EP1144523A2 - Preparations containing fine-particulate inorganic oxides - Google Patents
Preparations containing fine-particulate inorganic oxidesInfo
- Publication number
- EP1144523A2 EP1144523A2 EP99948855A EP99948855A EP1144523A2 EP 1144523 A2 EP1144523 A2 EP 1144523A2 EP 99948855 A EP99948855 A EP 99948855A EP 99948855 A EP99948855 A EP 99948855A EP 1144523 A2 EP1144523 A2 EP 1144523A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- preparations
- oxide
- preparation
- preparations according
- printing inks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 64
- 229910052809 inorganic oxide Inorganic materials 0.000 title description 4
- 239000002270 dispersing agent Substances 0.000 claims abstract description 48
- 239000000976 ink Substances 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 33
- 238000007639 printing Methods 0.000 claims abstract description 25
- 239000011164 primary particle Substances 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000002904 solvent Substances 0.000 claims abstract description 15
- 238000005245 sintering Methods 0.000 claims abstract description 7
- 239000012298 atmosphere Substances 0.000 claims abstract description 6
- 239000002245 particle Substances 0.000 claims description 39
- -1 agglomerate Substances 0.000 claims description 37
- 238000000227 grinding Methods 0.000 claims description 24
- 239000000725 suspension Substances 0.000 claims description 22
- 239000000203 mixture Substances 0.000 claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 17
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 17
- 125000000129 anionic group Chemical group 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229910052787 antimony Inorganic materials 0.000 claims description 7
- 125000002091 cationic group Chemical group 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 6
- 239000010937 tungsten Substances 0.000 claims description 6
- 238000007641 inkjet printing Methods 0.000 claims description 5
- 238000010790 dilution Methods 0.000 claims description 4
- 239000012895 dilution Substances 0.000 claims description 4
- SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 claims description 4
- 239000004094 surface-active agent Substances 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 150000005690 diesters Chemical class 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 229910000476 molybdenum oxide Inorganic materials 0.000 claims description 3
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical class [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 claims description 3
- 230000000737 periodic effect Effects 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 230000002829 reductive effect Effects 0.000 claims description 3
- 238000006467 substitution reaction Methods 0.000 claims description 3
- 229910052714 tellurium Inorganic materials 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 229910001930 tungsten oxide Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000003755 preservative agent Substances 0.000 claims description 2
- 229910052711 selenium Inorganic materials 0.000 claims description 2
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
- 238000002844 melting Methods 0.000 abstract description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 15
- 239000007787 solid Substances 0.000 description 12
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- 239000000843 powder Substances 0.000 description 11
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 10
- 239000011877 solvent mixture Substances 0.000 description 10
- 125000004432 carbon atom Chemical group C* 0.000 description 9
- 239000007859 condensation product Substances 0.000 description 9
- 235000014113 dietary fatty acids Nutrition 0.000 description 9
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- 229920001223 polyethylene glycol Polymers 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 239000002202 Polyethylene glycol Substances 0.000 description 8
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 8
- 229920006395 saturated elastomer Polymers 0.000 description 8
- 239000000654 additive Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 7
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 238000002604 ultrasonography Methods 0.000 description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- 229920002125 Sokalan® Polymers 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 150000007513 acids Chemical class 0.000 description 5
- 238000002296 dynamic light scattering Methods 0.000 description 5
- 238000011192 particle characterization Methods 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- 238000010992 reflux Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- GLZPCOQZEFWAFX-UHFFFAOYSA-N Geraniol Chemical compound CC(C)=CCCC(C)=CCO GLZPCOQZEFWAFX-UHFFFAOYSA-N 0.000 description 4
- 229920000805 Polyaspartic acid Polymers 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 4
- 150000002191 fatty alcohols Chemical class 0.000 description 4
- WTEVQBCEXWBHNA-JXMROGBWSA-N geranial Chemical compound CC(C)=CCC\C(C)=C\C=O WTEVQBCEXWBHNA-JXMROGBWSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 229920002523 polyethylene Glycol 1000 Polymers 0.000 description 4
- 229920005989 resin Chemical class 0.000 description 4
- 239000011347 resin Chemical class 0.000 description 4
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 4
- 150000003871 sulfonates Chemical class 0.000 description 4
- NOOLISFMXDJSKH-KXUCPTDWSA-N (-)-Menthol Chemical compound CC(C)[C@@H]1CC[C@@H](C)C[C@H]1O NOOLISFMXDJSKH-KXUCPTDWSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 229920001732 Lignosulfonate Polymers 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 3
