EP1039977A4 - A method for removing surface contaminants on moulds used in semiconductor packaging tools - Google Patents

A method for removing surface contaminants on moulds used in semiconductor packaging tools

Info

Publication number
EP1039977A4
EP1039977A4 EP98936795A EP98936795A EP1039977A4 EP 1039977 A4 EP1039977 A4 EP 1039977A4 EP 98936795 A EP98936795 A EP 98936795A EP 98936795 A EP98936795 A EP 98936795A EP 1039977 A4 EP1039977 A4 EP 1039977A4
Authority
EP
European Patent Office
Prior art keywords
semiconductor packaging
removing surface
surface contaminants
moulds used
packaging tools
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98936795A
Other languages
German (de)
French (fr)
Other versions
EP1039977A1 (en
Inventor
Wendong Song
Yongfeng Lu
Qiong Chen
Huck Wee Tay
Teik Hing Thomas Hwa
Lui Ching Dawn Lim
Jason Yan Koon Ngin
Jason Yak Hui Sim
Cheng Pak Gow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Data Storage Institute
Advanced Systems Automation Ltd Singapore
Original Assignee
Data Storage Institute
Advanced Systems Automation Ltd Singapore
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Data Storage Institute, Advanced Systems Automation Ltd Singapore filed Critical Data Storage Institute
Publication of EP1039977A1 publication Critical patent/EP1039977A1/en
Publication of EP1039977A4 publication Critical patent/EP1039977A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Cleaning In General (AREA)
  • Laser Beam Processing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
EP98936795A 1997-12-18 1998-07-06 A method for removing surface contaminants on moulds used in semiconductor packaging tools Withdrawn EP1039977A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SG9704544 1997-12-18
SG1997004544A SG78282A1 (en) 1997-12-18 1997-12-18 A method for removing surface contaminants on moulds used in semiconductor packaging tools
PCT/SG1998/000058 WO1999030845A1 (en) 1997-12-18 1998-07-06 A method for removing surface contaminants on moulds used in semiconductor packaging tools

Publications (2)

Publication Number Publication Date
EP1039977A1 EP1039977A1 (en) 2000-10-04
EP1039977A4 true EP1039977A4 (en) 2003-08-13

Family

ID=20429813

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98936795A Withdrawn EP1039977A4 (en) 1997-12-18 1998-07-06 A method for removing surface contaminants on moulds used in semiconductor packaging tools

Country Status (7)

