EP1124691B1 - Droplet deposition apparatus - Google Patents

Droplet deposition apparatus Download PDF

Info

Publication number
EP1124691B1
EP1124691B1 EP99950959A EP99950959A EP1124691B1 EP 1124691 B1 EP1124691 B1 EP 1124691B1 EP 99950959 A EP99950959 A EP 99950959A EP 99950959 A EP99950959 A EP 99950959A EP 1124691 B1 EP1124691 B1 EP 1124691B1
Authority
EP
European Patent Office
Prior art keywords
fluid
droplet
support member
fluid chamber
ejection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP99950959A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1124691A1 (en
Inventor
Paul Raymond 91 Garden Walk DRURY
Steven Temple
Robert Alan Harvey
Jerzy Marcin Zaba
Salhadin Omer
Howard John Manning
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xaar Technology Ltd
Original Assignee
Xaar Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB9823264A external-priority patent/GB9823264D0/en
Application filed by Xaar Technology Ltd filed Critical Xaar Technology Ltd
Publication of EP1124691A1 publication Critical patent/EP1124691A1/en
Application granted granted Critical
Publication of EP1124691B1 publication Critical patent/EP1124691B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/07—Ink jet characterised by jet control
    • B41J2/115—Ink jet characterised by jet control synchronising the droplet separation and charging time
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/145—Arrangement thereof
    • B41J2/155—Arrangement thereof for line printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17563—Ink filters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14419—Manifold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/12—Embodiments of or processes related to ink-jet heads with ink circulating through the whole print head

