EP0978094A1 - Data medium for transmission of electrical signals - Google Patents

Data medium for transmission of electrical signals

Info

Publication number
EP0978094A1
EP0978094A1 EP97935432A EP97935432A EP0978094A1 EP 0978094 A1 EP0978094 A1 EP 0978094A1 EP 97935432 A EP97935432 A EP 97935432A EP 97935432 A EP97935432 A EP 97935432A EP 0978094 A1 EP0978094 A1 EP 0978094A1
Authority
EP
European Patent Office
Prior art keywords
semiconductor chip
data carrier
carrier according
cardboard
induction coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97935432A
Other languages
German (de)
French (fr)
Inventor
Peter Stampka
Detlef Houdeau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0978094A1 publication Critical patent/EP0978094A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a data carrier according to the preamble of claim 1.
  • Such a data carrier has become known from EP 0710919 A2.
  • This comprises an electronic module with an integrated circuit (semiconductor chip) and a wire-wound coil, the integrated circuit resting directly on the wound coil.
  • the coil is encapsulated with a potting compound in the area of the integrated circuit.
  • Data carriers of the generic type are known, in particular, in the form of a contactless chip card designed in the form of a credit card, which can be used in an extremely versatile manner due to its high functional flexibility.
  • chip cards in the form of health insurance cards, flextime recording cards, telephone cards and the like, there will in particular be applications in future in local public transport where as many people as possible have to be recorded in the shortest possible time. In such applications, contactless offer
  • Chip cards have advantages over contact-based chip cards in that the former are not necessarily in a reading or Must be plugged in, but function without contact over a distance of up to a few meters.
  • the contactless chip card offers the advantage that no technical elements are visible on the card surface, so that the optical design of the card surface is not restricted by magnetic strips or contact areas.
  • the disadvantages of the contactless chip cards currently available are primarily the additional components, such as transmission coils or capacitor plates, which have to be integrated into the card.
  • the electronics required in the contactless chip card for the contactless transmission of electrical signals to the reading or writing station are more complex.
  • circuits are suitable for this purpose which enable signal transmission by means of microwaves, optical signals, capacitive or inductive coupling, the capacitive and inductive coupling being the most suitable due to the flat design of the chip card.
  • Most contactless cards are currently being transmitted inductively, which can be used to implement both data and energy transmission.
  • One or more induction coils are thus integrated in the card body and are suitably contacted with the circuit located on the semiconductor chip.
  • the transmission of electrical signals is based on the principle of the loosely coupled transformer, the carrier frequency being, for example, in the range between 100 and 300 kHz or a few MHz, in particular the industrial frequency of 13.56 MHz.
  • induction coils with an opposite to the bottom surface of the semiconductor chips of the order about 10 mm 2 substantially larger coil areas of typically from about 30 to 40 cm 2 is required, the induction coil having as a rule only a few turns and is formed flat.
  • the semiconductor components are mounted in the form of prefabricated modules or directly as a chip on the etched coil.
  • the card is laminated into the card body, with intermediate foils, if necessary provided with punched-outs, being inserted as ticking foils for the purpose of volume compensation during lamination.
  • the contactless chip cards used so far were all made with all-plastic materials and mostly in outer dimensions that correspond to the ISO standard dimensions. Characteristic of these standard specifications is furthermore a high mechanical flexibility of the card body, which, however, requires special measures to protect the semiconductor chip, which is very sensitive to bending or torsional stress, which results in a complex and consequently costly production and assembly effort for the contactless chip card.
  • the contactless chip cards, which are to be manufactured according to the ISO standard consist of individual plastic layers that are laminated on top of each other.
  • the production of the card structure, which generally consists of six to seven plastic layers, and the subsequent surface design with regard to labeling and provision of a coating layer are particularly complex. The associated high manufacturing costs of such contactless chip cards cannot usually be borne by all desired applications.
  • the present invention has for its object a
  • the data carrier body has two cardboard or paper layers, between which a stiffening at least partially surrounding the semiconductor chip element is introduced.
