EP1030320A1 - Split geometry inductor - Google Patents
Split geometry inductor Download PDFInfo
- Publication number
- EP1030320A1 EP1030320A1 EP00301135A EP00301135A EP1030320A1 EP 1030320 A1 EP1030320 A1 EP 1030320A1 EP 00301135 A EP00301135 A EP 00301135A EP 00301135 A EP00301135 A EP 00301135A EP 1030320 A1 EP1030320 A1 EP 1030320A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- inductor
- spiral
- substrate
- distal end
- inductance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000010409 thin film Substances 0.000 claims abstract description 16
- 230000001939 inductive effect Effects 0.000 abstract description 38
- 239000004020 conductor Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000001627 detrimental effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- -1 quarts Inorganic materials 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0046—Printed inductances with a conductive path having a bridge
Definitions
- the present invention relates to electronic components, and in particular to an inductor having two oppositely wound thin-film spirals that are physically, and magnetically, coupled to each other.
- Hybrid technology provides the means for assembling most major categories of electronic components in relatively small enclosures to satisfy system size requirements that cannot be met by more conventional packaging techniques.
- Analog and digital circuits as well as microwave modules are typically made in hybrid form.
- Such circuits usually consist of an insulating substrate with deposited networks, generally conductors and resistors, to which semiconductor devices, integrated circuits, and passive elements are attached in chip form.
- thick- and thin-film networks involve the deposition of passive circuit elements in a predetermined geometric pattern on the surface of the insulating substrate.
- Deposited thin-films can be made with precision and stability for the diverse requirements of linear circuits and can be fabricated with finer lines than thick films.
- an inductor 1 was typically fabricated by printing or defining conductor patterns of an appropriate spiral design 2 directly onto the top of a substrate 3.
- the distal end 4 of the spiral design 2 was connected, via a lead 5, to another conductive path 6 on the top of the substrate 3.
- such an inductor requires extensive substrate area to achieve high inductance values since its inductance is directly proportional to the overall size of the spiral design and the number of turns. Accordingly, the use of these inductors were avoided.
- EMI ElectroMagnetic Interference
- reducing EMI (ElectroMagnetic Interference) in transducers supports the fabrication of monolithic inductors.
- a low pass filter can be fabricated which works up to high frequencies ( ⁇ 6 Ghz or greater).
- the inductor provides a relatively high inductance value while utilizing little substrate area.
- the inductor of the present invention includes first and second thin-film spiral inductive portions with a planar substrate positioned therebetween.
- the first spiral inductive portion is wound in a clockwise direction, for example, and has a distal end.
- the second spiral inductive portion is wound in a counterclockwise direction (opposite that of the first) and has a distal end connected to the distal end of the first inductive portion.
- Both spiral inductive portions have magnetic lines of force that are linked together to provide a significant mutual inductance.
- a split geometry inductor 10 having square spiral inductive portions 12 and 14 deposited on opposite sides 16 and 18, respectively, of a substrate 20.
- the inductive portions 12 and 14 are defined by placing conductor patterns 22 and 24, respectively, on the substrate 20 by using thin-film technology.
- conductive material is deposited in a vacuum by electro-beam evaporation or, alternatively, sputtering.
- the film can consist of, for example, gold, nickel-chromium, or aluminum.
- the inductive spiral portions 12,14 on each side of the substrate 20 can have many shapes besides the square spirals depicted in FIGURES 2 and 3.
- the inductive spirals 112 and 114 can have a continuously arcuate shape that recedes from a center point similar to a clock spring.
- a continuous trace 26 is organized into a plurality of integrally connected linear segments 28 that extend perpendicularly from at least one other linear segment. Accordingly, a plurality of the linear segments 28 that form each square spiral inductive portion 12,14 are in spaced parallel relationship to each other.
- Each inductive spiral portion 12 and 14 has a proximal end 30 and 32, respectively, with the proximal ends connected to other circuitry (not shown), or ground, via conductive leads 34,36 mounted on side 16 of the substrate 20.
