EP0969512B1 - Inductive sensor - Google Patents
Inductive sensor Download PDFInfo
- Publication number
- EP0969512B1 EP0969512B1 EP98112052A EP98112052A EP0969512B1 EP 0969512 B1 EP0969512 B1 EP 0969512B1 EP 98112052 A EP98112052 A EP 98112052A EP 98112052 A EP98112052 A EP 98112052A EP 0969512 B1 EP0969512 B1 EP 0969512B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- coil
- transistors
- transistor
- collector
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001939 inductive effect Effects 0.000 title claims description 9
- 239000000758 substrate Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000005669 field effect Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
Definitions
- the present invention relates generally to a microstructure comprising an integrated circuit in a substrate at a lower or upper face of which is arranged a planar coil, in particular a spirally wound coil galvanically deposited on a passivation layer provided on the surface of this coil. substrate. More particularly, the invention relates to an inductive sensor according to claim 1.
- the document JP 08088324 shows a device comprising a coil and a field effect transistor (FET) which are arranged in such a way that the magnetic field generated by the coil is perpendicular to the source-drain direction of the FET and a Lorentz force acts on the electrons in the channel to confine the electrons in the channel and thus eliminate a short channel effect.
- FET field effect transistor
- the subject of the invention is an inductive sensor comprising an electronic circuit integrated in a semiconductor substrate and a planar coil formed by a conductive wire or a conductive track extending in a spiral. , this coil being arranged at an upper or lower face of this semiconductor substrate, said electronic circuit comprising a comparator having as input a first connection to a reference circuit and a second connection to said coil, said first and second connections being respectively connected to two control electrodes of two input transistors forming said comparator, these two input transistors being each formed by two regions respectively defining a source and a collector between which a current is generated as a function of the electrical state of the transistor in question, this inductive sensor being characterized in that at least the two input transistors are superimposed on the surface defined by said planar coil, and in that they are arranged so that said source and said collector of each of them are aligned in a direction substantially perpendicular to a portion of said conductive wire or conductive track which is located near the
- the magnetic field generated by the plane coil is parallel to the alignment of the source and the collector of each of the two input transistors of the comparator which have a high sensitivity.
- the electrons forming the electric currents flowing in these transistors between their sources and their collectors not undergoing a Lorentz force and, in the case of field effect transistors (FETs), the channel depth between the source and the collector is not affected by the presence of the coil superimposed on the electronic circuit integrated in the substrate serving to support this coil.
- the inductive sensor 2 comprises a semiconductor substrate 4 in which is integrated an electronic circuit formed by a plurality of transistors 6. At an upper face of the substrate 4 is arranged a plane coil 10 and contact pads 12. A figure 2 the coil 14 is arranged on the upper surface 8 and is covered by a passivation or protection layer which has not been shown in FIG. figure 1 .
- the coil 10 is formed by a conductive wire or track 14 which develops in a spiral. In the variant shown here, the coil 10 thus extends in a spiral on one and the same plane. However, it is possible to provide a planar coil arranged on several levels separated by passivation layers.
- the coil may be obtained by various methods known to those skilled in the art, in particular by deposition of a metal layer under vacuum, as in the case of the figure 2 , or by a galvanic process, as for the embodiment variant shown in FIG. figure 3 .
- the coil 10 defines a surface 16 (hatched surface of the figure 1 ).
- the electronic circuit forming the sensor 2 is integrated in the substrate 4 inside the region 18 defined by a dashed line.
- the surface 16 is located inside the region 18, in superposition according to a plan view from above ( figure 1 ). At least some transistors of the plurality of transistors forming the electronic circuit of the sensor 2 and the surface 16 defined by the coil 10 are superimposed on each other.
- the transistors which have a high sensitivity by working at relatively low electric current, among the transistors superimposed on the surface 16, are arranged so that the source 20 and the collector 22 of each of them are aligned in a direction 24 corresponding to the direction of the electric current I generated in the transistor 6 between the source 20 and the collector 22 as a function of the electrical state of the transistor 6. This direction is perpendicular to the portion 26 of the conductive wire or track 14 located near this transistor 6.
- the transistor 6 is a field effect transistor (FET) in which a channel 28 of variable depth is generated between the source 20 and the collector 22 as a function of the electrical state applied to the control electrode 30 defining the gate of this transistor 6.
