EP1029600A1 - Cleaning device - Google Patents
Cleaning device Download PDFInfo
- Publication number
- EP1029600A1 EP1029600A1 EP99939173A EP99939173A EP1029600A1 EP 1029600 A1 EP1029600 A1 EP 1029600A1 EP 99939173 A EP99939173 A EP 99939173A EP 99939173 A EP99939173 A EP 99939173A EP 1029600 A1 EP1029600 A1 EP 1029600A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- brush
- recessed section
- main unit
- section
- cleaning apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 23
- 239000007795 chemical reaction product Substances 0.000 abstract description 16
- 239000012530 fluid Substances 0.000 abstract description 14
- 238000005498 polishing Methods 0.000 description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 235000012431 wafers Nutrition 0.000 description 16
- 239000004744 fabric Substances 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 14
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Images
Classifications
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B17/00—Accessories for brushes
- A46B17/06—Devices for cleaning brushes after use
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
- B08B1/52—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
Definitions
- the present invention relates to a cleaning apparatus, and more specifically, to a cleaning apparatus for cleaning a brush which is used in a polishing apparatus for polishing a workpiece such as a semiconductor wafer, a CD disc and the like, which has a mirror-finished surface and is required to have a uniform thickness, by means of an abrasive cloth.
- the surfaces of semiconductor wafers, CD discs and the like must be mirror-finished to a uniform thickness.
- the semiconductor wafer which is composed of sliced monocrystal silicon, must be polished to a uniform thickness with the surface of it precisely mirror-finished before a semiconductor circuit is formed on the wafer.
- a surface of each semiconductor wafer is polished by being pressed against the abrasive cloth while supplying an alkaline solution containing abrasive grain such as fine particle silica or the like to the rotating abrasive cloth, whereby the surface of each semiconductor wafer is mirror-finished.
- the abrasive cloth As the abrasive cloth is used, it is clogged with the slurry of a reactive product penetrated thereinto, which is composed of an abrasive and particles separated from the semiconductor wafer when the wafer is polished. The polishing capability of the abrasive cloth is dropped thereby.
- a means for solving the above problem is to provide a dressing device with the polishing apparatus as proposed in Japanese Unexamined Patent Publication No. 3-10769.
- the dressing device is arranged such that high pressure pure water is injected to the polishing surface of the abrasive cloth from an injection nozzle while a polishing job is carried out and the reaction product, which builds up in the deep layer of the abrasive cloth, is beaten and removed by the impact of the injected water.
- the dressing device is provided with a splash prevention cover for entirely surrounding the nozzle in order to prevent the reaction product, which has been removed by the injection of the high pressure pure water, from being sprung out and splashed to the surroundings by the high pressure pure water injected to the reaction product thereafter.
- Japanese Patent No. 2622069 proposes a device provided with a brush, and the device is arranged such that a fluid injected to the abrasive cloth is not caused to build up at the position where the fluid is injected to the abrasive cloth but is caused to temporarily build up at a position apart from the above injecting position and discharged by the brush while the energy of the built-up fluid is lost by the brush.
- the brush used in the device has the following problem. That is, the slurry of the reactive product, which is composed of an abrasive penetrating the abrasive cloth and particles separated from the semiconductor wafer when the wafer is polished, enters the inside of the brush. Thus, the object intended by the device cannot be achieved as a time passes, although the reaction product and the used fluid are satisfactorily discharged at the beginning of the use of the brush.
- An object of the present invention is to provide a cleaning apparatus capable of always securing the initial state of a brush, which is used in a polishing apparatus for polishing a workpiece such as a semiconductor wafer, a CD disc and so forth whose surface must be mirror-finished to a uniform thickness, when the brush cannot be satisfactorily used, as a time passes, due to the reaction product and the used fluid which have built up in the inside of the brush.
- the cleaning apparatus the initial state of the brush is restored by discharging the reaction product and the used fluid which have entered the inside of the brush.
