EP1234323A2 - Monitoring system for a conveying device that conveys flat articles, especially wafers - Google Patents

Monitoring system for a conveying device that conveys flat articles, especially wafers

Info

Publication number
EP1234323A2
EP1234323A2 EP00993283A EP00993283A EP1234323A2 EP 1234323 A2 EP1234323 A2 EP 1234323A2 EP 00993283 A EP00993283 A EP 00993283A EP 00993283 A EP00993283 A EP 00993283A EP 1234323 A2 EP1234323 A2 EP 1234323A2
Authority
EP
European Patent Office
Prior art keywords
light
monitoring system
carriage
movement
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00993283A
Other languages
German (de)
French (fr)
Inventor
Hans Leitner
Xaver Kollmer
Günther SCHINDLER
Ernst Georg Frisch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Logitex Reinstmedientechnik GmbH
Original Assignee
Logitex Reinstmedientechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Logitex Reinstmedientechnik GmbH filed Critical Logitex Reinstmedientechnik GmbH
Publication of EP1234323A2 publication Critical patent/EP1234323A2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/404—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for compensation, e.g. for backlash, overshoot, tool offset, tool wear, temperature, machine construction errors, load, inertia
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37555—Camera detects orientation, position workpiece, points of workpiece
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37571—Camera detecting reflected light from laser
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Definitions

  • the invention relates to a monitoring system for a transport device for flat parts, in particular wafer slices.
  • Wafer wafers are thin wafers made of silicon, such as those used for the production of integrated circuits, solar cells, etc. Such wafer slices have to be handled with extreme care in clean rooms if they are transported from one processing step to another processing step in the course of the production of the integrated circuit, the solar cell, etc.
  • FIG. 3 shows a schematic plan view of a device for carrying out various processing steps of a wafer wafer.
  • a housing 2 forming a storage chamber is arranged with two frames 4, 6, which have compartments 8 (FIG. 5) one above the other, in which wafer slices 10 can be stored.
  • the housing 2 can be pushed back and forth by means of a motor 11 via a device (not shown in detail) on a fixed rail 12 in the direction of the double arrow 14, so that in one setting the one frame 4 and in the other setting the other frame 6 one Opening 16 of a housing 18 is opposite, which has further openings 20 to which working chambers 22 are connected.
  • a robot 24 (FIG. 4) is arranged in the housing 18 and has a support arm 26 on which a carriage 28 is arranged.
  • the carriage 28 has a depression 30, the bottom 32 of which is provided with vacuum slots 34 and capacitive proximity sensors 36.
  • Motors 38 and 40 are provided for moving the support arm 26, by means of which the support arm 26 is in a movement perpendicular to a central axis of rotation of the robot 24. swung plane and its distance from the axis of rotation can be changed.
  • the carriage 28 can be rigidly attached to the support arm 26 or be displaceable on the support arm 26 by means of a further drive, not shown.
  • Fig. 5 shows a perspective front view of the partially cut or basically open to the front housing 2, two rooms are visible, of which only the left is equipped with the frame 4.
  • the motor 10 is used for the back and forth movement of the housing 2 on the rail 12.
  • the housing 2 cannot be moved directly on the rail 12, but is arranged on a frame part 42, which together with the housing 2 can be moved along the rail 12 is.
  • the housing 2 can be displaced in height relative to the frame part 42 by means of a servomotor 44 in the direction of the double arrow 46, so that the individual compartments 8 with wafer disks 10 accommodated therein and not shown in FIG. 5 can be successively positioned at the same height.
  • the basic function is such that, according to FIG. 3, the robot 24 inserts the slide 28 in a once-adjusted, horizontal plane out of the opening 16 into an opposite compartment of the frame 4.
  • the frame 4 is then slightly lowered vertically with the aid of the servomotor 44 until the proximity sensors 36 determine the approach of a wafer 10 lying on a shelf of a shelf 8.
  • the wafer disk 10 comes to rest on the bottom 32 of the depression 30 and is held there when the vacuum slots 34 are activated.
  • the carriage 28 then moves out of the frame 4 into the interior of the housing 18 and through a first of the openings 20 into a first of the working chambers 22, in order to be stored and processed there.
  • the wafer 10 is fetched from the carriage 28 and brought into a next working chamber, etc., until after the processing steps in the individual working chambers 22 have been completed, it is deposited by the carriage 28 in the right frame 6 according to FIG. 3, the housing 2 3 is moved to the left. The carriage 28 is then moved out of the frame 6, the housing is moved to the right and the next wafer is removed from the housing.
  • Stell 4 picked up by first lowering it by the height of a compartment, so that after the carriage 28 has been moved into the next compartment and then the frame 4 has been lowered further, the next wafer 10 comes to rest on the carriage 28.
  • the individual openings 16 and 20 of the housing 18 can be closed by means of a vacuum-tight slide, so that work can be carried out under vacuum overall.
  • a problem that arises when processing by means of the described device is that the carriage 28 moved by the robot 24 changes its horizontal plane of movement, be it due to wear or high thermal stresses when it enters the partially high temperature Working chambers 22.
  • the vertical distance between the individual compartments 8 in the frames 4 and 6 is relatively small, so that even a slight deformation or deflection of the slide from its desired path of movement entails the risk that the slide will already be in its retraction touches a wafer in the frame 4 and damages it or that the wafer is then no longer properly placed on the carriage.
  • the invention has for its object to provide a remedy for the problem mentioned.
  • the monitoring system according to the invention is suitable for transport devices in accordance with the main claim of various types of flat parts, such as sensitive mica platelets, ceramic platelets, printed circuit boards, etc.
  • the monitoring system according to the invention is particularly well suited for transport devices from Wafer slices, the handling of which is particularly demanding.
  • 1 is a block diagram of the monitoring system
  • FIG. 4 shows a perspective view of a robot used in the device of FIG. 3,
  • FIG. 5 is a front perspective view of the device of FIG. 3,
  • Fig. 6 is a perspective view of a modified embodiment of a wafer processing device
  • FIG. 7 shows a section through a storage chamber of the device according to FIG. 5.
  • the monitoring system contains a light source 50 and a light receiver 52 arranged at a distance from the light source 50, which are connected to a control unit 54 to which a display unit 56 is connected.
  • the light source 50 advantageously contains a laser light source, the light of which is influenced by optics in such a way that a parallel light bundle 60 (shown in broken lines) emerges from an exit window 58 in the form of a vertical slot.
  • the light bundle 60 enters an entry window 62 of the light receiver 52 which is opposite the exit window 58 and which is advantageously designed in accordance with the exit slot.
  • the light entering the entry window 62 is imaged on a photodiode, the output signal of which is fed to the control unit 54.
  • the control unit 54 contains, in a manner known per se, a microprocessor and an evaluation device 64, the function of which is explained further below.
