EP1105907A1 - Travelling wave tube configuration - Google Patents

Travelling wave tube configuration

Info

Publication number
EP1105907A1
EP1105907A1 EP99938168A EP99938168A EP1105907A1 EP 1105907 A1 EP1105907 A1 EP 1105907A1 EP 99938168 A EP99938168 A EP 99938168A EP 99938168 A EP99938168 A EP 99938168A EP 1105907 A1 EP1105907 A1 EP 1105907A1
Authority
EP
European Patent Office
Prior art keywords
tube
arrangement
cooling element
housing
circuit arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP99938168A
Other languages
German (de)
French (fr)
Other versions
EP1105907B1 (en
Inventor
Hubert Bradatsch
Andreas Peters
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales Electron Devices GmbH
Original Assignee
Thomson Tubes Electroniques GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Tubes Electroniques GmbH filed Critical Thomson Tubes Electroniques GmbH
Publication of EP1105907A1 publication Critical patent/EP1105907A1/en
Application granted granted Critical
Publication of EP1105907B1 publication Critical patent/EP1105907B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J23/00—Details of transit-time tubes of the types covered by group H01J25/00
    • H01J23/005—Cooling methods or arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J23/00—Details of transit-time tubes of the types covered by group H01J25/00
    • H01J23/34—Circuit arrangements not adapted to a particular application of the tube and not otherwise provided for