Definitions

  • the present invention relates to droplet deposition apparatus, such as, for example, ink jet printheads.
  • the present invention provides droplet deposition apparatus comprising:
  • Arranging the drive circuit means in such a manner can conveniently allow the ink in the printhead to serve as the sink for the heat generated in the drive circuitry. This can substantially reduce the likelihood of overheating, whilst avoiding the problems with electrical integrity that might occur were the integrated circuit packaging containing the circuitry allowed to come into direct contact with the ink.
  • the apparatus may comprise first conduit means for supplying droplet fluid to said fluid chamber and second conduit means for leading droplet fluid from said fluid chamber.
  • the drive circuit means may advantageously be thermally connected to the second conduit means. This can provide the most direct route out of the printhead for the heat generated in the chip of the drive circuit and, in the event that the heat produced by the chip varies significantly during operation, can minimise any variation in the temperature of the ink in the fluid chamber itself. As is known, for example, from WO97/35167, such temperature variation can give rise to variations in droplet ejection velocity and consequent dot placement errors in the printed image.
  • a face other than that face having the smallest surface area may advantageously be arranged so as to lie substantially parallel to the direction of fluid flow in that part of the conduit closest to said face, and to be in substantial thermal contact with the fluid.
  • a face having the greatest surface area is arranged so as to lie parallel to the direction of fluid flow. Circuit architecture permitting, such an arrangement can maximise heat transfer from the circuitry.
  • a second aspect of the present invention provides droplet deposition apparatus comprising:
  • the droplet fluid passageway may occupy the majority of the area of the support member when viewed in cross-section.
  • the passageway may comprise respective portions for the flow of droplet fluid in to and out of each fluid chamber. Such flow can aid the transfer of heat from the fluid chamber (where the main source of heat - the actuator means - is located) to the remainder of the support, thereby reducing temperature differentials.
  • the cross-section of support member is preferably wider in the direction of ink ejection from the nozzles than in the direction of the nozzle row.
  • the apparatus comprises a plurality of said droplet ejection units, the support member supporting the droplet ejection units side by side in the direction of the nozzle rows, the support member comprising at least one droplet fluid passageway communicating with at least two of said ejection units and arranged so as to convey droplet fluid to or from said ejection units in a direction substantially parallel to said nozzle rows and to transfer a substantial part of the heat generated during droplet ejection to said conveyed droplet fluid.
  • Heat distribution may be facilitated by constructing the support member from a material - such as aluminium - having a high thermal conductivity.
  • a material - such as aluminium - having a high thermal conductivity.
  • Such a material also has advantages as regards manufacture and cost. Problems arise, however, where the ejection unit is made from material having a coefficient of thermal expansion that is significantly different to that of the support. This will be the case with an ejection unit comprising channels formed in a body of piezoelectric material (typically lead zirconium titanate, PZT) described hereafter.
  • PZT lead zirconium titanate
  • a third aspect of the present invention provides droplet deposition apparatus comprising:
  • the attachment means comprises resilient bonding means for bonding the or each fluid chamber to the support member.
  • an adhesive rubber pad is used to bond a support member of extruded aluminium to a fluid chamber structure comprising a channel formed in a body of PZT and closed by cover member of a material, such as molybdenum, that is thermally matched to the PZT.
  • Forming ink supply ports in the cover and ink ejection nozzles in the channelled component can provide a particularly compact design having a low component count.
  • Figure 1 illustrates a first embodiment of droplet deposition apparatus embodied by a printhead 10.
  • the embodiment shown is a "pagewide" device, having two rows of nozzles 20,30 that extend (in the direction indicated by arrow 100) the width of a piece of paper, which allows ink to be deposited across the entire width of a page in a single pass.
  • Ejection of ink from a nozzle is achieved by the application of an electrical signal to actuation means associated with a fluid chamber communicating with that nozzle, as is known e.g. from EP-A-0 277 703, EP-A-0 278 590 and, more particularly, UK application numbers 9710530, EP 1 011 977 A, and 9721555, EP 1 021 302 A.
  • the "pagewide" rows of nozzles are made up of a number of modules, one of which is shown at 40.
  • Each module has associated fluid chambers and actuation means and is connected to associated drive circuitry (integrated circuit ("chip") 50) by means e.g. of a flexible circuit 60.
  • Ink supply to and from the printhead is via respective bores (not shown) in endcaps 90.
  • Figure 2 is a perspective view of the printhead of figure 1 from the rear and with endcaps 90 removed to reveal the supporting structure 200 of the printhead incorporating ink flow passages 210,220,230 extending the width of the printhead.
  • ink enters the printhead and the ink supply passage 220, as shown at 215 in figure 2.
  • ink As it flows along the passage, it is drawn off into respective ink chambers, as illustrated in figure 3, which is a sectional view of the printhead taken perpendicular to the direction of extension of the nozzle rows.
  • ink flows into first and second parallel rows of ink chambers (indicated at 300 and 310 respectively) via aperture 320 formed in structure 200 (shown shaded). Having flowed through the first and second rows of ink chambers, ink exits via apertures 330 and 340 to join the ink flow along respective first and second ink outlet passages 210,230, as indicated at 235. These join at a common ink outlet (not shown) formed in the endcap located at the opposite end of the printhead to that in which the inlet bore is formed.
  • Each row of chambers 300 and 310 has associated therewith respective drive circuits 360, 370.
  • the drive circuits are mounted in substantial thermal contact with that part of structure 200 acting as a conduit and which defines the ink flow passageways so as to allow a substantial amount of the heat generated by the circuits during their operation to transfer via the conduit structure to the ink.
  • the structure 200 of the embodiment of figures 1-3 is made of a material having good thermal conduction properties. Of such materials, aluminium is particularly preferred on the grounds that it can be easily and cheaply formed by extrusion.