- lead 34 is integrally connected to the proximal end 30 of inductive spiral portion 12.
- the proximal end 32 of inductive spiral 14 is conductively coupled to lead 36 via an integrally connected lead 38 passing through an aperture 40 in the substrate 20.
- the material forming lead 38 consists of the same material forming the inductive portions 12,14 on each side of the substrate 20 or, alternatively, another type of conductive material.
- each inductive spiral portion 12 and 14 also includes a distal end 42 and 44, respectively.
- the distal ends 42,44 are integrally connected together via a center aperture 46 in the substrate 20.
- the aperture 46 is filled with conductive material that is integrally attached to the distal ends 42,44 of the inductive portions 12,14.
- the material filling aperture 46 is the same as the material forming inductive portions 12,14.
- the surface areas on the substrate 20 supporting the spiral inductive portions 12,14 are preferably coplanar with a dielectric constant of between about 9.0 and 9.5.
- the substrate can consist of, for example, alumina, quarts, or sapphire.
- inductance For each of the square spiral inductive portions 12,14, inductance increases roughly with the number of turns (N) as: L ⁇ N 5/3 . Accordingly, because the two conductive portions 12, 14 are connected together in series, the inductor 10 has a series inductance (L S )of ⁇ 2 N 5/3 or 2L. For the circular spiral inductor of FIGURES 7 and 8, the series inductance L S is 2N 2 since inductive portions 112 and 114 are connected together at ends 142 and 144, respectively.
- the mutual inductance M is also increased as the thickness (e) of the substrate 20 is reduced.
- the coupled inductance i.e., 2L+M
- the coupled inductance approaches 3.2L, which is 1.6 times that of just two isolated inductors.
- the coupled inductance approaches 4L, which is 2 times that of just two isolated inductors.
- the coupling between the inductive portions greatly increases the effective inductance of inductor 10, this effect also provides for reducing the substrate area required to realize a given inductance.
- the substrate area occupied is about 35 percent of the area required for placing two inductors, similar to inductive portion 12, on the top surface 16 of substrate 20. This is a significant savings in board area. Only the top surface 16 is counted in the above comparison for the inductor 10 since the bottom surface 18 is considered "free", since most of the other components arc fabricated on the top side of the substrate 20.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
A miniaturized inductor of the thin-film type utilized in miniaturized electrical
circuits is disclosed. The inductor includes two thin-film spiral inductive portions
with a substrate positioned therebetween. The first inductive portion is wound in a
clockwise direction and has a distal end. Conversely, the second inductive portion is
wound in a counterclockwise direction and has a distal end connected to the distal end
of the first inductive portion.
Description
- The present invention relates to electronic components, and in particular to an inductor having two oppositely wound thin-film spirals that are physically, and magnetically, coupled to each other.
- Hybrid technology provides the means for assembling most major categories of electronic components in relatively small enclosures to satisfy system size requirements that cannot be met by more conventional packaging techniques. Analog and digital circuits as well as microwave modules are typically made in hybrid form. Such circuits usually consist of an insulating substrate with deposited networks, generally conductors and resistors, to which semiconductor devices, integrated circuits, and passive elements are attached in chip form.
- Several steps are implemented in the design and fabrication of circuits for fitting within a small enclosure. First, the design is analyzed and thick- and/or thin-film materials are chosen, along with the discrete components, which include uncased active and passive chips. The geometry that defines the dominate parameter of each film-type circuit and the position of each component are determined next. After establishing the deposition sequence for the individual layers of film materials, master patterns for each layer are prepared. From them, photoreduced transparencies are made for photolithographic fabrication of the masks used to deposit or define the film on the substrate, after which the chip parts are attached and interconnected to the film circuit. Maximum circuit yield with related cost effectiveness necessitates an optimum number of add-on components per substrate, a limitation on the range of resistance and capacitance values and tolerances, and, in the past, a minimum use of inductors and transformers because of their relatively low inductance and extensive size.
