EP1002252A1 - Bauteil zur verbindung optischer fasern mit optischen oder optoelektronischen komponenten - Google Patents

Bauteil zur verbindung optischer fasern mit optischen oder optoelektronischen komponenten

Info

Publication number
EP1002252A1
EP1002252A1 EP99939787A EP99939787A EP1002252A1 EP 1002252 A1 EP1002252 A1 EP 1002252A1 EP 99939787 A EP99939787 A EP 99939787A EP 99939787 A EP99939787 A EP 99939787A EP 1002252 A1 EP1002252 A1 EP 1002252A1
Authority
EP
European Patent Office
Prior art keywords
fiber
support
substrate
housing
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99939787A
Other languages
English (en)
French (fr)
Inventor
Guy Parat
Patrice Caillat
Christiane Puget
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of EP1002252A1 publication Critical patent/EP1002252A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps

Definitions

  • a passive fiber optic alignment technique is also known, the main objective of which is to reduce costs.
  • This assembly is carried out using micro-beads of a fusible material (orasure) on a substrate, which can be an interconnection substrate, playing the role of optical micro-bench.
  • the fusible material constituting the microbeads is for example indium or a fusible alloy based on tin and lead or any alloy with low melting point.
  • the cover comprises, for each fiber, a protuberance by means of which this fiber is pressed against the corresponding housing.
  • the support is formed from a plate in which at least two walls are formed in V oe shape by chemical and / or mechanical etching of this plate and the first studs corresponding to the support by a photolithography technique.
  • the first pads corresponding to the component are formed by a photolithography technique.
  • the shape of the balls depends on the shape of the second studs and is therefore not necessarily spherical.
  • the elements are formed simultaneously by photolithography on the second studs.
  • FIG. 1 is a schematic cross-sectional view of an assembly according to the invention in which an optical fiber is pressed onto thick shims by a cover containing a protuberance
  • Figure 2 is a schematic cross-sectional view of an assembly according to the invention in which a optical fiber is pressed onto thin shims by means of a flat surface cover
  • FIG. 3 is a schematic cross-sectional view of an assembly according to the invention in which an optical fiber is pressed against shims in front of a laser diode
  • FIGS. 13A to 13D schematically illustrate steps for implementing this method according to the invention which follow the steps illustrated schematically in FIGS. 12A to 12E
  • Figure 14 is a schematic cross-sectional view of another assembly according to the invention in the case of a "non-crossing V”
  • Figures 15A, 15B, 16A and 16B schematically illustrate stages of a method of manufacturing a “V non-through” fiber support usable in the invention.
  • Figure 1 shows an assembly according to the invention between an optical fiber and a component, for example a laser diode (not shown).
  • a component for example a laser diode (not shown).
  • the V-shaped housing is filled with an adhesive 24 and the fiber, for example, is brought into contact with the shims by pressing on this fiber with the cover until the adhesive is dry.
  • the shims can be made of another factory-produced material very precisely with a sub-micronic control of the dimensions.
  • the thickness H3 of the beveled shims may vary depending on the application considered for the assembly. Only the contact area between the fiber and each wedge is important.
  • the shape of the cover holding the fiber against the shims can also vary depending on the thickness of these shims (see Figure 1 and Figures 2, 3, and 4).
  • This cover can be manufactured by etching, for example, a silicon wafer using KOH (case of FIG. 3) or be machined or molded in another material. In all cases, the cover can advantageously press each fiber against the wedges.
  • this cover is not critical except for the dimension H4, that is to say the height of the protuberance 10 (FIG. 1) which is the distance between the planar lower wall 28 of the cover and the lower face 30 of this protuberance. ).
  • This dimension H4 should be sufficient to press on each fiber so that it is well maintained in contact with the wedges (see Figure 1). In the example in FIG. 1, H4 is chosen> 160 ⁇ m.
  • Figure 2 shows an assembly according to the invention in which a fiber 2 is pressed against two thin shims 4 and 6 by means of a cover
  • Figure 6 is the section AA of Figure 5 (the fiber is not cut) with the cover 8 of the assembly.
  • FIG. 11A and FIG. 11B which is the enlarged section AA of FIG. 11A).
  • FIGS. 12A to 12E schematically illustrate various stages of preparation of a substrate with a view to forming an assembly in accordance with the invention.
  • the dimensions of these studs are determined from the heights desired for the microbeads.
  • the position of the core of the fiber along the axis XI is known precisely if one precisely controls the dimensions H2 of the brazing height 16, H7 between the bottom of the V and the underside of the wedge, H8 between the fiber and the bottom of the V and the diameter d of the fiber.
  • the dimension H7 depends on both the thickness H3 of the wedge, the opening H11 of the V and the angle ⁇ of the walls of the V.
  • the dimension H8 depends on the angle ⁇ of the walls of the V, and of the fiber diameter. So the critical dimensions for vertical alignment are H2, H3, Hll, d and the angle ⁇ .
  • each attachment stud located on the substrate merges with the axis of the corresponding stud located on a shim or on the component.
  • the wedges can be made of silicon and beveled by etching using KOH. In this case, a large number of shims can be obtained on the same silicon wafer. However, the shims can also be formed from a material other than silicon. If the shims are defective, the resulting additional cost remains low given the limited number of steps to form the shims.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
EP99939787A 1998-06-09 1999-06-08 Bauteil zur verbindung optischer fasern mit optischen oder optoelektronischen komponenten Withdrawn EP1002252A1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9807219A FR2779536B1 (fr) 1998-06-09 1998-06-09 Assemblage permettant la connexion de fibres optiques avec des composants optiques ou optoelectroniques et procede de fabrication de cet assemblage
FR9807219 1998-06-09
PCT/FR1999/001349 WO1999064907A1 (fr) 1998-06-09 1999-06-08 Assemblage de connexion de fibres optiques avec des composants optiques ou optoelectroniques

