EP1219424B1 - Cmos/mems integrierter Tintenstrahldruckkopf mit Querflussdüsenarchitektur auf Siliziumbasis und Verfahren zu seiner Herstellung - Google Patents

Cmos/mems integrierter Tintenstrahldruckkopf mit Querflussdüsenarchitektur auf Siliziumbasis und Verfahren zu seiner Herstellung Download PDF

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Publication number
EP1219424B1
EP1219424B1 EP20010130222 EP01130222A EP1219424B1 EP 1219424 B1 EP1219424 B1 EP 1219424B1 EP 20010130222 EP20010130222 EP 20010130222 EP 01130222 A EP01130222 A EP 01130222A EP 1219424 B1 EP1219424 B1 EP 1219424B1
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EP
European Patent Office
Prior art keywords
print head
bore
ink
silicon substrate
insulating layer
Prior art date
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Expired - Lifetime
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EP20010130222
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English (en)
French (fr)
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EP1219424A3 (de
EP1219424A2 (de
Inventor
Constantine N. Anagnostopoulos
John A. Lebens
David P. Trauernicht
Emmanuel K. Dokyi
James M. Chwalek
Gilbert A. Hawkins
Christopher N. Delametter
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Eastman Kodak Co
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Eastman Kodak Co
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Publication date
Priority claimed from US09/751,722 external-priority patent/US6439703B1/en
Priority claimed from US09/792,188 external-priority patent/US6450619B1/en
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of EP1219424A2 publication Critical patent/EP1219424A2/de
Publication of EP1219424A3 publication Critical patent/EP1219424A3/de
Application granted granted Critical
Publication of EP1219424B1 publication Critical patent/EP1219424B1/de
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/02—Ink jet characterised by the jet generation process generating a continuous ink jet
    • B41J2/03—Ink jet characterised by the jet generation process generating a continuous ink jet by pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/02—Ink jet characterised by the jet generation process generating a continuous ink jet
    • B41J2/03—Ink jet characterised by the jet generation process generating a continuous ink jet by pressure
    • B41J2002/032—Deflection by heater around the nozzle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/16—Nozzle heaters

Definitions

  • This invention generally relates to the field of digitally controlled printing devices, and in particular to liquid ink jet print heads which integrate multiple nozzles on a single substrate and in which a liquid drop is selected for printing by thermo-mechanical means.
  • Ink jet printing has become recognized as a prominent contender in the digitally controlled, electronic printing arena because, e.g., of its non-impact, low noise characteristics and system simplicity. For these reasons, ink jet printers have achieved commercial success for home and office use and other areas.
  • Ink jet printing mechanisms can be categorized as either continuous (CIJ) or Drop-on-Demand (DOD).
  • Piezoelectric DOD printers have achieved commercial success at image resolutions greater than 720 dpi for home and office printers.
  • piezoelectric printing mechanisms usually require complex high voltage drive circuitry and bulky piezoelectric crystal arrays, which are disadvantageous in regard to number of nozzles per unit length of print head, as well as the length of the print head.
  • piezoelectric print heads contain at most a few hundred nozzles.
  • Thermal ink jet printing typically requires that the heater generates an energy impulse enough to heat the ink to a temperature near 400°C which causes a rapid formation of a bubble.
  • the high temperatures needed with this device necessitate the use of special inks, complicates driver electronics, and precipitates deterioration of heater elements through cavitation and kogation.
  • Kogation is the accumulation of ink combustion by-products that encrust the heater with debris. Such encrusted debris interferes with the thermal efficiency of the heater and thus, shorten the operational life of the print head.
  • the high active power consumption of each heater prevents the manufacture of low cost, high speed and page wide print heads.
  • a gutter (sometimes referred to as a "catcher") is normally used to intercept the charged drops and establish a non-print mode, while the uncharged drops are free to strike the recording medium in a print mode as the ink stream is thereby deflected, between the "non-print” mode and the "print” mode.
  • the apparatus comprises an ink delivery channel, a source of pressurized ink in communication with the ink delivery channel, and a nozzle having a bore which opens into the ink delivery channel, from which a continuous stream of ink flows.
  • Periodic application of weak heat pulses to the stream by a heater causes the ink stream to break up into a plurality of droplets synchronously with the applied heat pulses and at a position spaced from the nozzle.