  • the stiffening element is formed at least in regions by the turns of the induction coil.
  • Deviating from the ISO standard specifications a data carrier that can be manufactured extremely inexpensively is proposed in the sense of a low-cost chip card that does without the all-plastic body.
  • the overall strength of the data carrier according to the invention can be increased compared to the ISO standard specifications, so that special measures for protecting the semiconductor chip, as are required in the previous chip cards according to the ISO standard, can be omitted.
  • the windings of the induction coil inserted between the two cardboard or paper layers are arranged at the same height and at the same mounting level as the semiconductor chip or the semiconductor chip housing and thus at the same time as a stiffening element
  • the turns of the induction coil which are made of enamelled wire, have a diameter of at least 200 ⁇ m, in particular preferably of at least 500 ⁇ m.
  • the induction coil inserted between the two cardboard or paper layers is assigned a coil core, in particular ferrite core, which at least partially surrounds the semiconductor chip or a semiconductor chip housing or at least approximately positively accommodates it, and its overall height and mounting level in turn that of the semiconductor chip or the semiconductor chip housing corresponds.
  • the coil core like the turns of the induction coil made of thick wire, serves as a stiffening element for mechanical protection of the semiconductor chip.
  • the data carrier according to the invention differs from Known all-plastic chip cards are significantly more resistant to bending, making special protective measures for the semiconductor chip against mechanical loads unnecessary.
  • the two cardboard or paper layers of the data carrier body are provided with an adhesive or adhesive layer on their surface facing the semiconductor chip.
  • the adhesive or adhesive layer is used both to assemble the data carrier body and the components to be inserted therein, and to compensate for differences in height of the individual components.
  • a more than about 20 ⁇ m thick, cold-adhesive layer is preferably used for the adhesive and adhesive layer.
  • a support frame inserted between the two cardboard or paper layers is provided at the edge region of the data carrier body.
  • a coil or ferrite core with a height of preferably 500 ⁇ m is first wrapped with enamelled wire, which likewise has a thickness of approximately 500 ⁇ m.
  • the semiconductor chip provided with the integrated electronic circuit is installed in a module housing, which is typical for semiconductor chips and consists of a lead frame and an overmold molding compound.
  • the semiconductor chip housing is then positively inserted into the coil core, which is provided with a suitably designed receiving opening for this purpose.
  • the total thickness of the module housing is again preferably approximately 500 ⁇ m.
  • the coil core can be surrounded with an additional support frame with a height of about 500 ⁇ m to further increase the rigidity.
  • the blank produced in this way consisting of a chip module, coil core and turns of the induction coil

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Near-Field Transmission Systems (AREA)

Abstract

The invention concerns a data medium for transmission of electrical signals to a read or write station with a data medium body (2) in which a semiconductor chip (3) is constructed with an integrated electronic circuit. The data medium (2) has two cardboard or paper layers (6, 7), between which a stiffening element (8) is inserted which at least partly surrounds the semiconductor chip (3).

Description

Beschreibungdescription
Datenträger zur Übertragung von elektrischen SignalenData carriers for the transmission of electrical signals
Die Erfindung bezieht sich auf einen Datenträger nach dem Oberbegriff des Anspruchs 1.The invention relates to a data carrier according to the preamble of claim 1.
Ein derartiger Datenträger ist aus der EP 0710919 A2 bekannt geworden. Dieser umfasst ein elektronisches Modul mit einem integrierten Schaltkreis (Halbleiterchip) und eine drahtgewickelte Spule, wobei der integrierte Schaltkreis direkt auf der gewickelten Spule aufliegt. Die Spule ist im Bereich des integrierten Schaltkreises mit einer Vergussmasse vergossen.Such a data carrier has become known from EP 0710919 A2. This comprises an electronic module with an integrated circuit (semiconductor chip) and a wire-wound coil, the integrated circuit resting directly on the wound coil. The coil is encapsulated with a potting compound in the area of the integrated circuit.
