differential conductor 100B and first conductive portion or external electrode portion 112 of monolithic tubular energy conditioner 600B.
  • Non-conductive void or banded insulating material 104 separates physically first conductive portion or external electrode portion 112 from second conductive portion or electrode isolated portion 102 and third conductive portion, or electrode isolated portion, or differential conductors 100B, as does insulating material 103.
  • Dielectric or supportive material 105 is shown and as stated these 105 materials can be customized to the requirements of the circuit into which the entire assembly is utilized.
  • Second conductive portion or isolated conductive portion or electrode 102 is appears on the outer portion of dielectric or supportive material 105. Second conductive portion or isolated conductive portion or electrode 102 will make conductive coupling contact with conductive sleeve 109, in this case by positioning monolithic tubular energy conditioner 600B within to a predetermined position for optimal electrical contact.
  • the non-conductive material band 110 can be placed between to separate conductive sleeve 109 from conductive substrate 111 , if desired.
  • Insulative potting material 106 almost totally surrounds conductive energy conditioning holder 109 as shown in the cutaway view.
  • an optional lip portion 120 of sleeve 109 which is either formed, coupled to or simply an elongated portion at the end of sleeve or holder 109 for preventing slippage of the of multi-layer tubular energy conditioners 500A and 500B or monolithic tubular energy conditioner 600A and 600B beyond the pre-selected points of positioning and coupling.
  • conductive solder 101 Moving out and away from the central positioned third conductive portion, or central positioned differential conductor 100"A" is conductive solder 101 as it couples third conductive portion, or central positioned differential conductor 100A with the first conductive portion, or external isolated electrode portion 112 of monolithic tubular energy conditioner 600A.
  • the first conductive portion, or isolated electrode portion 112 is non- conductively coupled to dielectric or supportive material 105. Isolated portion 112 is placed against dielectric or supportive material 105 for support as it eventually will conductive coupling to substrate 111 by resistive fit, mechanical means or soldering as with conductive solder 101.
  • second isolated conductive portions 102 on all conditioners 500A and 500B and 600A and 600B are isolated from each respective third conductive portion or external isolated electrode portion 112 and each respective third conductive portion or differential conductors 100"A" and 100"B", respectively in a predetermined manner by non-conductive void or band materials 104, insulation material 103, if needed as well as selective positioning or location of 112 and 102 relative to actual positioning on the capacitor tubes as well and as required to make a proper functioning circuit as is proposed by this invention and is illustrated in FIG. 4.
  • the illustration shown is by no means meant to limit the other possibilities of achieving the same resulting invention circuitry by other employed methodology.
  • the last area to be shown is the conductive solder 101 as it couples second conductive portion or external electrode portion 112 to conductive substrate 11 to further amalgamate the common conductive substrate assembly 20 into a single working unit.
  • FIG. 2 this image illustrates that the combined conductive elements that make up the common conductive substrate assembly 20 and that are further amalgamated by solder 111 to the inside portion of Filter connector sleeve 118.
  • Filter connector sleeve 118 is contains and is surrounding the 111 -substrate assembly holding the tubular devices 600.
  • the 118 is also considered a connector shell or conductive shell, which with bushing 116 and the threaded portion 117 of the 118 shell is operable to be considered sandwiching a larger conductive plane or conductive connector holder 115.
  • this shelf created by the connector structure is adapted and is conveniently used for resting the conductive substrate 111 or holding the conductive substrate 111 for eventual soldering of the mounting to side wall portion 121 and than the 'gooing' with material 106, as well as for additional overall structural support of substrate 111 , in the discrete, 2-piece connector assembly 30 application.
  • Connector shell 118 in this case is using a threaded bushing 117 that facilitates the sandwiching of conductive plane 115 together with threaded washer or threaded bolt 116 as well, but other forms of connection of the shell can be used and are to numerous to mention.
  • connector assembly 30 is interchangeable to as it is related to providing common conductive substrate assembly 10 or common conductive substrate assembly 20 accesses to electrical applications and that regardless of the container means used, it is the unique arraignments of the common conductive substrate assembly 20 with the paired energy conditioners as they are in relative position to each other on opposite sides of conductive substrate 111 that is very important.
  • Conductive substrate 111 becomes the isolating element for differential conditioning of propagating energies moving along 100A and 100B conductors of either common conductive substrate assembly 10 or common conductive substrate assembly 20.
  • the common conductive attachment of the 102s' which are the second conductive portion of most energy conditioners is also an isolated conductive portion or electrode coupled to the sleeve 109 and will be allowing the shielding function provided by conductive substrate 111 to be both a physical shield as well as to allow certain propagating portions of propagating energies to be electrically interposed or electrically separated between each side of conductive substrate 111 when located at any given point in time along the third conductive portions of tubes 600 and 500 which are the respective differential conductors, 100A and 100B when coupled to a circuit.
  • Such three-way energy pathway amalgamation or selective and predetermined circuit coupling as described in this disclosure comprises not only the center common shield structure 111 that will become a "0" reference image plane for the circuit, but other portions of a typical new invention circuit which can comprise the following: an energy source, a first energy pathway connecting from the energy source to third conductive portion or differential energy conductor pin 100A, of 500A for example, the first energy pathway then continuing through tubular element to first conductive portion 112 of energy conditioner 600 and then onward along a first energy pathway for delivering portions of the propagating energies to an energy utilizing-load.
  • a second energy pathway connecting from the load is found to be connecting to differential energy conductor pin 100B or third conductive portion of the other paired energy conditioner 500B which is now electrically on the opposite side of the circuit reference node created by conductive substrate 111's position and attachments and as was done with the complementary tube 500A, portions of propagating energy will pass on along third conductive portion differential energy conductor pin 100B, while other energy portions move to first conductive portion 112 to will receive or undergo conditioning from second conductive portions 102 which are isolated from first conductive portions 112 and the third conductive portions 102's respect to each portions location on all of multi-layer tubular energy conditioners 500A and 500B or monolithic tubular energy conditioner 600A and 600B, as disclosed.
  • portions of energies will also propagate to first conductive portion or isolated conductive electrode portion 112 from the various coupled third conductive portions, of course.
  • other portions of energies will also propagate or form to the second conductive portions or isolated conductive portions 102 (that are isolated from first and third conductive portions) and of which 102 is conductively connected to sleeve 109, which is in turn connected to conductive substrate 111.
  • Conductive substrate 111 is conductively coupled by conductive attachment material 101 to the inside of connector assembly 30s' housing 118 which in turn, is securely fastened and sandwiching portions of larger conductive substrate 115.
  • Larger conductive substrate 115 can be a third energy pathway end point in and of itself to serve as a final portion of the third energy pathway on its own.
  • larger conductive substrate 115 in this application for example could further be coupled or conductively connected to a chassis ground or even an earth ground, but does not necessarily need to be operated at all as a pathway the back to the energy source from which portions of energies initiated.