Definitions

  • the invention relates to a runway tube arrangement with a runway tubes and a linearization circuit arrangement
  • Running field tubes are preferably used as high-performance amplifiers in the microwave range, particularly in satellites.
  • the power loss that occurs during the operation of such amplifier tubes is given off to the environment as heat.
  • heat is emitted by radiation into space, typically with the tube housing on the inside of a heat-conducting tube Wall section of the satellite is attached and the heat loss is dissipated via the pipe housing to the wall section and is radiated by the same.
  • the radiating surface can be smaller with the same radiation power, the higher the temperature of the surface, the permissible minimum housing temperature is therefore, for example, 100 for the pipes ° C required
  • the high heat dissipation component of the tube collector is partially emitted via separate radiators that protrude from the satellite housing
  • Runway tubes show a clear phase response within the operating frequency band.
  • a linearizer for short, with a complementary phase response.
  • the connection between a signal generator, linearizer and The pipes are typically signal input via flexible Koa
  • ERSAT BLA7T (RULE 26) xial connections, whereby the circuit arrangement is protected by the spacing of the tube from damage caused by the high tube temperatures.
  • the present invention is based on the object of specifying an advantageous running tube arrangement with a running tube and a linearization circuit arrangement.
  • the invention results in a runway tube arrangement which is available to the user as a linearized runway tube without the previously required external circuitry and at the same time while maintaining high permissible housing temperatures.
  • the structural union reduces the space required for the arrangement and avoids the connection effort which is associated with a circuit arrangement which is otherwise to be inserted into the supply line.
  • the structural union of the linearizer with the tread tube offers the user a considerably simplified handling and the possibility for the manufacturer to be able to offer a tube type with a very good linearity that can be guaranteed by individually adapting the linearizer circuit arrangement to the individual tube. Influencing effects on the linearity due to unfavorable installation measures by the user can largely be excluded.
  • an active cooling element which keeps the linearization circuit arrangement, hereinafter also abbreviated linearizer, at a lower temperature than that of the tube wall.
  • the active cooling element is characterized in that it dissipates heat from a colder surface to a warmer surface. Because of the mechanical insensitivity of the simple electrical controllability and the long service life, the active cooling element is preferably designed as a Peltier element
  • the total power loss occurring and to be dissipated in the pipe arrangement is increased.
  • the power loss component caused by the cooling element is small compared to the power loss of the runway tubes, on the other hand, one is due to the additional Loss fraction of a slight increase in the housing temperatures of the pipes is not critical
  • the temperature of the linearizer is limited by the cooling element to a temperature that is not critical for the structural elements of the linearizer, preferably to a maximum of 60 ° C.
  • the cooling element can be used as an active element with controllable cooling output in a temperature control circuit with a temperature sensor for the temperature of the linearizer, the controllability of a Peltier element is again of particular advantage.
  • the linearization circuit arrangement can be present, for example, as a circuit board structure with several components or fully integrated as a single integrated circuit
  • the linearizer is used in an electromagnetically shielding housing in order to avoid interference from stray fields, in particular the runway tubes themselves.
  • the housing advantageously also acts as a radiation barrier, thus preventing the radiation of heat from the pipes in the immediate vicinity or one of them
  • the linearizer housing possibly also surrounding common housing of the pipe arrangement, by executing the inward and / or outward-pointing housing flats. Chen with low radiation emission or radiation absorption capacity for heat radiation, the heating of the linearizer can be further reduced via this radiation path.
  • the linearizer is mechanically preferably connected to the wall of the tube or the wall of a common housing of the tube arrangement essentially only via the cooling element, so that little or no solid-state heat transfer takes place from the wall to the linearizer.
  • the linearizer housing is fastened with a housing surface on the cooling surface of the cooling element, which then serves as a mechanical support and is preferably fastened with its heat-emitting surface on the tube wall or a common wall.
  • the heat-emitting surface of the cooling element can also be connectable directly to a heat-dissipating surface of the object, in particular an outer wall of a satellite.
  • the cooling element is arranged at least with its cooling surface within the linearizer housing and is preferably used directly as a carrier for the linearizer circuit arrangement with good thermal contact with the latter.
  • the heat-emitting surface of the cooling element can then advantageously be thermally coupled to a housing surface of the linearizer housing and this to a wall of the tube or a common wall or a heat-dissipating surface of the object.
  • the linearizer is advantageously arranged in the vicinity of the beam generation system and / or the signal input of the tube and far from the collector of the tube, as a result of which greater heat radiation due to the high col
  • FIG. 1 shows a runway tube arrangement with a linearizer arranged on the outside of the tube housing.
  • FIG. 2 shows a tube arrangement with a linearizer arranged in a common housing
  • a common treadmill tube LR which is surrounded by a stable wall, is fastened with a wall surface to a heat-dissipating outer wall AF of a satellite.
  • the heat output given off by the treadmill tubes via their housing area in contact with the satellite wall AF is given in the outer wall AF of the satellite is distributed to a larger area by solid-state heat conduction and is released into space by heat radiation R.
  • the tread tubes are typically constructed from a beam generation system ST, a delay line L and a collector C and have a high frequency Signal input E and a signal output SA through the housing wall W on
  • the inner structure of tread tubes is known and irrelevant to the invention in detail
  • a cooling element K in the form of a Peltier element is fastened to a flat part of the wall W of the runtime tubes LR in the vicinity of the beam generation system ST and the signal input SE.
  • the cooling surface KL which is colder during operation, and a warmer, power-emitting surface KA, is fastened
  • REAL DATE SHEET (RULE 26) can be done directly by gluing with heat-conducting adhesive or by means of fasteners not shown in detail.
  • the heat-emitting surface is in good thermal contact with the wall W of the running tube.
  • the housing G of a linearizer is fastened on the cooling surface KL of the cooling element K, the fastening in turn being present with a good thermal coupling between a housing surface of the housing G and the cooling surface KL, and the fastening can be carried out using adhesive or fastening means not shown.
  • the actual linearizer is arranged in the interior of the housing G in the form of a circuit arrangement S present as a circuit board structure or as a single integrated circuit and is shielded by the housing G against electromagnetic radiation, in particular stray fields of the runway tube LR.
  • a high-frequency control signal can be supplied to the linearizer via an input connection E.
  • the high-frequency input signal provided with a predistorting phase response which is complementary to the phase response of the turret tube is fed to the signal input SE of the tube with a short line length from the linearizer to the tube. Since the cooling of the circuit arrangement S by the cooling surface KL of the cooling element K is of primary importance, the circuit arrangement S is in good thermal contact with the cooled surface of the housing G.
  • the housing G also provides a shielding of the circuit arrangement S against direct heat radiation from the high temperature wall W of the runway tube.
  • a temperature of 100 ° C. is permissible for the temperature of the wall W of the runway tube at a reference point TP.
  • the areas of the wall W which are not in direct contact with the heat-dissipating wall AF of the satellite can also reach higher temperatures.
  • the cooling element K which is in particular a Peltier element, transports heat output from the circuit arrangement S via a surface of the housing G and the cooling surface KL to the heat-emitting surface KH, which is at a substantially higher temperature, and transfers the heat output to the wall W of the running tube.
  • the temperature of the circuit arrangement is limited to a maximum of 60 ° C. by the cooling element.
  • Via a control circuit the components of which are not shown, and which in particular comprise a temperature sensor on or in the vicinity of the circuit arrangement S and a control device for controlling the current through the cooling element K, the electrical power consumed by the cooling element K can be maintained in order to maintain an substantially constant temperature of the circuit arrangement S can be controlled.
  • the arrangement sketched in FIG. 2 differs from the arrangement according to FIG. 1 essentially in that the linearizer with the complete shielding housing G is arranged within a common housing of the turret tube arrangement, the wall of which is again designated W.
  • the input connection E to the linearizer circuit arrangement leads through the common wall W.
  • the connection between the linearizer and the signal input of the runner tube is made within the common wall W, for example by a waveguide section H.
  • the runner tubes are preferably separated from one another by a partition wall T which reduces stray fields and blocks direct heat radiation.
  • the linearizer is arranged at the end of the elongated structure of the turret tube which is located in the radiation generation system ST.
  • the cooling element K is arranged inside the linearizer housing G.
  • the circuit arrangement S is preferred attached with good thermal coupling to the cooling surface KL of the cooling element K serving as a carrier, for example via a thermally highly conductive adhesive layer.
  • the heat-emitting surface KH of the cooling element K bears against a surface of the linearizer housing G, which in turn bears against the inside of the wall W.
  • a good thermal coupling again exists between the heat-emitting surface KH of the cooling element K, the adjacent housing section of the linearizer housing G, the common wall W and the heat-dissipating wall AF of the satellite.
  • an arrangement with a cooling element located within the linearizer housing G can be fastened from the outside to the wall of a runtime tube, or the cooling element can be arranged between an inner surface of a common wall W and a linearizer housing G lying within the common wall.
  • the positions for the arrangement of the linearizer housing G and the cooling element K in the described embodiments are only to be regarded as examples. The given sketched examples are primarily based on the clarity of the figures.
  • the linearizer housing can in particular also be attached to a side surface or end surface of the wall W.
  • Peltier element as a whole can stabilize the temperature in relation to higher and lower temperatures. NEN and thus enable the structural union of temperature-sensitive components with other components with different permissible operating temperatures in a tube arrangement.

Abstract

The invention relates to a travelling wave tube configuration with a travelling wave tube (LR) and a linearization circuit arrangement (S). The aim of the invention is to integrate the linearization circuit arrangement (S) and the travelling wave tube (LR) in one unit and to keep the linearization circuit arrangement (S) at a temperature that is safe and lower than that of the wall (W) of the tube or a common wall in order to protect the linearization circuit arrangement while the tube housing is kept at an admissible high temperature. To this end, an active cooling element (K), preferably a Peltier element, is used.