- 229920002873 Polyethylenimine Polymers 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ULUAUXLGCMPNKK-UHFFFAOYSA-N Sulfobutanedioic acid Chemical class OC(=O)CC(C(O)=O)S(O)(=O)=O ULUAUXLGCMPNKK-UHFFFAOYSA-N 0.000 description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 3
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 3
- 229920001400 block copolymer Polymers 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 150000004665 fatty acids Chemical class 0.000 description 3
- 229920000578 graft copolymer Polymers 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 108010064470 polyaspartate Proteins 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 3
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 3
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 3
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 3
- 150000004671 saturated fatty acids Chemical class 0.000 description 3
- 235000003441 saturated fatty acids Nutrition 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 3
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 2
- WDGCBNTXZHJTHJ-UHFFFAOYSA-N 2h-1,3-oxazol-2-id-4-one Chemical class O=C1CO[C-]=N1 WDGCBNTXZHJTHJ-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- WTEVQBCEXWBHNA-UHFFFAOYSA-N Citral Natural products CC(C)=CCCC(C)=CC=O WTEVQBCEXWBHNA-UHFFFAOYSA-N 0.000 description 2
- NOOLISFMXDJSKH-UHFFFAOYSA-N DL-menthol Natural products CC(C)C1CCC(C)CC1O NOOLISFMXDJSKH-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N Propionic acid Chemical class CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical compound [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 description 2
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- 125000005210 alkyl ammonium group Chemical group 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 150000008107 benzenesulfonic acids Chemical class 0.000 description 2
- UAHWPYUMFXYFJY-UHFFFAOYSA-N beta-myrcene Chemical compound CC(C)=CCCC(=C)C=C UAHWPYUMFXYFJY-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000003857 carboxamides Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- NEHNMFOYXAPHSD-UHFFFAOYSA-N citronellal Chemical compound O=CCC(C)CCC=C(C)C NEHNMFOYXAPHSD-UHFFFAOYSA-N 0.000 description 2
- QMVPMAAFGQKVCJ-UHFFFAOYSA-N citronellol Chemical compound OCCC(C)CCC=C(C)C QMVPMAAFGQKVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
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- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
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- 229920005611 kraft lignin Polymers 0.000 description 2
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- YYACAUKNCULOTG-UHFFFAOYSA-N n-(2-aminoacetyl)prop-2-enamide Chemical compound NCC(=O)NC(=O)C=C YYACAUKNCULOTG-UHFFFAOYSA-N 0.000 description 2
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- 229910052757 nitrogen Inorganic materials 0.000 description 2
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- CRBTVNNAESVHSD-UHFFFAOYSA-N 4-(chloromethyl)-1,2-thiazolidin-3-one Chemical compound ClCC1CSNC1=O CRBTVNNAESVHSD-UHFFFAOYSA-N 0.000 description 1
- KFDVPJUYSDEJTH-UHFFFAOYSA-N 4-ethenylpyridine Chemical class C=CC1=CC=NC=C1 KFDVPJUYSDEJTH-UHFFFAOYSA-N 0.000 description 1
- DDPJJWIKEDDECP-UHFFFAOYSA-N 4-methyl-1,2-thiazolidin-3-one Chemical compound CC1CSNC1=O DDPJJWIKEDDECP-UHFFFAOYSA-N 0.000 description 1
- HERXOXLYNRDHGU-UHFFFAOYSA-N 5-methyl-2H-1,3-oxazol-2-id-4-one Chemical class CC1C(N=[C-]O1)=O HERXOXLYNRDHGU-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 241000134874 Geraniales Species 0.000 description 1
- GLZPCOQZEFWAFX-YFHOEESVSA-N Geraniol Natural products CC(C)=CCC\C(C)=C/CO GLZPCOQZEFWAFX-YFHOEESVSA-N 0.000 description 1
- 239000005792 Geraniol Substances 0.000 description 1
- OYHQOLUKZRVURQ-HZJYTTRNSA-N Linoleic acid Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(O)=O OYHQOLUKZRVURQ-HZJYTTRNSA-N 0.000 description 1
- NFLGAXVYCFJBMK-UHFFFAOYSA-N Menthone Chemical compound CC(C)C1CCC(C)CC1=O NFLGAXVYCFJBMK-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- GLZPCOQZEFWAFX-JXMROGBWSA-N Nerol Natural products CC(C)=CCC\C(C)=C\CO GLZPCOQZEFWAFX-JXMROGBWSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 108010039918 Polylysine Proteins 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001447 alkali salts Chemical class 0.000 description 1
- 150000008051 alkyl sulfates Chemical class 0.000 description 1
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 1
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 1
- VYBREYKSZAROCT-UHFFFAOYSA-N alpha-myrcene Natural products CC(=C)CCCC(=C)C=C VYBREYKSZAROCT-UHFFFAOYSA-N 0.000 description 1
- 229920005603 alternating copolymer Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001413 amino acids Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 229920006318 anionic polymer Polymers 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000008346 aqueous phase Substances 0.000 description 1
- AVXYPAZKABBYHD-UHFFFAOYSA-N benzhydryl 2-methylprop-2-enoate Chemical compound C=1C=CC=CC=1C(OC(=O)C(=C)C)C1=CC=CC=C1 AVXYPAZKABBYHD-UHFFFAOYSA-N 0.000 description 1
- DMSMPAJRVJJAGA-UHFFFAOYSA-N benzo[d]isothiazol-3-one Chemical compound C1=CC=C2C(=O)NSC2=C1 DMSMPAJRVJJAGA-UHFFFAOYSA-N 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- JGQFVRIQXUFPAH-UHFFFAOYSA-N beta-citronellol Natural products OCCC(C)CCCC(C)=C JGQFVRIQXUFPAH-UHFFFAOYSA-N 0.000 description 1
- 229930003642 bicyclic monoterpene Natural products 0.000 description 1
- 150000001604 bicyclic monoterpene derivatives Chemical class 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229920006317 cationic polymer Polymers 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 235000010980 cellulose Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- WTEVQBCEXWBHNA-YFHOEESVSA-N citral B Natural products CC(C)=CCC\C(C)=C/C=O WTEVQBCEXWBHNA-YFHOEESVSA-N 0.000 description 1