  • the light receiver 50 is attached to the fixed housing 18 on one side of the opening 16 and the light receiver 52 on the other side of the opening 16.
  • the desired plane of movement in which the carriage 28 moves as it moves into the frame 4 and out of the frame 4, is such that the underside 66 of the carriage 28 intersects the light beam 60 at a predetermined height, so that a corresponding predetermined height of the entrance window 62 is shadowed and the output signal of the light receiver 52 decreases accordingly.
  • curve K represents a measurement curve which represents the exit signal of light receiver 52.
  • area A there is no object between the light source 50 and the light receiver 52, so that the latter receives the full light intensity which is set to one hundred in the evaluation unit 64.
  • the intensity of the light falling on the light receiver 52 suddenly decreases depending on the contour of the carriage, which is recognized by the evaluation device 64 and sets a time or count signal to zero.
  • the curve K assumes a characteristic course when the carriage 28 is moved through the light beam 60 (the short-term deviation from the horizontal course in the form of the decrease M is shown, for example, by one from the underside 66 of the carriage 28 protruding screw) to then increase again depending on the contour of the carriage until the carriage has completely moved through the light beam 60 and the output signal in region A resumes its original value.
  • the curve K can be recorded with a different clock frequency and evaluated in different ways.
  • the area I between the dashed lines indicates a very narrow precision area within which an average value of the output signal formed, for example, between the counting points tl and t2 must lie so that the carriage movement is recognized as being in a very good order.
  • the measured value lies between the dash-dotted curves II, the movement of the carriage is considered to be still tolerable. Outside of area II, it is considered to be intolerable and leads to an error message.
  • the display can follow directly on a screen similar to FIG. 2 and / or the display can take place by means of diodes, whereby green diodes mean "IO”, yellow diodes mean “still tolerable” and red diodes indicate insufficient movement accuracy that require readjustment or the like of the carriage.
  • the monitoring device can be installed as a separate, independent system or can be integrated in the control system of the motors for the robot and the drive of the housing 2 in a horizontal and vertical direction, for example by corresponding time stamps are supplied from the control device of the electric motors to the control device 54 and so on.
  • a drift of the measurement result can be detected so that systematic changes can be observed and extrapolated, whereby errors can be predicted.
  • a diode bar can be arranged behind the entrance window 62, so that the absolute value of the height of the underside 66 can be detected directly within the light beam 60.
  • the arrangement can also be designed such that the top of the carriage 28 is scanned so that first the top of the carriage outside the depression 30 is detected and then a wafer disc lying in the depression 30 is detected, so that with the Monitoring the flawless movement of the carriage, the flawless positioning of a wafer and even the flawless quality of the wafer itself can be monitored.
  • FIG. 6 shows a modified embodiment of a wafer wafer processing device, the same reference numerals as in FIGS. 3 to 5 being used for functionally similar components.
  • the view of FIG. 6 corresponds with respect to the viewing direction of a view of the arrangement according to FIG. 5 obliquely from behind.
  • the housing 2 which receives the frames 4 and 6, not shown, contains two hermetically closable housing parts 2a and 2b, which contain vacuum chambers in which holders 67 for the magazines or frames 4 and 6 (FIGS. 3 and 5) are accommodated.
  • the brackets 67 can be moved vertically by means of servomotors 68.
  • the entire housing 2 is rigidly attached to a base frame (not shown).
  • a base frame not shown.
  • a light source 50 and a light receiver 52 are arranged within each housing part 2a and 2b , which are connected via cable 68 to the control unit 54 (FIG. 1).
  • the receiving chambers formed in the housing parts 2a and 2b are open in FIG. 6 and can be closed air-tight with slides 72a and 72b. With the slides 72a and 72b open, frames equipped with wafer disks can be inserted or removed from the holders 67.
  • FIG. 7 represents a horizontal section through the housing part 2a.
  • the light source 50, the light receiver 52, the slide 28, the frame 6 and a wafer disk 10 are visible.
  • the arrangement of the light source 50 and the light receiver 52 and the dimensions are such that the light bundle 60 (FIG. 1) freely shines through a space between two compartments equipped with wafer disks 10 when the carriage 28 is not within the frame 6 and the frame in a predetermined step position located.
  • the function sequence of the monitoring system when using the embodiment according to FIGS. 6 and 7 is as follows:
  • the magazines are each in a position by actuating the stepping motors 68, in which the light beam shines through the space between two compartments without being covered, i.e. in the diagram of FIG. 2 there is a signal value in the area A, that is to say a maximum value of the output signal of the light receiver (s) 52.
  • the function is only for one of the magazines, for example that in the right housing part 2b according to FIG. 6 described magazine, not shown. If the maximum value of the light intensity is not measured in the position of the slide 28 outside the housing part 2b, this indicates an error in the associated stepping motor 68 or in its control.
  • the monitoring system can be used to control the actuation of stepper motor 68 by actuating it until maximum light intensity is reached. This can be done on a trial basis for an entire newly inserted magazine, possibly loaded with wafer disks, so that magazine inaccuracies can be compensated for by the stepping motor 68 always being actuated in such a way that the space between two shelves is arranged in such a way that it is completely separated from that Beam of light 60 is shone through. It goes without saying that it is advantageous to dimension the height dimension of the light beam 60 somewhat smaller than the distance between two shelves, so that the maximum output signal is guaranteed.
  • the transport arm 28 is now moved into the housing part 2b into the space between two compartment bases or two wafer disks received at their edges by the compartment bases, this movement being monitored according to FIG. 2 becomes.
  • the monitoring differs somewhat from the illustration in FIG. 2 in that the carriage moves from the left area A only in the area B and does not move completely through the light beam.
  • the frame is lowered, whereby the lowering takes place by a predetermined amount, or, if the proximity sensors 36 (FIG. 4) are provided, the lowering is controlled via the proximity sensors 36.
  • the wafer disk lying on the carriage is then held in place by means of vacuum application of the vacuum slots 34 and moved out of the housing part 2a.
  • the monitoring system according to the invention described by way of example thus makes it possible, with extremely little equipment (light transmitter and light receiver) in the production facility, to carry out targeted monitoring which monitors the vertical movement of the frame formed with the compartments for receiving the wafer disks and the movement of the Wafer slices transporting carriage uses only one light receiver and light transmitter, the light receiver only generating a simple output signal corresponding to an overall irradiation intensity.

