EP1112616A1 - Systeme et procede pour la compensation de la puissance de sortie pour la temperature reelle d'un dispositif - Google Patents

Systeme et procede pour la compensation de la puissance de sortie pour la temperature reelle d'un dispositif

Info

Publication number
EP1112616A1
EP1112616A1 EP99969187A EP99969187A EP1112616A1 EP 1112616 A1 EP1112616 A1 EP 1112616A1 EP 99969187 A EP99969187 A EP 99969187A EP 99969187 A EP99969187 A EP 99969187A EP 1112616 A1 EP1112616 A1 EP 1112616A1
Authority
EP
European Patent Office
Prior art keywords
temperature
power amplifier
thermal resistance
power
power dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99969187A
Other languages
German (de)
English (en)
Inventor
Steven J. Laureanti
Veli-Pekka Ketonen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Oyj
Original Assignee
Nokia Networks Oy
Nokia Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Networks Oy, Nokia Oyj filed Critical Nokia Networks Oy
Publication of EP1112616A1 publication Critical patent/EP1112616A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H6/00—Emergency protective circuit arrangements responsive to undesired changes from normal non-electric working conditions using simulators of the apparatus being protected, e.g. using thermal images
    • H02H6/005—Emergency protective circuit arrangements responsive to undesired changes from normal non-electric working conditions using simulators of the apparatus being protected, e.g. using thermal images using digital thermal images