  • the droplets are deflected by increased heat pulses from the heater (in the nozzle bore) which heater has a selectively actuated section, i.e., the section associated with only a portion of the nozzle bore.
  • Asymmetrically applied heat results in stream deflection, the magnitude of which depends upon several factors, e.g. the geometric and thermal properties of the nozzles, the quantity of applied heat, the pressure applied to, and the physical, chemical and thermal properties of the ink.
  • solvent-based (particularly alcohol-based) inks have quite good deflection patterns, and achieve high image quality in asymmetrically heated continuous ink jet printers, water-based inks are more problematic. The water-based inks do not deflect as much, thus their operation is not robust.
  • a continuous ink jet print printer that includes a print head of the type wherein ink forms a meniscus above a nozzle bore and spreads along an upper surface of the print head.
  • the print head includes a substrate having an upper surface, an ink delivery channel below the substrate, and a nozzle bore through the substrate and opening below the substrate inot the ink delivery channel to establish an ink flow path.
  • a resistive heater lies about at least a portion of the heater bore.
  • the invention to be described herein builds upon the work of Chwalek et al. and Delametter et al. in terms of constructing continuous ink jet print heads that are suitable for low-cost manufacture and preferably for print heads that can be made page wide.
  • page wide refers to print heads of a minimum length of about four inches.
  • High-resolution implies nozzle density, for each ink color, of a minimum of about 300 nozzles per inch to a maximum of about 2400 nozzles per inch.
  • page wide print heads To take full advantage of page wide print heads with regard to increased printing speed they must contain a large number of nozzles. For example, a conventional scanning type print head may have only a few hundred nozzles per ink color. A four inch page wide print head, suitable for the printing of photographs, should have a few thousand nozzles. While a scanned print head is slowed down by the need for mechanically moving it across the page, a page wide print head is stationary and paper moves past it. The image can theoretically be printed in a single pass, thus substantially increasing the printing speed.
  • nozzles have to be spaced closely together, of the order of 10 to 80 micrometers, center to center spacing.
  • the drivers providing the power to the heaters and the electronics controlling each nozzle must be integrated with each nozzle, since attempting to make thousands of bonds or other types of connections to external circuits is presently impractical.
  • One way of meeting these challenges is to build the print heads on silicon wafers utilizing VLSI technology and to integrate the CMOS circuits on the same silicon substrate with the nozzles.
  • a continuous ink jet print head having a plurality of nozzles
  • the print head comprising: a silicon substrate including integrated circuits formed therein for controlling operation of the print head, the silicon substrate having an ink channel formed therein; an insulating layer or layers overlying the silicon substrate, the insulating layer or layers having a bore formed therein and communicating with the ink channel; and wherein the silicon substrate includes at each nozzle a blocking structure formed of silicon between the ink channel and the bore, an access opening being provided between the ink channel and the bore to permit ink from the ink channel to flow about the blocking structure and to enter the access opening at a location offset from the bore to provide lateral flow components to the liquid ink entering the bore, and a heater around the bore for asymmetrically heating the ink stream and therefore deflecting or not the ink stream.
  • a method of forming a continuous ink jet print head comprising: providing a silicon substrate having integrated circuits for controlling operation of the print head, the silicon substrate having an insulating layer or layers formed thereon, the insulating layer or layers having electrical conductors formed therein that are electrically connected to circuits formed in the silicon substrate; forming in the insulating layer or layers a bore; forming in the silicon substrate an ink channel that is to communicate with the bore; providing a heater around the bore for asymmetrically heating the ink stream and therefore deflecting or not the ink stream and forming a blocking structure in the silicon substrate for controlling lateral flow of ink from the ink channel formed in the silicon substrate to the bore formed in the insulating layer or layers.
  • a continuous ink jet printer system is generally shown at 10.
  • the print head 10a from which extends an array of nozzles 20, incorporates heater control circuits (not shown).
  • Heater control circuits read data from an image memory, and send time-sequenced electrical pulses to the heaters of the nozzles of nozzle array 20. These pulses are applied an appropriate length time, and to the appropriate nozzle, so that drops formed from a continuous ink jet stream will form spots on a recording medium 13, in the appropriate position designated by the data sent from the image memory. Pressurized ink travels from an ink reservoir (not shown) to an ink delivery channel 14 and through nozzle array 20 on to either the recording medium 13 or the gutter 19.
  • the ink gutter 19 is configured to catch undeflected ink droplets 11 while allowing deflected droplets 12 to reach a recording medium.