- 229930003633 citronellal Natural products 0.000 description 1
- 235000000983 citronellal Nutrition 0.000 description 1
- 235000000484 citronellol Nutrition 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical class CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- YIOJGTBNHQAVBO-UHFFFAOYSA-N dimethyl-bis(prop-2-enyl)azanium Chemical compound C=CC[N+](C)(C)CC=C YIOJGTBNHQAVBO-UHFFFAOYSA-N 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 229940113087 geraniol Drugs 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 125000003010 ionic group Chemical group 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 229960004873 levomenthol Drugs 0.000 description 1
- 235000001510 limonene Nutrition 0.000 description 1
- 229940087305 limonene Drugs 0.000 description 1
- 229930007744 linalool Natural products 0.000 description 1
- 235000020778 linoleic acid Nutrition 0.000 description 1
- OYHQOLUKZRVURQ-IXWMQOLASA-N linoleic acid Natural products CCCCC\C=C/C\C=C\CCCCCCCC(O)=O OYHQOLUKZRVURQ-IXWMQOLASA-N 0.000 description 1
- 229960004488 linolenic acid Drugs 0.000 description 1
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 1
- 238000005374 membrane filtration Methods 0.000 description 1
- 229940041616 menthol Drugs 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000010327 methods by industry Methods 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 238000001471 micro-filtration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- QNILTEGFHQSKFF-UHFFFAOYSA-N n-propan-2-ylprop-2-enamide Chemical compound CC(C)NC(=O)C=C QNILTEGFHQSKFF-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 239000012074 organic phase Substances 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 229920000867 polyelectrolyte Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000656 polylysine Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000005118 spray pyrolysis Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 238000006557 surface reaction Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- YODZTKMDCQEPHD-UHFFFAOYSA-N thiodiglycol Chemical compound OCCSCCO YODZTKMDCQEPHD-UHFFFAOYSA-N 0.000 description 1
- 229950006389 thiodiglycol Drugs 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- JSPLKZUTYZBBKA-UHFFFAOYSA-N trioxidane Chemical compound OOO JSPLKZUTYZBBKA-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 210000004127 vitreous body Anatomy 0.000 description 1
- 229920003170 water-soluble synthetic polymer Polymers 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D17/00—Pigment pastes, e.g. for mixing in paints
- C09D17/004—Pigment pastes, e.g. for mixing in paints containing an inorganic pigment
- C09D17/007—Metal oxide
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K23/00—Use of substances as emulsifying, wetting, dispersing, or foam-producing agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K23/00—Use of substances as emulsifying, wetting, dispersing, or foam-producing agents
- C09K23/017—Mixtures of compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K23/00—Use of substances as emulsifying, wetting, dispersing, or foam-producing agents
- C09K23/16—Amines or polyamines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to finely particulate inorganic oxide-containing preparations, a process for their preparation, their use for the production of printing inks and the use of the printing inks for the production of transparent, electrically conductive, structured surfaces on transparent carrier materials.
- the object of the present invention is to produce preparations which are transparent, structured surfaces, e.g. can be applied to substrates in the form of conductor tracks with little outlay in terms of process technology.
- the object of the present invention is to produce the electrical conductivity within these structured surfaces by sintering in a reducing atmosphere.
- electrically conductive structured surfaces can be converted.
- electrically conductive structured surface structures for example conductor tracks
- the invention relates to preparations containing a) at least one oxide with an average primary particle size of 1 to 100 nm, b) at least one dispersant with an average molecular weight of M w greater than 1000 g / mol and c) at least one solvent.
- A means Sn, In or Zn and
- B is Sb, Sn, F, P, Al or Cd and X is O, S. Se or Te, preferably O and
- A forms the host lattice and B represents the dopings in the host lattice, i.e. part of A is substituted by B, the
- tungsten and molybdenum bronzes the composition Z WO 3 , or Z x MoO 3 with 0 ⁇ x ⁇ 1 and Z being an element of the first and / or second main group of
- Periodic table of the elements is iii) tungsten and molybdenum oxides, the composition WO 3 . x , or MoO 3 . x with x ⁇ 0.1,
- At least one dispersant with an average molecular weight M w of greater than 1,000 g / mol, preferably greater than 1,000 to 500,000 g / mol and c) at least one solvent.
- the oxides a) contained in the preparations according to the invention can be present either in the form of their primary particles, agglomerates or aggregates of primary particles or mixtures of the two.
- Agglomerates or aggregates are understood to mean particles in which several primary particles interact with one another via van der Waals forces, or in which the primary particles are connected to one another by surface reaction or "sintering" during the production process.
- the average primary particle size of the oxides is usually 1 to 100 nm, preferably 1 to 50 nm. It can be determined with the aid of electron micrographs.
- the primary particles of the oxides preferably have a spherical structure.