- FET field effect transistor
- the source 20 and the collector 22 are respectively associated with two electrodes 32 and 34.
- the current I flowing in the channel 28 is substantially parallel to the magnetic field B generated by the coil 10 at the channel 28.
- the coil is spirally wound in rectilinear segments defining a square or rectangular profile at the winding of the coil.
- four regions of the surface 16 can be defined in which the wire or metallized track 14 defines a set of linear segments parallel to each other.
- the sensitive transistors of the integrated circuit are each superimposed on only one of these four regions, at a distance from the half-diagonals.
- the direction of the magnetic field B passing through the transistor is thus well defined and substantially perpendicular to the direction of the linear segments of the wire or track 14. This ensures that the magnetic field B is substantially parallel to the electric current I in the transistor 6 of which the channel 28 is perpendicular to the portion 26 of the coil 10.
- the electric wire 14 of the coil 10 is obtained in particular by a galvanic bath.
- This wire 14 having a width L F of several micrometers ( ⁇ m).
- the length L T of the transistor 6 is smaller than the width L F of the wire 14.
- each transistor 6 of the set of transistors superimposed on the surface 26 defined by the coil 10 and having a large sensitivity are arranged so that each of them is located under the wire 14. Since the magnetic field produced by a single segment of the coil 10 is circular around this segment, the resulting magnetic field in the vicinity of this segment is substantially parallel to the direction defined by the channel 28 between the source 20 and the collector 22 of the transistor 6 located under the wire 14.
- FIG. 4 represents the general electronic diagram of a differential relaxation oscillator comprising a reference circuit 40, a detection circuit 42 comprising the coil 10 electrically defined by an inductance L C and a resistor R C.
- a comparator 44 has at its input a first connection 46 to the reference circuit 40 and a second connection 48 to the detection circuit 42.
- the electronic circuit forming the comparator 44 which has cascaded current mirrors and cascaded amplification stages, is shown in greater detail.
- the connections 46 and 48 are respectively connected to two control electrodes 50 and 52 of two input transistors 54 and 56.
- These two input transistors 54 and 56 are particularly sensitive when working with electric currents. relatively weak.
- at least these two transistors 54 and 56 are arranged in such a way that the direction of the electric current flowing in the channel between the source and the collector of these transistors is perpendicular to the direction of the wire of the coil located near the these transistors.
- these two transistors 54 and 56 are arranged according to the preferred variant of the figure 3 .
- the person skilled in the art can also arrange other transistors shown in FIG. figure 5 similarly to the input transistors 54 and 56, i.e. in an orientation defined by the present invention.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
- Coils Or Transformers For Communication (AREA)
- Measuring Magnetic Variables (AREA)
Description
La présente invention se rapporte d'une façon générale à une microstructure comprenant un circuit intégré dans un substrat à une face inférieure ou supérieure duquel est agencée une bobine plane, notamment une bobine en spirale déposée galvaniquement sur une couche de passivation prévue en surface de ce substrat. Plus particulièrement, l'invention concerne un capteur inductif selon la revendication 1.The present invention relates generally to a microstructure comprising an integrated circuit in a substrate at a lower or upper face of which is arranged a planar coil, in particular a spirally wound coil galvanically deposited on a passivation layer provided on the surface of this coil. substrate. More particularly, the invention relates to an inductive sensor according to claim 1.
Le document
Dans le cadre de la présente invention, il a été prévu, afin de réduire au maximum les dimensions de la microstructure développée, de superposer au moins partiellement ladite bobine plane avec ledit circuit électronique susmentionné. Cependant, dans le cadre du développement de cette microstructure aux dimensions réduites, l'inventeur a observé que le champ magnétique engendré par la bobine plane avait une influence sur certains transistors sensibles du circuit électronique intégré sous la surface définie par la bobine plane. En particulier, les transistors sensibles sont ceux qui travaillent avec un courant relativement faible.In the context of the present invention, it has been provided, in order to minimize the dimensions of the developed microstructure, at least partially superimpose said planar coil with said aforementioned electronic circuit. However, in the context of the development of this microstructure with reduced dimensions, the inventor observed that the magnetic field generated by the plane coil had an influence on some sensitive transistors of the integrated electronic circuit under the surface defined by the plane coil. In particular, sensitive transistors are those that work with a relatively low current.