- a cleaning apparatus is arranged such that a recessed section, which has an open upper surface and a size for permitting a brush to be located in the recessed section, is formed to a main unit, a chamber section is formed in the inside of the main unit so as to surround the recessed section, a plurality of nozzle sections are formed to the main unit between the chamber section and the recessed section, and an introduction hole communicating with the chamber section and a discharge hole communicating with the recessed section are opened to the lower surface of the main unit, respectively. Accordingly, the cleaning apparatus can discharge the reaction product and the used fluid, which have entered the inside of the brush. Further, the recessed section is formed to a square, and the chamber section is formed to a square surrounding the recessed section.
- FIG. 1 shows a schematic plan view of a cleaning apparatus
- FIG. 2 shows a schematic sectional view of the cleaning apparatus.
- the cleaning apparatus 1 of the present invention is provided with a recessed section 2 having a size in which a brush used in a polishing apparatus can be accommodated.
- a discharge hole 3 is formed to the bottom of the recessed section 2 at the center thereof, and the inside of the recessed section 2 communicates with the lower surface of a main unit 4 through the discharge hole 3.
- the main unit 4 is provided with a chamber section 5 which surrounds the recessed section 2.
- a plurality of nozzle sections 6 are formed to the main unit 4 between the chamber section 5 and the recessed section 2 over the entire periphery of the recessed section 2.
- an upper surface section and a lower surface section may be separately made and formed to an integral body.
- various arrangements may be employed.
- a Teflon resin or other resins, metal, resin-coated metal, and the like may be employed as the material of the main unit 4. In this case, they can be preferably used so long as they have resistance to a chemical agent such as an abrasive and the like which deposits on the brush.
- the strength of the main unit 4 it is preferably about 0 to 10 kg/cm 2 and more preferably about 2 to 3 kg/cm 2 .
- a high pressure water supply source is connected to the high pressure water introduction hole 7 which is opened to the lower surface of the main unit 4.
- a connecting means is not particularly exemplified in the figure, a port may be screwed into the introduction hole 7 or any of known means may be employed.
- the brush located in the inside of the recessed section 2 of the main unit 4 is the brush which is mounted on the polishing apparatus and used therein and in which a reaction product and a used fluid build up.
- the high pressure water is sprayed to the brush through the plurality of nozzle sections 6. Since the high pressure water is sprayed in a direction opposite to that when the brush is mounted on the polishing apparatus and used in it, the reaction product and the used fluid, which have built up in the inside of the brush, are easily fed to the inside of the brush together with the high pressure water.
- reaction product and the used fluid which have built up in the inside of the brush, reach the central portion of the recessed section 2 together with the high pressure water introduced through the introduction hole 7 and then are discharged through the discharge hole 3 opened to the lower surface of the main unit 4.
- reaction product and the used fluid which have built up in the inside of the brush used in the polishing apparatus, can be reliably discharged only with the high pressure water.
- the brush can be restored to the initial state of it by the above operation and can be used again, whereby the operating cost of the polishing apparatus can be reduced.
- the cleaning apparatus Since the cleaning apparatus is very simply arranged as a whole, it can be manufactured at an inexpensive cost.
- the pressure of the high pressure water and the period of time during which the high pressure water is introduced can be arbitrarily set depending upon the state of the reaction product and the used fluid which have built up in the inside of the brush.
- both the recessed section and the chamber section are formed to a square, they may be toned to a square with round corners. That is, they may be formed to any arbitrary shape according to the shape of the brush to be used.
- the cleaning apparatus according to the present invention is suitable for a cleaning apparatus for cleaning a brush, which is used in a polishing apparatus for polishing a workpiece such as a semiconductor wafer, a CD disc and the like whose surface is mirror-finished and which is required to have a uniform thickness, by means of an abrasive cloth.