Definitions

  • This invention relates in general to systems and methods for controlling temperature in electrical devices, and more particularly to systems and methods for output power compensation for actual device temperature
  • Elect ⁇ cal devices are often provided with a temperature range by the manufacturer, or at least a maximum temperature, regulating the elect ⁇ cal dev ice should be used Since electrical devices may require cooling m order to operate properly, they are usually provided with what may generally be called coolmg devices Such cooling devices may, for example, allow ambient air to flow through passages m the electrical device, or as another example actively force coolmg air through at least parts of the electncal device
  • An electrical de ⁇ ice may, for example, be provided with a heat sink substantially surrounding the electrical device, whereby energy dissipating from the elect ⁇ cal device in form of heat is absorbed in the heat sink while allowing the heat sink to remain substantially at a constant temperature
  • a fan provided close to the elect ⁇ cal device may force an air flow toward the electrical device, thereby increasing the heat dissi
  • the present invention discloses a system and method for output power compensation for actual device temperature.
  • the present invention solves the above-described problems by providing a system and method for controlling a temperature of an elect ⁇ cal device, using a temperature of the device and a thermal resistance of the device.
  • a system m accordance with the p ⁇ nciples of the present invention includes an elect ⁇ cal device having a thermal resistance, a temperature sensor adjacent the elect ⁇ cal device, for sensing a temperature of the elect ⁇ cal device, and a controller connected to the elect ⁇ cal device and to the temperature sensor The controller adjusts a power dissipation of the elect ⁇ cal device using the temperature and the thermal resistance to control an inner temperature of the elect ⁇ cal device
  • a method in accordance with the p ⁇ nciples of the present invention includes sensing an outer temperature of an elect ⁇ cal device du ⁇ ng operation, and controlling a power dissipation of the elect ⁇ cal device using the outer temperature and a thermal resistance of the elect ⁇ cal device
  • FIG. 1 schematically illustrates an embodiment of a system in accordance with the principles of the invention
  • Fig 2 is an exemplary diagram showing the effects on junction temperature at increasing casing temperature without power compensation.
  • Fig 3 is an exemplary diagram showing junction temperature at increasing casing temperat e. when dissipated power is adjusted
  • the present invention provides new systems and methods foi controlling temperature of electrical devices.
  • Fig 1 illustrates schematically an embodiment of a system in accordance with the pimciples of the present invention
  • the system 100 includes a device 101 , which generally is an electric device In some applications the device 101 is, or includes, a power amplifier Well-known power amplifiers may be used with embodiments of the invention
  • the system 100 is included in a cellular base station in an RF network, with the device 101 being at least part of an RF power amplifier device
  • RF networks typically include a plurality of cellular base stations, located at different geographical precisions, for controlling RF transmissions in the network
  • Each one of such cellular base stations is generally enclosed in its own casing, provided with forced and/or unforced air cooling, for example as desc ⁇ bed above
  • the device 101 is typically provided with external pow er supply from a remote power source (not show n) as is w ell-known
  • the device 101 may also be connected with data communication cables, antennas, etc. to perfo ⁇ n desired functions a particular application
  • a temperature sensor 103 is positioned adjacent the dev ice 101
  • Well-know n temperatm e sensors may be used with embodiments of the inv ention.
  • the temperature sensoi 103 will be used for sensing a temperature of the device 101. in order to adjust a power dissipation of the device 101 __
  • the temperature sensor 103 is connected to a controller 120 for controlling the power dissipation of the device 101
  • Many kinds of well-known controllers may be used with embodiments of the invention.
  • the controller 120 is connected to the sensor 103 using, for example, well-known techniques.
  • the controller 120 may be positioned inside the device 101 as indicated in Fig 1 In other embodiments, the controller 120 may be positioned outside the dev
  • the controller 120 will receive temperature measurements from the temperature sensor 103 and adjust settings m the device 101 using the temperature measurements to control the power dissipation of the device 101
  • the device 101 and temperature sensor 103 are located in a surrounding 105
  • the surrounding will generally include other pans, devices, circuitry or components of the application where the device 101 is being used
  • the surrounding 105 may be a printed circuit board, where the device 101 is mounted on the printed circuit board.
  • Different well-known printed circuit boards may be used with embodiments of the invention
  • the device 101 is a RF power amplifier device, it may be mounted on the printed circuit board 105 inside a cellulai base station
  • the device 101 and the temperature sensor 103 may be provided with a heat sink 107
  • a heat sink 107 Different well-known heat sinks mav be used with embodiments of the invention.
  • the heat sink 107 at least partially surrounds the dev ice 101 and temperature sensor 103 and is used to absorb energy in the form of heat dissipating from the device 101
  • the heat sink 107 may be manufactured from a metal, and be provided with extending fins (not shown) to facilitate the performance of its desired function
  • the temperature ⁇ sensor 103 may, for example be mounted directly on the device 101 , or adjacent to the dev ice 101 on the heat sink 107
  • the system 100 may be provided with one or more forms of coolmg As desc ⁇ bed above, a heat sink 107 may be used to absorb energy from the device 101 Forced air coolmg may also be used, for example in the form of a fan providing a forced an flow adjacent the device 101
  • the forced air coolmg is schematically illustrated by the box 109 in Fig 1
  • Many different kinds of well-known forced air coolmg may be used with embodiments of the invention
  • the system 100 may be provided with unforced air coolmg, schematically illustrated by the box 1 1 1 m Fig 1
  • unforced air coolmg schematically illustrated by the box 1 1 1 m Fig 1
  • the system 100 may be provided with air intakes and outlets for allowing ambient air to circulate adjacent the device 101
  • junction temperature T The manufacturer of the power amplifier typically pro ides a maximum tolerable junction temperature for the power amplifier, which should not be exceeded to ensure safe and reliable operation of the amplifier
  • the maximum tolerable junction temperature will typically be selected in consideration of the particular RF power amplifier device and/or its intended use and/or the desired reliability
  • the junction temperature T mav be set to a maximum of 200°C in some applications Due to practical circumstances and in order to increase the reliability of the RF __ power amplifier, a derating v alue is typically associated with this maximum temperature
  • a casing temperature T c of the power amplifier may be measured, for example, by the temperature sensor 103 located on or adjacent the device 101 The lelationship between the junction temperature T and the casing temperature T c is
  • P dlSb is a power dissipation from the power amplifier
  • R ⁇ is the
  • thermal resistance between the junction of the power amplifier and the casing For embodiments in accordance with the invention, it can be assumed that the thermal resistance
  • resistance R ⁇ c is substantially constant and not unilaterally proportional to the
  • the thermal resistance R ti c may,
  • the value of R 0 c may be used in controlling the junction temperature T,
  • the thermal resistance should be a value measured in °C/W, in order for their product to have the unit of
  • the junction temperature T may be calculated according to equation 1
  • FIG. 2 is an exemplary graph 200 showing junction temperature T, 210, measured casing temperatme T c 212, and power dissipation P dlbS 214
  • the casing temperature T t 212 is increasing, and the power dissipation P dlb 214 is not compensated for the increase
  • the casing temperature T c 212 is indicated along the abscissa of the graph, showing the range between 60°C and 170°C
  • the power dissipation P dlss 214 remains substantially constant as illustrated by the line 220
  • the junction temperature T 210 is linearly dependent on the casing temperature T c 212, as indicated by line 222 For example, it can be seen that while the casing temperature T 212 increases from 65°C to 165°C, the junction temperature T, 210 inci eases from 130°C to 230°C on the left ordinate
  • FIG. 3 is an exemplary graph 300 showing junction temperature T j 310, measured casing temperature T L 312, and adjusted power dissipation P dl b 314 In this example, the power dissipation P dlbS 314 is adjusted to decrease substantially linearly with increasing casing temperature T c 312, as indicated by line 320
  • the power dissipation P dlss 314 is adjusted by the _ controller 120 receiving the measured casing temperature T c 312 from the temperature sensor 103
  • the controller 120 may, for example, be connected to the device 101 such that it may control the level of output power from the device 101
  • the controller 120 may, for example, access the equation ( 1 ) where P d]bi and R ⁇
  • the equation ( 1 ) may be provided in a memory m the controller 120, or the controller 120 may access it when needed, using well-known techniques
  • the junction temperature T j 310 can be determined once the casing temperature T c 312, the adjusted power dissipation P d ⁇ ss 314. and the
  • thermal resistance R ⁇ , c are known As indicated by line 320 in the exemplary Fig 3,
  • the junction temperature T 310 may be held substantially constant
  • the power dissipation P dlss 314 is adjusted to successively lower values, resulting in the junction temperature T, 310 remaining substantially constant at about 180°C
  • the increasing casing temperature T c 312 caused for example by malfunctioning coolmg devices, is compensated by a decrease in the output power P dlSb 314 of the device