  • Circuits 360,370 are then positioned on the outside surface of the structure 200 so as to lie in thermal contact with the structure, thermally conductive pads or adhesive being optionally employed to reduce resistance to heat transfer between circuit and structure.
  • the cuboid drive circuit dies 360,370 are arranged such that a largest (rectangular or square) surface of each die lies substantially parallel to the direction (indicated at 235) of fluid flow in the respective parts of the conduits 210,230 lying closest to those surfaces. This helps maximise heat transfer between circuit and ink, which is also facilitated by minimising the thickness of the structure separating the ink channel and the circuit, as well as by making the structure of a material having good thermal conduction.
  • FIG 4 is a perspective view from the top and above of one end of the printhead with all but one of the modules 40 having been removed to show external and internal details of structure 200 more clearly.
  • the structure includes recesses 500 to accommodate drive circuits 370 and lips 510,520 to retain further circuit boards 530 populated with those components not suited to incorporation into the drive circuits 370.
  • Forming rear lip 520 on a separate component 540, as shown in figure 4, allows these boards to be clamped into place by the action of fastening means, for example screws inserted through holes 240 shown in figure 2 and engaging with a bar (not shown) residing in channel 550.
  • the bar is made of a strong material, such as steel, able to accommodate screw threads and reinforce aluminium structure 200, particularly against the forces generated when installing and connecting the printhead.
  • further circuit board is also formed with pins (figure 3, 420) for supply of power and data into the printhead and with posts 560 for supplying power and data - suitably processed - to the drive circuits 370 via flexible connectors 570.
  • pins figure 3, 420
  • posts 560 for supplying power and data - suitably processed - to the drive circuits 370 via flexible connectors 570.
  • heat generated in the drive circuits is transferred to the ink whence it is distributed about the structure 200 as a result of the aforementioned ink flow paths. Heat generated in the ink chambers by the associated actuator means is also distributed in this manner. As a result, any temperature differentials that arise within structure 200 are small and do not give rise to significant internal forces and/or distortion.
  • the overall warming of the printhead during operation may lead to differential expansion of the structure 200 and the body in which the fluid chambers 300,310 are formed where these two members are of materials having significantly differing coefficients of thermal expansion, C TE .
  • C TE coefficients of thermal expansion
  • channels 11 are formed in a base component 860 of piezoelectric material so as to define piezoelectric channel walls therebetween. These walls are subsequently coated with electrodes to form channel wall actuators as are known e.g. from the aforementioned EP-0-0 277 703, a break in the electrodes at 810 allowing the channel walls in either half of the channel to be operated independently by means of electrical signals applied via electrical inputs (flexible circuits 60).
  • Each channel half is closed along a length 600,610 by respective sections 820,830 of a cover component 620 which is also formed with ports 630,640,650 that allow ink to be supplied to and from each channel half for cleaning and heat removal purposes, as is generally known.
  • cover component 620 is preferably made of a material that is thermally matched to the piezoelectric material of the channelled component. Ink ejection from each channel half is via openings 840,850 that communicate the channel with the opposite surface of the piezoelectric base component to that in which the channel is formed.
  • Nozzles 870,880 for ink ejection are subsequently formed in a nozzle plate 890 attached to the piezoelectric component.
  • tie rods may be inserted in bores 580 in the structure and tightened so as to keep structure 200 in compression.
  • any material having a value of C TE less than that of the structure - steel in the case of an aluminium structure - is suitable for the tie rods, it will be appreciated that low values of C TE are to be preferred.
  • cover component 620 may be attached to structure 200 by means of a resilient bond - adhesive coated rubber is shown at 430 in figure 3 - so as to allow any relative expansion that may occur in spite of the presence of tie rods (and which may be of the order of 0.3mm over a typical 12.6" (32 cm) length of a printhead) to take place at this less critical interface rather than generating stresses and deformations in the printhead module 40 itself.
  • cover 620 may be sat in a well 590 formed in structure 200 and may additionally extend to either side of the printhead to provide mounting surfaces for the printhead.
  • Molybdenum which has high strength and thermal conductivity in addition to being thermally matched to PZT, has been found to be a particularly suitable material for the cover.
  • Figure 6 shows a sectional view of a second embodiment of droplet deposition apparatus taken perpendicular to the direction of extension of the nozzle rows.
  • the supporting structure 900 of the printhead incorporates ink flow passages 910,920 extending the width of the printhead. Ink enters the printhead and the ink supply passage 920 as shown at 915 in figure 6. As it flows along the passage, it is drawn off into respective ink chambers 925 via aperture 930 formed in structure 900. Having flowed through the ink chambers, ink exits via apertures 940 and 950 to join the ink flow along ink outlet passage 910 as indicated at 935.
  • a flat alumina substrate 960 is mounted to the structure 900 via alumina interposer layer 970.
  • the interposer layer 970 is preferably bonded to the structure 900 using thermally conductive adhesive, approximately 100 microns in thickness, the substrate 960 being in turn bonded to the interposer layer 970 using thermally conductive adhesive.
  • Chips 980 of the drive circuit are mounted on a low density flexible circuit board 985.
  • the portions of the circuit board carrying the chips 980 are mounted directly on the surface of the alumina substrate 960.
  • other heat generating components of the drive circuit such as resistors 990, are mounted in substantial thermal conduct with that part of the structure 900 acting as a conduit so as to allow a substantial amount of the heat generated by these components 990 during their operation to transfer via the conduit structure to the ink.
  • an alumina plate 995 is mounted to the underside of the structure 900 in order to limit expansion of the aluminium structure 900 at this position, thereby substantially preventing bowing of the structure due to thermal expansion.