- the oxides a) contained in the preparations according to the invention are in the form of their agglomerates or aggregates, the average particle size of these agglomerates or aggregates is less than 500 nm, preferably less than 150 nm.
- the oxides a) contained in the preparations according to the invention can be crystalline or amorphous, preferably crystalline.
- the oxides a) can, for example, by the sol-gel method, chemical vapor reaction method (CVR), chemical vapor condensation method or by
- Plasma desorption can be produced.
- the oxides a) contained in the preparations according to the invention are preferably present in an amount of from 0.05 to 80% by weight, in particular from 0J to 30% by weight, particularly preferably from 0.5 to 20% by weight, based on the
- Molecules with a molecular weight of greater than 1,000 to 500,000 g / mol, preferably greater than 1,000 to 100,000 g / mol and in particular larger, are used as dispersants
- the dispersants can be nonionic, anionic, cationic or amphoteric compounds.
- Polymeric dispersants are particularly preferred.
- polymeric dispersants are, for example, the compounds mentioned in the directory “Water-Soluble Synthetic Polymers: Properties and Behavior” (Volume I + II, Philip Molyneux, CRC Press, Florida 1983/84).
- Other polymeric dispersants are, for example, water-soluble and water-emulsifiable compounds, for example homopolymers and copolymers, graft and graft copolymers and statistical block copolymers.
- Particularly preferred polymeric dispersants are, for example, AB, BAB and
- the A segment is a hydrophobic homopolymer or copolymer which, when used in the preparations according to the invention, ensures a connection to the oxide.
- the B block is a hydrophilic homopolymer or copolymer or a salt thereof which, when used in the preparations according to the invention, ensures the dispersion of the oxide in the solvent in the preparation according to the invention.
- Such polymeric dispersants and their synthesis are known for example from EP-A-518 225 and EP-A-556 649.
- Suitable polymeric dispersants are:
- Polyethylene oxides Polypropylene oxides, polyoxymethylenes, polytrimethylene oxides, polyvinyl methyl ethers, polyethyleneimines, polyacrylic acids, polyarylamides, polymethacrylic acids, polymethacrylamides, poly-N, N-dimethylacrylamides, poly-N-isopropylacrylamides, poly-N-acrylglycinamides, poly-N-methacrylacrylglycinamides, poly Copolymers of polyvinyl alcohol and
- Suitable natural polymeric dispersants are: cellulose, starch, gelatin or their derivatives.
- nonionic dispersants examples include alkoxylates, alkylolamides, esters, amine oxides, silanes such as 3-glycidyloxypropyltrimethoxysilane and alkylpolyglycosides.
- Other suitable nonionic dispersants are: reaction products of alkylene oxides with alkoxylatable compounds, such as, for example, fatty alcohols, fatty amines, fatty acids, phenols, alkylphenols, arylalkylphenols, such as styrene-phenol condensates, carboxamides and resin acids. These reaction products are preferably ethylene oxide
- alkylphenols with 4 to 12 carbon atoms in the alkyl radical or 3) saturated and / or unsaturated fatty amines with 14 to 20 carbon atoms or
- Suitable ethylene oxide adducts are, in particular, the alkoxylable compounds mentioned under 1) to 5) with 5 to 120, preferably 5 to 60, in particular 5 to 30, ethylene oxide units per molecule.
- Nonionic polymeric dispersants such as, for example, polyethylene oxides, polypropylene oxides, polyoxymethylenes, polytrimethylene oxides, polyvinyl methyl ether, polyethyleneimines, polyacrylic acids are particularly preferred.
- Polyarylamides polymethacrylic acids, polymethacrylamides, poly-N, N-dimethylacrylamides, poly-N-isopropylacrylamides, poly-N-acrylglycinamides, poly-N-methacrylglycinamides, polyvinyl alcohols, polyvinyl pyrrolidone, polyvinyl oxazolidones, polyvinylmethyloxazolidones.
- anionic dispersants are: alkyl sulfates, ether sulfates, ether carboxylates, phosphate esters, sulfosuccinates, sulfosuccinatamides, paraffin sulfonates, olefin sulfonates, sarcosinates, isothionates, taurates and lignin compounds.
- Anionic, polymeric dispersants are particularly preferred.
- Preferred anionic polymeric dispersants are condensation products of aromatic sulfonic acids with formaldehyde, such as, for example, condensation products from formaldehyde and alkylnaphthalenesulfonic acids, condensation products from formaldehyde and naphthalenesulfonic acids and / or benzenesulfonic acids or condensation products from optionally substituted phenol with formaldehyde and sodium bisulfite.
- Naphthols with alkanols, addition of alkylene oxide and at least partial conversion of the terminal hydroxy groups into sulfo groups or half esters of maleic acid, phthalic acid or succinic acid are available.
- preferred anionic dispersants are compounds from the
- Alkoxylated fatty acid alcohols are understood to mean in particular those with 5 to 120, preferably 5 to 60, in particular 5 to 30, ethylene oxide units per molecule of C 6 -C 22 fatty acid alcohols which are saturated or unsaturated, in particular stearyl alcohol.
- a stearyl alcohol alkoxylated with 8 to 10 ethylene oxide units is particularly preferred.