Landscapes

  • Amplifiers (AREA)

Abstract

L'invention concerne un système de réglage de la puissance de sortie comprenant un dispositif électrique avec une résistance thermique, un capteur de température adjacent au dispositif électrique pour détecter la température de ce dernier, et un contrôleur pour régler la dissipation de puissance du dispositif électrique en utilisant la température et la résistance thermique pour commander une température intérieure du dispositif électrique. Ce système peut être utilisé avec un amplificateur de puissance HF. Une relation linéaire entre la température de jonction, la température de boîtier et la dissipation de puissance est utilisée avec une résistance thermique déterminée du dispositif. L'invention traite également d'un procédé de commande de la température d'un dispositif électrique, consistant à détecter la température extérieure de ce dernier et contrôler la dissipation de puissance à l'aide de la température extérieure et d'une résistance thermique. Ce système et ce procédé permettent de maintenir la température de jonction à un niveau sensiblement constant.
EP99969187A 1998-09-14 1999-09-13 Systeme et procede pour la compensation de la puissance de sortie pour la temperature reelle d'un dispositif Withdrawn EP1112616A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15237198A 1998-09-14 1998-09-14
US152371 1998-09-14
PCT/US1999/020938 WO2000016476A1 (fr) 1998-09-14 1999-09-13 Systeme et procede pour la compensation de la puissance de sortie pour la temperature reelle d'un dispositif

Publications (1)

Publication Number Publication Date
EP1112616A1 true EP1112616A1 (fr) 2001-07-04

Family

ID=22542647

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99969187A Withdrawn EP1112616A1 (fr) 1998-09-14 1999-09-13 Systeme et procede pour la compensation de la puissance de sortie pour la temperature reelle d'un dispositif

Country Status (3)

Country Link
EP (1) EP1112616A1 (fr)
AU (1) AU6035699A (fr)
WO (1) WO2000016476A1 (fr)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA991756A (en) * 1974-04-19 1976-06-22 Richard I. Maran Semi-conductor thermal protection arrangement
US4611180A (en) * 1985-01-09 1986-09-09 Crown International, Inc. Grounded bridge amplifier protection through transistor thermo protection
DE3622713A1 (de) * 1986-07-05 1988-01-07 Blaupunkt Werke Gmbh Schaltungsanordnung mit einer brueckenendstufe
US4939786A (en) * 1987-03-09 1990-07-03 Motorola, Inc. Adaptive thermal protection for a power amplifier by remote sense
IT1229777B (it) * 1989-05-22 1991-09-11 Sgs Thomson Microelectronics Circuito per la limitazione della temperatura senza distorsione per amplificatori audio di potenza.
GB2279835B (en) * 1990-07-30 1995-04-05 Nad Electronics Limited Power amplifier protection circuit
WO1995031035A1 (fr) * 1994-05-10 1995-11-16 Ericsson Inc. Circuit de reduction de puissance lineaire a commande thermique
US5600575A (en) * 1994-10-05 1997-02-04 Anticole; Robert B. Drive protection monitor for motor and amplifier

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0016476A1 *

Also Published As

Publication number Publication date
AU6035699A (en) 2000-04-03
WO2000016476A1 (fr) 2000-03-23

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