EP0939684A1 - Method for soft soldering metals and soft solder for carrying said method - Google Patents
Method for soft soldering metals and soft solder for carrying said methodInfo
- Publication number
- EP0939684A1 EP0939684A1 EP98939558A EP98939558A EP0939684A1 EP 0939684 A1 EP0939684 A1 EP 0939684A1 EP 98939558 A EP98939558 A EP 98939558A EP 98939558 A EP98939558 A EP 98939558A EP 0939684 A1 EP0939684 A1 EP 0939684A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- solder
- soft solder
- soft
- reaction component
- reaction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0006—Exothermic brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/125—Inorganic compounds, e.g. silver salt
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19728014A DE19728014A1 (en) | 1997-07-01 | 1997-07-01 | Process for soft soldering of metals and soft solder for carrying out this process |
DE19728014 | 1997-07-01 | ||
PCT/EP1998/003974 WO1999001250A1 (en) | 1997-07-01 | 1998-06-29 | Method for soft soldering metals and soft solder for carrying said method |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0939684A1 true EP0939684A1 (en) | 1999-09-08 |
Family
ID=7834274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP98939558A Withdrawn EP0939684A1 (en) | 1997-07-01 | 1998-06-29 | Method for soft soldering metals and soft solder for carrying said method |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0939684A1 (en) |
DE (1) | DE19728014A1 (en) |
WO (1) | WO1999001250A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005310956A (en) | 2004-04-20 | 2005-11-04 | Denso Corp | Method for manufacturing semiconductor device |
DE102009013919B4 (en) * | 2008-09-15 | 2021-01-28 | Wolfgang, Dr. Ludeck | Solder material with a filler material, carrier component or component with such a solder material and the use of a flux |
DE102011083931A1 (en) | 2011-09-30 | 2013-04-04 | Robert Bosch Gmbh | Layer composite of an electronic substrate and a layer arrangement comprising a reaction solder |
DE102015205820A1 (en) | 2015-03-31 | 2016-10-06 | KLEB- UND GIEßHARZTECHNIK DR. LUDECK GMBH | Heating element for SMD mounting, electronic assembly with such a heating element and method for producing an electronic assembly |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3808670A (en) * | 1972-05-24 | 1974-05-07 | Isotopes Inc | Exothermic bonding of thermoelectric couples |
GB2019443B (en) * | 1977-11-03 | 1982-05-12 | Sergeant C | Hypophosphite soft solder flux |
US4274483A (en) * | 1979-08-01 | 1981-06-23 | Modine Manufacturing Company | Reaction bonding of ferrous metals |
JPS61111765A (en) * | 1984-11-02 | 1986-05-29 | Matsushita Electric Ind Co Ltd | Joining method of articles and solder material for said method |
JPH04190995A (en) * | 1990-11-21 | 1992-07-09 | Hitachi Ltd | Autogeneous soldering material and electronic circuit board |
US5381944A (en) * | 1993-11-04 | 1995-01-17 | The Regents Of The University Of California | Low temperature reactive bonding |
JPH07136795A (en) * | 1993-11-16 | 1995-05-30 | Showa Denko Kk | Solder paste |
JPH10146690A (en) * | 1996-11-14 | 1998-06-02 | Senju Metal Ind Co Ltd | Solder paste for soldering chip part |
-
1997
- 1997-07-01 DE DE19728014A patent/DE19728014A1/en not_active Ceased
-
1998
- 1998-06-29 EP EP98939558A patent/EP0939684A1/en not_active Withdrawn
- 1998-06-29 WO PCT/EP1998/003974 patent/WO1999001250A1/en not_active Application Discontinuation
Non-Patent Citations (1)
Title |
---|
See references of WO9901250A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO1999001250A1 (en) | 1999-01-14 |
DE19728014A1 (en) | 1999-01-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 19990301 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): BE DE DK ES FI FR GB IT LU NL SE |
|
17Q | First examination report despatched |
Effective date: 20010326 |
|
GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWA Owner name: ZENTRUM FUER MATERIAL- UND UMWELTTECHNIK GMBH |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20020917 |