- the sulfated alkoxylated fatty acid alcohols are preferably present as a salt, in particular as an alkali or ammonium salt, preferably as a diethylammonium salt.
- anionic, polymeric dispersants are the salts of polyacrylic acids, polyethylene sulfonic acids, polystyrene sulfonic acid, polymethacrylic acids, polyphosphoric acids and polyaspartic acids.
- anionic, polymeric dispersants which are copolymers of acrylic monomers. These copolymers are exemplified by Combinations of the following monomers are available, which are synthesized to random or alternating copolymers or graft copolymers:
- N-acrylglycinamide N-isopropylacrylamide
- Methacrylamide methacrylic acid
- Methacrylic acid diphenylmethyl methacrylate
- Methacrylic acid methyl methacrylate
- Methacrylic acid styrene
- lignin sulfonates for example those obtained by the sulfite or kraft process (sulfite and kraft lignin sulfonates). These are preferably products which are partially hydrolyzed, oxidized, propoxylated, sulfonated, sulfomethylated or disulfonated and are fractionated by known processes, for example by the molecular weight or by the degree of sulfonation. Mixtures of sulfite and kraft lignin sulfonates are also suitable.
- Lignin sulfonates with an average molecular weight of greater than 1,000 to 100,000 g / mol, a content of active lignin sulfonate of at least 80% and preferably with a low content of polyvalent cations are particularly suitable.
- the degree of sulfonation can vary within wide limits.
- Examples of cationic dispersants are: alkylammonium compounds and imidazoles.
- Cationic, polymeric dispersants are particularly preferred.
- cationic, polymeric dispersants are the salts of polyethyleneimines, polyvinylamines, poly (2-vinylpyridines), poly (4-vinylpyridines), poly (diallyldimethylammonium) chloride, poly (4-vinylbenzyltrimethylammonium) salts, poly (2- vinylpiperidine) and polylysine.
- amphoteric dispersants are: betaines, glycinates, propionates and imidazolines.
- Anionic and cationic polymers are summarized as polyelectrolytes and can be partially or completely dissociated in an aqueous and / or organic phase.
- the dispersants used are preferably in an amount of 0J to 200% by weight, in particular 0.5 to 100% by weight, particularly preferably 1 to
- B means Sb, Sn, F, P, AI or Cd and XO, S, Se or Te, preferably O
- A forms the host lattice
- Sulfosuccinic acid esters alkylbenzene sulfonates, sulfated, alkoxylated fatty acid alcohols or their salts, ether sulfates, ether carboxylates, phosphate esters, sulfosuccinatamides, paraffin sulfonates, olefin sulfonates, sarcosinates, isothionates, taurates, lignin compounds, condensation products with formaldehyde acids, from aromatic sulfonates, from aromatic sulfonates, from aromatic sulfonates Condensation products from formaldehyde and naphthalenesulfonic acids and / or benzenesulfonic acids or
- Condensation products from optionally substituted phenol with formaldehyde and sodium bisulfite, condensation products of naphthols with alkanols, addition of alkylene oxide and at least partially Conversion of the terminal hydroxyl groups into sulfo groups or half esters of maleic acid, phthalic acid or succinic acid are available, as well as polymers of amino acid units, in particular polyaspartic acid, or
- quaternary alkylammonium compounds and imidazoles from the group of the cationic dispersants: quaternary alkylammonium compounds and imidazoles, or
- amphoteric dispersants glycinates, propionates and imidazolines, or
- Alkoxylates alkylolamides, esters, amine oxides, silanes such as, for example, 3-glycidyloxypropyltrimethoxysilane, alkylpolyglycosides and reaction products of alkylene oxides with alkoxylable compounds, such as, for example, fatty alcohols, fatty amines, fatty acids, phenols, alkylphenols,
- Arylalkylphenols such as styrene-phenol condensates, carboxamides and resin acids, preferably ethylene oxide adducts, which result from the reaction of ethylene oxide with
- the solvents used in the inventive preparations c) are preferably water, ahphatician C, -C 4 alcohols such as methanol, ethanol, isopropanol, n-propanol, ahphatician n-butanol, isobutanol or tert-butanol,
- Ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone or diacetone alcohol,
- Polyols such as ethylene glycol, propylene glycol, butylene glycol, diethylene glycol, triethylene glycol, trimethylolpropane, polyethylene glycol with an average molecular weight of 100 to 4,000 g / mol, preferably 400 to 1,500 g / mol, glycerol, monohydroxy ether, preferably monohydroxyalkyl ether are particularly preferred
- Mono-C, -C 4 -alkyl glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, dipropylene glycol monoethyl ether, thiodiglycol, triethylene glycol monomethyl ether or triethylene glycol pyrrolidone-2-methylrolidone-nolonyl ether, methyl-2-pyrrolidone -pyrrolidone, 1.3-
- Mixtures of solvents are preferably used, particularly preferably mixtures of polyethylene glycol / 2-pyrrolidone / water or polyethylene glycol / 2-pyrrolidone / ethanol.
- the amount of the solvent used in the preparations according to the invention is preferably 10 to 99% by weight, particularly preferably 30 to 98% by weight, based on the solids content of oxide in the preparation according to the invention.