Aus der DE 4403513 AI ist ein aus Papier und/oder Karton bestehender Datenträger bekannt geworden. Die in dieser Druckschrift näher erläuterten Ausführungsformen beziehen sich auf kontaktbehaftete Chipkarten, die auf ihrer Oberfläche Kontaktflächen für die berührende Kontaktabnahme tragen. Es ist erwähnt, dass die Chipkarte auch mit einem elektronischen Modul versehen werden kann, welches für einen berührungslosen Datenaustausch geeignet ist. Nähere Einzelheiten einer solchen aus Papier oder Karton bestehenden kontaktlosen Chipkarte sind allerdings nicht dargestellt .From DE 4403513 AI a data carrier made of paper and / or cardboard has become known. The embodiments explained in more detail in this publication relate to contact-based chip cards which have contact surfaces on their surface for contact-making removal. It is mentioned that the chip card can also be provided with an electronic module which is suitable for contactless data exchange. However, further details of such a contactless chip card made of paper or cardboard are not shown.
Datenträger der gattungsgemäßen Art sind insbesondere in der Form einer im Scheckkartenformat ausgebildeten kontaktlosen Chipkarte bekannt, welche aufgrund einer hohen funktionalen Flexibilität äußerst vielseitig zum Einsatz gelangt. Neben den derzeit typischen Anwendungsfeldern solcher Chipkarten in der Form von Krankenversichertenkarten, Gleitzeiterfasssungs- karten, Telefonkarten und dergleichen ergeben sich zukünftig insbesondere Anwendungen im öffentlichen Personennahverkehr, wo in möglichst kurzer Zeit möglichst viele Personen erfasst werden müssen. Bei solchen Anwendungen bieten kontaktloseData carriers of the generic type are known, in particular, in the form of a contactless chip card designed in the form of a credit card, which can be used in an extremely versatile manner due to its high functional flexibility. In addition to the currently typical fields of application of such chip cards in the form of health insurance cards, flextime recording cards, telephone cards and the like, there will in particular be applications in future in local public transport where as many people as possible have to be recorded in the shortest possible time. In such applications, contactless offer
Chipkarten gegenüber den kontaktbehafteten Chipkarten dadurch Vorteile, dass erstere nicht unbedingt in eine Lese- bzw. Schreibstation eingesteckt werden müssen, sondern berührungs- los über eine Entfernung von bis zu einigen Metern funktionieren. Neben weiteren Vorteilen bietet die kontaktlose Chipkarte den Vorzug, dass keine technischen Elemente an der Kar- tenoberfläche sichtbar sind, so dass die optische Gestaltung der Kartenoberfläche nicht durch Magnetstreifen oder Kontakt- flächen eingeschränkt wird. Die Nachteile bei den derzeit verfügbaren kontaktlosen Chipkarten liegen vor allem in den zusätzlichen Bauelementen wie Übertragungsspulen oder Konden- satorplatten, die in die Karte zu integrieren sind. Darüber hinaus ist die in der kontaktlosen Chipkarte erforderliche Elektronik zur kontaktlosen Übertragung von elektrischen Signalen an die Lese- bzw. Schreibstation aufwendiger. Im Prinzip geeignet hierfür sind Schaltungen, die eine Signalüber- tragung mittels Mikrowellen, optischer Signale, kapazitiver oder induktiver Kopplung ermöglichen, wobei sich wegen der flachen Bauform der Chipkarte am ehesten die kapazitive und die induktive Kopplung eignen. Derzeit erfolgt bei den meisten kontaktlosen Karten die Übertragung auf induktivem Wege, mit dem sich sowohl die Daten wie auch die Energieübertragung realisieren lassen. So sind im Kartenkörper eine oder mehrere Induktionsspulen integriert ausgebildet, die auf geeignete Weise mit der auf dem Halbleiterchip befindlichen Schaltung kontaktiert sind. Die Übertragung von elektrischen Signalen erfolgt nach dem Prinzip des lose gekoppelten Transformators, wobei die Trägerfrequenz beispielsweise im Bereich zwischen 100 und 300 kHz oder bei einigen MHz, insbesondere der Industriefrequenz von 13,56 MHz liegt. Hierfür werden Induktionsspulen mit einem gegenüber der Grundfläche des Halbleiter- chips von in der Größenordnung etwa 10 mm2 wesentlich größeren Spulenflächen von typischerweise etwa 30 bis 40 cm2 benötigt, wobei die Induktionsspule in der Regel nur wenige Windungen aufweist und flach ausgebildet ist. In der Regel werden die Halbleiterbauelemente in Form von vorgefertigten Mo- dulen oder direkt als Chip auf die geätzte Spule montiert, anschließend wird das als separates Bauteil vorliegende Chipmodul samt der