Abstract

The invention relates to a monitoring system for a conveying device that conveys flat articles, especially wafers. Said conveying device comprises a carriage (28) which can be displaced along a predetermined path next to a flat article (10) that is located at a predetermined removal location and which is provided with an accommodating device for accommodating the flat article (10). Said monitoring system contains a light source (50) with a light emitting aperture and a contains a light receiver (52) with a light admitting aperture. The light emitting aperture and the light admitting aperture are positioned in such a manner that a light beam (60) which is directed from the light emitting aperture to the light admitting aperture is at least partially covered by the carriage (28) during the movement thereof through the light beam. In addition, an evaluating device is provided which is connected to the light receiver. Said evaluating device compares a specified signal, which is derived from the movement of the carriage along a specified path, with an actual signal, which is derived from an actual movement of the carriage, and indicates a possible variance between the two signals.

Description

Überwachungssystem für eine Transportvorrichtung von Flachteilen, insbesondere Monitoring system for a transport device for flat parts, in particular
Wafer-ScheibenWafer slices
Die Erfindung betrifft ein Uberwachungssystem für eine Transportvorrichtung von Flachteilen, insbesondere Wafer-Scheiben.The invention relates to a monitoring system for a transport device for flat parts, in particular wafer slices.
Wafer-Scheiben sind dünne Scheiben aus Silicium, wie sie für die Herstellung von integrierten Schaltkreisen, Solarzellen usw. verwendet werden. Solche Wafer-Scheiben müs- sen in Reinsträumen außerordentlich sorgfältig gehandhabt werden, wenn sie im Laufe der Herstellung des integrierten Schaltkreises, der Solarzelle usw. von einem Bearbeitungsschritt zu einem weiteren Bearbeitungsschritt transportiert werden.Wafer wafers are thin wafers made of silicon, such as those used for the production of integrated circuits, solar cells, etc. Such wafer slices have to be handled with extreme care in clean rooms if they are transported from one processing step to another processing step in the course of the production of the integrated circuit, the solar cell, etc.
Fig. 3 zeigt eine schematische Aufsicht auf eine Einrichtung zum Durchführen verschiede- ner Bearbeitungsschritte einer Wafer-Scheibe.3 shows a schematic plan view of a device for carrying out various processing steps of a wafer wafer.
Einem eine Vorratskammer bildendes Gehäuse 2 sind zwei Gestelle 4, 6 angeordnet, die übereinander befindliche Fächer 8 (Fig. 5) aufweisen, in denen Wafer-Scheiben 10 aufbewahrbar sind.A housing 2 forming a storage chamber is arranged with two frames 4, 6, which have compartments 8 (FIG. 5) one above the other, in which wafer slices 10 can be stored.
Das Gehäuse 2 ist mittels eines Motors 11 über eine nicht im einzelnen dargestellte Einrichtung an einer ortsfesten Schiene 12 in Richtung des Doppelpfeils 14 hin- und herverschiebbar, so daß sich in einer Einstellung das eine Gestell 4 und in der anderen Einstellung das andere Gestell 6 einer Öffnung 16 eines Gehäuses 18 gegenüber befindet, das weitere Öffnungen 20 aufweist, an die Arbeitskammern 22 angeschlossen sind.The housing 2 can be pushed back and forth by means of a motor 11 via a device (not shown in detail) on a fixed rail 12 in the direction of the double arrow 14, so that in one setting the one frame 4 and in the other setting the other frame 6 one Opening 16 of a housing 18 is opposite, which has further openings 20 to which working chambers 22 are connected.
In dem Gehäuse 18 ist ein Roboter 24 (Fig. 4) angeordnet, der einen Tragarm 26 aufweist, an dem ein Schlitten 28 angeordnet ist. Der Schlitten 28 weist eine Einsenkung 30 auf, deren Boden 32 mit Vakuumschlitzen 34 sowie kapazitiven Annäherungssensoren 36 ver- sehen ist.A robot 24 (FIG. 4) is arranged in the housing 18 and has a support arm 26 on which a carriage 28 is arranged. The carriage 28 has a depression 30, the bottom 32 of which is provided with vacuum slots 34 and capacitive proximity sensors 36.
Zur Bewegung des Tragarms 26 sind Motoren 38 und 40 vorgesehen, mit denen der Tragarm 26 in einer senkrecht auf einer zentralen Drehachse des Roboters 24 stehenden Bewe- gungsebene verschwenkt und in seinem Abstand von der Drehachse verändert werden kann. Der Schlitten 28 kann starr am Tragarm 26 befestigt sein oder mittels eines nicht dargestellten weiteren Antriebs verschiebbar am Tragarm 26 sein.Motors 38 and 40 are provided for moving the support arm 26, by means of which the support arm 26 is in a movement perpendicular to a central axis of rotation of the robot 24. swung plane and its distance from the axis of rotation can be changed. The carriage 28 can be rigidly attached to the support arm 26 or be displaceable on the support arm 26 by means of a further drive, not shown.
Fig. 5 zeigt eine perspektivische Vorderansicht auf das teilweise aufgeschnittene oder nach vorne grundsätzlich offene Gehäuse 2, wobei zwei Räume sichtbar sind, von denen nur der linke mit dem Gestell 4 bestückt ist. Zur Hin- und Herbewegung des Gehäuses 2 auf der Schiene 12 dient der Motor 10. Wie ersichtlich, ist das Gehäuse 2 nicht unmittelbar an der Schiene 12 verschiebbar, sondern auf einem Rahmenteil 42 angeordnet, das zusammen mit dem Gehäuse 2 längs der Schiene 12 verschiebbar ist. Das Gehäuse 2 ist relativ zu dem Rahmenteil 42 mittels eines Stellmotors 44 in Richtung des Doppelpfeils 46 höhenverschiebbar, so daß die einzelnen Fächer 8 mit darin aufgenommenen, in Fig. 5 nicht dargestellten Wafer-Scheiben 10 nacheinander in gleicher Höhe positioniert werden können.Fig. 5 shows a perspective front view of the partially cut or basically open to the front housing 2, two rooms are visible, of which only the left is equipped with the frame 4. The motor 10 is used for the back and forth movement of the housing 2 on the rail 12. As can be seen, the housing 2 cannot be moved directly on the rail 12, but is arranged on a frame part 42, which together with the housing 2 can be moved along the rail 12 is. The housing 2 can be displaced in height relative to the frame part 42 by means of a servomotor 44 in the direction of the double arrow 46, so that the individual compartments 8 with wafer disks 10 accommodated therein and not shown in FIG. 5 can be successively positioned at the same height.
Aufbau und Funktion der bisher beschriebenen Vorrichtungen, die in unterschiedlichen Ausfuhrungsformen von verschiedenen Firmen im Handel angeboten werden, sind an sich bekannt und werden daher nicht im einzelnen beschrieben.Structure and function of the devices described so far, which are offered in different embodiments by different companies in the trade, are known per se and are therefore not described in detail.