- the preparations according to the invention may contain further cationic anionic, amophotere and / or nonionic surface-active compounds, for example those which are available in the directory "Surfactants Europe, A Directory of Surface Active Agents Europe "(Edited by Gordon L. Hollis, Royal Society of Chemistry), Cambridge (1995).
- these surface-active compounds should preferably be non-ionic or of the same ionicity as the dispersant b).
- the preparations according to the invention can furthermore contain additives in addition to the components a) -c) used.
- Preferred additives are aromatic dicarboxylic acids and their esters.
- Preferred aromatic dicarboxylic acids are phthalic acid, isophthalic acid and terephthalic acid.
- Preferred esters are isophthalic diesters, phthalic diesters and
- Terephthalic acid diester of the formula RCOO-C 6 H 4 -COOR ' where R, R' independently of one another are methyl, ethyl, propyl, isopropyl, butyl, isobutyl, pentyl, hexyl, phenyl or benzyl.
- Diethyl phthalate is particularly preferred. Mixtures of the additives mentioned are also suitable.
- Further preferred additives are compounds from the group of terpenes, terpenoids, fatty acids and fatty acid esters.
- Preferred compounds are ocimen, myrcene, geraniol, nerol, linalool, citronellol, geranial, citronellal, neral, limonene, menthol, for example (-) - menthol, menthone or bicyclic monoterpenes, saturated and unsaturated fatty acids with 6 to 22 carbon atoms, for example Stearic acid, oleic acid, linoleic acid or linolenic acid. Mixtures of the additives mentioned also come in
- the preparation of the preparations according to the invention comprises wet comminution and a dilution step.
- the wet comminution optionally includes a pre-comminution, the production of a grinding suspension and the grinding.
- the oxides a are generally in powder form or in the form of water-moist
- Press cake together with a portion of the dispersant and polar organic solvent and / or water, preferably deionized water, are beaten to a homogeneous grinding suspension, i.e. introduced and homogenized.
- the dispersants used adsorb to the oxides, which thereby deagglomerate or deaggregate.
- This grinding suspension can be produced, for example, by means of a stirrer, dissolver and similar devices.
- the grinding suspension can also contain fractions of low-boiling solvents (boiling point ⁇ 150 ° C), which are removed in the course of the subsequent fine grinding
- Evaporation can be carried out. However, it can also contain proportions of higher-boiling solvents, surface-active compounds as mentioned above or other additives e.g. Grinding aids, defoaming agents or wetting agents.
- the solids content of oxide a) in the grinding suspension is preferably above the desired solids content in the finished preparation.
- the desired solids content in the finished preparation is preferably set after the wet comminution.
- the grinding takes place to the desired particle size distribution.
- the grinding is carried out, for example, in kneaders, roller mills, kneading screws, ball mills, rotor-stator mills, dissolvers, corundum disc mills or vibrating mills. Milling is preferably carried out in high-speed, continuously or discontinuously charged stirred ball mills
- the grinding media can be made of glass, ceramic or metal, e.g. Be steel.
- the grinding temperature is preferably in the range from 0 to 250 ° C., but as a rule at room temperature, particularly preferably below the cloud point of the dispersant b) used.
- the grinding can be carried out partially or completely in a high-pressure homogenizer or in a so-called jet disperser (known from DE-A 19 536 845).
- a so-called jet disperser known from DE-A 19 536 845.
- the suspension obtained after grinding is mixed and homogenized in a manner known per se in solvent, preferably water, optionally with the remaining amounts of dispersant and, if appropriate, further additives, and adjusted to the desired solids content of the finished preparation.
- solvent preferably water
- dispersants can also be added here, for example in order to avoid reagglomeration of fine particles in the finished preparation.
- Stabilization sufficient dispersants are provided. in the Following this or after the dilution step, dispersing agents and / or excess surface-active compounds which are not adsorbed on the oxides a) used are preferably removed and then the desired solids content in the finished preparation is adjusted.
- One method for removing dispersants in solution is, for example, centrifuging the grinding suspension and then decanting off the supernatant.
- Membrane or microfiltration processes can also be considered.
- the preparations according to the invention are preferred for applying structured, conductive and transparent surfaces (for example for display applications), such as Conductor tracks are used on insulating, transparent substrates.
- the preparations according to the invention can be applied to the substrates in the form of pastes or pourable compositions by knife coating or casting or in the form of printing inks by inkjet printing.
- the preparations according to the invention are preferably applied to substrates in the form of printing inks by ink-jet printing.
- the invention further relates to printing inks containing the preparations according to the invention.
- the printing inks according to the invention can contain agents for adjusting the viscosity of the ink, such as, for example, polyvinyl alcohol, polyvinylpyrrolidone, methyl cellulose and others, agents known to the person skilled in the art, provided that they do not adversely affect the stability of the printing ink, the printing behavior and the drying behavior on a suitable surface.
- the printing inks according to the invention can also contain preservatives, surfactants and pH regulators.
- NaOH, ammonia, aminomethylpropanol N, N-dimethylaminoethanol are preferably used as pH regulators.