Pour répondre à ce problème détecté dans le cadre de la présente invention, l'invention a pour objet un capteur inductif comprenant un circuit électronique intégré dans un substrat semiconducteur et une bobine plane formée par un fil conducteur ou une piste conductrice s'étendant en spirale, cette bobine étant agencée à une face supérieure ou inférieure de ce substrat semiconducteur, ledit circuit électronique comprenant un comparateur ayant en entrée une première connexion à un circuit de référence et une deuxième connexion à ladite bobine, ces première et deuxième connexions étant reliées respectivement à deux électrodes de commande de deux transistors d'entrée formant ce comparateur, ces deux transistors d'entrée étant chacun formés par deux régions définissant respectivement une source et un collecteur entre lesquels un courant est engendré en fonction de l'état électrique du transistor considéré, ce capteur inductif étant caractérisé en ce qu'au moins les deux transistors d'entrée sont superposés à la surface définie par ladite bobine plane, et en ce qu'ils sont agencés de manière que ladite source et ledit collecteur de chacun d'eux sont alignés selon une direction sensiblement perpendiculaire à une partie dudit fil conducteur ou de ladite piste conductrice qui est située à proximité du transistor d'entrée considéré.In order to respond to this problem detected in the context of the present invention, the subject of the invention is an inductive sensor comprising an electronic circuit integrated in a semiconductor substrate and a planar coil formed by a conductive wire or a conductive track extending in a spiral. , this coil being arranged at an upper or lower face of this semiconductor substrate, said electronic circuit comprising a comparator having as input a first connection to a reference circuit and a second connection to said coil, said first and second connections being respectively connected to two control electrodes of two input transistors forming said comparator, these two input transistors being each formed by two regions respectively defining a source and a collector between which a current is generated as a function of the electrical state of the transistor in question, this inductive sensor being characterized in that at least the two input transistors are superimposed on the surface defined by said planar coil, and in that they are arranged so that said source and said collector of each of them are aligned in a direction substantially perpendicular to a portion of said conductive wire or conductive track which is located near the input transistor considered.
Grâce à ces caractéristiques, le champ magnétique engendré par la bobine plane est parallèle à l'alignement de la source et du collecteur de chacun des deux transistors d'entrée du comparateur qui présentent une grande sensibilité. Ainsi, les électrons formant les courants électriques circulant dans ces transistors entre leurs sources et leurs collecteurs ne subissant pas de force de Lorentz et, dans le cas de transistors à effet de champ (FET), la profondeur du canal entre la source et le collecteur n'est pas affectée par la présence de la bobine superposée au circuit électronique intégré dans le substrat servant de support à cette bobine.Thanks to these characteristics, the magnetic field generated by the plane coil is parallel to the alignment of the source and the collector of each of the two input transistors of the comparator which have a high sensitivity. Thus, the electrons forming the electric currents flowing in these transistors between their sources and their collectors not undergoing a Lorentz force and, in the case of field effect transistors (FETs), the channel depth between the source and the collector is not affected by the presence of the coil superimposed on the electronic circuit integrated in the substrate serving to support this coil.
La présente invention sera décrite ci-après plus en détail à l'aide des figures données à titre d'exemple nullement limitatif, dans lesquels :
- la
figure 1 est une vue en plan d'un capteur inductif selon l'invention; - la
figure 2 est une vue en coupe selon la ligne II-II de lafigure 1 ; - la
figure 3 est une vue en coupe similaire à lafigure 2 d'une variante préférée de réalisation de l'invention, et - les
figures 4 et 5 sont deux schémas décrivant le circuit électronique d'un capteur inductif formé par un oscillateur à relaxation différentielle.
- the
figure 1 is a plan view of an inductive sensor according to the invention; - the
figure 2 is a sectional view along line II-II of thefigure 1 ; - the
figure 3 is a sectional view similar to thefigure 2 a preferred embodiment of the invention, and - the
Figures 4 and 5 are two diagrams describing the electronic circuit of an inductive sensor formed by a differential relaxation oscillator.