Die grundsätzliche Funktion ist derart, daß gemäß Fig. 3 der Roboter 24 den Schlitten 28 in einer einmal einjustierten, waagerechten Ebene aus der Öffnung 16 heraus in ein gegenüberliegendes Fach des Gestells 4 einführt. Das Gestell 4 wird dann mit Hilfe des Stellmotors 44 senkrecht leicht abgesenkt, bis die Annäherungssensoren 36 die Annäherung einer auf einem Fachboden eines Faches 8 liegenden Wafer-Scheibe 10 feststellen. Bei weiterer Absenkung des Gestells 4 kommt die Wafer-Scheibe 10 in Auflage auf den Boden 32 der Einsenkung 30 und wird dort bei Aktivieren der Vakuumschlitze 34 festgehalten. Der Schlitten 28 bewegt sich anschließend aus dem Gestell 4 heraus in das Innere des Gehäuses 18 und durch eine erste der Öffnungen 20 in eine erste der Arbeitskammern 22, um dort abgelegt und bearbeitet zu werden. Anschließend wird die Wafer-Scheibe 10 vom Schlitten 28 abgeholt und in eine nächste Arbeitskammer gebracht usw., bis sie nach Durchlaufen der Bearbeitungsschritte in den einzelnen Arbeitskammern 22 vom Schlitten 28 in dem gemäß Fig. 3 rechten Gestell 6 abgelegt wird, wobei das Gehäuse 2 gemäß Fig. 3 nach links verfahren wird. Anschließend wird der Schlitten 28 aus dem Gestell 6 herausbewegt, das Gehäuse nach rechts verfahren und die nächste Wafer-Scheibe aus dem Ge- stell 4 abgeholt, indem dieses zunächst um die Höhe eines Faches abgesenkt wird, so daß nach dem Einfahren des Schlittens 28 in das nächste Fach und anschließendem weiterem Absenken des Gestells 4 die nächste Wafer-Scheibe 10 auf den Schlitten 28 zu liegen kommt.The basic function is such that, according to FIG. 3, the robot 24 inserts the slide 28 in a once-adjusted, horizontal plane out of the opening 16 into an opposite compartment of the frame 4. The frame 4 is then slightly lowered vertically with the aid of the servomotor 44 until the proximity sensors 36 determine the approach of a wafer 10 lying on a shelf of a shelf 8. When the frame 4 is lowered further, the wafer disk 10 comes to rest on the bottom 32 of the depression 30 and is held there when the vacuum slots 34 are activated. The carriage 28 then moves out of the frame 4 into the interior of the housing 18 and through a first of the openings 20 into a first of the working chambers 22, in order to be stored and processed there. Subsequently, the wafer 10 is fetched from the carriage 28 and brought into a next working chamber, etc., until after the processing steps in the individual working chambers 22 have been completed, it is deposited by the carriage 28 in the right frame 6 according to FIG. 3, the housing 2 3 is moved to the left. The carriage 28 is then moved out of the frame 6, the housing is moved to the right and the next wafer is removed from the housing. Stell 4 picked up by first lowering it by the height of a compartment, so that after the carriage 28 has been moved into the next compartment and then the frame 4 has been lowered further, the next wafer 10 comes to rest on the carriage 28.
Die einzelnen Öffnungen 16 und 20 des Gehäuses 18 können mittels vakuumdichter Schieber verschließbar sein, so daß insgesamt unter Vakuum gearbeitet werden kann.The individual openings 16 and 20 of the housing 18 can be closed by means of a vacuum-tight slide, so that work can be carried out under vacuum overall.
Ein Problem, das sich bei der Bearbeitung mittels der beschriebenen Vorrichtung stellt, liegt darin, daß der von dem Roboter 24 bewegte Schlitten 28 seine waagerechte Bewegungsebene verändert, sei es durch Verschleiß oder durch hohe thermische Beanspruchungen bei seinem Einfahren in die teilweise unter hoher Temperatur stehenden Arbeitskammern 22. Der senkrechte Abstand zwischen den einzelnen Fächern 8 in den Gestellen 4 und 6 ist verhältnismäßig klein, so daß bereits eine geringe Verformung bzw. Auslenkung des Schlittens aus seiner Soll-Bewegungsbahn die Gefahr mit sich bringt, daß der Schlitten bereits bei seinem Einfahren in das Gestell 4 eine Wafer-Scheibe berührt und diese beschädigt oder daß die Wafer-Scheibe dann nicht mehr einwandfrei auf dem Schlitten abgelegt wird.A problem that arises when processing by means of the described device is that the carriage 28 moved by the robot 24 changes its horizontal plane of movement, be it due to wear or high thermal stresses when it enters the partially high temperature Working chambers 22. The vertical distance between the individual compartments 8 in the frames 4 and 6 is relatively small, so that even a slight deformation or deflection of the slide from its desired path of movement entails the risk that the slide will already be in its retraction touches a wafer in the frame 4 and damages it or that the wafer is then no longer properly placed on the carriage.
Der Erfindung liegt die Aufgabe zugrunde, Abhilfe für das genannte Problem zu schaffen.The invention has for its object to provide a remedy for the problem mentioned.
Die vorstehend genannte Aufgabe wird mit einem Überwachungssystem gemäß dem Hauptanspruch gelöst.The above object is achieved with a monitoring system according to the main claim.
Mit dem erfindungsgemäßen Überwachungssystem ist gewährleistet, daß bereits kleine Abweichungen der Schlittenbewegung von der Soll-Bahn des Schlittens erfaßt werden und angezeigt werden können. Auf diese Weise können teure Beschädigungen der Wafer- Scheiben vermieden werden.With the monitoring system according to the invention it is ensured that even small deviations of the carriage movement from the desired path of the carriage can be detected and displayed. In this way, expensive damage to the wafer slices can be avoided.
Es versteht sich, daß das erfindungsgemäße Überwachungssystem für Transportvorrich- tungen gemäß dem Hauptanspruch von Flachteilen vielerlei Art, wie empfindliche Glim- merplättchen, Keramikplättchen, bestückte Leiterplatten usw. geeignet ist. Besonders gut eignet sich das erfindungsgemäße Überwachungssystem für Transportvorrichtungen von Wafer-Scheiben, bezüglich deren Handhabung besonders hohe Anforderungen gestellt sind.It goes without saying that the monitoring system according to the invention is suitable for transport devices in accordance with the main claim of various types of flat parts, such as sensitive mica platelets, ceramic platelets, printed circuit boards, etc. The monitoring system according to the invention is particularly well suited for transport devices from Wafer slices, the handling of which is particularly demanding.
Die Unteransprüche sind auf vorteilhafte Ausführungsformen und Weiterbildungen des erfindungsgemäßen Überwachungssystems gerichtet.The subclaims are directed to advantageous embodiments and developments of the monitoring system according to the invention.
Das erfindungsgemäße Überwachungssystem wird im Folgenden anhand schematischer Zeichnungen beispielsweise und mit weiteren Einzelheiten erläutert.The monitoring system according to the invention is explained below using schematic drawings, for example and with further details.
Es stellen dar:They represent:
Fig. 1 ein Blockschaltbild des Überwachungssystems,1 is a block diagram of the monitoring system,
Fig. 2 Kurven zur Erläuterung der Funktionsweise des Überwachungssystems,2 curves to explain the operation of the monitoring system,
Fig. 3 die bereits beschriebene Aufsicht auf eine Bearbeitungseinrichtung für Wafer- Scheiben,3 the supervision of a processing device for wafer wafers already described,