Landscapes

  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet (AREA)
  • Coating Apparatus (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Manufacturing And Processing Devices For Dough (AREA)
  • Radiation-Therapy Devices (AREA)
  • Spray Control Apparatus (AREA)
EP99950959A 1998-10-24 1999-10-22 Droplet deposition apparatus Expired - Lifetime EP1124691B1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
GB9823264A GB9823264D0 (en) 1998-10-24 1998-10-24 Droplet deposition apparatus
GB9823264 1998-10-24
US11857499P 1999-02-05 1999-02-05
US118574P 1999-02-05
PCT/GB1999/003505 WO2000024584A1 (en) 1998-10-24 1999-10-22 Droplet deposition apparatus

Publications (2)

Publication Number Publication Date
EP1124691A1 EP1124691A1 (en) 2001-08-22
EP1124691B1 true EP1124691B1 (en) 2003-01-02

Family

ID=26314563

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99950959A Expired - Lifetime EP1124691B1 (en) 1998-10-24 1999-10-22 Droplet deposition apparatus

Country Status (11)

Country Link
EP (1) EP1124691B1 (ja)
JP (1) JP2002528301A (ja)
KR (1) KR100761892B1 (ja)
CN (1) CN1165429C (ja)
AT (1) ATE230351T1 (ja)
AU (1) AU762871B2 (ja)
BR (1) BR9914788A (ja)
CA (1) CA2344931C (ja)
DE (1) DE69904743T2 (ja)
ES (1) ES2189504T3 (ja)
WO (1) WO2000024584A1 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AUPR399001A0 (en) 2001-03-27 2001-04-26 Silverbrook Research Pty. Ltd. An apparatus and method(ART104)
GB0121619D0 (en) 2001-09-07 2001-10-31 Xaar Technology Ltd Droplet depostion apparatus
GB0121909D0 (en) 2001-09-11 2001-10-31 Xaar Technology Ltd Droplet deposition apparatus
JP2006523142A (ja) 2003-04-10 2006-10-12 プレジデント・アンド・フェロウズ・オブ・ハーバード・カレッジ 流体種の形成および制御
KR20070029618A (ko) 2003-08-27 2007-03-14 더 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 유체종의 전자적 제어
JP2005225106A (ja) * 2004-02-13 2005-08-25 Sony Corp 液体吐出装置及びその制御方法
JP5398171B2 (ja) * 2008-05-20 2014-01-29 富士ゼロックス株式会社 液滴吐出ヘッド、液滴吐出ユニット、および液滴吐出装置
JP5351714B2 (ja) * 2009-11-12 2013-11-27 エスアイアイ・プリンテック株式会社 液体噴射ヘッド、液体噴射装置及び液体噴射ヘッドの製造方法
KR20140034000A (ko) * 2012-09-11 2014-03-19 삼성전기주식회사 잉크젯 프린트 헤드
GB2522563B (en) 2013-11-26 2015-11-04 Xaar Technology Ltd Droplet deposition apparatus and method for manufacturing the same
GB2546097B (en) 2016-01-08 2020-12-30 Xaar Technology Ltd Droplet deposition head
US11331915B2 (en) 2017-03-15 2022-05-17 Hewlett-Packard Development Company, L.P. Fluid ejection dies
CN113022137B (zh) 2017-03-15 2022-08-23 惠普发展公司，有限责任合伙企业 流体喷射管芯