- the cleaning apparatus can reliably remove the reaction product and the used fluid which have built up in the inside of the brush used in the polishing apparatus. The initial state of the brush itself can be restored thereby so that the brush can be used repeatedly.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Disclosed is a cleaning apparatus having a very
simple arrangement and capable of reliably removing the
reaction product and the used fluid which have built up in a
brush. A recessed section (2) having a size for permitting
a brush to be located therein is formed to a main unit (4)
having an open upper surface, and a chamber section (5) is
formed so as to surround the recessed section (2). A
plurality of nozzle sections (6) are formed to the main unit
(4) between the chamber section (5) and the recessed section
(2), whereas an introduction hole (7) communicating with the
chamber section (5) and a discharge hole (3) communicating
with the recessed section (2) are opened to the main unit
(4), respectively.
Description
- The present invention relates to a cleaning apparatus, and more specifically, to a cleaning apparatus for cleaning a brush which is used in a polishing apparatus for polishing a workpiece such as a semiconductor wafer, a CD disc and the like, which has a mirror-finished surface and is required to have a uniform thickness, by means of an abrasive cloth.
- In general, the surfaces of semiconductor wafers, CD discs and the like must be mirror-finished to a uniform thickness. When this is described as to the semiconductor wafer, the semiconductor wafer, which is composed of sliced monocrystal silicon, must be polished to a uniform thickness with the surface of it precisely mirror-finished before a semiconductor circuit is formed on the wafer.
- For this purpose, in a polishing apparatus, a base plate (or platen), on which an abrasive cloth such as felt is adhered, is rotated as well as a plurality of heads, on which a plurality of semiconductor wafers are fixed, are also rotated so that the abrasive cloth rotates relatively to the semiconductor wafers.
- In this state, a surface of each semiconductor wafer is polished by being pressed against the abrasive cloth while supplying an alkaline solution containing abrasive grain such as fine particle silica or the like to the rotating abrasive cloth, whereby the surface of each semiconductor wafer is mirror-finished.
- However, as the abrasive cloth is used, it is clogged with the slurry of a reactive product penetrated thereinto, which is composed of an abrasive and particles separated from the semiconductor wafer when the wafer is polished. The polishing capability of the abrasive cloth is dropped thereby.
- A means for solving the above problem is to provide a dressing device with the polishing apparatus as proposed in Japanese Unexamined Patent Publication No. 3-10769. The dressing device is arranged such that high pressure pure water is injected to the polishing surface of the abrasive cloth from an injection nozzle while a polishing job is carried out and the reaction product, which builds up in the deep layer of the abrasive cloth, is beaten and removed by the impact of the injected water.
- The dressing device is provided with a splash prevention cover for entirely surrounding the nozzle in order to prevent the reaction product, which has been removed by the injection of the high pressure pure water, from being sprung out and splashed to the surroundings by the high pressure pure water injected to the reaction product thereafter.
- With this means, however, the pure water and the reaction product build up in the splash prevention cover and the surface of the abrasive cloth is covered with them, whereby the removing capability of the abrasive cloth for removing the reaction product by the splash of the high pressure pure water is dropped.
- To prevent the drop of the removing capability, there has been proposed Japanese Patent No. 2622069. Japanese Patent No. 2622069 proposes a device provided with a brush, and the device is arranged such that a fluid injected to the abrasive cloth is not caused to build up at the position where the fluid is injected to the abrasive cloth but is caused to temporarily build up at a position apart from the above injecting position and discharged by the brush while the energy of the built-up fluid is lost by the brush.
- However, the brush used in the device has the following problem. That is, the slurry of the reactive product, which is composed of an abrasive penetrating the abrasive cloth and particles separated from the semiconductor wafer when the wafer is polished, enters the inside of the brush. Thus, the object intended by the device cannot be achieved as a time passes, although the reaction product and the used fluid are satisfactorily discharged at the beginning of the use of the brush.
- This problem arises likewise in the polish of the surface of a CD disc and in the polish of the surface of liquid crystal glass, and the like, in addition to the polish of the semiconductor wafer.