Induktionsspule zur Fertigstellung der Chip- karte in den Kartenkörper einlaminiert, wobei für den Volumenausgleich beim Laminieren gegebenenfalls mit Ausstanzungen versehene Zwischenfolien als Inlettfolien eingebracht werden.Chip cards have advantages over contact-based chip cards in that the former are not necessarily in a reading or Must be plugged in, but function without contact over a distance of up to a few meters. In addition to other advantages, the contactless chip card offers the advantage that no technical elements are visible on the card surface, so that the optical design of the card surface is not restricted by magnetic strips or contact areas. The disadvantages of the contactless chip cards currently available are primarily the additional components, such as transmission coils or capacitor plates, which have to be integrated into the card. In addition, the electronics required in the contactless chip card for the contactless transmission of electrical signals to the reading or writing station are more complex. In principle, circuits are suitable for this purpose which enable signal transmission by means of microwaves, optical signals, capacitive or inductive coupling, the capacitive and inductive coupling being the most suitable due to the flat design of the chip card. Most contactless cards are currently being transmitted inductively, which can be used to implement both data and energy transmission. One or more induction coils are thus integrated in the card body and are suitably contacted with the circuit located on the semiconductor chip. The transmission of electrical signals is based on the principle of the loosely coupled transformer, the carrier frequency being, for example, in the range between 100 and 300 kHz or a few MHz, in particular the industrial frequency of 13.56 MHz. For this purpose induction coils with an opposite to the bottom surface of the semiconductor chips of the order about 10 mm 2 substantially larger coil areas of typically from about 30 to 40 cm 2 is required, the induction coil having as a rule only a few turns and is formed flat. As a rule, the semiconductor components are mounted in the form of prefabricated modules or directly as a chip on the etched coil. The card is laminated into the card body, with intermediate foils, if necessary provided with punched-outs, being inserted as ticking foils for the purpose of volume compensation during lamination.
Die bisher verwendeten kontaktlosen Chipkarten wurden ausnahmslos mit Vollkunststoffmaterialien und überwiegend in äußeren Abmessungen hergestellt, die den ISO-Standardmaßen entsprechen. Kennzeichnend für diese Standardvorgaben ist darüber hinaus eine hohe mechanische Flexibilität des Kartenkör- pers, welche jedoch besondere Maßnahmen zum Schutz des gegenüber Biege- oder Torsionsbeanspruchungen sehr empfindlichen Halbleiterchips bedingen, welche in einem aufwendigen und folglich kostenintensiven Herstellungs- und Montageaufwand der kontaktlosen Chipkarte resultieren. Die nach ISO-Standard zu fertigenden kontaktlosen Chipkarten bestehen aus Kunststoff-Einzelschichten, die aufeinander laminiert werden. Aufwendig ist hierbei insbesondere die Fertigung des in der Regel aus sechs bis sieben Kunststofflagen bestehenden Kartenaufbaus und die sich hieran anschließende Oberflächengestal- tung hinsichtlich Beschriftung und Versehen mit einer Überzugsschicht. Die damit verbundenen hohen Herstellungskosten solcher kontaktlosen Chipkarten können in der Regel nicht von allen gewünschten Anwendungen getragen werden.The contactless chip cards used so far were all made with all-plastic materials and mostly in outer dimensions that correspond to the ISO standard dimensions. Characteristic of these standard specifications is furthermore a high mechanical flexibility of the card body, which, however, requires special measures to protect the semiconductor chip, which is very sensitive to bending or torsional stress, which results in a complex and consequently costly production and assembly effort for the contactless chip card. The contactless chip cards, which are to be manufactured according to the ISO standard, consist of individual plastic layers that are laminated on top of each other. The production of the card structure, which generally consists of six to seven plastic layers, and the subsequent surface design with regard to labeling and provision of a coating layer are particularly complex. The associated high manufacturing costs of such contactless chip cards cannot usually be borne by all desired applications.