Fig. 4 eine perspektivische Ansicht eines in der Einrichtung der Fig. 3 verwendeten Ro- boters,4 shows a perspective view of a robot used in the device of FIG. 3,
Fig. 5 eine perspektivische Vorderansicht der Einrichtung gemäß Fig. 3,5 is a front perspective view of the device of FIG. 3,
Fig. 6 eine perspektivische Ansicht einer abgeänderten Ausführungsform einer Wafer- Scheiben-Bearbeitungseinrichtung undFig. 6 is a perspective view of a modified embodiment of a wafer processing device and
Fig. 7 einen Schnitt durch eine Aufbewahrungskammer der Einrichtung gemäß Fig. 5.7 shows a section through a storage chamber of the device according to FIG. 5.
Das erfindungsgemäße Überwachungssystem enthält eine Lichtquelle 50 und einen im Abstand von der Lichtquelle 50 angeordneten Lichtempfänger 52, die mit einem Steuergerät 54 verbunden sind, an das eine Anzeigeeinheit 56 angeschlossen ist. Die Lichtquelle 50 enthält vorteilhafterweise eine Laserlichtquelle, deren Licht mit einer Optik derart beeinflußt wird, daß aus einem in Form eines senkrechten Schlitzes ausgebildetes Austrittsfenster 58ein paralleles Lichtbündel 60 (gestrichelt eingezeichnet) austritt. Das Lichtbündel 60 tritt in ein dem Austrittsfenster 58 gegenüberliegendes Eintrittsfenster 62 des Lichtempfängers 52 ein, das vorteilhafterweise dem Austrittsschlitz entsprechend ausgebildet ist. Das in das Eintrittsfenster 62 eintretende Licht wird auf eine Fotodiode abgebildet, deren Ausgangssignal dem Steuergerät 54 zugeführt wird.The monitoring system according to the invention contains a light source 50 and a light receiver 52 arranged at a distance from the light source 50, which are connected to a control unit 54 to which a display unit 56 is connected. The light source 50 advantageously contains a laser light source, the light of which is influenced by optics in such a way that a parallel light bundle 60 (shown in broken lines) emerges from an exit window 58 in the form of a vertical slot. The light bundle 60 enters an entry window 62 of the light receiver 52 which is opposite the exit window 58 and which is advantageously designed in accordance with the exit slot. The light entering the entry window 62 is imaged on a photodiode, the output signal of which is fed to the control unit 54.
Das Steuergerät 54 enthält in an sich bekannter Weise einen Mikroprozessor und eine Auswerteeinrichtung 64, deren Funktion weiter unten erläutert wird.The control unit 54 contains, in a manner known per se, a microprocessor and an evaluation device 64, the function of which is explained further below.
Wie aus Fig. 3 ersichtlich, ist der Lichtempfänger 50 an dem ortsfesten Gehäuse 18 an einer Seite der Öffnung 16 angebracht und der Lichtempfänger 52 an der anderen Seite der Öffnung 16.3, the light receiver 50 is attached to the fixed housing 18 on one side of the opening 16 and the light receiver 52 on the other side of the opening 16.
In Fig. 1 ist dargestellt, wie der im wesentlichen senkrecht zur Papierebene bewegliche Schlitten 28 bei seiner Bewegung das Lichtbündel 60 teilweise durchschneidet bzw. abdeckt. Die Soll-Bewegungsebene, in der sich der Schlitten 28 bei seiner Bewegung in das Gestell 4 und aus dem Gestell 4 heraus bewegt, ist derart, daß die Unterseite 66 des Schlittens 28 das Lichtbündel 60 in vorbestimmter Höhe schneidet, so daß eine entsprechende vorbestimmte Höhe des Eintrittsfensters 62 abgeschattet wird und das Ausgangssignal des Lichtempfängers 52 entsprechend abnimmt.1 shows how the carriage 28, which is movable essentially perpendicular to the plane of the paper, partially cuts or covers the light bundle 60 during its movement. The desired plane of movement, in which the carriage 28 moves as it moves into the frame 4 and out of the frame 4, is such that the underside 66 of the carriage 28 intersects the light beam 60 at a predetermined height, so that a corresponding predetermined height of the entrance window 62 is shadowed and the output signal of the light receiver 52 decreases accordingly.
In Fig. 2 stellt die Kurve K eine Meßkurve dar, die das Austrittssignal des Lichtempfängers 52 darstellt. Im Bereich A befindet sich kein Gegenstand zwischen der Lichtquelle 50 und dem Lichtempfanger 52, so daß dieser die volle Lichtintensität empfängt, die in der Auswerteeinheit 64 zu Hundert gesetzt wird. Wenn sich der Schlitten 28 in das Lichtbündel 60 hineinbewegt, nimmt die Intensität des auf den Lichtempfänger 52 fallenden Lichtes je nach Kontur des Schlittens plötzlich ab, was von der Auswerteeinrichtung 64 erkannt wird und ein Zeit- oder Zählsignal auf Null setzt. Je nach Kontur des Schlittens 28 nimmt die Kurve K beim Hindurchbewegen des Schlittens 28 durch das Lichtbündel 60 einen charakteristischen Verlauf an (die kurzzeitige Abweichung von dem waagerechten Verlauf in Form der Abnahme M zeigt beispielsweise eine aus der Unterseite 66 des Schlittens 28 vorstehende Schraube an), um dann je nach Kontur des Schlittens wieder zuzunehmen, bis sich der Schlitten vollständig durch das Lichtbündel 60 hindurch bewegt hat und im Bereich A das Ausgangssignal wieder seinen ursprünglichen Wert annimmt.2, curve K represents a measurement curve which represents the exit signal of light receiver 52. In area A there is no object between the light source 50 and the light receiver 52, so that the latter receives the full light intensity which is set to one hundred in the evaluation unit 64. When the carriage 28 moves into the light bundle 60, the intensity of the light falling on the light receiver 52 suddenly decreases depending on the contour of the carriage, which is recognized by the evaluation device 64 and sets a time or count signal to zero. Depending on the contour of the carriage 28, the curve K assumes a characteristic course when the carriage 28 is moved through the light beam 60 (the short-term deviation from the horizontal course in the form of the decrease M is shown, for example, by one from the underside 66 of the carriage 28 protruding screw) to then increase again depending on the contour of the carriage until the carriage has completely moved through the light beam 60 and the output signal in region A resumes its original value.
Je nach Ausbildung des Steuergerätes 54 kann die Kurve K mit unterschiedlicher Taktfrequenz aufgenommen werden und in unterschiedlicher Weise ausgewertet werden. Im Falle der Fig. 2 gibt der Bereich I zwischen den gestrichelten Linien einen sehr engen Präzisionsbereich an, innerhalb dessen ein beispielsweise zwischen den Zählstellen tl und t2 gebildeter Mittelwert des Ausgangssignals liegen muß, damit die Schlittenbewegung als hochgradig in Ordnung anerkannt wird. Solange der Meßwert zwischen den strichgepunkteten Kurven II liegt, wird die Bewegung des Schlittens als noch tolerabel angesehen. Außerhalb des Bereiches II wird sie als untolerabel angesehen und führt zu einer Fehleranzeige.Depending on the design of the control device 54, the curve K can be recorded with a different clock frequency and evaluated in different ways. In the case of FIG. 2, the area I between the dashed lines indicates a very narrow precision area within which an average value of the output signal formed, for example, between the counting points tl and t2 must lie so that the carriage movement is recognized as being in a very good order. As long as the measured value lies between the dash-dotted curves II, the movement of the carriage is considered to be still tolerable. Outside of area II, it is considered to be intolerable and leads to an error message.