Abstract

L'invention concerne un ensemble condensateur à filtre (10), à une ou plusieurs paires, comprenant soit des condensateurs multicouches, soit des condensateurs monolithiques (500A, 500B) et possédant des portions d'électrode (102) connectés à un support conducteur (109) disposé de façon sélective sur un substrat conducteur (111). Ce substrat (111) protège les portions d'électrode (102) les unes des autres afin de former un filtre de mode commun et de mode différentiel.
EP01922559A 2000-03-22 2001-03-22 Ensemble de protection conditionneur d'energie a isolation Withdrawn EP1277278A4 (fr)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US19119600P 2000-03-22 2000-03-22
US191196P 2000-03-22
US20032700P 2000-04-28 2000-04-28
US200327P 2000-04-28
US21531400P 2000-06-30 2000-06-30
US215314P 2000-06-30
US22549700P 2000-08-15 2000-08-15
US225497P 2000-08-15
PCT/US2001/009185 WO2001071908A1 (fr) 2000-03-22 2001-03-22 Ensemble de protection conditionneur d'energie a isolation

Publications (2)

Publication Number Publication Date
EP1277278A1 EP1277278A1 (fr) 2003-01-22
EP1277278A4 true EP1277278A4 (fr) 2008-10-29

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EP01922559A Withdrawn EP1277278A4 (fr) 2000-03-22 2001-03-22 Ensemble de protection conditionneur d'energie a isolation

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EP (1) EP1277278A4 (fr)
CN (1) CN1430811A (fr)
AU (1) AU2001249347A1 (fr)
WO (1) WO2001071908A1 (fr)

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Publication number Priority date Publication date Assignee Title
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US6760882B1 (en) 2000-09-19 2004-07-06 Intel Corporation Mode selection for data transmission in wireless communication channels based on statistical parameters
US7356050B2 (en) 2003-12-17 2008-04-08 Siemens Aktiengesellschaft System for transmission of data on a bus
JP2008535207A (ja) 2005-03-01 2008-08-28 エックストゥーワイ アテニュエイターズ，エルエルシー 共平面導体を有する調整器

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FR2606207A1 (fr) * 1987-01-30 1988-05-06 Eurofarad Ensemble de filtrage electronique a elements capacitifs discrets
US5206786A (en) * 1990-11-28 1993-04-27 Samsung Electro-Mechanics Co., Ltd. Through type condenser
US5319525A (en) * 1991-05-10 1994-06-07 Nokia Mobile Phones (U.K.) Ltd. Circuit assembly

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JPH02267879A (ja) * 1989-04-07 1990-11-01 Fujitsu Ltd コネクタ
US5647766A (en) * 1995-05-26 1997-07-15 The Whitaker Corporation Modular connector assembly having removable contacts
US5838216A (en) * 1996-09-06 1998-11-17 Sunstrand Corporation Common-mode EMI filter

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FR2606207A1 (fr) * 1987-01-30 1988-05-06 Eurofarad Ensemble de filtrage electronique a elements capacitifs discrets
US5206786A (en) * 1990-11-28 1993-04-27 Samsung Electro-Mechanics Co., Ltd. Through type condenser
US5319525A (en) * 1991-05-10 1994-06-07 Nokia Mobile Phones (U.K.) Ltd. Circuit assembly

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Title
See also references of WO0171908A1 *

Also Published As

Publication number Publication date
WO2001071908A1 (fr) 2001-09-27
EP1277278A1 (fr) 2003-01-22
CN1430811A (zh) 2003-07-16
AU2001249347A1 (en) 2001-10-03

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