Description

Bezeichnung description
LauffeldröhrenanordnungRunning tube arrangement
Beschreibungdescription
Die Erfindung betrifft eine Lauffeldrohrenanordnung mit einer Lauffeldrohre und einer Lineaπsierungs-SchaltungsanordnungThe invention relates to a runway tube arrangement with a runway tubes and a linearization circuit arrangement
Lauffeld röhren sind bevorzugt als Hochleistungsverstarker im Mikrowellenbe- reich insbesondere in Satelliten eingesetzt Die beim Betrieb solcher Verstar- kerrohren anfallende Verlustleistung wird als Warme an die Umgebung abgegeben Bei Satelliteneinsatz erfolgt die Wärmeabgabe durch Abstrahlung in den Weltraum, wobei typischerweise das Rohrengehause an der Innenseite eines wärmeleitenden Wandabschnitts des Satelliten befestigt ist und die Verlustwarme über das Rohrengehause an den Wandabschnitt abgeführt und von diesem abgestrahlt wird Die abstrahlende Flache kann bei gleicher Abstrahlleistung umso kleiner sein, je hoher die Temperatur der Flache ist Für die Rohren ist daher häufig eine zulassige Gehausemindesttemperatur von beispielsweise 100° C gefordert Der hohe Verlustleistungsanteil des Rohrenkollektors wird teilweise über gesonderte, aus dem Satellitengehause hinausragende Radiatoren abgestrahltRunning field tubes are preferably used as high-performance amplifiers in the microwave range, particularly in satellites. The power loss that occurs during the operation of such amplifier tubes is given off to the environment as heat. When used in satellites, heat is emitted by radiation into space, typically with the tube housing on the inside of a heat-conducting tube Wall section of the satellite is attached and the heat loss is dissipated via the pipe housing to the wall section and is radiated by the same. The radiating surface can be smaller with the same radiation power, the higher the temperature of the surface, the permissible minimum housing temperature is therefore, for example, 100 for the pipes ° C required The high heat dissipation component of the tube collector is partially emitted via separate radiators that protrude from the satellite housing
Lauffeldrohren zeigen einen deutlichen Phasengang innerhalb des Betnebsfre- quenzbandes Es ist bekannt, zur Kompensation eines solchen Phasenganges die Ansteuersignale für die Rohren über eine vorgeschaltete Lineansierungs- Schaltungsanordnung, kurz Lineaπsierer genannt, mit komplementärem Phasengang zu fuhren Die Verbindung zwischen einem Signalgenerator, Linean- sierer und Signaleingang der Rohre erfolgt typischerweise über flexible Koa-Runway tubes show a clear phase response within the operating frequency band. To compensate for such a phase response, it is known to drive the control signals for the tubes via an upstream linearization circuit arrangement, called a linearizer for short, with a complementary phase response. The connection between a signal generator, linearizer and The pipes are typically signal input via flexible Koa
ERSAT BLA7T (REGEL 26) xialverbindungen, wodurch die Schaltungsanordnung durch den Abstand der Röhre vor Beschädigung durch die hohen Röhrentemperaturen geschützt ist.ERSAT BLA7T (RULE 26) xial connections, whereby the circuit arrangement is protected by the spacing of the tube from damage caused by the high tube temperatures.
Der vorliegenden Erfindung liegt die Aufgabe zugrunde, eine vorteilhafte Lauffeldröhrenanordnung mit einer Lauffeldröhre und eine Linearisierungs- Schaltungsanordnung anzugeben.The present invention is based on the object of specifying an advantageous running tube arrangement with a running tube and a linearization circuit arrangement.
Die Erfindung ist im Patentanspruch 1 beschrieben. Die Unteransprüche enthalten vorteilhafte Ausgestaltungen und Weiterbildungen.The invention is described in claim 1. The subclaims contain advantageous refinements and developments.
Durch die Erfindung ergibt sich eine Lauffeldröhrenanordnung, die dem Benutzer als linearisierte Lauffeldöhre ohne die zuvor notwendige Außenbeschaltung und gleichzeitig unter Beibehaltung hoher zulässiger Gehäusetemperaturen zur Verfügung steht. Die bauliche Vereinigung reduziert den Platzbedarf der An- Ordnung und vermeidet den Verbindungsaufwand, der mit einer sonst in die Zuleitung einzufügenden Schaltungsanordnung verbunden ist. Darüber hinaus bietet die bauliche Vereinigung des Linearisierers mit der Lauffeldröhre für den Benutzer eine wesentlich vereinfachte Handhabung und für den Hersteller die Möglichkeit, durch individuelle Abstimmung der Linearisierer- Schaltungsanordnung auf die einzelne Röhre einen Röhrentyp mit gewährleistbarer sehr guter Linearität anbieten zu können. Die Linearitätseigenschaften verschlechternde Einflüsse durch ungünstige Einbaumaßnahmen beim Benutzer können weitgehend ausgeschlossen werden.The invention results in a runway tube arrangement which is available to the user as a linearized runway tube without the previously required external circuitry and at the same time while maintaining high permissible housing temperatures. The structural union reduces the space required for the arrangement and avoids the connection effort which is associated with a circuit arrangement which is otherwise to be inserted into the supply line. In addition, the structural union of the linearizer with the tread tube offers the user a considerably simplified handling and the possibility for the manufacturer to be able to offer a tube type with a very good linearity that can be guaranteed by individually adapting the linearizer circuit arrangement to the individual tube. Influencing effects on the linearity due to unfavorable installation measures by the user can largely be excluded.
Wesentlich an der erfindungsgemäßen Anordnung ist der Einsatz eines aktiven Kühlelements, weiches die Linea sierungs-Schaltungsanordnung, nachfolgend auch abgekürzt Linearisierer genannt, auf niedrigerer Temperatur als die der Röhrenwandung hält. Das aktive Kühlelement zeichnet sich dadurch aus, daß es Wärmeleistung von einer kälteren Fläche an eine wärmere Fläche abführt. Wegen der mechanischen Unempfindlichkeit der einfachen elektrischen Steuerbarkeit und der hohen Lebensdauer ist das aktive Kuhlelement bevorzugt als Peltier-Element ausgeführtWhat is essential to the arrangement according to the invention is the use of an active cooling element, which keeps the linearization circuit arrangement, hereinafter also abbreviated linearizer, at a lower temperature than that of the tube wall. The active cooling element is characterized in that it dissipates heat from a colder surface to a warmer surface. Because of the mechanical insensitivity of the simple electrical controllability and the long service life, the active cooling element is preferably designed as a Peltier element