Der vorliegenden Erfindung liegt die Aufgabe zugrunde, einenThe present invention has for its object a
Datenträger zur Übertragung von elektrischen Signalen an eine Lese- bzw. Schreibstation zur Verfügung zu stellen, welche gegenüber den bisherigen kontaktlosen Chipkarten mit Kunst- stoffkörpern wesentlich kostengünstiger hergestellt werden kan .To provide data carriers for the transmission of electrical signals to a reading or writing station, which can be manufactured much more cost-effectively than the previous contactless chip cards with plastic bodies.
Diese Aufgabe wird durch einen Datenträger gemäß Anspruch 1 gelöst .This object is achieved by a data carrier according to claim 1.
Erfindungsgemäß ist vorgesehen, dass der Datenträgerkörper zwei Pappe- oder Papierlagen aufweist, zwischen denen ein den Halbleiterchip wenigstens teilweise umgebendes Versteifungse- lement eingebracht ist. Dem Prinzip der Erfindung folgend ist das Versteifungselement wenigstens bereichsweise durch die Windungen der Induktionsspule ausgebildet.According to the invention, it is provided that the data carrier body has two cardboard or paper layers, between which a stiffening at least partially surrounding the semiconductor chip element is introduced. Following the principle of the invention, the stiffening element is formed at least in regions by the turns of the induction coil.
Abweichend von den ISO-Standardvorgaben wird ein äußerst preiswert herzustellender Datenträger gewissermaßen im Sinne einer Billig-Chipkarte vorgeschlagen, welche auf den Voll- kunststoffkörper verzichtet. Darüber hinaus kann die Gesamtstärke des erfindungsgemäßen Datenträgers gegenüber den ISO-Standardvorgaben heraufgesetzt sein, so dass besondere Maßnahmen zum Schutz des Halbleiterchips, wie sie bei den bisherigen Chipkarten nach ISO-Standard erforderlich sind, weggelassen werden können.Deviating from the ISO standard specifications, a data carrier that can be manufactured extremely inexpensively is proposed in the sense of a low-cost chip card that does without the all-plastic body. In addition, the overall strength of the data carrier according to the invention can be increased compared to the ISO standard specifications, so that special measures for protecting the semiconductor chip, as are required in the previous chip cards according to the ISO standard, can be omitted.
Bei einer besonders bevorzugten Ausführung der Erfindung ist vorgesehen, dass die ohnehin vorgesehenen Windungen der zwischen den beiden Pappe- oder Papierlagen eingebrachten Induktionsspule in gleicher Bauhöhe und in gleicher Montageebene wie der Halbleiterchip bzw. das Halbleiterchipgehäuse ange- ordnet ist und somit gleichzeitig als Versteifungselement zumIn a particularly preferred embodiment of the invention, it is provided that the windings of the induction coil inserted between the two cardboard or paper layers are arranged at the same height and at the same mounting level as the semiconductor chip or the semiconductor chip housing and thus at the same time as a stiffening element
Schutz des Halbleiterchips vor mechanischen Belastungen dient. Zur Gewährleistung einer ausreichend hohen mechanischen Steifigkeit besitzen die aus Lackdraht bestehenden Windungen der Induktionsspule einen Durchmesser von wenigstens 200 μm, insbesondere vorzugsweise von wenigstens 500 μm.Protection of the semiconductor chip against mechanical loads. To ensure a sufficiently high mechanical rigidity, the turns of the induction coil, which are made of enamelled wire, have a diameter of at least 200 μm, in particular preferably of at least 500 μm.
