EP0960693A3 - A polishing machine - Google Patents

A polishing machine Download PDF

Info

Publication number
EP0960693A3
EP0960693A3 EP99109243A EP99109243A EP0960693A3 EP 0960693 A3 EP0960693 A3 EP 0960693A3 EP 99109243 A EP99109243 A EP 99109243A EP 99109243 A EP99109243 A EP 99109243A EP 0960693 A3 EP0960693 A3 EP 0960693A3
Authority
EP
European Patent Office
Prior art keywords
grooves
polishing machine
platen
polishing
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99109243A
Other languages
German (de)
French (fr)
Other versions
EP0960693A2 (en
Inventor
Hitoshi c/o Speedfam Co. Ltd. Nagayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Publication of EP0960693A2 publication Critical patent/EP0960693A2/en
Publication of EP0960693A3 publication Critical patent/EP0960693A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The present invention is a polishing machine, comprising a rotatable metallic platen whose surface is covered by the plural number of polishing pad, on the position of the surface of said metallic platen corresponding to the jointing lines of said polishing pads, the grooves are engraved, and the filling material which is different from the material composing the platen is inserted into said grooves. The desirable substance to be inserted into said grooves is stainless steel, synthetic resin or ceramics.
EP99109243A 1998-05-28 1999-05-25 A polishing machine Withdrawn EP0960693A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP14715998 1998-05-28
JP14715998A JPH11333703A (en) 1998-05-28 1998-05-28 Polishing machine

Publications (2)

Publication Number Publication Date
EP0960693A2 EP0960693A2 (en) 1999-12-01
EP0960693A3 true EP0960693A3 (en) 2002-09-04

Family

ID=15423930

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99109243A Withdrawn EP0960693A3 (en) 1998-05-28 1999-05-25 A polishing machine

Country Status (2)

Country Link
EP (1) EP0960693A3 (en)
JP (1) JPH11333703A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6328872B1 (en) * 1999-04-03 2001-12-11 Nutool, Inc. Method and apparatus for plating and polishing a semiconductor substrate
US6409904B1 (en) 1998-12-01 2002-06-25 Nutool, Inc. Method and apparatus for depositing and controlling the texture of a thin film
US7204917B2 (en) 1998-12-01 2007-04-17 Novellus Systems, Inc. Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
US6569004B1 (en) * 1999-12-30 2003-05-27 Lam Research Polishing pad and method of manufacture
JP2004358616A (en) * 2003-06-05 2004-12-24 Yasuhiro Tani Polishing tool, polishing device and method
US8360823B2 (en) * 2010-06-15 2013-01-29 3M Innovative Properties Company Splicing technique for fixed abrasives used in chemical mechanical planarization
CN103551961A (en) * 2013-11-04 2014-02-05 无锡雨田精密工具有限公司 Machine clamp cutting and polishing cutter

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3164855A (en) * 1960-08-01 1965-01-12 American Felt Co Polishing pad assembly for a glass polishing head
US3921342A (en) * 1973-12-17 1975-11-25 Spitfire Tool & Machine Co Inc Lap plate
US5534106A (en) * 1994-07-26 1996-07-09 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers
US5743788A (en) * 1996-12-02 1998-04-28 Motorola, Inc. Platen coating structure for chemical mechanical polishing and method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3164855A (en) * 1960-08-01 1965-01-12 American Felt Co Polishing pad assembly for a glass polishing head
US3921342A (en) * 1973-12-17 1975-11-25 Spitfire Tool & Machine Co Inc Lap plate
US5534106A (en) * 1994-07-26 1996-07-09 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers
US5743788A (en) * 1996-12-02 1998-04-28 Motorola, Inc. Platen coating structure for chemical mechanical polishing and method

Also Published As

Publication number Publication date
JPH11333703A (en) 1999-12-07
EP0960693A2 (en) 1999-12-01

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