Durch den Einsatz eines aktiven Kuhlelements und die in diesem entstehende Verlustleistung wird zwar insgesamt die in der Rohrenanordnung anfallende und abzuführende Verlustleistung erhöht Zum einen ist aber der durch das Kuhlelement bewirkte Verlustleistungsanteil im Vergleich zu der Verlustleistung der Lauffeldrohre gering, zum anderen ist eine durch den zusatzlichen Ver- lustanteil evtl entstehende geringe Erhöhung der Gehausetemperaturen der Rohre unkritischThrough the use of an active cooling element and the power loss that arises in it, the total power loss occurring and to be dissipated in the pipe arrangement is increased.On the one hand, the power loss component caused by the cooling element is small compared to the power loss of the runway tubes, on the other hand, one is due to the additional Loss fraction of a slight increase in the housing temperatures of the pipes is not critical
Die Temperatur des Lineansierers wird durch das Kuhlelement auf eine für die Baulelemente des Lineansierers unkritische Temperatur, vorzugsweise auf ma- ximal 60° C begrenzt Das Kuhlelement kann als aktives Element mit steuerbarer Kuhlleistung in einem Temperaturregelkreis mit einem Temperaturfühler für die Temperatur des Lineansierers eingesetzt sein, wobei wiederum die Steuerbarkeit eines Peltier-Elements von besonderem Vorteil ist Die Lineansierungs- Schaltungsanordnung kann beispielsweise als Platinenaufbau mit mehreren Bauelementen oder vollintegriert als einzelner integrierter Schaltkreis vorliegenThe temperature of the linearizer is limited by the cooling element to a temperature that is not critical for the structural elements of the linearizer, preferably to a maximum of 60 ° C. The cooling element can be used as an active element with controllable cooling output in a temperature control circuit with a temperature sensor for the temperature of the linearizer, the controllability of a Peltier element is again of particular advantage. The linearization circuit arrangement can be present, for example, as a circuit board structure with several components or fully integrated as a single integrated circuit
Der Lineansierer ist gebrauchlicherweise in einem elektromagnetisch abschirmendem Gehäuse angeordnet, um Störungen von Streufeldern, insbesondere der Lauffeldrohre selbst zu vermeiden Bei der erfindunggemaßen Anordnung wirkt das Gehäuse vorteilhafterweise zusätzlich als Strahlungsbarnere warmei- soherend gegen die Einstrahlung von Wärmeleistung der in unmittelbarer Nachbarschaft befindlichen Rohre oder eines das Lineansierergehause evtl auch umgebenden gemeinsamen Gehäuses der Rohrenanordnung Durch Ausfuhrung der nach innen und/oder der nach außen weisenden Gehausefla- chen mit geringem Strahlungsemissions- bzw. Strahlungsabsorptionsvermögen für die Wärmestrahlung kann die Erwärmung des Linearisierers über diesen Strahlungsweg weiter verringert werden.The linearizer is used in an electromagnetically shielding housing in order to avoid interference from stray fields, in particular the runway tubes themselves.In the arrangement according to the invention, the housing advantageously also acts as a radiation barrier, thus preventing the radiation of heat from the pipes in the immediate vicinity or one of them The linearizer housing, possibly also surrounding common housing of the pipe arrangement, by executing the inward and / or outward-pointing housing flats. Chen with low radiation emission or radiation absorption capacity for heat radiation, the heating of the linearizer can be further reduced via this radiation path.
Der Linearisierer ist mechanisch vorzugsweise im wesentlichen nur über das Kühlelement mit der Wandung der Röhre oder der Wandung eines gemeinsamen Gehäuses der Röhrenanordnung verbunden, so daß keine oder nur eine geringe Festkörper-Wärmeübertragung von der Wandung zum Linearisierer stattfindet. In einer vorteilhaften Ausführungsform ist das Linearisierer-Gehäuse mit einer Gehäusefläche auf der Kühlfläche des Kühlelements befestigt, daß dann als mechanischer Träger dient und vorzugsweise mit seiner wärmeabgebenden Fläche auf der Röhrenwandung oder einer gemeinsamen Wandung befestigt ist. Die wärmeabgebende Fläche des Kühlelements kann auch unmittelbar mit einer wärmeabführenden Fläche des Objekt, insbesondere einer Außenwand eines Satelliten verbindbar sein.The linearizer is mechanically preferably connected to the wall of the tube or the wall of a common housing of the tube arrangement essentially only via the cooling element, so that little or no solid-state heat transfer takes place from the wall to the linearizer. In an advantageous embodiment, the linearizer housing is fastened with a housing surface on the cooling surface of the cooling element, which then serves as a mechanical support and is preferably fastened with its heat-emitting surface on the tube wall or a common wall. The heat-emitting surface of the cooling element can also be connectable directly to a heat-dissipating surface of the object, in particular an outer wall of a satellite.
In einer anderen vorteilhaften Ausführungsform ist das Kühlelement zumindest mit seiner Kühlfläche innerhalb des Linearisierer-Gehäuses angeordnet und vorzugsweise direkt als Träger für die Linearisierer-Schaltungsanordnung mit gutem thermischem Kontakt zu dieser eingesetzt. Die wärmeabgebende Fläche des Kühlelements kann dann vorteilhafterweise mit einer Gehäusefläche des Linearisierer-Gehäuses und diese mit einer Wandung der Röhre oder einer gemeinsamen Wandung oder einer wärmeabführenden Fläche des Objekts thermisch gekoppelt sein.In another advantageous embodiment, the cooling element is arranged at least with its cooling surface within the linearizer housing and is preferably used directly as a carrier for the linearizer circuit arrangement with good thermal contact with the latter. The heat-emitting surface of the cooling element can then advantageously be thermally coupled to a housing surface of the linearizer housing and this to a wall of the tube or a common wall or a heat-dissipating surface of the object.
Der Linearisierer ist vorteilhafterweise in der Nähe des Strahlerzeugungssystems und/oder dem Singaleingang der Röhre und fern dem Kollektor der Röhre angeordnet, wodurch eine stärkere Wärmeeinstrahlung durch die hohe Kol-The linearizer is advantageously arranged in the vicinity of the beam generation system and / or the signal input of the tube and far from the collector of the tube, as a result of which greater heat radiation due to the high col
EHSATZBLATT (REGEL 26) lektortemperatur und lange Signalwege von Linearisierer zum Signaleingang vermieden werdenREAL DATE SHEET (RULE 26) sensor temperature and long signal paths from the linearizer to the signal input can be avoided
Die Erfindung ist nachfolgend anhand von bevorzugter Ausfuhrungsbeispiele unter Bezugnahme auf die Abbildungen noch eingehend veranschaulicht Dabei zeigtThe invention is illustrated in more detail below with the aid of preferred exemplary embodiments with reference to the figures