- An object of the present invention is to provide a cleaning apparatus capable of always securing the initial state of a brush, which is used in a polishing apparatus for polishing a workpiece such as a semiconductor wafer, a CD disc and so forth whose surface must be mirror-finished to a uniform thickness, when the brush cannot be satisfactorily used, as a time passes, due to the reaction product and the used fluid which have built up in the inside of the brush. In the cleaning apparatus, the initial state of the brush is restored by discharging the reaction product and the used fluid which have entered the inside of the brush.
- That is, according to the present invention, a cleaning apparatus is arranged such that a recessed section, which has an open upper surface and a size for permitting a brush to be located in the recessed section, is formed to a main unit, a chamber section is formed in the inside of the main unit so as to surround the recessed section, a plurality of nozzle sections are formed to the main unit between the chamber section and the recessed section, and an introduction hole communicating with the chamber section and a discharge hole communicating with the recessed section are opened to the lower surface of the main unit, respectively. Accordingly, the cleaning apparatus can discharge the reaction product and the used fluid, which have entered the inside of the brush. Further, the recessed section is formed to a square, and the chamber section is formed to a square surrounding the recessed section.
-
- FIG. 1 is a schematic plan view showing a preferable cleaning apparatus according to the present invention; and
- FIG. 2 is a schematic longitudinal sectional view of the cleaning apparatus.
-
- The present invention will be described below in more detail with reference to the accompanying drawings.
- FIG. 1 shows a schematic plan view of a cleaning apparatus, and FIG. 2 shows a schematic sectional view of the cleaning apparatus.
- The cleaning apparatus 1 of the present invention is provided with a
recessed section 2 having a size in which a brush used in a polishing apparatus can be accommodated. Adischarge hole 3 is formed to the bottom of therecessed section 2 at the center thereof, and the inside of therecessed section 2 communicates with the lower surface of amain unit 4 through thedischarge hole 3. - The
main unit 4 is provided with achamber section 5 which surrounds therecessed section 2. - A plurality of
nozzle sections 6 are formed to themain unit 4 between thechamber section 5 and therecessed section 2 over the entire periphery of therecessed section 2. - Further, an
introduction hole 7, which is opened to the lower surface of themain unit 4, is formed to thechamber section 5. - As the arrangement of the
main unit 4, an upper surface section and a lower surface section may be separately made and formed to an integral body. In addition to the above arrangement, various arrangements may be employed. As to the material of themain unit 4, a Teflon resin or other resins, metal, resin-coated metal, and the like may be employed. In this case, they can be preferably used so long as they have resistance to a chemical agent such as an abrasive and the like which deposits on the brush. - Further, as to the strength of the
main unit 4, it is preferably about 0 to 10 kg/cm2 and more preferably about 2 to 3 kg/cm2. - Next, how the cleaning apparatus 1 arranged as described above is used will be described.
- First, a high pressure water supply source is connected to the high pressure
water introduction hole 7 which is opened to the lower surface of themain unit 4. - Although a connecting means is not particularly exemplified in the figure, a port may be screwed into the
introduction hole 7 or any of known means may be employed. - In contrast, located in the inside of the
recessed section 2 of themain unit 4 is the brush which is mounted on the polishing apparatus and used therein and in which a reaction product and a used fluid build up. - When the high pressure water is introduced through the
introduction hole 7 in this state, the inside of thechamber section 5 is filled with the high pressure water. - As a result, the high pressure water is sprayed to the brush through the plurality of
nozzle sections 6. Since the high pressure water is sprayed in a direction opposite to that when the brush is mounted on the polishing apparatus and used in it, the reaction product and the used fluid, which have built up in the inside of the brush, are easily fed to the inside of the brush together with the high pressure water. - Thereafter, the reaction product and the used fluid, which have built up in the inside of the brush, reach the central portion of the
recessed section 2 together with the high pressure water introduced through theintroduction hole 7 and then are discharged through thedischarge hole 3 opened to the lower surface of themain unit 4. - That is, the reaction product and the used fluid, which have built up in the inside of the brush used in the polishing apparatus, can be reliably discharged only with the high pressure water.