Publications (1)

Publication Number Publication Date
EP1002252A1 true EP1002252A1 (de) 2000-05-24

Family

ID=9527169

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99939787A Withdrawn EP1002252A1 (de) 1998-06-09 1999-06-08 Bauteil zur verbindung optischer fasern mit optischen oder optoelektronischen komponenten

Country Status (4)

Country Link
US (1) US6435733B1 (de)
EP (1) EP1002252A1 (de)
FR (1) FR2779536B1 (de)
WO (1) WO1999064907A1 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020028057A1 (en) * 2000-06-19 2002-03-07 Dautartas Mindaugas F. Two-dimentional fiber array and method of manufacture
TW527676B (en) * 2001-01-19 2003-04-11 Matsushita Electric Ind Co Ltd Photo-semiconductor module and method for manufacturing
US6546172B2 (en) 2001-02-20 2003-04-08 Avanti Optics Corporation Optical device
US6443631B1 (en) 2001-02-20 2002-09-03 Avanti Optics Corporation Optical module with solder bond
US6956999B2 (en) 2001-02-20 2005-10-18 Cyberoptics Corporation Optical device
US6546173B2 (en) 2001-02-20 2003-04-08 Avanti Optics Corporation Optical module
US6928225B2 (en) * 2001-04-03 2005-08-09 Schott Glas Method and assembly for mounting at least one optical fiber
US20020191943A1 (en) * 2001-05-01 2002-12-19 Hughes William T. Venting optical microbench
JP4263509B2 (ja) * 2003-03-14 2009-05-13 株式会社フジクラ 光ファイバ把持装置及び光ファイバ突合わせ装置、並びに光ファイバ融着接続装置
JP5378376B2 (ja) * 2007-07-16 2013-12-25 コーニング インコーポレイテッド レーザ軟化ガラスバンプを用いる微細位置合せ
JP5847473B2 (ja) * 2011-07-21 2016-01-20 シチズンホールディングス株式会社 光モジュール
JP5862391B2 (ja) * 2012-03-19 2016-02-16 富士通株式会社 光結合構造及び光伝送装置
US11156781B2 (en) * 2013-06-14 2021-10-26 Chiral Photonics, Inc. Passive aligning optical coupler array
US11966091B2 (en) * 2013-06-14 2024-04-23 Chiral Photonics, Inc. Multichannel optical coupler array
US10564348B2 (en) * 2013-06-14 2020-02-18 Chiral Photonics, Inc. Passive aligning optical coupler array
US10914891B2 (en) * 2013-06-14 2021-02-09 Chiral Photonics, Inc. Multichannel optical coupler
US10838155B2 (en) 2013-06-14 2020-11-17 Chiral Photonics, Inc. Multichannel optical coupler
WO2015012694A1 (en) * 2013-07-24 2015-01-29 Effect Photonics B.V. Optical subassembly, optical system and method
US10209477B1 (en) * 2017-05-25 2019-02-19 Lockheed Martin Coherent Technologies, Inc. Systems and methods for reconfigurable micro-optic assemblies

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US5499312A (en) * 1993-11-09 1996-03-12 Hewlett-Packard Company Passive alignment and packaging of optoelectronic components to optical waveguides using flip-chip bonding technology
JP3658426B2 (ja) * 1995-01-23 2005-06-08 株式会社日立製作所 光半導体装置
US5631987A (en) * 1995-06-07 1997-05-20 Reliaspeed, Inc. Low cost, mode-field matched, high performance laser transmitter optical subassembly
US5742720A (en) * 1995-08-30 1998-04-21 Matsushita Electric Industrial Co., Ltd. Optical coupling module and method for producing the same
JPH09138325A (ja) * 1995-11-13 1997-05-27 Nec Corp 光ファイバ実装構造とその製造方法
US5627931A (en) * 1996-05-28 1997-05-06 Motorola Optoelectronic transducer
US5923481A (en) * 1996-11-27 1999-07-13 The Regents Of The University Of California Microlens frames for laser diode arrays
FR2757276B1 (fr) * 1996-12-13 1999-01-08 Commissariat Energie Atomique Assemblage de composants optiques alignes optiquement et procede de fabrication de cet assemblage

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9964907A1 *

Also Published As

Publication number Publication date
US6435733B1 (en) 2002-08-20
FR2779536A1 (fr) 1999-12-10
WO1999064907A1 (fr) 1999-12-16
FR2779536B1 (fr) 2001-10-19

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