- As indicated above, and known by those skilled in the art, thick- and thin-film networks involve the deposition of passive circuit elements in a predetermined geometric pattern on the surface of the insulating substrate. Deposited thin-films can be made with precision and stability for the diverse requirements of linear circuits and can be fabricated with finer lines than thick films.
- In the past, as shown in FIGURE 1, an inductor 1 was typically fabricated by printing or defining conductor patterns of an appropriate spiral design 2 directly onto the top of a substrate 3. The distal end 4 of the spiral design 2 was connected, via a
lead 5, to anotherconductive path 6 on the top of the substrate 3. - Accordingly, such an inductor requires extensive substrate area to achieve high inductance values since its inductance is directly proportional to the overall size of the spiral design and the number of turns. Accordingly, the use of these inductors were avoided.
- However, in many circuit designs it is advantageous to include one or more inductors. For example, reducing EMI (ElectroMagnetic Interference) in transducers supports the fabrication of monolithic inductors. When an inductor is used with a high-quality capacitor, a low pass filter can be fabricated which works up to high frequencies (∼6 Ghz or greater).
- Besides the prior art inductor of FIGURE 1 being relatively large, the presence of a ground plane opposite the inductor (i.e., on the opposite side of the substrate) can have a detrimental effect on the characteristics of the inductor. In fact, any structure that has a large extended metallization such as the bottom plate of a capacitor would have a similar detrimental effect.
- These effects are a result of induced eddy currents forming in the back metallization. In addition, the shunt capacitance that exists between the inductor and the back metallization also degrades inductor performance. These degrading effects become more important as the substrate thickness is reduced.
- Hence, prior to the present invention, a need existed for a relatively small thin-film inductor having a relatively high inductance without occupying an inordinate amount of board area. The present invention satisfies these needs.
- According to the present invention, a compact inductor of the thin-film type for utilization in miniaturized electrical circuits has been developed. The inductor provides a relatively high inductance value while utilizing little substrate area.
- Generally, the inductor of the present invention includes first and second thin-film spiral inductive portions with a planar substrate positioned therebetween. The first spiral inductive portion is wound in a clockwise direction, for example, and has a distal end. Conversely, the second spiral inductive portion is wound in a counterclockwise direction (opposite that of the first) and has a distal end connected to the distal end of the first inductive portion. Both spiral inductive portions have magnetic lines of force that are linked together to provide a significant mutual inductance.
- Other advantages and aspects of the present invention will become apparent upon reading the following description of the drawings and detailed description of the invention.
-
- FIGURE 1 is a greatly enlarged perspective view of a prior art inductor attached to a substrate;
- FIGURE 2 is a greatly enlarged top view of a square spiral portion of an inductor in accordance with the present invention attached to the top of a substrate;
- FIGURE 3 is a greatly enlarged top view (through the substrate) of the bottom of the substrate of FIGURE 2 with another square spiral portion of the inductor attached thereon;
- FIGURE 4 is a cross sectional view of FIGURES 2 and 3 along plane 6-6;
- FIGURE 5 is a cross sectional view of FIGURES 2 and 3 along plane 5-5;
- FIGURE 6 is a greatly enlarged plan view of another embodiment of an inductor in accordance with the present invention wherein the substrate is removed and the thickness of one spiral inductive portion is reduced for illustrative purposes;
- FIGURE 7 is a greatly enlarged plan view of yet another embodiment of an inductor in accordance with the present invention depicting one of two continuously arcuate spiral inductive portions mounted on a substrate; and
- FIGURE 8 is a greatly enlarged plan view of the bottom of the substrate of FIGURE 7 and depicting the other spiral inductive portion of the same inductor.