  • the general description of the continuous ink jet printer system of Fig. 9 is also suited for use as a general description in the printer system of the invention.
  • FIG. 1 there is shown a top view of an ink jet print head according to the teachings of the present invention.
  • the print head comprises an array of nozzles 1a-1d arranged in a line or a staggered configuration.
  • Each nozzle is addressed by a logic AND gate (2a-2d) which contains logic circuitry and a heater driver transistor (not shown).
  • the logic circuitry causes a respective driver transistor to turn on if a respective signal on a respective data input line (3a-3d) to the AND gate (2a-2d) and the respective enable clock lines (5a-5d), which is connected to the logic gate, are both logic ONE.
  • signals on the enable clock lines (5a-5d) determine durations of the lengths of time current flows through the heaters in the particular nozzles 1a-1d.
  • Data for driving the heater driver transistor may be provided from processed image data that is input to a data shift register 6.
  • the latch register 7a-7d in response to a latch clock, receives the data from a respective shift register stage and provides a signal on the lines 3a-3d representative of the respective latched signal (logical ONE or ZERO) representing either that a dot is to be printed or not on a receiver.
  • the lines A-A and B-B define the direction in which cross-sectional views are taken.
  • Figures 1A and 1B show more detailed top views of the two types of heaters (the "notch type” and “split type” respectively) used in CIJ print heads. They produce asymmetric heating of the jet and thus cause ink jet deflection. Asymmetrical application of heat merely means supplying electrical current to one or the other section of the heater independently in the case of a split type heater. In the case of a notch type heater applied current to the notch type heater will inherently involve an asymmetrical heating of the ink. With reference now to Figure 1A there is illustrated a top view of an ink jet print head nozzle with a notched type heater. The heater is formed adjacent the exit opening of the nozzle bore.
  • the heater element material substantially encircles the nozzle bore but for a very small notched out area, just enough to cause an electrical open.
  • one side of each heater is connected to a common bus line, which in turn is connected to the power supply typically +5 volts.
  • the other side of each heater is connected to a logic AND gate within which resides an MOS transistor driver capable of delivering up to 30 mA of current to that heater.
  • the AND gate has two logic inputs. One is from the Latch 7a-d which has captured the information from the respective shift register stage indicating whether the particular heater will be activated or not during the present line time.
  • the other input is the enable clock that determines the length of time and sequence of pulses that are applied to the particular heater. Typically there are two or more enable clocks in the print head so that neighboring heaters can be turned on at slightly different times to avoid thermal and other cross talk effects.
  • FIG. 1B there is illustrated the nozzle with a split type heater wherein there are essentially two semicircular heater elements surrounding the nozzle bore adjacent the exit opening thereof. Separate conductors are provided to the upper and lower segments of each semi circle, it being understood that in this instance upper and lower refer to elements in the same plane. Vias are provided that electrically contact the conductors to metal layers associated with each of these conductors. These metal layers are in turn connected to driver circuitry formed on a silicon substrate as will be described below.
  • FIG. 2 there is shown a simplified cross-sectional view of an operating nozzle across the B-B direction.
  • an ink channel formed under the nozzle bores to supply the ink.
  • This ink supply is under pressure typically between 15 to 25 psi for a bore diameter of about 8.8 micrometers.
  • the ink in the delivery channel emanates from a pressurized reservoir (not shown), leaving the ink in the channel under pressure.
  • the constant pressure can be achieved by employing an ink pressure regulator (not shown). Without any current flowing to the heater, a jet forms that is straight and flows directly into the gutter.
  • On the surface of the print head a symmetric meniscus forms around each nozzle that is a few microns larger in diameter than the bore.
  • the meniscus in the heated side pulls in and the jet deflects away from the heater.
  • the droplets that form then bypass the gutter and land on the receiver.
  • the current through the heater is returned to zero, the meniscus becomes symmetric again and the jet direction is straight.
  • the device could just as easily operate in the opposite way, that is, the deflected droplets are directed into the gutter and the printing is done on the receiver with the non-deflected droplets.
  • having all the nozzles in a line is not absolutely necessary. It is just simpler to build a gutter that is essentially a straight edge rather than one that has a staggered edge that reflects the staggered nozzle arrangement.
