EP1052726B1 - Procédé de fabrication d'une antenne à guide d'onde micro-usiné à couplage à fente - Google Patents

Procédé de fabrication d'une antenne à guide d'onde micro-usiné à couplage à fente Download PDF

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Publication number
EP1052726B1
EP1052726B1 EP20000870097 EP00870097A EP1052726B1 EP 1052726 B1 EP1052726 B1 EP 1052726B1 EP 20000870097 EP20000870097 EP 20000870097 EP 00870097 A EP00870097 A EP 00870097A EP 1052726 B1 EP1052726 B1 EP 1052726B1
Authority
EP
European Patent Office
Prior art keywords
antenna
substrate
cavity
layer
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP20000870097
Other languages
German (de)
English (en)
Other versions
EP1052726A1 (fr
Inventor
Hocine Ziad
Ezzeldin Soliman
Guy Vandenbosch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interuniversitair Microelektronica Centrum vzw IMEC
Original Assignee
Katholieke Universiteit Leuven
Interuniversitair Microelektronica Centrum vzw IMEC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP99870129A external-priority patent/EP1063723A1/fr
Application filed by Katholieke Universiteit Leuven, Interuniversitair Microelektronica Centrum vzw IMEC filed Critical Katholieke Universiteit Leuven
Priority to EP20000870097 priority Critical patent/EP1052726B1/fr
Publication of EP1052726A1 publication Critical patent/EP1052726A1/fr
Application granted granted Critical
Publication of EP1052726B1 publication Critical patent/EP1052726B1/fr
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/06—Waveguide mouths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H01Q13/18—Resonant slot antennas the slot being backed by, or formed in boundary wall of, a resonant cavity ; Open cavity antennas