Weiterhin kann vorgesehen sein, dass der zwischen den beiden Pappe- oder Papierlagen eingebrachten Induktionsspule ein Spulenkern, insbesondere Ferritkern zugeordnet ist, welcher den Halbleiterchip bzw. ein Halbleiterchipgehäuse wenigstens teilweise umgibt bzw. wenigstens annähernd formschlüssig aufnimmt , und dessen Bauhöhe und Montageebene wiederum der des Halbleiterchips bzw. des Halbleiterchipgehäuses entspricht. Der Spulenkern dient hierbei ebenso wie die aus Dickdraht ge- fertigten Windungen der Induktionsspule als Versteifungselement für einen mechanischen Schutz des Halbleiterchips. Insgesamt ist der erfindungsgemäße Datenträger im Unterschied zu vorbekannten Vollkunststoff-Chipkarten deutlich biegesteifer, wodurch sich besondere SchutzVorkehrungen des Halbleiterchipε gegenüber mechanischen Belastungen erübrigen.Furthermore, it can be provided that the induction coil inserted between the two cardboard or paper layers is assigned a coil core, in particular ferrite core, which at least partially surrounds the semiconductor chip or a semiconductor chip housing or at least approximately positively accommodates it, and its overall height and mounting level in turn that of the semiconductor chip or the semiconductor chip housing corresponds. The coil core, like the turns of the induction coil made of thick wire, serves as a stiffening element for mechanical protection of the semiconductor chip. Overall, the data carrier according to the invention differs from Known all-plastic chip cards are significantly more resistant to bending, making special protective measures for the semiconductor chip against mechanical loads unnecessary.
Bei einer weiterhin bevorzugten Ausführung kann vorgesehen sein, dass die beiden Pappe- oder Papierlagen des Datenträgerkörpers auf ihrer jeweils dem Halbleiterchip zugewandten Oberfläche mit einer Klebe- bzw. Haftschicht versehen sind. Die Klebe- bzw. Haftschicht dient hierbei sowohl zur Montage des Datenträgerkörpers und der darin einzubringenden Bestandteile, als auch zum Ausgleich von Höhendifferenzen der einzelnen Bestandteile. Vorzugsweise wird für die Klebe- und Haftschicht eine mehr als etwa 20 μm starke, kaltklebende Schicht verwendet.In a further preferred embodiment it can be provided that the two cardboard or paper layers of the data carrier body are provided with an adhesive or adhesive layer on their surface facing the semiconductor chip. The adhesive or adhesive layer is used both to assemble the data carrier body and the components to be inserted therein, and to compensate for differences in height of the individual components. A more than about 20 μm thick, cold-adhesive layer is preferably used for the adhesive and adhesive layer.
Weiterhin kann vorgesehen sein, dass am Randbereich des Datenträgerkörpers ein zwischen den beiden Pappe- oder Papierlagen eingebrachter Stützrahmen vorgesehen ist.Furthermore, it can be provided that a support frame inserted between the two cardboard or paper layers is provided at the edge region of the data carrier body.