A l'aide des
La bobine 10 est formée par un fil conducteur ou une piste conductrice 14 qui se développe en spirale. Dans la variante représentée ici, la bobine 10 s'étend donc en spirale sur un seul et même plan. Toutefois, il est possible de prévoir une bobine plane agencée sur plusieurs niveaux séparés par des couches de passivation. La bobine peut être obtenue par divers procédés connus de l'homme du métier, notamment par dépôt d'une couche métallique sous vide, comme dans le cas de la
La bobine 10 définit une surface 16 (surface hachurée de la
Le transistor 6 est un transistor à effet de champ (FET) dans lequel un canal 28 d'une profondeur variable est engendré entre la source 20 et le collecteur 22 en fonction de l'état électrique appliqué à l'électrode de commande 30 définissant la grille de ce transistor 6. On remarquera que la source 20 et le collecteur 22 sont associés respectivement à deux électrodes 32 et 34. Selon l'invention, le courant I circulant dans le canal 28 est sensiblement parallèle au champ magnétique B engendré par la bobine 10 au niveau du canal 28. Ainsi, il n'y a quasi aucune force de Lorentz sur les électrons qui se déplacent entre la source et le collecteur du transistor.The
On remarquera à la
A la
Aux
Aux
A la
Lors de l'établissement du plan du circuit intégré, l'homme du métier peut également agencer d'autres transistors représentés à la
Claims (3)
- Inductive sensor (2) including an electronic circuit integrated in a semiconductor substrate (4) and a flat coil (10) formed by a conductive wire (14) or a conductive path (14) extending in a spiral, this coil being arranged on an upper (8) or lower face of said semiconductor substrate, said electronic circuit including a comparator (44) having at its inputs a first connection (46) to a reference circuit (40) and a second connection (48) to said coil (10), these first and second connections being respectively connected to two control electrodes (50, 52) of two input transistors (54, 56) of said comparator, each of these two input transistors being formed by two regions defining respectively a source (20) and a collector (22) between which a current (I) is generated as a function of the electric state of the transistor, this inductive sensor being characterised in that at least the two input transistors and the surface (26) defined by said flat coil (10) are superposed, and in that they are arranged so that said source and said collector of each of them are aligned along a direction approximately perpendicular to a portion of said conductive wire or said conductive path situated in proximity to the respective input transistor so that the magnetic field (B) generated by said flat coil (10) is substantially parallel to the direction defined by the source (20) and the collector (22) of this respective input transistor.
- Sensor according to claim 1, characterised in that said input transistors are formed by field effect transistors (FET).
- Sensor according to claim 1 or 2, characterised in that each input transistor is substantially arranged under a portion of said wire (14) or said path of said coil (10).
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE69840827T DE69840827D1 (en) | 1998-06-30 | 1998-06-30 | Inductive sensor |
EP98112052A EP0969512B1 (en) | 1998-06-30 | 1998-06-30 | Inductive sensor |
TW088109838A TW405250B (en) | 1998-06-30 | 1999-06-11 | Microstructure including a circuit integrated in a substrate on one surface of which is arranged a flat coil |
CNB991089251A CN1169221C (en) | 1998-06-30 | 1999-06-29 | Microstructure including circuit integrated in substrate on one surface of which is arranged flat coil |
JP18334299A JP4279409B2 (en) | 1998-06-30 | 1999-06-29 | Microstructure containing circuitry integrated on a substrate with a flat coil on the surface |
US09/342,226 US6194961B1 (en) | 1998-06-30 | 1999-06-29 | Microstructure including a circuit integrated in a substrate on one surface of which is arranged a flat coil |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP98112052A EP0969512B1 (en) | 1998-06-30 | 1998-06-30 | Inductive sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0969512A1 EP0969512A1 (en) | 2000-01-05 |
EP0969512B1 true EP0969512B1 (en) | 2009-05-13 |
Family
ID=8232195