- Therefore, the brush can be restored to the initial state of it by the above operation and can be used again, whereby the operating cost of the polishing apparatus can be reduced.
- Since the cleaning apparatus is very simply arranged as a whole, it can be manufactured at an inexpensive cost.
- The pressure of the high pressure water and the period of time during which the high pressure water is introduced can be arbitrarily set depending upon the state of the reaction product and the used fluid which have built up in the inside of the brush.
- Although both the recessed section and the chamber section are formed to a square, they may be toned to a square with round corners. That is, they may be formed to any arbitrary shape according to the shape of the brush to be used.
- As described above, the cleaning apparatus according to the present invention is suitable for a cleaning apparatus for cleaning a brush, which is used in a polishing apparatus for polishing a workpiece such as a semiconductor wafer, a CD disc and the like whose surface is mirror-finished and which is required to have a uniform thickness, by means of an abrasive cloth. The cleaning apparatus can reliably remove the reaction product and the used fluid which have built up in the inside of the brush used in the polishing apparatus. The initial state of the brush itself can be restored thereby so that the brush can be used repeatedly.
Claims (3)
- A cleaning apparatus, characterized in that a recessed section, which has an open upper surface and a size for permitting a brush to be located in the recessed section, is formed to a main unit, a chamber section is formed in the inside of the main unit so as to surround the recessed section, a plurality of nozzle sections are formed to the main unit between the chamber section and the recessed section, and an introduction hole communicating with the chamber section and a discharge hole communicating with the recessed section are opened to the lower surface of the main unit, respectively.
- A cleaning apparatus according to claim 1, wherein the recessed section is formed to a square.
- A cleaning apparatus according to claim 1, wherein the chamber section is formed to a square surrounding the recessed section.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5931298A JPH11254293A (en) | 1998-03-11 | 1998-03-11 | Cleaning device |
JP5931298 | 1998-03-11 | ||
PCT/JP1999/001070 WO1999046063A1 (en) | 1998-03-11 | 1999-03-05 | Cleaning device |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1029600A1 true EP1029600A1 (en) | 2000-08-23 |
Family
ID=13109734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99939173A Withdrawn EP1029600A1 (en) | 1998-03-11 | 1999-03-05 | Cleaning device |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1029600A1 (en) |
JP (1) | JPH11254293A (en) |
DE (1) | DE19980139T1 (en) |
GB (1) | GB2338176A (en) |
WO (1) | WO1999046063A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001274123A (en) * | 2000-03-27 | 2001-10-05 | Matsushita Electric Ind Co Ltd | Substrate polishing apparatus and substrate-polishing method |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2622069B2 (en) * | 1993-06-30 | 1997-06-18 | 三菱マテリアル株式会社 | Dressing equipment for polishing cloth |
-
1998
- 1998-03-11 JP JP5931298A patent/JPH11254293A/en not_active Withdrawn
-
1999
- 1999-03-05 EP EP99939173A patent/EP1029600A1/en not_active Withdrawn
- 1999-03-05 DE DE19980139T patent/DE19980139T1/en not_active Ceased
- 1999-03-05 WO PCT/JP1999/001070 patent/WO1999046063A1/en not_active Application Discontinuation
- 1999-03-05 GB GB9918867A patent/GB2338176A/en not_active Withdrawn
Non-Patent Citations (1)
Title |
---|
See references of WO9946063A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO1999046063A1 (en) | 1999-09-16 |
GB9918867D0 (en) | 1999-10-13 |
GB2338176A (en) | 1999-12-15 |
DE19980139T1 (en) | 2000-03-16 |
JPH11254293A (en) | 1999-09-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20000523 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): FR NL |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20011002 |