  • the heater resistance is of the order of 400 ohms
  • the current amplitude is between 10 to 20 mA
  • the pulse duration is about 2 microseconds
  • the resulting deflection angle for pure water is of the order of a few degrees.
  • U.S. Application Serial Number 09/221,256 entitled “Continuous Ink Jet Print head Having Power-Adjustable Segment Heaters”
  • U.S. Application Serial Number 09/221,342 entitled “Continuous Ink Jet Print head Having Multi-Segmented Heaters", both filed December 28, 1998.
  • the application of periodic current pulses causes the jet to break up into synchronous droplets, to the applied pulses.
  • These droplets form about 100 to 200 micrometers away from the surface of the print head and for an 8.8 micrometers diameter bore and about 2 microseconds wide, 200 kHz pulse rate, they are typically 3 to 4 pL in size.
  • the cross-sectional view taken along sectional line A-B and shown in Figure 3 represents an incomplete stage in the formation of a print head in which nozzles are to be later formed in an array wherein CMOS circuitry is integrated on the same silicon substrate.
  • CMOS circuitry is fabricated first on the silicon wafers.
  • the CMOS process may be a standard 0.5 micrometers mixed signal process incorporating two levels of polysilicon 2 and three levels of metal on a six inch diameter wafer. Wafer thickness is typically 675 micrometers.
  • this process is represented by the three layers of metal, shown interconnected with vias.
  • polysilicon level 2 and an N+ diffusion contact to metal layer 1 are drawn to indicate active circuitry in the silicon substrate.
  • Gates of CMOS transistors may be formed in the polysilicon layers.
  • dielectric layers are deposited between them making the total thickness of the film on top of the silicon wafer about 4.5 micrometers.
  • CMOS fabrication steps a silicon substrate of approximately 675 micrometers in thickness and about 6 inches in diameter is provided. Larger or smaller diameter silicon wafers can be used equally as well.
  • a plurality of transistors are formed in the silicon substrate through conventional steps of selectively depositing various materials to form these transistors as is well known.
  • Supported on the silicon substrate are a series of layers eventually forming an oxide/nitride insulating layer that has one or more layers of polysilicon and metal layers formed therein in accordance with desired pattern. Vias are provided between various layers as needed and openings may be pre-provided in the surface for allowing access to metal layers to provide for bond pads.
  • the oxide/nitride insulating layers is about 4.5 micrometers in thickness.
  • the structure illustrated in Figure 3 basically would provide the necessary interconnects, transistors and logic gates for providing the control components illustrated in Figure 1. Although only one of the bond pads is shown it will be understood that multiple bond pads are formed in the nozzle array. The various bond pads are provided to make respective connections to data, latch clock, enable clocks, and power provided from a circuit board mounted adjacent the print head or from a remote location.
  • jet deflection could be further increased by increasing the portion of ink entering the bore of the nozzle with lateral rather than axial momentum. Such can be accomplished by blocking some of the fluid having axial momentum by building a block in the center of each nozzle array construct aligned with and just below the nozzle bore.
  • the same polysilicon layer that is used to form gates of the MOS transistors is used as the heater film.
  • the heater film To enhance the jet deflection from this nozzle it is desirable to thin the dielectric film above the heater to about 0.35 micrometers.
  • approximately 3.5 micrometers of the dielectric film is removed to form a nozzle bore region between the ink channel and a relatively wider and deep nozzle recess opening formed in the surface of the nozzle array.
  • the nozzle recess is formed through an etch back process in a timed step.
  • the final bore film thickness is approximately 1.0 micrometers.
  • the silicon wafers are then thinned from their initial thickness of 675 micrometers to 300 micrometers.
  • a mask to open channels is then applied to the backside of the wafers and the silicon is etched, in an STS etcher, all the way to the front surface of the silicon.
  • the mask used is one that will leave behind a silicon bridge or rib between each nozzle of the nozzle array during the etching of the ink channel. These bridges extend all the way from the back of the silicon wafer to the front of the silicon wafer.
  • the ink channel pattern defined in the back of the wafer therefore, is thus not a long rectangular recess running parallel to the direction of the row of nozzles but is instead a series of smaller rectangular cavities each feeding a single nozzle, see Figure 4.
  • jet stream deflection could be further increased by increasing the portion of ink entering the bore of the nozzle with lateral rather than axial momentum. Such can be accomplished by blocking some of the fluid having axial momentum by building a block in the center of each nozzle element just below the nozzle bore.