-
- While this invention is susceptible of embodiments in many different forms, there is shown in the drawings and will herein be described detail preferred embodiments of the invention. The embodiments are to be considered as an exemplification of the principles of the invention and are not intended to limit the broad aspect of the invention to the embodiments illustrated.
- Referring now to the drawings, and particularly to FIGURES 2-5, a
split geometry inductor 10 is disclosed having square spiralinductive portions opposite sides substrate 20. Preferably, theinductive portions conductor patterns substrate 20 by using thin-film technology. As such, conductive material is deposited in a vacuum by electro-beam evaporation or, alternatively, sputtering. The film can consist of, for example, gold, nickel-chromium, or aluminum. - The inductive
spiral portions substrate 20 can have many shapes besides the square spirals depicted in FIGURES 2 and 3. For example, as shown in FIGURES 7 and 8, theinductive spirals - In each of the square spiral
inductive portion continuous trace 26 is organized into a plurality of integrally connectedlinear segments 28 that extend perpendicularly from at least one other linear segment. Accordingly, a plurality of thelinear segments 28 that form each square spiralinductive portion - Each inductive
spiral portion proximal end conductive leads side 16 of thesubstrate 20. - Preferably,
lead 34 is integrally connected to theproximal end 30 of inductivespiral portion 12. Moreover, as shown in FIGURE 4, theproximal end 32 ofinductive spiral 14 is conductively coupled to lead 36 via an integrally connectedlead 38 passing through anaperture 40 in thesubstrate 20. Thematerial forming lead 38 consists of the same material forming theinductive portions substrate 20 or, alternatively, another type of conductive material. - As shown in FIGURES 2, 3 and 5, each inductive
spiral portion distal end distal ends center aperture 46 in thesubstrate 20. Theaperture 46 is filled with conductive material that is integrally attached to thedistal ends inductive portions material filling aperture 46 is the same as the material forminginductive portions - As indicated above, the surface areas on the
substrate 20 supporting the spiralinductive portions - For each of the square spiral
inductive portions conductive portions inductor 10 has a series inductance (LS)of ∝ 2 N5/3 or 2L. For the circular spiral inductor of FIGURES 7 and 8, the series inductance LS is 2N2 sinceinductive portions - Referring back to FIGURES 2-5, in addition to the series inductance LS, there is also a significant mutual inductance (M) between the two
inductive portions inductor 10 having a coupled inductance (LT) of 2L + M. To maximize the mutual inductance, it is preferred that the spiralinductive portions substrate 20. However, as shown in FIGURE 6, there can be differences between the spiral designs, but these differences will reduce the mutual inductance between theinductive portions 212, 214. - The mutual inductance M is also increased as the thickness (e) of the
substrate 20 is reduced. In the embodiment having square spiralinductive potions inductive portions - As indicated previously, in the presence of a back metallization, the effective inductance (LEFF ) of each inductive portion is reduced by about 35%. Accordingly, because the two
inductive portions inductor 10 has an effective series inductance (LS-eff) of about 2·(1-.35)L = 1.3L depending on the distance (d) between adjacentlinear segments 28 and the thickness e of thesubstrate 20. By including the effects of the mutual inductance between theinductive portions inductor 10 has a coupled inductance of where β represent the effect of the back metallization and ranges from 2 - 3, depending on the substrate thickness e and the linear spatial extent d of the linear segments. Accordingly, the net increase of the inductance ofinductor 10 over that of a conventional design is about 1.5 to 2.3 times greater. - While the coupling between the inductive portions greatly increases the effective inductance of
inductor 10, this effect also provides for reducing the substrate area required to realize a given inductance. Forinductor 10, the substrate area occupied is about 35 percent of the area required for placing two inductors, similar toinductive portion 12, on thetop surface 16 ofsubstrate 20. This is a significant savings in board area. Only thetop surface 16 is counted in the above comparison for theinductor 10 since thebottom surface 18 is considered "free", since most of the other components arc fabricated on the top side of thesubstrate 20. - While the specific embodiments have been illustrated and described, numerous modifications come to mind without significantly departing from the spirit of the invention and the scope of protection is only limited by the scope of the accompanying Claims.