Fig 1 eine Lauffeldrohrenanordnung mit am Rohrengehause außen angeordnetem Linearisierer Fig 2 eine Rohrenanordnung mit in einem gemeinsamen Gehäuse angeordnetem Linearisierer1 shows a runway tube arrangement with a linearizer arranged on the outside of the tube housing. FIG. 2 shows a tube arrangement with a linearizer arranged in a common housing
Bei der in Fig 1 skizzierten Anordnung ist eine gebräuchliche Lauffeldohre LR, welche von einer stabilen Wandung umgeben ist, mit einer Wandungsflache auf einer warmeabfuhrenden Außenwandung AF eines Satelliten befestigt Die von der Lauffeldrohre über deren mit der Satellitenwand AF in Kontakt stehende Gehauseflache abgegebene Wärmeleistung wird in der Außenwand AF des Satelliten durch Festkorper-Warmeleitung auf eine größere Flache verteilt und pπmar durch Warmeabstrahlung R in den Weltraum abgegeben Die Lauf- feldrohre ist in typischer Weise aus einem Strahlerzeugungssystem ST, einer Verzögerungsleitung L und einem Kollektor C aufgebaut und weist einen Hoch- frequenz-Signaleingang E und einen Signalausgang SA durch die Gehausewandung W auf Der innere Aufbau von Lauffeldrohren ist bekannt und für die Erfindung im einzelnen unerheblichIn the arrangement sketched in FIG. 1, a common treadmill tube LR, which is surrounded by a stable wall, is fastened with a wall surface to a heat-dissipating outer wall AF of a satellite. The heat output given off by the treadmill tubes via their housing area in contact with the satellite wall AF is given in the outer wall AF of the satellite is distributed to a larger area by solid-state heat conduction and is released into space by heat radiation R. The tread tubes are typically constructed from a beam generation system ST, a delay line L and a collector C and have a high frequency Signal input E and a signal output SA through the housing wall W on The inner structure of tread tubes is known and irrelevant to the invention in detail
Auf einem Flachenteil der Wandung W der Laufzeitrohre LR in der Nahe des Strahlerzeugungssystems ST und des Signaleingangs SE ist ein Kuhlelement K in Form eines Peltier-Elements mit einer im Betrieb kälteren Kuhlflache KL und einer wärmeren leistungsabgebenden Flache KA befestigt Die BefestigungA cooling element K in the form of a Peltier element is fastened to a flat part of the wall W of the runtime tubes LR in the vicinity of the beam generation system ST and the signal input SE. The cooling surface KL, which is colder during operation, and a warmer, power-emitting surface KA, is fastened
EHSATZBLATT (REGEL 26) kann unmittelbar durch Kleben mit gut wärmeleitendem Kleber oder durch nicht im einzelnen eingezeichnete Befestigungsmittel erfolgen. Die wärmeabgebende Fläche steht in gutem thermischen Kontakt mit der Wandung W der Lauffeldröhre.REAL DATE SHEET (RULE 26) can be done directly by gluing with heat-conducting adhesive or by means of fasteners not shown in detail. The heat-emitting surface is in good thermal contact with the wall W of the running tube.
Auf der Kühlfläche KL des Kühlelements K ist das Gehäuse G eines Lineansierers befestigt, wobei wiederum die Befestigung mit einer guten thermischen Kopplung zwischen einer Gehäusefläche des Gehäuses G und der Kühlfläche KL vorliegt und die Befestigung über Kleber oder nicht eingezeichnete Befesti- gungsmittel erfolgen kann. Im inneren des Gehäuses G ist in Form einer als Platinenaufbau oder als einzelnder integrierter Schaltkreis vorliegende Schaltungsanordnung S der eigentliche Linearisierer angeordnet und durch das Gehäuse G gegen elektromagnetische Strahlung, insbesondere Streufelder der Lauffeldröhre LR abgeschirmt. Ein hochfrequentes Ansteuersignal kann dem Linearisierer über einen Eingangsanschluß E zugeführt werden. Das mit einem zum Phasengang der Lauffeldröhre komplementären vorverzerrenden Phasengang versehene hochfrequente Eingangssignal wird mit geringer Leitungslänge vom Linearisierer zur Röhre dem Signaleingang SE der Röhre zugeführt. Da primär die Kühlung der Schaltungsanordnung S durch die Kühlfläche KL des Kühlelements K von Bedeutung ist, steht die Schaltungsanordnung S in gutem thermischem Kontakt mit der gekühlten Fläche des Gehäuses G. Das Gehäuse G bewirkt zugleich eine Abschirmung der Schaltungsanordnung S gegen direkte Wärmeeinstrahlung von der auf hoher Temperatur befindlichen Wandung W der Lauffeldröhre.The housing G of a linearizer is fastened on the cooling surface KL of the cooling element K, the fastening in turn being present with a good thermal coupling between a housing surface of the housing G and the cooling surface KL, and the fastening can be carried out using adhesive or fastening means not shown. The actual linearizer is arranged in the interior of the housing G in the form of a circuit arrangement S present as a circuit board structure or as a single integrated circuit and is shielded by the housing G against electromagnetic radiation, in particular stray fields of the runway tube LR. A high-frequency control signal can be supplied to the linearizer via an input connection E. The high-frequency input signal provided with a predistorting phase response which is complementary to the phase response of the turret tube is fed to the signal input SE of the tube with a short line length from the linearizer to the tube. Since the cooling of the circuit arrangement S by the cooling surface KL of the cooling element K is of primary importance, the circuit arrangement S is in good thermal contact with the cooled surface of the housing G. The housing G also provides a shielding of the circuit arrangement S against direct heat radiation from the high temperature wall W of the runway tube.
Im Betrieb sei für die Temperatur der Wandung W der Lauffeldröhre an einem Referenzpunkt TP beispielsweise eine Temperatur von 100° C zulässig. Die nicht direkt mit der wärmeabführenden Wand AF des Satelliten in Kontakt stehenden Bereiche der Wandung W können auch höhere Temperaturen errei-In operation, for example, a temperature of 100 ° C. is permissible for the temperature of the wall W of the runway tube at a reference point TP. The areas of the wall W which are not in direct contact with the heat-dissipating wall AF of the satellite can also reach higher temperatures.