  • FIG. 5 the cross-sectional view taken along sectional line A-A shows the lateral flow blocking structure and silicon ribs.
  • a cross-sectional view taken along sectional line B-B is illustrated in Figure 6.
  • footing a phenomenon of the STS etcher.
  • the wafers are then placed in a conventional plasma etch chamber and the silicon in the center of the bore is etched anistropically about 5 micrometers down.
  • Figures 5 and 6 shown cross-sectional views of the resulting structure. Note that in Figure 6, the cross-hatched area represents the silicon that has been removed to provide an access opening between an ink channel formed in the silicon substrate and the nozzle bore.
  • a second method is one that does not depend on the footing effect. Instead, the silicon in the bore is etched isotropically from the front of the wafer for about 5 micrometers. The isotropic etch then removes the silicon laterally as well as vertically eventually removing the silicon shown in cross-section in Figure 7 thus, facilitating fluidic contact between the ink channel and the bore. In this approach the blocking structure is shorter reflecting the etch back from the top fabrication method, which removes the cross-hatched region of silicon.
  • the ink flowing into the bore is dominated by lateral momentum components, which is what is desired for increased droplet deflection.
  • alignment of the ink channel openings in the back of the wafer to the nozzle array in the front of the wafer may be provided with and aligner system such as the Karl Suss aligner.
  • Figure 8 there is provided a perspective view of the nozzle array with silicon based blocking structure showing the oxide/nitride layer partially removed to illustrate the blocking structure beneath the nozzle bore.
  • the nozzle bore is spaced from the top of the blocking structure by an access opening.
  • the blocking structure formed in the silicon substrate causes the ink which is under pressure in the ink cavity to flow about the blocking structure and to develop lateral momentum components. These lateral momentum components can be made unequal by the application of asymmetric heating and this then leads to stream deflection, as shown in Figures 6 and 7.
  • the completed CMOS/MEMS print head 120 is mounted on a supporting mount 110 having a pair of ink feed lines 130 L, 130R connected adjacent end portions of the mount for feeding ink to ends of a longitudinally extending channel formed in the supporting mount.
  • the channel faces the rear of the print head 120 and is thus in communication with all the ink channels formed in the silicon substrate of the print head 120.
  • the supporting mount which could be a ceramic substrate, includes mounting holes at the ends for attachment of this structure to a printer system.

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  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Claims (14)

  1. Kontinuierlich arbeitender Tintenstrahldruckkopf mit einer Vielzahl von Düsen und mit:
    einem Siliciumsubstrat mit darin ausgebildeten integrierten Schaltungen zum Steuern des Betriebs des Druckkopfs, wobei das Siliciumsubstrat einen darin ausgebildeten Tintenkanal aufweist;
    einer Isolierschicht oder mehreren Isolierschichten, die das Siliciumsubstrat überlagert bzw. überlagern und für jede darin ausgebildete Düse eine Öffnung aufweist bzw. aufweisen und mit dem Tintenkanal in Verbindung steht bzw. stehen, und einem Heizelement, das um die Öffnung herum angeordnet ist zum asymmetrischen Aufheizen des Tintenstroms und deshalb zum Umlenken des Tintenstroms oder nicht;
    wobei das Siliciumsubstrat an jeder Düse eine zwischen dem Tintenkanal und der Öffnung aus Silicium ausgebildete Blockiereinrichtung aufweist, wobei eine Zugangsöffnung zwischen dem Tintenkanal und der Öffnung vorgesehen ist, die es der Tinte ermöglicht, vom Tintenkanal um die Blockiereinrichtung herum in die Zugangsöffnung hinein bis zu einem Punkt zu strömen, der gegenüber der Öffnung versetzt ist, um seitliche Strömungskomponenten für die in die Öffnung strömende Flüssigtinte bereitzustellen.
  2. Druckkopf nach Anspruch 1, worin die eine Isolierschicht oder die Isolierschichten eine Reihe vertikal getrennter Ebenen von elektrisch leitfähigen Anschlüssen und elektrisch leitfähigen Verbindungsdurchgängen aufweist bzw. aufweisen, die mindestens einige der Ebenen verbinden.
  3. Druckkopf nach Anspruch 1, worin die Öffnung in der Isolierschicht ausgebildet ist und das Heizelement der Öffnung benachbart in der Isolierschicht ausgebildet ist.