Claims (14)
- An inductor attached to a substrate comprising:a first thin-film spiral portion wound in a first direction and having a distal end;a second thin-film spiral portion wound in a second direction opposite the first direction and having a distal end connected to the distal end of the first spiral portion; and
wherein the substrate is positioned between the spiral portions. - The inductor of claim 1, wherein the first spiral portion is a square spiral inductor having a plurality of linear segments that are in parallel spaced relationship to each other.
- The inductor of claim 2, wherein the first spiral inductor and the second spiral portion are symmetrical with respect to each other about a plane defined by the substrate.
- The inductor of claim 2, wherein the first spiral portion is a circular spiral inductor having an elongated arcuate portion.
- The inductor of claim 1, wherein the first spiral portion and the second spiral portion are symmetrical with respect to each other about a plane defined by the substrate.
- The inductor of claim 1, wherein the first spiral portion has an isolated inductance of L and the first spiral portion and the second spiral portion have an inductance of between about 3.2L and 4L.
- The inductor of claim 1, wherein portions of the first spiral portion and the second spiral portion are in alignment with each other.
- An inductor attached to a substrate comprising:a first thin-film square spiral inductor wound in a clockwise direction and having a plurality of linear segments that are in parallel spaced relationship to each other and a distal end;a second thin-film square spiral inductor wound in a counterclockwise direction and having a distal end connected to the distal end of the first spiral inductor; and
wherein the substrate is positioned between the spiral inductors. - The inductor of claim 8, wherein the first inductor and the second inductor are symmetrical with respect to each other about a plane defined by the substrate.
- The inductor of claim 8, wherein the first spiral inductor has an isolated inductance of L and the first spiral portion and the second spiral inductor have a coupled inductance of about 3.2L.
- The inductor of claim 8, wherein linear segments of the first spiral inductor and the second spiral inductor are in parallel alignment with each other.
- An inductor attached to a substrate comprising:a first thin-film circular inductor wound in a clockwise direction and having a distal end;a second thin-film inductor wound in a counterclockwise direction and having a distal end connected to the distal end of the first inductor; and
wherein the substrate is positioned between the spiral inductors. - The inductor of claim 12, wherein the first inductor and the second inductor are symmetrical with respect to each other about a plane defined by the substrate.
- The inductor of claim 12, wherein the first inductor has an isolated inductance of L and the first inductor and the second inductor have a coupled inductance of about 4L.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25110199A | 1999-02-16 | 1999-02-16 | |
US251101 | 1999-02-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1030320A1 true EP1030320A1 (en) | 2000-08-23 |
Family
ID=22950481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00301135A Withdrawn EP1030320A1 (en) | 1999-02-16 | 2000-02-15 | Split geometry inductor |
Country Status (1)
Country | Link |
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EP (1) | EP1030320A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6534406B1 (en) * | 2000-09-22 | 2003-03-18 | Newport Fab, Llc | Method for increasing inductance of on-chip inductors and related structure |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4494100A (en) * | 1982-07-12 | 1985-01-15 | Motorola, Inc. | Planar inductors |
JPH045806A (en) * | 1990-04-23 | 1992-01-09 | Nec Corp | Spiral inductor |
-
2000
- 2000-02-15 EP EP00301135A patent/EP1030320A1/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4494100A (en) * | 1982-07-12 | 1985-01-15 | Motorola, Inc. | Planar inductors |
JPH045806A (en) * | 1990-04-23 | 1992-01-09 | Nec Corp | Spiral inductor |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 016, no. 150 (E - 1189) 14 April 1992 (1992-04-14) * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6534406B1 (en) * | 2000-09-22 | 2003-03-18 | Newport Fab, Llc | Method for increasing inductance of on-chip inductors and related structure |
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