EHSATZBLATT (REGEL 26) chen. Das Kühlelement K, das insbesondere ein Peltier-Element ist, transportiert Wärmeleistung von der Schaltungsanordnung S über eine Fläche des Gehäuses G und die Kühlfläche KL zu der auf wesentlich höherer Temperatur liegenden wärmeabgebenden Fläche KH und überträgt die Wärmeleistung auf die Wandung W der Lauffeldröhre. Die Temperatur der Schaltungsanordnung sei durch das Kühlelement auf maximal 60° C beschränkt. Über einen Regelkreis, dessen Komponenten nicht eingezeichnet sind, und die insbesondere einen Temperatursensor auf oder in der Nähe von der Schaltungsanordnung S und eine Regeleinrichtung zur Steuerung des Stroms durch das Kühlelement K umfassen, kann die von dem Kühlelement K aufgenommene elektrische Leistung zur Einhaltung einer im wesentlichen konstanten Temperatur der Schaltungsanordnung S gesteuert werden.REAL DATE SHEET (RULE 26) chen. The cooling element K, which is in particular a Peltier element, transports heat output from the circuit arrangement S via a surface of the housing G and the cooling surface KL to the heat-emitting surface KH, which is at a substantially higher temperature, and transfers the heat output to the wall W of the running tube. The temperature of the circuit arrangement is limited to a maximum of 60 ° C. by the cooling element. Via a control circuit, the components of which are not shown, and which in particular comprise a temperature sensor on or in the vicinity of the circuit arrangement S and a control device for controlling the current through the cooling element K, the electrical power consumed by the cooling element K can be maintained in order to maintain an substantially constant temperature of the circuit arrangement S can be controlled.
Die in Fig. 2 skizzierte Anordnung unterscheidet sich von der Anordnung nach Fig. 1 im wesentlichen dadurch, daß der Linearisierer mit dem vollständigen abschirmenden Gehäuse G innerhalb eines gemeinsamen Gehäuses der Lauffeldröhrenanordnung, dessen Wandung wiederum mit W bezeichnet ist, angeordnet ist. Der Eingangsanschluß E zur der Linearisierer- Schaltungsanordnung führt durch die gemeinsame Wandung W hindurch. Die Verbindung zwischen Linearisierer und Signaleingang der Lauffeldröhre erfolgt innerhalb der gemeinsamen Wandung W beispielsweise durch einen Hohlleiterabschnitt H. Innerhalb der gemeinsamen Wandung sind vorzugsweise die Lauffeldröhre durch eine Streufelder reduzierende und direkte Wärmestrahlung abblockende Trennwand T voneinander getrennt. Der Linearisierer ist bei dem beim Strahlungserzeugungssystem ST liegenden Ende des langgestreckten Aufbaus der Lauffeldröhre angeordnet.The arrangement sketched in FIG. 2 differs from the arrangement according to FIG. 1 essentially in that the linearizer with the complete shielding housing G is arranged within a common housing of the turret tube arrangement, the wall of which is again designated W. The input connection E to the linearizer circuit arrangement leads through the common wall W. The connection between the linearizer and the signal input of the runner tube is made within the common wall W, for example by a waveguide section H. Within the common wall, the runner tubes are preferably separated from one another by a partition wall T which reduces stray fields and blocks direct heat radiation. The linearizer is arranged at the end of the elongated structure of the turret tube which is located in the radiation generation system ST.
Das Kühlelement K ist in dem in Fig. 2 skizzierten Beispiel innerhalb des Linearisierer-Gehäuses G angeordnet. Die Schaltungsanordnung S ist vorzugsweise mit guter thermischer Kopplung auf der Kühlfläche KL des dabei als Träger dienenden Kühlelements K befestigt, beispielsweise über eine thermisch gut leitende Haftschicht. Die wärmeabgebende Fläche KH des Kühlelements K liegt an einer Fläche des Linearisierer-Gehäuses G an, welches seinerseits wieder- um an der Innenseite der Wandung W anliegt. Zwischen wärmeabgebender Fläche KH des Kühlelements K, dem anliegenden Gehäuseabschnitt des Line- arisierergehäuses G, der gemeinsamen Wandung W und der wärmeabführenden Wand AF des Satelliten bestehe wieder eine gute thermische Kopplung. Für den Betrieb der Anordnung und insbesondere des Kühlelements K gelten die zu Fig. 1 gemachten Überlegungen in entsprechender weise.In the example outlined in FIG. 2, the cooling element K is arranged inside the linearizer housing G. The circuit arrangement S is preferred attached with good thermal coupling to the cooling surface KL of the cooling element K serving as a carrier, for example via a thermally highly conductive adhesive layer. The heat-emitting surface KH of the cooling element K bears against a surface of the linearizer housing G, which in turn bears against the inside of the wall W. A good thermal coupling again exists between the heat-emitting surface KH of the cooling element K, the adjacent housing section of the linearizer housing G, the common wall W and the heat-dissipating wall AF of the satellite. The considerations made in relation to FIG. 1 apply in a corresponding manner to the operation of the arrangement and in particular of the cooling element K.
Neben den skizzierten Anordnungen nach Fig. 1 und Fig. 2 sind noch verschiedene Variationen, die Einzelheiten dieser Anordnungen auf andere Weise verknüpfen, denkbar. Insbesondere kann eine Anordnung mit innerhalb des Linearisierer-Gehäuses G liegendem Kühlelement von außen an der Wand einer Laufzeitröhre befestigt sein, oder das Kühlelement kann zwischen einer Innenfläche einer gemeinsamen Wandung W und einem innerhalb der gemeinsamen Wandung liegenden Linearisierer-Gehäuse G angeordnet sein. Die Positionen für die Anordnung des Linearisierer-Gehäuses G und des Kühlelements K sind in den beschriebenen Ausführungsformen lediglich als beispielhaft zu betrachten. Die gegebenen skizzierten Beispiele sind primär nach dem Gesichtspunkt der Anschaulichkeit der Figuren gestaltet. Das Linearisierer-Gehäuse kann insbesondere auch an einer Seitenfläche oder Endfläche der Wandung W befestigt sein.In addition to the arrangements outlined in FIGS. 1 and 2, various variations which link the details of these arrangements in a different way are also conceivable. In particular, an arrangement with a cooling element located within the linearizer housing G can be fastened from the outside to the wall of a runtime tube, or the cooling element can be arranged between an inner surface of a common wall W and a linearizer housing G lying within the common wall. The positions for the arrangement of the linearizer housing G and the cooling element K in the described embodiments are only to be regarded as examples. The given sketched examples are primarily based on the clarity of the figures. The linearizer housing can in particular also be attached to a side surface or end surface of the wall W.
Die Erfindung ist nicht auf die beschriebenen bevorzugten Ausführungsbeispiele beschränkt, sondern im Rahmen fachmännischen Könnens in mancherlei Weise abwandelbar. Insbesondere kann ein Peltier-Element insgesamt zur Temperaturstabilisierung gegenüber höheren und tieferen Temperaturen die- nen und somit die bauliche Vereinigung temperaturempfindlicher Komponenten mit anderen Komponenten mit unterschiedlichen zulässigen Betriebstemperaturen in einer Röhrenanordnung ermöglichen. The invention is not limited to the preferred exemplary embodiments described, but rather can be modified in many ways within the scope of expert knowledge. In particular, a Peltier element as a whole can stabilize the temperature in relation to higher and lower temperatures. NEN and thus enable the structural union of temperature-sensitive components with other components with different permissible operating temperatures in a tube arrangement.