  4. Druckkopf nach Anspruch 3, worin das Heizelement aus Polysilicium besteht.
  5. Druckkopf nach Anspruch 4, worin eine Schicht aus Polysilicium in der Isolierschicht auch als Gate für einen CMOS Transistor verwendbar ist.
  6. Druckkopf nach Anspruch 1, worin die Isolierschicht oder Isolierschichten aus einem Oxid besteht bzw. bestehen.
  7. Druckkopf nach Anspruch 1, worin die integrierten Schaltkreise CMOS Elemente aufweisen.
  8. Druckkopf nach Anspruch 1, worin eine Vielzahl von Düsen auf der Isolierschicht ausgebildet ist, um einen seitenbreiten Druckkopf mit hochauflösenden Druckelementen bereitzustellen.
  9. Druckkopf nach Anspruch 8, worin das Siliciumsubstrat eine Rippenstruktur aufweist, die benachbarte Düsen voneinander trennt.
  10. Verfahren zum Ausbilden eines kontinuierlich arbeitenden Tintenstrahldruckkopfs, mit den Schritten:
    Bereitstellen eines Siliciumsubstrats mit integrierten Schaltkreisen zum Steuern des Betriebs des Druckkopfs, wobei das Siliciumsubstrat eine darauf ausgebildete Isolierschicht oder darauf ausgebildete Isolierschichten aufweist, die darin ausgebildete elektrische Leiter umfasst bzw. umfassen, welche elektrisch mit im Siliciumsubstrat ausgebildeten Schaltungen verbunden sind;
    Ausbilden einer Öffnung in der Isolierschicht oder den Isolierschichten;
    Ausbilden eines Tintenkanals im Siliciumsubstrat, welcher mit der Öffnung in Verbindung steht;
    Bereitstellen eines Heizelements um die Öffnung herum zum asymmetrischen Aufheizen des Tintenstroms und deshalb zum Umlenken des Tintenstroms oder nicht; und
    Ausbilden einer Blockiereinrichtung im Siliciumsubstrat zum Steuern der seitlichen Strömung von Tinte von dem im Siliciumsubstrat ausgebildeten Tintenkanal zu der in der Isolierschicht bzw. den Isolierschichten ausgebildeten Öffnung.
  11. Verfahren nach Anspruch 10 mit dem Schritt: Ausbilden des Heizelements benachbart zu einem Düsenloch der Öffnung, wobei das Heizelement von einer der Isolierschichten bedeckt ist.
  12. Verfahren nach Anspruch 10 mit dem Schritt: Ausbilden einer Blockiereinrichtung durch seitliches Ätzen des Siliciumsubstrats.
  13. Verfahren nach Anspruch 12, mit dem Schritt: Ätzen des Siliciumsubstrats bis auf die Siliciumisolierschicht oder -schichten zum Ausbilden der Blockiereinrichtung.
  14. Verfahren nach Anspruch 13, worin eine Zugangsöffnung zwischen dem Tintenkanal und der Öffnung bereitgestellt wird mittels einer Ätzung durch die Öffnung hindurch.
EP20010130222 2000-12-29 2001-12-19 Cmos/mems integrierter Tintenstrahldruckkopf mit Querflussdüsenarchitektur auf Siliziumbasis und Verfahren zu seiner Herstellung Expired - Lifetime EP1219424B1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/751,722 US6439703B1 (en) 2000-12-29 2000-12-29 CMOS/MEMS integrated ink jet print head with silicon based lateral flow nozzle architecture and method of forming same
US751722 2000-12-29
US792188 2001-02-22
US09/792,188 US6450619B1 (en) 2001-02-22 2001-02-22 CMOS/MEMS integrated ink jet print head with heater elements formed during CMOS processing and method of forming same

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EP1219424A2 EP1219424A2 (de) 2002-07-03
EP1219424A3 EP1219424A3 (de) 2003-05-14
EP1219424B1 true EP1219424B1 (de) 2005-02-09

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US7607766B2 (en) 2004-05-04 2009-10-27 Kodak Graphic Communications Canada Company Method and print head for flow conditioning a fluid
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EP1219424A3 (de) 2003-05-14
DE60108838T2 (de) 2006-05-04
JP4142286B2 (ja) 2008-09-03
JP2002225279A (ja) 2002-08-14
DE60108838D1 (de) 2005-03-17
EP1219424A2 (de) 2002-07-03

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