- the printing inks according to the invention can be produced analogously to the production of the preparations according to the invention, the printing ink according to the invention being adjusted to the desired viscosity, density and
- Surface tension is preferably carried out with the adjustment of the solids content of the printing ink according to the invention.
- the physical ink properties are preferably adjusted for use in conventional inkjet printers, with the surface tension preferably
- the viscosity should preferably be less than 20 mPa-s, preferably 0.5 to 10 mPa-s.
- the printing inks according to the invention are preferably filtered before use, for example using 0.5 to 5 ⁇ m membrane or glass filters.
- the printing inks according to the invention show excellent dispersion and
- the invention further relates to a method for producing electrically conductive, structured, transparent surfaces (for example for display applications), such as Conductor tracks on insulating, transparent
- Substrates such as glass or high-melting plastics by applying the printing inks according to the invention in the form of structured, transparent surfaces by ink-jet printing and then converting these structured, transparent surfaces into electrically conductive, structured transparent surfaces by sintering the printed substrates in reductive
- Ink-jet printing or the ink-jet method is known per se.
- the printing ink is filled into a receptacle of an ink jet printhead and sprayed onto the substrate in small droplets.
- the ink ejection in droplets is preferably carried out via a piezoelectric crystal, a heated cannula (bubble or thermo-jet process) or mechanical pressure increase, pressure being exerted on the ink system and ink drops being thrown out in this way.
- the droplets are shot from one or more small nozzles onto the substrate.
- a method is also possible in which the smallest volumes, in the form of drops, are brought onto a substrate by means of electrostatic deflection from an ink jet.
- the individual droplets on the substrate are combined into characters or graphic patterns such as structured surfaces by electronic control.
- a reducing atmosphere e.g. Argon-hydrogen gas mixture
- forming gas 5% hydrogen, 95% argon
- the electrically conductive, structured, transparent surfaces produced by the method according to the invention have a specific resistance of 0.014 to 0.11 ohm * cm.
- d 10 means that 10% of all particles are not larger than 17 nm
- d 50 means that 50% of all particles are not larger than 43 nm
- d 90 means that 90% of all particles are not larger than 87 nm.
- particles are to be understood as primary particles as well as aggregates or agglomerates.
- polyaspartic acid (molecular weight 3,000 g / mol) were dissolved in 247.5 ml of water.
- d 10 means that 10% of all particles are not larger than 34 nm
- d 50 means that 50% of all particles are not larger than 79 nm
- d 90 means that 90% of all
- particles that are not larger than 107 nm.
- particles are to be understood as primary particles as well as aggregates or agglomerates.
- d 0 means that 10% of all particles are not larger than 23 nm
- d 50 means that 50% of all particles are not larger than 60 nm
- d 90 means that 90% of all particles are not larger than 92 nm.
- particles are to be understood as primary particles as well as aggregates or agglomerates.
- d 10 means that 10% of all particles are not larger than 34 nm
- d 50 means that 50% of all particles are not larger than 67 nm
- d 90 means that 90% of all
- Particles are not larger than 1 10 nm.
- particles are to be understood as primary particles as well as aggregates or agglomerates.
- Indium tin oxide particles determined by the method of dynamic light scattering (scattered light distribution). A particle diameter of 91 nm could be measured. The mass distribution was determined in the ultracentrifuge:
- d 10 means that 10% of all particles are not larger than 31 nm
- d 50 means that 50% of all particles are not larger than 64 nm and cL ,,, means that 90% of all particles are not larger than 117 nm .
- particles are to be understood as primary particles as well as aggregates or agglomerates.
- the preparations prepared in Examples 1 to 5 were used as printing inks. Structured areas and conductor tracks were printed on 1 to 2 mm thick glass plates using an ink jet printer.
- the glass plates printed in this way were sintered for 6 hours under forming gas (5% hydrogen, 95% argon) at 400 ° C. and then in an oven sintered in air for 6 hours at 400 ° C.