Claims

Patentansprüche claims
1 . Lauffeldröhrenanordnung mit einer Lauffeldröhre und einer Linearisierungs- 5 Schaltungsanordnung zur Kompensation eines Phasengangs der Lauffeldröhre, dadurch gekennzeichnet, daß die Linearisierungs- Schaltungsanordnung und die Lauffeldröhre eine bauliche Einheit bilden und dabei die Linearisierungs-Schaltungsanordnung durch ein aktives Kühlelement auf gegenüber der Wandung der Lauffeldröhre niedrigerer Temperatur1 . Running tube arrangement with a running tube and a linearization 5 circuit arrangement for compensating a phase response of the running tube, characterized in that the linearizing circuit arrangement and the running tube form a structural unit and thereby the linearizing circuit arrangement by means of an active cooling element on a lower temperature than the wall of the running tube
I O gehalten werden kann.I O can be kept.
2. Anordnung nach Anspruch 1 , dadurch gekennzeichnet, daß die Schaltungsanordnung in einem elektromagnetisch abgeschirmten Gehäuse untergebracht ist.2. Arrangement according to claim 1, characterized in that the circuit arrangement is housed in an electromagnetically shielded housing.
I 5I 5
3. Anordnung nach Anspruch 2, dadurch gekennzeichnet, daß durch das Kühlelement eine Außenfläche des Gehäuses kühlbar ist.3. Arrangement according to claim 2, characterized in that an outer surface of the housing can be cooled by the cooling element.
4. Anordnung nach Anspruch 2, dadurch gekennzeichnet, daß das Kühlele- 0 ment im inneren des Gehäuses angeordnet ist.4. Arrangement according to claim 2, characterized in that the cooling element is arranged in the interior of the housing.
5. Anordnung nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß die Lineahsierungs-Schaltungsanordnung in der Nähe des Strahlerzeugungssystems der Lauffeldröhre angeordnet ist. 55. Arrangement according to one of claims 1 to 4, characterized in that the linearization circuit arrangement is arranged in the vicinity of the beam generating system of the turret tube. 5
6. Anordnung nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß das Kühlelement die von der Linearisierungs-Schaltungsanordnung abgeführte Wärmeleistung an die Wandung der Lauffeldröhre oder eine gegebenenfalls gemeinsame Wandung der Lauffeldröhrenanordnung abgibt.6. Arrangement according to one of claims 1 to 5, characterized in that the cooling element emits the thermal power dissipated by the linearization circuit arrangement to the wall of the running tube or a possibly common wall of the running tube arrangement.
EHSATZBLATT (REGEL 26) REAL DATE SHEET (RULE 26)
7. Anordnung nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, daß die Kühlleistung des Kühlelements steuerbar ist.7. Arrangement according to one of claims 1 to 6, characterized in that the cooling capacity of the cooling element is controllable.
8. Anordnung nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, daß das Kühlelement die Temperatur der Schaltungsanordnung unter 60° C hält.8. Arrangement according to one of claims 1 to 7, characterized in that the cooling element keeps the temperature of the circuit arrangement below 60 ° C.
9. Anordnung nach einem der Ansprüche 1 bis 8, gekennzeichnet durch ein Peltier-Element als Kühlelement. 9. Arrangement according to one of claims 1 to 8, characterized by a Peltier element as a cooling element.
EP99938168A 1999-06-11 1999-06-11 Travelling wave tube configuration Expired - Lifetime EP1105907B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DE1999/001707 WO2000077818A1 (en) 1999-06-11 1999-06-11 Travelling wave tube configuration