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP98112052A Expired - Lifetime EP0969512B1 (en) | 1998-06-30 | 1998-06-30 | Inductive sensor |
Country Status (6)
Country | Link |
---|---|
US (1) | US6194961B1 (en) |
EP (1) | EP0969512B1 (en) |
JP (1) | JP4279409B2 (en) |
CN (1) | CN1169221C (en) |
DE (1) | DE69840827D1 (en) |
TW (1) | TW405250B (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6759746B1 (en) * | 2000-03-17 | 2004-07-06 | Robert Bruce Davies | Die attachment and method |
US6864558B2 (en) * | 2001-05-17 | 2005-03-08 | Broadcom Corporation | Layout technique for C3MOS inductive broadbanding |
US7148553B1 (en) | 2001-08-01 | 2006-12-12 | Davies Robert B | Semiconductor device with inductive component and method of making |
US6999339B2 (en) * | 2003-04-22 | 2006-02-14 | Micron Technology, Inc. | Integrated circuit including sensor to sense environmental data, method of compensating an MRAM integrated circuit for the effects of an external magnetic field, MRAM integrated circuit, and method of testing |
WO2004102665A1 (en) * | 2003-05-14 | 2004-11-25 | Ericsson Technology Licensing Ab | High-density circuits that include inductors |
JP2005006153A (en) * | 2003-06-13 | 2005-01-06 | Nec Electronics Corp | Voltage controlled oscillator |
US7268409B2 (en) * | 2004-05-21 | 2007-09-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Spiral inductor with electrically controllable resistivity of silicon substrate layer |
DE102005050484B4 (en) * | 2005-10-21 | 2010-01-28 | Atmel Automotive Gmbh | Monolithically integrated circuit arrangement |
US7622910B2 (en) * | 2006-10-06 | 2009-11-24 | Honeywell International Inc. | Method and apparatus for AC integrated current sensor |
JP5442950B2 (en) | 2008-01-29 | 2014-03-19 | ルネサスエレクトロニクス株式会社 | Semiconductor device, manufacturing method thereof, signal transmission / reception method using the semiconductor device, and tester device |
CN111430372B (en) * | 2020-03-31 | 2022-08-02 | 厦门天马微电子有限公司 | Array substrate, display panel and display device |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4157563A (en) * | 1971-07-02 | 1979-06-05 | U.S. Philips Corporation | Semiconductor device |
JPS60182175A (en) * | 1984-02-28 | 1985-09-17 | Matsushita Electronics Corp | Semiconductor device for signal switching |
DE3727142C2 (en) * | 1987-08-14 | 1994-02-24 | Kernforschungsz Karlsruhe | Process for the production of microsensors with integrated signal processing |
JPH0377360A (en) * | 1989-08-18 | 1991-04-02 | Mitsubishi Electric Corp | Semiconductor device |
WO1994017558A1 (en) * | 1993-01-29 | 1994-08-04 | The Regents Of The University Of California | Monolithic passive component |
US5416356A (en) * | 1993-09-03 | 1995-05-16 | Motorola, Inc. | Integrated circuit having passive circuit elements |
JP3400853B2 (en) * | 1994-04-27 | 2003-04-28 | 三菱電機株式会社 | Semiconductor device |
JPH0888324A (en) * | 1994-09-19 | 1996-04-02 | Matsushita Electric Ind Co Ltd | Semiconductor device and its manufacture |
US5880506A (en) * | 1994-10-28 | 1999-03-09 | Siemens Aktiengesellschaft | Solid-state switching element with two source electrodes and solid-state switch with such an element |
US5483207A (en) * | 1994-12-30 | 1996-01-09 | At&T Corp. | Adiabatic MOS oscillators |
JPH09200031A (en) * | 1996-01-19 | 1997-07-31 | Canon Inc | Complementary transistor output circuit |
US5952893A (en) * | 1998-03-06 | 1999-09-14 | International Business Machines Corporation | Integrated circuit inductors for use with electronic oscillators |
-
1998
- 1998-06-30 DE DE69840827T patent/DE69840827D1/en not_active Expired - Lifetime
- 1998-06-30 EP EP98112052A patent/EP0969512B1/en not_active Expired - Lifetime
-
1999
- 1999-06-11 TW TW088109838A patent/TW405250B/en not_active IP Right Cessation
- 1999-06-29 US US09/342,226 patent/US6194961B1/en not_active Expired - Lifetime
- 1999-06-29 JP JP18334299A patent/JP4279409B2/en not_active Expired - Fee Related
- 1999-06-29 CN CNB991089251A patent/CN1169221C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP4279409B2 (en) | 2009-06-17 |
TW405250B (en) | 2000-09-11 |
EP0969512A1 (en) | 2000-01-05 |
CN1242605A (en) | 2000-01-26 |
CN1169221C (en) | 2004-09-29 |
DE69840827D1 (en) | 2009-06-25 |
US6194961B1 (en) | 2001-02-27 |
JP2000031384A (en) | 2000-01-28 |
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