Definitions

  • the present invention relates to a method for manufacturing slot-coupled micromachined waveguide antenna.
  • Microwave antennas are usually to emit radiation in a medium such as air, ..., with a sufficient precision of directivity and are to be sufficiently small.
  • State of the art millimetre wave antennas are, thanks to the antennas scaling laws, inherently small enough for being arrangeable in highly directive arrays. The larger the number of radiating elements in the array, the more directive the antenna can be. If the directivity of one element is already high, the number of elements required for reaching a target directivity will be smaller, and therefore the antenna itself can be smaller.
  • the state of the art directive antennas in the millimetre wave range are planar antennas, with patch antennas being the most widely used.
  • planar antennas are very attractive for use within compact communication systems, (telecommunication, WLAN) owing to their simple integration with driving electronics and microwave circuits. However, they suffer from two serious disadvantages which are the limited bandwidth and the substrate losses.
  • Millimetre wave antennas furthermore find applications within the automotive market as a FLAR (Forward Looking Automobile Radar) or as automobile sensors.
  • FLAR Forward Looking Automobile Radar
  • millimetre wave portion of the spectrum is used for at least two important applications requiring small and directive antennas:
  • Automotive applications are considered one of the two most important applications [ H.H. Gol, "Commercial Applications of Millimetre Waves. History, Present Status, and Future Trends", IEEE Transactions on Microwave Theory and Techniques. Vol.43. Nr 7, July 1995, pp 1639-1653 .] in the millimetre wave communication range, the second being the short haul transmission links for PCN installations.
  • a FLAR is a radar used for measuring the relative velocity between two vehicles in a lane, and the distance between these vehicles, in order to issue warnings to the vehicle drivers.
  • the FLAR consists of different parts:
  • the FLARs are to be designed for operation at different frequencies, depending on the geographic area:
  • Radar systems for the automobile have been studied for more than 20 years by major car companies in collaboration with RF companies and chips manufacturers.
  • An antenna for an Automobile anticollision radar (77 GHz) system needs to fulfil the requirements of scanning the road ahead.
  • radar techniques are used requiring antennas which are:
  • the radar size can be reduced by the following measures
  • An aim of the present invention is to provide a method for manufacturing a slot-coupled micromachined waveguide antenna for millimetre wave communication device applications.
  • These antennas are millimetre wave antennas emitting radiation, having high directivity and high efficiency.
  • the antennas can be used for instance for telecommunications and for automotive radars.
  • the present invention relates to a method according to claim 1.
  • This method can further comprise the step of filling said cavity with a polymer, preferably BCB, the substrate being an MCM-D wafer.
  • the substrate can comprise Si and the first insulating layer can comprise a Si-oxide layer and a polymer layer, said polymer preferably comprising BCB.
  • Figures 1a to 1d are representing two distinct embodiments of the cavity of the antenna. Parameter values are given in Table 1 and Table 2.
  • Figure 2a to 2f illustrate a method of fabricating the device according to the present invention.
  • Figure 3 shows a radar device
  • Preferred embodiments of the present invention which are millimetre wave antenna micromachined on an MCM-D silicon platform are described hereunder. It is designed for radiating above 20 GHz.
  • the radiating aperture of this antenna is a micromachined waveguide.
  • the aperture is etched in the bulk of the silicon substrate.
  • the cross section of the micromachined waveguide can take a rectangular ( Figs. 1a and 1b ) or a circular ( Figs. 1c and 1d ) cross section or a cross section of any geometry.
  • the cavity may be filled with a low loss dielectric, material such as a polymer material (BCB), to shrink the antenna dimensions.
  • BCB polymer material
  • the proposed antenna's are fed by a coplanar waveguide (CPW) realised on the side of the substrate of the antenna facing the MCM-D substrate but separated therefrom by a dielectric material.
  • CPW coplanar waveguide
  • the electromagnetic coupling from the feeding CPW to the antenna is achieved through a slot etched in the metal base of the aperture waveguide.
  • the coupling slot has the same shape as the waveguide cross section.
  • Figs. 1a and 1b show a rectangular opening (slot) (37a) in the base of a micromachined rectangular waveguide (33a) while Figs. 1c et 1b show a circular opening (slot) (37b) in the base of a micromachined circular waveguide (33b).
  • the feeding CPW (23) are also shown on these Figures.
  • Several radiating ends of the feeding CPW are used, such as open, short, capacitive, and inductive ends.
  • the frequency of the signal radiated by the antenna is the frequency of the signal propagating in the CPW waveguide, and fed to the antenna by electromagnetic coupling through the slot.
  • the radiated wavelength is basically not set by the waveguide dimensions.
  • the waveguide dimensions actually define the cut-off frequency of the respective modes which could be excited by a fed signal of given frequency.
  • a cylindrical aperture antenna is described on Fig. 1c .
  • the walls of the cylinder are sputter coated with TiW/Au.
  • An opening is made in this metal in the bottom of the cylinder, in order to feed (excite) the antenna located on chip's backside through a microstrip tine leaving the oscillator, and located on the frontside of the substrate.
  • the hole is either
  • a rectangular aperture antenna can be manufactured similarly.
  • the process of fabrication of an antenna according to the present invention starts with a double side polished low resistivity silicon wafer (antenna substrate) (31), wherein the following steps are performed:

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Waveguide Aerials (AREA)
  • Radar Systems Or Details Thereof (AREA)

Claims (3)