In der Anzeigeeinheit 56 kann die Anzeige unmittelbar auf einem Bildschirm ähnlich der Fig. 2 folgen und/oder die Anzeige kann mittels Dioden erfolgen, wobei grüne Dioden „I.O." bedeuten, gelbe Dioden „noch tolerabel" bedeuten und rote Dioden auf eine unzureichende Bewegungsgenauigkeit hinweisen, die eine Nachjustierung oder ähnliches des Schlittens erfordern.In the display unit 56, the display can follow directly on a screen similar to FIG. 2 and / or the display can take place by means of diodes, whereby green diodes mean "IO", yellow diodes mean "still tolerable" and red diodes indicate insufficient movement accuracy that require readjustment or the like of the carriage.
Es versteht sich, daß vielfältige andere Auswertemöglichkeiten möglich sind und daß die Überwachungsvorrichtung als eigenständiges, unabhängiges System installiert werden kann oder in das Steuersystem der Motoren für den Roboter und den Antrieb des Gehäuses 2 in waagerechter und senkrechter Richtung integriert sein kann, indem beispielsweise entsprechende Zeitmarken von der Steuereinrichtung der Elektromotoren dem Steuergerät 54 zugeführt werden und so weiter.It goes without saying that various other evaluation options are possible and that the monitoring device can be installed as a separate, independent system or can be integrated in the control system of the motors for the robot and the drive of the housing 2 in a horizontal and vertical direction, for example by corresponding time stamps are supplied from the control device of the electric motors to the control device 54 and so on.
Es versteht sich, daß eine Drift des Meßergebnisses erfaßt werden kann, so daß systematische Veränderungen beobachtet und extrapoliert werden können, wodurch Fehler vorher- gesagt werden können. Weiter kann hinter dem Eintrittsfenster 62 eine Diodenleiste angeordnet sein, so daß der Absolutwert der Höhe der Unterseite 66 innerhalb des Lichtbündels 60 unmittelbar erfaßt werden kann. Des weiteren kann die Anordnung auch derart ausgebildet sein, daß die Oberseite des Schlittens 28 abgetastet wird, so daß zunächst die Oberseite des Schlittens außerhalb der Einsenkung 30 erfaßt wird und dann eine in der Einsenkung 30 liegende Wafer-Scheibe erfaßt wird, so daß mit der Überwachung der einwandfreien Bewegung des Schlittens die einwandfreie Positionierung einer Wafer-Scheibe und sogar die einwandfreie Qualität der Wafer-Scheibe selbst überwacht werden kann.It goes without saying that a drift of the measurement result can be detected so that systematic changes can be observed and extrapolated, whereby errors can be predicted. Furthermore, a diode bar can be arranged behind the entrance window 62, so that the absolute value of the height of the underside 66 can be detected directly within the light beam 60. Furthermore, the arrangement can also be designed such that the top of the carriage 28 is scanned so that first the top of the carriage outside the depression 30 is detected and then a wafer disc lying in the depression 30 is detected, so that with the Monitoring the flawless movement of the carriage, the flawless positioning of a wafer and even the flawless quality of the wafer itself can be monitored.
Durch die Kalibrierung des Ausgangssignals bei nicht abgedecktem Eintrittsfenster 64 auf jeweils Hundert ist eine weitgehende Unempfindlichkeit gegenüber Veränderungen der Lichtstärke der Lichtquelle 50 und gegenüber Verschmutzungen gegeben.By calibrating the output signal when the entrance window 64 is not covered to a hundred, there is extensive insensitivity to changes in the light intensity of the light source 50 and to contamination.
Fig. 6 zeigt eine abgeänderte Ausführungsform einer Wafer-Scheiben- Verarbeitungseinrichtung, wobei für funktionsähnliche Bauteile die gleichen Bezugszeichen wie in den Fig. 3 bis 5 verwendet sind. Die Ansicht der Fig. 6 entspricht bezüglich der Blickrichtung einer Ansicht der Anordnung gemäß Fig. 5 schräg von hinten. Das Gehäuse 2, das die nicht dargestellten Gestelle 4 und 6 aufnimmt, enthält zwei hermetisch verschließbare Gehäuseteile 2a und 2b, die Vakuumkammern enthalten, in denen Halterungen 67 für die Magazine bzw. Gestelle 4 und 6 (Fig. 3 und 5) aufgenommen sind. Die Halterungen 67 sind mittels Stellmotoren 68 senkrecht bewegbar. Das gesamte Gehäuse 2 ist starr an einem Grund- rahmen (nicht dargestellt) befestigt. Im Unterschied zur Ausführungsform gemäß Fig. 3, bei der die Lichtquelle 50 und der Lichtempfänger 52 an dem den Roboter aufnehmenden Gehäuse 18 angeordnet sind, sind bei der Ausführungsform gemäß Fig. 6 innerhalb jedes Gehäuseteils 2a und 2b eine Lichtquelle 50 und ein Lichtempfanger 52 angeordnet, die über Kabel 68 an das Steuergerät 54 (Fig. 1) angeschlossen sind.FIG. 6 shows a modified embodiment of a wafer wafer processing device, the same reference numerals as in FIGS. 3 to 5 being used for functionally similar components. The view of FIG. 6 corresponds with respect to the viewing direction of a view of the arrangement according to FIG. 5 obliquely from behind. The housing 2, which receives the frames 4 and 6, not shown, contains two hermetically closable housing parts 2a and 2b, which contain vacuum chambers in which holders 67 for the magazines or frames 4 and 6 (FIGS. 3 and 5) are accommodated. The brackets 67 can be moved vertically by means of servomotors 68. The entire housing 2 is rigidly attached to a base frame (not shown). In contrast to the embodiment according to FIG. 3, in which the light source 50 and the light receiver 52 are arranged on the housing 18 receiving the robot, in the embodiment according to FIG. 6, a light source 50 and a light receiver 52 are arranged within each housing part 2a and 2b , which are connected via cable 68 to the control unit 54 (FIG. 1).
Die in den Gehäuseteilen 2a und 2b ausgebildeten Aufnahmekammern sind in Fig. 6 offen und können mit Schiebern 72a und 72b luftdicht verschlossen werden. Bei geöffneten Schiebern 72a und 72b können an den Halterungen 67 mit Wafer-Scheiben bestückte Gestelle eingesetzt bzw. herausgenommen werden.The receiving chambers formed in the housing parts 2a and 2b are open in FIG. 6 and can be closed air-tight with slides 72a and 72b. With the slides 72a and 72b open, frames equipped with wafer disks can be inserted or removed from the holders 67.
