EP1150249A4 - Mark detecting method, exposure method, device manufacturing method, mark detector, exposure apparatus, and device - Google Patents
Mark detecting method, exposure method, device manufacturing method, mark detector, exposure apparatus, and deviceInfo
- Publication number
- EP1150249A4 EP1150249A4 EP99931487A EP99931487A EP1150249A4 EP 1150249 A4 EP1150249 A4 EP 1150249A4 EP 99931487 A EP99931487 A EP 99931487A EP 99931487 A EP99931487 A EP 99931487A EP 1150249 A4 EP1150249 A4 EP 1150249A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- mark
- exposure
- exposure apparatus
- device manufacturing
- detector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7092—Signal processing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Electron Beam Exposure (AREA)
Abstract
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20697498 | 1998-07-22 | ||
JP20697498 | 1998-07-22 | ||
PCT/JP1999/003926 WO2000005683A1 (en) | 1998-07-22 | 1999-07-22 | Mark detecting method, exposure method, device manufacturing method, mark detector, exposure apparatus, and device |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1150249A1 EP1150249A1 (en) | 2001-10-31 |
EP1150249A4 true EP1150249A4 (en) | 2007-10-31 |
Family
ID=16532088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99931487A Withdrawn EP1150249A4 (en) | 1998-07-22 | 1999-07-22 | Mark detecting method, exposure method, device manufacturing method, mark detector, exposure apparatus, and device |
Country Status (6)
Country | Link |
---|---|
US (1) | US6693713B1 (en) |
EP (1) | EP1150249A4 (en) |
JP (1) | JP4277448B2 (en) |
KR (1) | KR20010053600A (en) |
AU (1) | AU4799399A (en) |
WO (1) | WO2000005683A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7565219B2 (en) * | 2003-12-09 | 2009-07-21 | Asml Netherlands B.V. | Lithographic apparatus, method of determining a model parameter, device manufacturing method, and device manufactured thereby |
JP2007059714A (en) * | 2005-08-25 | 2007-03-08 | Sumitomo Heavy Ind Ltd | Best focus detecting method and detecting device |
US7583359B2 (en) * | 2006-05-05 | 2009-09-01 | Asml Netherlands B.V. | Reduction of fit error due to non-uniform sample distribution |
US7898653B2 (en) * | 2006-12-20 | 2011-03-01 | Hitachi High-Technologies Corporation | Foreign matter inspection apparatus |
US8072496B2 (en) * | 2008-09-29 | 2011-12-06 | Intel Corporation | Motion smoothing in video stabilization |
KR102399575B1 (en) * | 2014-09-26 | 2022-05-19 | 삼성디스플레이 주식회사 | Deposition accuracy inspecting apparatus and the inspecting method using the same |
JP7041489B2 (en) * | 2017-10-19 | 2022-03-24 | キヤノン株式会社 | Evaluation method, determination method, lithography equipment, and program |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0479571A (en) * | 1990-07-19 | 1992-03-12 | Brother Ind Ltd | Digital image reducing/magnifying device |
US5109430A (en) * | 1986-07-22 | 1992-04-28 | Schlumberger Technologies, Inc. | Mask alignment and measurement of critical dimensions in integrated circuits |
US5418899A (en) * | 1992-05-25 | 1995-05-23 | Ricoh Company, Ltd. | Size magnification processing unit for processing digital image in accordance with magnification factor |
US5493403A (en) * | 1990-07-05 | 1996-02-20 | Nikon Corporation | Method and apparatus for the alignment of a substrate |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2814538B2 (en) * | 1989-04-14 | 1998-10-22 | 株式会社ニコン | Alignment device and alignment method |
US5151750A (en) | 1989-04-14 | 1992-09-29 | Nikon Corporation | Alignment apparatus |
US5473410A (en) | 1990-11-28 | 1995-12-05 | Nikon Corporation | Projection exposure apparatus |
US5528118A (en) | 1994-04-01 | 1996-06-18 | Nikon Precision, Inc. | Guideless stage with isolated reaction stage |
US5874820A (en) | 1995-04-04 | 1999-02-23 | Nikon Corporation | Window frame-guided stage mechanism |
US5623853A (en) | 1994-10-19 | 1997-04-29 | Nikon Precision Inc. | Precision motion stage with single guide beam and follower stage |
JPH09128540A (en) | 1995-10-27 | 1997-05-16 | Hitachi Ltd | Pattern detecting method and device therefor |
JPH09128450A (en) * | 1995-10-31 | 1997-05-16 | Toshiba Corp | Distributed schedule management device |
JP3625236B2 (en) | 1996-01-29 | 2005-03-02 | 株式会社ルネサステクノロジ | Defect inspection method for inspection pattern and semiconductor manufacturing process evaluation method |
US6018600A (en) * | 1998-04-15 | 2000-01-25 | Arch Development Corp. | Sampling and reconstruction of signals and images including MR images of multiple regions |
JP3828283B2 (en) * | 1998-06-04 | 2006-10-04 | 株式会社アドバンテスト | Image acquisition method for flat panel display inspection, image acquisition apparatus for flat panel display inspection |
-
1999
- 1999-07-22 US US09/743,989 patent/US6693713B1/en not_active Expired - Fee Related
- 1999-07-22 JP JP2000561589A patent/JP4277448B2/en not_active Expired - Fee Related
- 1999-07-22 WO PCT/JP1999/003926 patent/WO2000005683A1/en not_active Application Discontinuation
- 1999-07-22 EP EP99931487A patent/EP1150249A4/en not_active Withdrawn
- 1999-07-22 KR KR1020017001023A patent/KR20010053600A/en not_active Application Discontinuation
- 1999-07-22 AU AU47993/99A patent/AU4799399A/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5109430A (en) * | 1986-07-22 | 1992-04-28 | Schlumberger Technologies, Inc. | Mask alignment and measurement of critical dimensions in integrated circuits |
US5493403A (en) * | 1990-07-05 | 1996-02-20 | Nikon Corporation | Method and apparatus for the alignment of a substrate |
JPH0479571A (en) * | 1990-07-19 | 1992-03-12 | Brother Ind Ltd | Digital image reducing/magnifying device |
US5418899A (en) * | 1992-05-25 | 1995-05-23 | Ricoh Company, Ltd. | Size magnification processing unit for processing digital image in accordance with magnification factor |
Non-Patent Citations (1)
Title |
---|
See also references of WO0005683A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2000005683A1 (en) | 2000-02-03 |
EP1150249A1 (en) | 2001-10-31 |
AU4799399A (en) | 2000-02-14 |
KR20010053600A (en) | 2001-06-25 |
JP4277448B2 (en) | 2009-06-10 |
US6693713B1 (en) | 2004-02-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20010202 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
|
AX | Request for extension of the european patent |
Free format text: AL;LT;LV;MK;RO;SI |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: NAKAJIMA, SHIN-ICHI C/O NIKON CORPORATION |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20071001 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20071229 |