- the electrically conductive, structured surfaces produced in this way are transparent and have a specific resistance of 0.014 to OJ 1 ohm * cm.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
- Laminated Bodies (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19846096A DE19846096A1 (en) | 1998-10-07 | 1998-10-07 | Preparation of suspensions of ternary oxides for printing inks |
DE19846096 | 1998-10-07 | ||
PCT/EP1999/007116 WO2000020519A2 (en) | 1998-10-07 | 1999-09-24 | Preparations containing fine-particulate inorganic oxides |
Publications (1)
Publication Number | Publication Date |
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EP1144523A2 true EP1144523A2 (en) | 2001-10-17 |
Family
ID=7883631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99948855A Withdrawn EP1144523A2 (en) | 1998-10-07 | 1999-09-24 | Preparations containing fine-particulate inorganic oxides |
Country Status (7)
Country | Link |
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EP (1) | EP1144523A2 (en) |
JP (1) | JP2002526630A (en) |
KR (1) | KR20010080059A (en) |
CN (1) | CN1411497A (en) |
AU (1) | AU6196299A (en) |
DE (1) | DE19846096A1 (en) |
WO (1) | WO2000020519A2 (en) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19940560C2 (en) * | 1999-08-26 | 2001-09-13 | Infineon Technologies Ag | Method for producing a semiconductor chip with an electrical property that can be set using the silicon process |
AU2003237181A1 (en) * | 2002-05-07 | 2003-11-11 | Reveo, Inc. | Conductive ink |
US20050176246A1 (en) * | 2004-02-09 | 2005-08-11 | Haixin Yang | Ink jet printable thick film ink compositions and processes |
US7683107B2 (en) | 2004-02-09 | 2010-03-23 | E.I. Du Pont De Nemours And Company | Ink jet printable thick film compositions and processes |
US20050173680A1 (en) * | 2004-02-10 | 2005-08-11 | Haixin Yang | Ink jet printable thick film ink compositions and processes |
DE102004020559A1 (en) | 2004-04-27 | 2005-12-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Process for dispersing and passivating finely divided powders in water and aqueous media |
WO2006016729A1 (en) * | 2004-08-13 | 2006-02-16 | Hae-Wook Lee | Composition for functional coatings, film formed therefrom and method for forming the composition and the film |
KR101100861B1 (en) * | 2005-04-21 | 2012-01-02 | 삼성코닝정밀소재 주식회사 | Method for fabricating suspension of metal oxide |
WO2007038950A1 (en) | 2005-09-28 | 2007-04-12 | Stichting Dutch Polymer Institute | Method for generation of metal surface structures and apparatus therefor |
US20070078190A1 (en) * | 2005-09-30 | 2007-04-05 | Distefano Frank V | Use of 2,3-dihydroxynaphthalene-6-sulfonic acid salts as dispersants |
US20100096601A1 (en) * | 2005-10-27 | 2010-04-22 | Distefano Frank Vito | Molecules with complexing groups for aqueous nanoparticle dispersions and uses thereof |
DE102013100662B4 (en) | 2013-01-23 | 2018-09-20 | Deutsche Institute Für Textil- Und Faserforschung Denkendorf | Marking composition, its use and articles containing the same |
JP6076459B2 (en) * | 2013-03-01 | 2017-02-08 | 国立大学法人京都大学 | Method for producing ceramic fine particle dispersion |
CN103242695B (en) * | 2013-05-05 | 2015-07-29 | 浙江师范大学 | A kind of preparation method of ZnO semiconductor nanomaterial ink |
JP6877997B2 (en) * | 2016-12-27 | 2021-05-26 | 小林製薬株式会社 | Topical composition |
JP6877996B2 (en) * | 2016-12-27 | 2021-05-26 | 小林製薬株式会社 | Topical composition |
CN108441024B (en) * | 2018-04-24 | 2021-03-26 | 株洲科能新材料有限责任公司 | ITO film ink for printing and preparation method thereof |
DE102019201792A1 (en) * | 2019-02-12 | 2020-08-13 | Evonik Operations Gmbh | Semiconductor circuit arrangement and method for its production |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2523993A1 (en) * | 1982-03-24 | 1983-09-30 | Cables De Lyon Geoffroy Delore | Silk screen printing paste contg. metal oxide(s) as active materials - used for varistor prodn. |
JPS63151619A (en) * | 1986-12-13 | 1988-06-24 | Dainippon Printing Co Ltd | Treatment of transparent powder having conductivity |
GB9415075D0 (en) * | 1994-07-27 | 1994-09-14 | Cookson Group Plc | Paste or printable ink compositions |
DE4427931C1 (en) * | 1994-08-06 | 1995-11-23 | Goldschmidt Ag Th | Pigment concentrate of electrically conductive metal oxide pigment |
DE4430285A1 (en) * | 1994-08-26 | 1996-02-29 | Basf Ag | Highly pure ferromagnetic iron oxide pigments |
WO1997015382A1 (en) * | 1995-10-27 | 1997-05-01 | E.I. Du Pont De Nemours And Company | Dispersants for inorganic materials in aqueous systems |
DE19647539A1 (en) * | 1996-11-16 | 1998-05-20 | Merck Patent Gmbh | Conductive pigment with flaky or acicular substrate coated without using high shear |
-
1998
- 1998-10-07 DE DE19846096A patent/DE19846096A1/en not_active Withdrawn
-
1999
- 1999-09-24 KR KR1020017004458A patent/KR20010080059A/en not_active Application Discontinuation
- 1999-09-24 EP EP99948855A patent/EP1144523A2/en not_active Withdrawn
- 1999-09-24 CN CN99811927A patent/CN1411497A/en active Pending
- 1999-09-24 WO PCT/EP1999/007116 patent/WO2000020519A2/en not_active Application Discontinuation
- 1999-09-24 JP JP2000574623A patent/JP2002526630A/en active Pending
- 1999-09-24 AU AU61962/99A patent/AU6196299A/en not_active Abandoned
Non-Patent Citations (1)
Title |
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See references of WO0020519A2 * |
Also Published As
Publication number | Publication date |
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JP2002526630A (en) | 2002-08-20 |
CN1411497A (en) | 2003-04-16 |
AU6196299A (en) | 2000-04-26 |
DE19846096A1 (en) | 2000-04-13 |
WO2000020519A2 (en) | 2000-04-13 |
KR20010080059A (en) | 2001-08-22 |
WO2000020519A3 (en) | 2001-11-29 |
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