Die geometrische Anordnung ergibt sich aus Fig. 7, die einen waagerechten Schnitt durch das Gehäuseteil 2a darstellt. Sichtbar sind die Lichtquelle 50, der Lichtempfänger 52, der Schlitten 28, das Gestell 6 und eine Wafer-Scheibe 10. Die Anordnung der Lichtquelle 50 und des Lichtempfängers 52 und die Dimensionierungen sind derart, daß das Lichtbündel 60 (Fig. 1) einen Zwischenraum zwischen zwei mit Wafer-Scheiben 10 bestückten Fächern frei durchstrahlt, wenn sich der Schlitten 28 nicht innerhalb des Gestells 6 und das Gestell in einer vorbestimmten Schrittposition befindet. Die Funktionsfolge des Überwachungssy- stems bei der Anwendung der Ausführungsform gemäß Fig. 6 und 7 ist Folgende:The geometric arrangement results from FIG. 7, which represents a horizontal section through the housing part 2a. The light source 50, the light receiver 52, the slide 28, the frame 6 and a wafer disk 10 are visible. The arrangement of the light source 50 and the light receiver 52 and the dimensions are such that the light bundle 60 (FIG. 1) freely shines through a space between two compartments equipped with wafer disks 10 when the carriage 28 is not within the frame 6 and the frame in a predetermined step position located. The function sequence of the monitoring system when using the embodiment according to FIGS. 6 and 7 is as follows:
Bei außerhalb des Gehäuses 2 bzw. einer der Gehäuseteile 2 befindlichen Schlitten 28 befinden sich die Magazine durch Betätigung der Schrittschaltmotoren 68 jeweils in einer Stellung, in der das Lichtbündel den Zwischenraum zwischen zwei Fächern ohne Abdek- kung durchstrahlt, d.h. im Diagramm der Fig. 2 ergibt sich ein Signalwert im Bereich A, also ein maximaler Wert des Ausgangssignals des bzw. der Lichtempfanger 52. Im Folgenden wird die Funktion nur für eines der Magazine, beispielsweise das gemäß Fig. 6 in dem rechten Gehäuseteil 2b befindliche, nicht dargestellte Magazin beschrieben. Wenn in der außerhalb des Gehäuseteils 2b befindlichen Stellung des Schlittens 28 nicht der Maxi- malwert der Lichtintensität gemessen wird, deutet dies auf einen Fehler des zugehörigen Schrittschaltmotors 68 bzw. von dessen Steuerung. Das Überwachungssystem kann dazu verwendet werden, die Betätigung des Schrittschaltmotors 68 zu steuern, indem dieser solange betätigt wird, bis maximale Lichtintensität erreicht wird. Dies kann probeweise für ein gesamtes, neu eingesetztes, gegebenenfalls mit Wafer-Scheiben beladenes Magazin geschehen, so daß Magazinungenauigkeiten ausgeglichen werden können, indem der Schrittschaltmotor 68 immer derart betätigt wird, daß der Zwischenraum zwischen zwei Fachböden derart angeordnet ist, daß er vollständig von dem Lichtbündel 60 durchstrahlt wird. Es versteht sich, daß es vorteilhaft ist, die Höhenabmessung des Lichtbündels 60 etwas kleiner zu dimensionieren als den Abstand zwischen zwei Fachböden, damit das maximale Ausgangssignal gewährleistet ist.When the carriage 28 is located outside the housing 2 or one of the housing parts 2, the magazines are each in a position by actuating the stepping motors 68, in which the light beam shines through the space between two compartments without being covered, i.e. in the diagram of FIG. 2 there is a signal value in the area A, that is to say a maximum value of the output signal of the light receiver (s) 52. In the following, the function is only for one of the magazines, for example that in the right housing part 2b according to FIG. 6 described magazine, not shown. If the maximum value of the light intensity is not measured in the position of the slide 28 outside the housing part 2b, this indicates an error in the associated stepping motor 68 or in its control. The monitoring system can be used to control the actuation of stepper motor 68 by actuating it until maximum light intensity is reached. This can be done on a trial basis for an entire newly inserted magazine, possibly loaded with wafer disks, so that magazine inaccuracies can be compensated for by the stepping motor 68 always being actuated in such a way that the space between two shelves is arranged in such a way that it is completely separated from that Beam of light 60 is shone through. It goes without saying that it is advantageous to dimension the height dimension of the light beam 60 somewhat smaller than the distance between two shelves, so that the maximum output signal is guaranteed.
In der mit Hilfe des Lichtbündels kontrollierten, vorbestimmten Stellung des Magazins wird nun der Transportarm 28 in den Gehäuseteil 2b in den Zwischenraum zwischen zwei Fächerböden bzw. zwei an ihren Rand von den Fächerböden aufgenommenen Wafer- Scheiben hineinbewegt, wobei diese Bewegung gemäß Fig. 2 überwacht wird. Die Überwachung unterscheidet sich insoweit etwas von der Darstellung der Fig. 2, als sich der Schlitten aus dem linken Bereich A nur in dem Bereich B bewegt und nicht vollständig durch das Lichtbündel hindurchbewegt. Anschließend wird das Gestell abgesenkt, wobei die Absenkung um einen vorbestimmten Betrag erfolgt, oder, wenn die Annäherungssensoren 36 (Fig. 4) vorgesehen sind, die Absenkung über die Annäherungssensoren 36 gesteuert wird. Die auf dem Schlitten aufliegende Wafer-Scheibe wird dann mit Hilfe von Vakuumbeaufschlagung der Vakuumschlitze 34 festgehalten und aus dem Gehäuseteil 2a her- ausbewegt.In the predetermined position of the magazine controlled with the aid of the light bundle, the transport arm 28 is now moved into the housing part 2b into the space between two compartment bases or two wafer disks received at their edges by the compartment bases, this movement being monitored according to FIG. 2 becomes. The monitoring differs somewhat from the illustration in FIG. 2 in that the carriage moves from the left area A only in the area B and does not move completely through the light beam. Then the frame is lowered, whereby the lowering takes place by a predetermined amount, or, if the proximity sensors 36 (FIG. 4) are provided, the lowering is controlled via the proximity sensors 36. The wafer disk lying on the carriage is then held in place by means of vacuum application of the vacuum slots 34 and moved out of the housing part 2a.
Die Ablage der fertig bearbeiteten Wafer-Scheibe in dem in dem anderen Gehäuseteil 2a aufgenommenen Gestell geschieht in analoger Weise wie anhand der Fig. 3 bis 5 erläutert, wobei die Höhenposition des Gestells zusätzlich, wie erläutert, überwacht werden kann.The storage of the finished wafer in the frame accommodated in the other housing part 2a takes place in an analogous manner as explained with reference to FIGS. 3 to 5, wherein the height position of the frame can also be monitored, as explained.
Insgesamt wird mit dem beispielhaft beschriebenen, erfindungsgemäßen Überwachungssystem somit bei außerordentlich geringem Bestückungsaufwand (Lichtsender und Lichtempfänger) in der Produktionseinrichtung eine zielführende Überwachung möglich, die die Überwachung der senkrechten Bewegung des mit den Fächern zur Aufnahme der Wafer- Scheiben ausgebildeten Gestells und der Bewegung des die Wafer-Scheiben transportierenden Schlittens nur einen Lichtempfanger und Lichtsender verwendet, wobei der Lichtempfänger lediglich ein einfaches, einer Bestrahlungsgesamtintensität entsprechendes Ausgangssignal erzeugt. Overall, the monitoring system according to the invention described by way of example thus makes it possible, with extremely little equipment (light transmitter and light receiver) in the production facility, to carry out targeted monitoring which monitors the vertical movement of the frame formed with the compartments for receiving the wafer disks and the movement of the Wafer slices transporting carriage uses only one light receiver and light transmitter, the light receiver only generating a simple output signal corresponding to an overall irradiation intensity.