Bei der Herstellung eines insbesondere bevorzugten Datenträgers gemäß der Erfindung wird zunächst ein Spulen- bzw. Ferritkern mit einer Bauhöhe von vorzugsweise 500 μm mit Lackdraht umwickelt, welcher ebenfalls eine Dicke von etwa 500 μm besitzt. Der mit der integrierten elektronischen Schaltung versehene Halbleiterchip wird in einem für Halbleiterchips typischen Modulgehäuse bestehend aus einem Leadframe und einer Overmold-Pressmasse eingebaut. Anschließend wird das Halbleiterchipgehäuse formschlüssig in den Spulenkern eingelassen, der zu diesem Zweck mit einer geeignet ausgebildeten Aufnahmeöffnung versehen ist. Die Gesamtstärke des Modulgehäuses beträgt wiederum vorzugsweise etwa 500 μm. Nach dem Wickeln des Lackdrahtes, der elektrischen Verbindung der blanken Drahtenden mit dem Leadframe kann der Spulenkern zur weiteren Erhöhung der Steifigkeit mit einem zusätzlichen Stützrahmen mit einer Bauhöhe von ebenfalls etwa 500 μm umgeben werden. Der auf diese Weise gefertigte Rohling bestehend aus Chipmodul, Spulenkern und Windungen der Induktionsspule In the production of a particularly preferred data carrier according to the invention, a coil or ferrite core with a height of preferably 500 μm is first wrapped with enamelled wire, which likewise has a thickness of approximately 500 μm. The semiconductor chip provided with the integrated electronic circuit is installed in a module housing, which is typical for semiconductor chips and consists of a lead frame and an overmold molding compound. The semiconductor chip housing is then positively inserted into the coil core, which is provided with a suitably designed receiving opening for this purpose. The total thickness of the module housing is again preferably approximately 500 μm. After winding the enamelled wire and the electrical connection of the bare wire ends to the lead frame, the coil core can be surrounded with an additional support frame with a height of about 500 μm to further increase the rigidity. The blank produced in this way, consisting of a chip module, coil core and turns of the induction coil

Claims

Patentansprüche claims
1. Datenträger zur kontaktlosen Übertragung von elektrischen Signalen an eine Lese- bzw. Schreibstation mit einem Datenträgerkörper (2) , in welchem ein Halbleiterchip (3) mit einer integrierten elektronischen Schaltung ausgebildet ist, und wenigstens einer, der integrierten elektronischen Schaltung des Halbleiterchips (3) zugeordneten, innerhalb des Datenträ- gerkörpers (2) eingebrachten Induktionsspule mit einem gegenüber den äußeren Abmessungen des Halbleiterchips (3) größeren Spulenumfang, d a d u r c h g e k e n n z e i c h n e t, dass der Datenträgerkörper (2) zwei Pappe- oder Papierlagen (6, 7) aufweist, zwischen denen ein den Halbleiterchip (3) wenigstens teilweise umgebendes, wenigstens bereichsweise durch die Windungen (13, 14) der Induktionsspule ausgebildetes Versteifungselement (8) eingebracht ist.1. Data carrier for contactless transmission of electrical signals to a reading or writing station with a data carrier body (2), in which a semiconductor chip (3) is formed with an integrated electronic circuit, and at least one, the integrated electronic circuit of the semiconductor chip (3 ) assigned, introduced within the data carrier body (2) induction coil with a larger coil size compared to the outer dimensions of the semiconductor chip (3), characterized in that the data carrier body (2) has two cardboard or paper layers (6, 7), between which one the stiffening element (8) which is at least partially surrounding the semiconductor chip (at least in some areas) is formed by the windings (13, 14) of the induction coil.
2. Datenträger nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t, dass die Windungen (13, 14) der zwischen den beiden Pappe- oder Papierlagen (6, 7) eingebrachten Induktionsspule in gleicher Bauhöhe und in gleicher Montageebene wie der ungehäuste bzw. gehäuste Halbleiterchip angeordnet sind.2. Data carrier according to claim 1, so that the windings (13, 14) of the induction coil inserted between the two cardboard or paper layers (6, 7) are arranged at the same height and at the same mounting level as the unhoused or packaged semiconductor chip.
3. Datenträger nach Anspruch 1 oder 2 , d a d u r c h g e k e n n z e i c h n e t, dass die Windungen (13, 14) der Induktionsspule aus Lackdraht be- stehen.3. Data carrier according to claim 1 or 2, so that the windings (13, 14) of the induction coil consist of enamelled wire.