Country Link
EP (1) EP1039977A4 (en)
JP (1) JP2002508249A (en)
CN (1) CN1210113C (en)
MY (1) MY136708A (en)
SG (1) SG78282A1 (en)
TW (1) TW480689B (en)
WO (1) WO1999030845A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4630442B2 (en) * 2000-10-19 2011-02-09 Ｔｏｗａ株式会社 Resin molding apparatus and resin molding method
JP3789349B2 (en) * 2001-11-16 2006-06-21 Ｔｏｗａ株式会社 Method and apparatus for cleaning mold for resin molding
TW552188B (en) * 2001-11-16 2003-09-11 Towa Corp Apparatus and method for evaluating degree of adhesion of adherents to mold surface, apparatus and method for surface treatment of mold surface and method and apparatus for cleaning mold used for molding resin
JP2004230750A (en) * 2003-01-31 2004-08-19 Sumitomo Heavy Ind Ltd Mold cleaning method and device
KR100626037B1 (en) 2004-11-18 2006-09-20 삼성에스디아이 주식회사 Method of descaling mask
JP2006317726A (en) * 2005-05-13 2006-11-24 Nec Lcd Technologies Ltd Method for correcting disconnection, method for manufacturing active matrix substrate, and display apparatus
JP5314876B2 (en) * 2006-11-22 2013-10-16 アピックヤマダ株式会社 Resin molding apparatus and resin molding method
CN104043617A (en) * 2014-05-19 2014-09-17 南京南车浦镇城轨车辆有限责任公司 Laser cleaning equipment for oil stain on metallic surface
BR112018075413A2 (en) 2016-09-26 2019-04-09 Saint-Gobain Glass France device and method for producing and method for producing a stamped functional coating for a glass layer
GB201701607D0 (en) * 2017-01-31 2017-03-15 Advanced Laser Tech Ltd Scanning and cleaning of moulds
CN107377532A (en) * 2017-08-25 2017-11-24 济南高能清扬激光清洗有限公司 A kind of compound cleaning method of rubber mould
CN108816960B (en) * 2018-06-14 2020-06-26 爱阔特(上海)清洗设备制造有限公司 Semiconductor photoetching plate cleaning device
CN108807129B (en) * 2018-06-21 2020-09-01 北京蜃景光电科技有限公司 Coating chamber cleaning device and coating chamber cleaning method
CN108787631A (en) * 2018-07-09 2018-11-13 江苏峰钛激光科技有限公司 A kind of laser cleaning method of heavy corrosion layer
JP2020006600A (en) * 2018-07-10 2020-01-16 Ｔｏｗａ株式会社 Mold cleaning device and method, resin molding apparatus, and manufacturing method of resin molded article
JP6930946B2 (en) * 2018-07-10 2021-09-01 Ｔｏｗａ株式会社 Mold cleaning equipment, mold cleaning method, resin molding equipment, and resin molded product manufacturing method
CN111375603A (en) * 2018-12-29 2020-07-07 膳魔师（江苏）家庭制品有限公司 Paint removing method and device for vacuum cup
CN110303009B (en) * 2019-06-26 2020-10-16 深圳市华星光电技术有限公司 Ultraviolet light cleaning device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0233755A2 (en) * 1986-02-14 1987-08-26 Amoco Corporation Ultraviolet laser treating of molded surfaces
JPH01122417A (en) * 1987-11-06 1989-05-15 Rohm Co Ltd Cleaning method for mold for synthetic resin molding

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD242760A1 (en) * 1985-11-19 1987-02-11 Akad Wissenschaften Ddr METHOD FOR TESTING THE PURITY OF SUBSTRATE SURFACES AND CLEANING THE SAME
DE3721940A1 (en) * 1987-07-02 1989-01-12 Ibm Deutschland REMOVAL OF PARTICLES FROM SURFACES OF SOLID BODY BY LASER Bombardment
US5023424A (en) * 1990-01-22 1991-06-11 Tencor Instruments Shock wave particle removal method and apparatus
US5373140A (en) * 1993-03-16 1994-12-13 Vernay Laboratories, Inc. System for cleaning molding equipment using a laser
IT1282722B1 (en) * 1996-03-01 1998-03-31 Pirelli METHOD AND APPARATUS FOR THE CLEANING OF VULCANIZATION MOLDS OF ELASTOMERIC MATERIAL ARTICLES

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0233755A2 (en) * 1986-02-14 1987-08-26 Amoco Corporation Ultraviolet laser treating of molded surfaces
JPH01122417A (en) * 1987-11-06 1989-05-15 Rohm Co Ltd Cleaning method for mold for synthetic resin molding

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch Week 198925, Derwent World Patents Index; Class A32, AN 1989-183271 [25], XP002244738 *
PATENT ABSTRACTS OF JAPAN vol. 013, no. 365 (M - 859) 15 August 1989 (1989-08-15) *
See also references of WO9930845A1 *

Also Published As

Publication number Publication date
JP2002508249A (en) 2002-03-19
WO1999030845A1 (en) 1999-06-24
MY136708A (en) 2008-11-28
CN1210113C (en) 2005-07-13
EP1039977A1 (en) 2000-10-04
CN1282277A (en) 2001-01-31
SG78282A1 (en) 2001-02-20
TW480689B (en) 2002-03-21

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Legal Events

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18W Application withdrawn

Effective date: 20030618