  1. Procédé de fabrication d'une antenne de guide d'ondes à microsystème par couplage à fentes pour émettre et/ou recevoir un signal dans la grandeur d'ondes du millimètre, caractérisé en ce que le procédé comprend les étapes suivantes :
    a) déposer une première couche isolante (21, 26) sur un premier côté d'un substrat plan (31) ayant deux côtés opposés et une épaisseur, ladite première couche isolante ayant une fonctionnalité de blocage de gravure ;
    b) déposer une première couche métallique (25) sur ladite première couche isolante (21) ;
    c) graver une cavité (27) ayant des dimensions prédéterminées dans ledit substrat (31) sur ledit deuxième côté de celui-ci, dans laquelle la gravure s'arrête dès que l'interface entre le substrat (31) et la couche isolante (21, 26) est atteinte, de telle sorte que la profondeur de la cavité (27) correspond à l'épaisseur du substrat (31) ;
    d) déposer une deuxième couche métallique (33) qui recouvre ledit deuxième côté dudit substrat (31) y compris la cavité (27); et
    e) enlever une partie de ladite deuxième couche métallique située au fond de ladite cavité afin de créer une ouverture (37) dans ladite deuxième couche métallique (33) située au fond de ladite cavité, la première couche métallique (25) se superposant à ladite ouverture (37), définissant ainsi un couplage à fentes.
  2. Procédé selon la revendication 1, comprenant en outre l'étape supplémentaire consistant à remplir ladite cavité avec un matériau polymère (41), de préférence un diélectrique comprenant du BCB (benzocyclobutène).
  3. Procédé selon la revendication 1 ou 2, caractérisé en ce que le substrat comprend du Si et la première couche isolante comprend une couche d'oxyde de Si (26) et une couche de polymère (21), ladite couche de polymère comprenant de préférence du BCB (benzocyclobutène).
EP20000870097 1999-05-05 2000-05-05 Procédé de fabrication d'une antenne à guide d'onde micro-usiné à couplage à fente Expired - Lifetime EP1052726B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP20000870097 EP1052726B1 (fr) 1999-05-05 2000-05-05 Procédé de fabrication d'une antenne à guide d'onde micro-usiné à couplage à fente

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP99870096 1999-05-05
EP99870096 1999-05-05
EP99870129A EP1063723A1 (fr) 1999-06-22 1999-06-22 Antenne à guide d'onde micro-usiné à couplage à fente
EP99870129 1999-06-22
EP20000870097 EP1052726B1 (fr) 1999-05-05 2000-05-05 Procédé de fabrication d'une antenne à guide d'onde micro-usiné à couplage à fente

Publications (2)

Publication Number Publication Date
EP1052726A1 EP1052726A1 (fr) 2000-11-15
EP1052726B1 true EP1052726B1 (fr) 2008-02-20

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EP20000870097 Expired - Lifetime EP1052726B1 (fr) 1999-05-05 2000-05-05 Procédé de fabrication d'une antenne à guide d'onde micro-usiné à couplage à fente

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EP (1) EP1052726B1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110401022A (zh) * 2019-08-02 2019-11-01 电子科技大学 基于mems工艺的毫米波高增益缝隙阵列天线

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1784063A1 (fr) * 2005-11-08 2007-05-09 Alcatel Lucent Carte de circuit avec composants électroniques montés et méthode de fabrication d'une telle carte de circuit
US9496593B2 (en) 2011-02-21 2016-11-15 Siklu Communication ltd. Enhancing operation of laminate waveguide structures using an electrically conductive fence
US9270005B2 (en) 2011-02-21 2016-02-23 Siklu Communication ltd. Laminate structures having a hole surrounding a probe for propagating millimeter waves

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4208058C2 (de) * 1992-03-13 1998-02-26 Daimler Benz Aerospace Ag Hohlleiter/Mikrostreifenleitungs-Übergang
FR2700066A1 (fr) * 1992-12-29 1994-07-01 Philips Electronique Lab Dispositif hyperfréquences comprenant au moins une transition entre une ligne de transmission intégrée sur un substrat et un guide d'onde.
US5724049A (en) * 1994-05-23 1998-03-03 Hughes Electronics End launched microstrip or stripline to waveguide transition with cavity backed slot fed by offset microstrip line usable in a missile
FI98105C (fi) * 1995-03-06 1997-04-10 Valtion Teknillinen Mikroliuska-aaltoputkisiirtymä
US6404402B1 (en) * 1997-03-25 2002-06-11 University Of Virginia Patent Foundation Preferential crystal etching technique for the fabrication of millimeter and submillimeter wavelength horn antennas
JPH11251829A (ja) * 1998-02-27 1999-09-17 Kyocera Corp スロットアンテナ及びそれを具備する配線基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110401022A (zh) * 2019-08-02 2019-11-01 电子科技大学 基于mems工艺的毫米波高增益缝隙阵列天线

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