4. Datenträger nach einem der Ansprüche 1 bis 3, d a d u r c h g e k e n n z e i c h n e t, dass das Versteifungselement des weiteren durch einen Spulenkern (11) ausgebildet ist, welcher den ungehäusten bzw. gehäusten Halbleiterchip (3) wenigstens teilweise umgibt bzw. wenigstens annähernd formschlüssig aufnimmt, und dessen Bauhöhe und Montageebene wiederum der des ungehäusten bzw. gehäusten Halbleiterchips (3) entspricht.4. Data carrier according to one of claims 1 to 3, characterized in that the stiffening element is further formed by a coil core (11) which at least partially surrounds the unhoused or packaged semiconductor chip (3) or at least approximately form-fitting, and its height and assembly level in turn corresponds to that of the unhoused or packaged semiconductor chip (3).
5. Datenträger nach Anspruch 4, d a d u r c h g e k e n n z e i c h n e t, dass der Spülenkern (11) einen Ferritkern darstellt., welcher den5. Data carrier according to claim 4, so that the sink core (11) represents a ferrite core., Which represents the
Halbleiterchip (3) bzw. das Halbleiterchipgehäuse wenigstens teilweise umgibt, und dessen Bauhöhe der des HalbleiterchipsSemiconductor chip (3) or the semiconductor chip housing at least partially surrounds, and the overall height of that of the semiconductor chip
(3) bzw. des Halbleiterchipgehäuses entspricht.(3) or the semiconductor chip housing corresponds.
6. Datenträger nach einem der Ansprüche 1 bis 5, d a d u r c h g e k e n n z e i c h n e t, dass die Windungen (13, 14) der Induktionsspule einen Durchmesser von wenigstens 200 μm, vorzugsweise wenigstens 500 μm besit- zen.6. Data carrier according to one of claims 1 to 5, so that the windings (13, 14) of the induction coil have a diameter of at least 200 μm, preferably at least 500 μm.
7. Datenträger nach einem der Ansprüche 1 bis 6, d a d u r c h g e k e n n z e i c h n e t, dass die beiden Pappe- oder Papierlagen (6, 7) des Datenträgerkör- pers auf ihrer jeweils dem Halbleiterchip (3) zugewandten7. Data carrier according to one of claims 1 to 6, that the two cardboard or paper layers (6, 7) of the data carrier body face the semiconductor chip (3)
Oberfläche mit einer Klebe- bzw. Haftschicht (9, 10) versehen sind.Surface are provided with an adhesive or adhesive layer (9, 10).
8. Datenträger nach einem der Ansprüche 1 bis 7, d a d u r c h g e k e n n z e i c h n e t, dass am Randbereich des Datenträgerkörpers ein zwischen den beiden Pappe- oder Papierlagen (6, 7) eingebrachter Stützrahmen (19) vorgesehen ist . 8. Data carrier according to one of claims 1 to 7, so that a support frame (19) is provided between the two cardboard or paper layers (6, 7) at the edge region of the data carrier body.
EP97935432A 1996-08-08 1997-07-16 Data medium for transmission of electrical signals Withdrawn EP0978094A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19632117A DE19632117C1 (en) 1996-08-08 1996-08-08 Chip card for use with read/write station
DE19632117 1996-08-08
PCT/DE1997/001503 WO1998007114A1 (en) 1996-08-08 1997-07-16 Data medium for transmission of electrical signals

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EP0978094A1 true EP0978094A1 (en) 2000-02-09

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KR (1) KR20000029797A (en)
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BR (1) BR9711618A (en)
DE (1) DE19632117C1 (en)
WO (1) WO1998007114A1 (en)

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JP2000516362A (en) 2000-12-05
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KR20000029797A (en) 2000-05-25
WO1998007114A1 (en) 1998-02-19
BR9711618A (en) 1999-08-24

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