Publications (2)

Publication Number Publication Date
EP1105907A1 true EP1105907A1 (en) 2001-06-13
EP1105907B1 EP1105907B1 (en) 2004-09-08

Family

ID=6918833

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99938168A Expired - Lifetime EP1105907B1 (en) 1999-06-11 1999-06-11 Travelling wave tube configuration

Country Status (4)

Country Link
EP (1) EP1105907B1 (en)
JP (1) JP2002533889A (en)
DE (1) DE59910467D1 (en)
WO (1) WO2000077818A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6937696B1 (en) 1998-10-23 2005-08-30 Varian Medical Systems Technologies, Inc. Method and system for predictive physiological gating
US7620444B2 (en) 2002-10-05 2009-11-17 General Electric Company Systems and methods for improving usability of images for medical applications
US6991604B2 (en) * 2003-09-04 2006-01-31 Scope Co, Inc. Dual blade laryngoscope with esophageal obturator
US8571639B2 (en) * 2003-09-05 2013-10-29 Varian Medical Systems, Inc. Systems and methods for gating medical procedures
US10667727B2 (en) 2008-09-05 2020-06-02 Varian Medical Systems, Inc. Systems and methods for determining a state of a patient

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4130495C2 (en) * 1991-09-13 1995-09-21 Ant Nachrichtentech Arrangement for the compensation of modulation disturbances
FR2700888B1 (en) * 1993-01-26 1995-04-07 Matra Marconi Space France Traveling wave tube cooling device mounted in a satellite and geostationary satellite with application.
JP3336717B2 (en) * 1994-02-09 2002-10-21 松下電器産業株式会社 Power integrated magnetron device
JP3269904B2 (en) * 1994-03-01 2002-04-02 オリジン電気株式会社 Power supply for traveling wave tube

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0077818A1 *

Also Published As

Publication number Publication date
DE59910467D1 (en) 2004-10-14
EP1105907B1 (en) 2004-09-08
WO2000077818A1 (en) 2000-12-21
JP2002533889A (en) 2002-10-08

Similar Documents

Publication Publication Date Title
ES2402070T3 (en) Pre-distortion linearization device with adjustable amplitude and curve
DE60303727T2 (en) Radio receiver with high sensitivity
DE19818144C1 (en) Progressive field tube arrangement for high power microwave amplifiers, especially in satellites, has linearizing circuit/tube unit with circuit held at lower temperature than tube wall by active cooling
WO2000077818A1 (en) Travelling wave tube configuration
Brown et al. 7kW GaN W-band transmitter
DE602004011969T2 (en) SELECTIVE LAYER MILLIMETER WAVE SURFACE MOUNTING SYSTEM AND METHOD
DE2933088A1 (en) RULE-FREE HEAT EXHAUST AND TEMPERATURE STABILIZATION SYSTEM
Katz et al. High-efficiency high-power linearized L-band SSPA for navigational satellites
JP2008034166A (en) Microwave generation device
EP1023749A1 (en) Semiconductor laser chip
DE102018009310B4 (en) Method of cooling a device with an electronic system
Abrams et al. Introduction to the MPM: what it is and where it might fit
Smith et al. An Adaptable GaN Power Amplifier for S-Band Radar
EP2306092A2 (en) Cooking device with a component that heats up during operation and method for cooling such a component
CH377941A (en) Arrangement for discharge cooling of a thermally heavily loaded electrode of an electron tube in a high-frequency device
DE102018128659A1 (en) High-frequency module with connection interface
DE19515704A1 (en) Cooled diode pumped solid state laser appts.
EP0496008B1 (en) Controllable high-power electron tube
AT210024B (en) Arrangement for discharge cooling of a thermally heavily loaded electrode of electron tubes
DE1439357A1 (en) High frequency arrangement with laser diode
Yingst et al. High-power gridded tubes—1972
DE102014018821B4 (en) diode laser attachment
DE19743817C1 (en) High temperature electrical cable cooling arrangement
DE2014159A1 (en) High-voltage circuit arrangement and a resistor which can be used therein, including a method for producing such a resistor
Kobayashi et al. Experimental study of a single tube high RF power amplifier for ICRF heating system

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE FR GB IT

17P Request for examination filed

Effective date: 20010621

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: THALES ELECTRON DEVICES GMBH

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR GB IT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED.

Effective date: 20040908

Ref country code: GB

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20040908

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20040908

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REF Corresponds to:

Ref document number: 59910467

Country of ref document: DE

Date of ref document: 20041014

Kind code of ref document: P

GBV Gb: ep patent (uk) treated as always having been void in accordance with gb section 77(7)/1977 [no translation filed]

Effective date: 20040908

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20050609

EN Fr: translation not filed
PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060103