Claims

Patentansprüche claims
1. Überwachungssystem für eine Transportvorrichtung von Flachteilen, insbesondere Wafer-Scheiben, welche Transportvorrichtung einen längs einer vorbestimmten Bahn neben ein an einer vorbestimmten Entnahmestelle befindliches Flachteil (10) bewegbaren Schlitten (28) mit einer Aufnahmeeinrichtung (30, 34) zur Aufnahme des Flachteils (10) aufweist, welches Überwachungssystem enthält eine Lichtquelle (50) mit einem Lichtaustrittsfenster (38) und einen Lichtempfänger (52) mit einem Lichteintrittsfenster (62), wobei das Lichtaustrittsfenster und das Lichteintrittsfenster derart positioniert sind, daß ein vom Lichaustrittsfenster zum Lichteintrittsfenster gerichtetes Lichtbündel (60) von dem Schlitten (28) während seiner Bewegung durch das Lichtbündel teilweise abgedeckt wird, und eine an den Lichtempfänger angeschlossene Auswerteeinrichtung (64), die ein aus seiner Bewegung des Schlittens längs einer Soll-Bahn hergeleitetes Sollsignal mit einem aus einer Ist-Bewegung des Schlittens hergeleiteten Istsignal vergleicht und eine Abweichung anzeigt.1. Monitoring system for a transport device for flat parts, in particular wafer slices, which transport device has a carriage (28) movable along a predetermined path next to a flat part (10) located at a predetermined removal point, with a receiving device (30, 34) for receiving the flat part ( 10), which monitoring system contains a light source (50) with a light exit window (38) and a light receiver (52) with a light entry window (62), the light exit window and the light entry window being positioned such that a light beam directed from the light exit window to the light entry window ( 60) is partially covered by the carriage (28) during its movement through the light beam, and an evaluation device (64) connected to the light receiver, which evaluates a target signal derived from its movement of the carriage along a target path with a signal from an actual movement of the sled s derived actual signal is compared and indicates a deviation.
2. Überwachungssystem nach Anspruch 1, wobei die vorbestimmte Bahn in einer Ebene verläuft und das Lichtbundel (60) parallel zu der Ebene gerichtet ist.2. The monitoring system of claim 1, wherein the predetermined path is in a plane and the light beam (60) is directed parallel to the plane.
3. Überwachungssystem nach Anspruch 1, wobei die Lichtquelle (50) eine Laserlichtquelle ist und das Lichtaustrittsfenster (58) und das Lichteintrittsfenster (62) als senkrecht zu der Bewegungsbahnebene gerichtete Schlitze ausgebildet sind, zwischen denen das Lichtbündel als Parallellichtbündel verläuft.3. Monitoring system according to claim 1, wherein the light source (50) is a laser light source and the light exit window (58) and the light entry window (62) are designed as slots directed perpendicular to the plane of the movement path, between which the light beam runs as a parallel light beam.
4. Überwachungssystem nach Anspruch 2 oder 3, wobei der Schlitten (28) eine etwa parallel zur Bewegungsbahnebene gerichtete Unterseite (66) aufweist, die bei Bewegung des Schlittens längs der Sollbahn das Lichtbündel durchschneidet.4. Monitoring system according to claim 2 or 3, wherein the carriage (28) has an approximately parallel to the plane of the movement underside (66) which cuts through the light beam when the carriage moves along the desired path.
5. Überwachungssystem nach einem der Ansprüche 1 bis 4, wobei die Auswerteeinrichtung (64) ein Soll- und /oder ein Istsignal dadurch ermittelt, daß das Ausgangssignal des Lichtempfängers (52) ohne Schlittenüberdeckung in Beziehung zu wenigstens einem Ausgangssignal des Lichtempfängers mit Schlittenüberdeckung gesetzt wird.5. Monitoring system according to one of claims 1 to 4, wherein the evaluation device (64) determines a target and / or an actual signal in that the output signal of the light receiver (52) without sled cover in relation to at least one output signal of the light receiver with sled cover.
6. Überwachungssystem nach Anspruch 5, wobei mehrere während einer Schlitten- Überdeckung erhaltene Ausgangssignale übermittelt werden.6. Monitoring system according to claim 5, wherein a plurality of output signals obtained during a sled overlap are transmitted.
7. Überwachungssystem nach Anspruch 6, wobei die Erfassung der während einer Schlittenüberdeckung aufgenommenen Ausgangssignale durch die Abnahme des Ausgangssignals bei Beginn der Schlittenüberdeckung getriggert wird.7. Monitoring system according to claim 6, wherein the detection of the output signals recorded during a sled cover is triggered by the decrease in the output signal at the start of the sled cover.
8. Überwachungssystem nach einem der Ansprüche 1 bis 7, wobei mehrere Flachteile (10) in einem Gestell (4, 6) mit senkrecht zur Bewegungsbahnebene des Schlittens beab- standeten Fächern (8) aufgenommen sind, das Gestell schrittweise senkrecht zur Bewegungsbahn des Schlittens derart bewegbar ist, daß ein in einem Fach aufgenommenes Flachteil in die vorbestimmte Entnahmeposition gelangt, und die Lichtquelle (50) und der Lichtempfänger (52) derart angeordnet sind, daß das Lichtbündel (60) zwischen den Fächern ausgebildete Zwischenräume mit vorbestimmter Überdeckung durch ein Gestellteil durchstrahlt, wenn das Gestell nach Entnahme eines Flachteils und Herausbewegen des Schlittens mit dem darauf befindlichen Flachteil in eine vor- bestimmte neue Positon bewegt wird, wobei die Auswerteeinrichtung (54) einen Fehler anzeigt, wenn das Ausgangssignal des Lichtempfängers der vorbestimmten Überdeckung nicht entspricht.8. Monitoring system according to one of claims 1 to 7, wherein a plurality of flat parts (10) are accommodated in a frame (4, 6) with compartments (8) spaced apart perpendicularly to the plane of movement of the slide, the frame gradually perpendicular to the movement of the slide in such a way It is movable that a flat part accommodated in a compartment comes into the predetermined removal position, and the light source (50) and the light receiver (52) are arranged in such a way that the light bundle (60) shines through gaps formed between the compartments with a predetermined coverage through a frame part if the frame is moved into a predetermined new position after removing a flat part and moving the slide with the flat part thereon, the evaluation device (54) indicating an error if the output signal of the light receiver does not correspond to the predetermined overlap.
9. Überwachungssystem nach Anspruch 8, dadurch gekennzeichnet, daß in der vorbe- stimmten neuen Position des Gestells (4, 6) das Lichtbündel (60) nicht überdeckt ist. 9. Monitoring system according to claim 8, characterized in that in the predetermined new position of the frame (4, 6) the light beam (60) is not covered.
EP00993283A 1999-12-02 2000-12-01 Monitoring system for a conveying device that conveys flat articles, especially wafers Withdrawn EP1234323A2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19958082A DE19958082A1 (en) 1999-12-02 1999-12-02 Monitoring system for a transport device for flat parts, in particular wafer slices
DE19958082 1999-12-02
PCT/EP2000/012103 WO2001040884A2 (en) 1999-12-02 2000-12-01 Monitoring system for a conveying device that conveys flat articles, especially wafers

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EP1234323A2 true EP1234323A2 (en) 2002-08-28

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7489779B2 (en) * 2001-03-22 2009-02-10 Qstholdings, Llc Hardware implementation of the secure hash standard
KR100568867B1 (en) * 2004-03-18 2006-04-10 삼성전자주식회사 Semiconductor manufacture device sensing coordinates of wafer and device sensing coordinates of wafer therefor

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07115773B2 (en) * 1986-01-29 1995-12-13 株式会社ニコン Substrate transfer device
US5605428A (en) * 1993-03-05 1997-02-25 Jenoptik Gmbh Device for indexing magazine compartments and wafer-shaped objects in the compartments
DE4310149C2 (en) * 1993-03-29 1996-05-02 Jenoptik Jena Gmbh Device for handling disc-shaped objects in a handling level of a local clean room
DE4326309C1 (en) * 1993-08-05 1994-09-15 Jenoptik Jena Gmbh Device for transferring wafer magazines
US5466945A (en) * 1994-03-23 1995-11-14 Eaton Corporation Apparatus for detecting proper positioning of objects in a holder
KR100213991B1 (en) * 1994-05-23 1999-08-02 히가시 데쓰로 Probe test apparatus
KR100315007B1 (en) * 1995-11-22 2002-02-28 이시다 아키라 Substrate detection and transfer apparatus in cassette and method thereof
JP3327130B2 (en) * 1996-07-24 2002-09-24 ウシオ電機株式会社 Object detection method and wafer transfer arm detection device
JPH11150078A (en) * 1997-11-17 1999-06-02 Ulvac Corp Vertical type heat treatment furnace
JPH11179692A (en) * 1997-12-16 1999-07-06 Shin Meiwa Ind Co Ltd Hand abnormality detecting device and hand abnormality detecting method for industrial robot
JPH11254359A (en) * 1998-03-12 1999-09-21 Toyota Autom Loom Works Ltd Member conveyance system
US6516244B1 (en) * 2000-08-25 2003-02-04 Wafermasters, Inc. Wafer alignment system and method
US6430468B1 (en) * 2000-11-17 2002-08-06 Applied Materials, Inc. Method and apparatus for accurate placement of semiconductor wafers onto respective platforms within a single reaction chamber

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0140884A3 *

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WO2001040884A3 (en) 2002-02-14
WO2001040884A2 (en) 2001-06-07
DE19958082A1 (en) 2001-06-07
US6681148B2 (en) 2004-01-20
US20020182052A1 (en) 2002-12-05
WO2001040884A9 (en) 2002-09-19

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