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4879568A (en) 1987-01-10 1989-11-07 Am International, Inc. Droplet deposition apparatus
DE68914897T2 (de) * 1988-07-26 1994-08-25 Canon Kk Flüssigkeitsstrahlaufzeichnungskopf und Aufzeichnungsgerät, versehen mit diesem Kopf.
US5469199A (en) * 1990-08-16 1995-11-21 Hewlett-Packard Company Wide inkjet printhead
AU657931B2 (en) * 1991-01-30 1995-03-30 Canon Kabushiki Kaisha An integrally formed bubblejet print device
AU657720B2 (en) * 1991-01-30 1995-03-23 Canon Kabushiki Kaisha A bubblejet image reproducing apparatus
US5160945A (en) * 1991-05-10 1992-11-03 Xerox Corporation Pagewidth thermal ink jet printhead
JP3114776B2 (ja) * 1992-06-23 2000-12-04 セイコーエプソン株式会社 インクジェット式ライン記録ヘッドを用いたプリンタ
US5528272A (en) * 1993-12-15 1996-06-18 Xerox Corporation Full width array read or write bars having low induced thermal stress
US5734394A (en) * 1995-01-20 1998-03-31 Hewlett-Packard Kinematically fixing flex circuit to PWA printbar
GB9605547D0 (en) 1996-03-15 1996-05-15 Xaar Ltd Operation of droplet deposition apparatus

Also Published As

Publication number Publication date
CA2344931A1 (en) 2000-05-04
AU762871B2 (en) 2003-07-10
ATE230351T1 (de) 2003-01-15
EP1124691A1 (en) 2001-08-22
KR20010082239A (ko) 2001-08-29
CA2344931C (en) 2008-04-29
ES2189504T3 (es) 2003-07-01
WO2000024584A1 (en) 2000-05-04
AU6354699A (en) 2000-05-15
KR100761892B1 (ko) 2007-09-28
CN1324301A (zh) 2001-11-28
DE69904743D1 (de) 2003-02-06
CN1165429C (zh) 2004-09-08
JP2002528301A (ja) 2002-09-03
DE69904743T2 (de) 2003-10-16
BR9914788A (pt) 2001-07-03

Similar Documents

Publication Publication Date Title
US8783583B2 (en) Droplet deposition apparatus
CA2400608C (en) Droplet deposition apparatus
EP1124691B1 (en) Droplet deposition apparatus
AU2001233870A1 (en) Droplet deposition apparatus
US6820966B1 (en) Droplet deposition apparatus
US20120081476A1 (en) Liquid ejecting head and liquid ejecting apparatus
EP1905592B1 (en) Inkjet head
US6808252B2 (en) Ink jet recording head and manufacturing method therefor
US5757402A (en) Module assembly for an ink-jet printer
US6935726B2 (en) Printing head and ink jet printing apparatus which performs printing with the printing head
US8534798B2 (en) Ink jet recording head
US11780243B2 (en) Liquid ejecting head and liquid ejecting apparatus
JP4228632B2 (ja) インクジェットヘッド及びインクジェットプリンタ
JP2001121692A (ja) インクジェットヘッド

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20010424

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

17Q First examination report despatched

Effective date: 20020128

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: XAAR TECHNOLOGY LIMITED

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030102

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030102

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030102

Ref country code: CH

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030102

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030102

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030102

REF Corresponds to:

Ref document number: 230351

Country of ref document: AT

Date of ref document: 20030115

Kind code of ref document: T

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: 20030102

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 69904743

Country of ref document: DE

Date of ref document: 20030206

Kind code of ref document: P

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030402

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030402

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20030402

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2189504

Country of ref document: ES

Kind code of ref document: T3

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

ET Fr: translation filed
PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20031022

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20031022

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20031022

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20031031

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20031003

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20141008

Year of fee payment: 16

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20141010

Year of fee payment: 16

REG Reference to a national code

Ref country code: NL

Ref legal event code: MM

Effective date: 20151101

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20160630

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20151102

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20151101

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20181009

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20181018

Year of fee payment: 20

Ref country code: GB

Payment date: 20181017

Year of fee payment: 20

Ref country code: ES

Payment date: 20181102

Year of fee payment: 20

REG Reference to a national code

Ref country code: DE

Ref legal event code: R071

Ref document number: 69904743

Country of ref document: DE

REG Reference to a national code

Ref country code: GB

Ref legal event code: PE20

Expiry date: 20191021

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION

Effective date: 20191021

REG Reference to a national code

Ref country code: ES

Ref legal event code: FD2A

Effective date: 20201002

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION

Effective date: 20191023