EP0909400A1 - Procede de fabrication d'un boitier hermetique comportant au moins une traversee pour fibre optique - Google Patents

Procede de fabrication d'un boitier hermetique comportant au moins une traversee pour fibre optique

Info

Publication number
EP0909400A1
EP0909400A1 EP97930492A EP97930492A EP0909400A1 EP 0909400 A1 EP0909400 A1 EP 0909400A1 EP 97930492 A EP97930492 A EP 97930492A EP 97930492 A EP97930492 A EP 97930492A EP 0909400 A1 EP0909400 A1 EP 0909400A1
Authority
EP
European Patent Office
Prior art keywords
fibre
solder
package
fibres
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97930492A
Other languages
German (de)
English (en)
Inventor
John Ingalls Thackara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumentum Ottawa Inc
Original Assignee
Akzo Nobel NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akzo Nobel NV filed Critical Akzo Nobel NV
Priority to EP97930492A priority Critical patent/EP0909400A1/fr
Publication of EP0909400A1 publication Critical patent/EP0909400A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers

Definitions

  • the invention pertains to a method for making a hermetically sealed package, which package comprises a housing, a lid, and a feedthrough for at least one stripped optical fibre
  • An array of, e.g., seven optical fibres requires the making of at least seven holes and seven hermetical feedthroughs, for instance by the method disclosed in US 4,779,788. Accordingly, the process for manufacturing fiat packages is complicated and expensive Not surprisingly, the hermetical feedthroughs are responsible for the greater part of the total costs involved in said manufacturing process
  • US 5,061 ,035 concerns a method for making a hermetically sealed fibre array comprising a bundle of optical fibres provided with a solderable metal coating (preferably nickel and gold) to ensure adhesion to a solder
  • the optical fibre bundle is placed in a supporting structure having a front face and a coated inner surface so that the end face of the optical fibre bundle is flush with the front face of the supporting structure
  • the assembly is then heated and fluxless solder is applied to the end face and allowed to wick between the individual fibres and the inner surface of the support
  • the solder is sucked in by means of a vacuum on the back face of the supporting structure
  • US 4, 174,491 relates to a method in which a metallised optical fibre is placed in a groove in a mount substrate A keeper substate which is also provided with a groove is placed on top of the mount substrate so that the grooves snugly hold the optical fibre
  • the grooved substrates are welded together by means of a solder coating provided on their grooved surfaces Subsequently, the interspace between the optical fibre and the substrates is filled up with a low fusing solder
  • hermetic fibre feedthrough(s) can be formed using conventional package housings or seal rings and lids and do(es) not require custom ferrules.
  • the number of juxtaposed fibres in this type of feedthrough is limited only by the available package lid seam length and the fibre diameter.
  • a still further advantage of the present invention resides in the fact that welding or soldering the lid onto the housing is combined with making the fibre feedthroughs. Until now, attaching the lid to the housing and providing the fibre feedthrough were two separate processes.
  • solder preform includes, amongst others, separate rings of solder (adapted to the shape of the lid and/or the shape of the opening in the package body or housing) and relatively thick coatings on the lid sealing surface and/or the housing sealing surface. Said coating can, for instance, be achieved by reflowing solder onto the sealing surface(s) using a proper flux.
  • solder of which the preforms are made should have the property that it wets both the optical fibre or fibres and the sealing surfaces of the lid and the housing.
  • suitable solders are indium, indium/silver, indium/tin, and glass solder (ex Gould).
  • solder preform In order to further simplify the process and make an improved seam it is preferred to use more than one solder preform.
  • a stack can be obtained comprising at least five elements, e.g., the package body or housing, a first solder preform, the fibre or array of fibres, a second solder preform, and the lid Since the solder which is to form the seam is present on both sides of the fibre or fibres, it is easier to ensure that it reflows completely around the fibre or fibres Thus, the chance of obtaining an end product not suitable for sale is reduced
  • the (total) thickness of the preform or preforms exceeds the diameter of the stripped fibre, preferably at least by 20 percent.
  • the optical fibre or fibres are solder coated prior to sealing the package
  • the solder used to precoat the fibres must have the property that it wets glass in a molten state
  • suitable solders are, e g , indium, indium/silver, and indium/tin solders With solders of this type, the precoating of the fibres can be accomplished by simply dipping the stripped section of the optical fibres into the molten solder
  • the package is sealed through the application of heat and pressure During this sealing step all or nearly all the voids between the solder and the fibre or fibres are eliminated
  • additional heat after the sealing step for instance, to further melt the solder and improve the continuity of the solder seam between the package body, the lid, and the optical fibre or fibres
  • the housing or the lid can be advantageous to use an intermediate between the housing or the lid and the solder preform or the fibres
  • a metal sealing ring or brazing pad can be provided around the opening of the housing to enhance the adherence of the solder
  • the invention further pertains to a hermetically sealed package obtainable by the method as described above, which package comprises a housing or package body and a lid (preferably both having a flat sealing surface) sealed onto it by means of a continuous solder seam, through which solder seam at least one fibre is fed
  • This package allows very efficient manufacture, is inexpensive, and does not require custom ferrules or the like Also, the width of a fibre array feedthrough can be made very small (because ferrules or grooves are not necessary), thus reducing the package size in the dimension of the array
  • JP 63 085505 concerns a method for welding and fixing optical fibres into V-grooves formed on a substrate Heating elements consisting of a high resistance material are deposited into the grooves and, in turn, a "low melting metal” such as a solder is plated on the heating elements The optical fibres are coated with a welding metal such as gold and placed in the grooves. During subsequent heating by means of the heating elements, a plate is pressed onto the fibres and the "low melting metal" is melted Thus, the optical fibres are adhered to the metal A hermetically sealed package is not disclosed
  • Figure 1 shows schematically an assembly according to the invention just prior to the application of heat and pressure
  • the assembly comprises a package body or housing 1 , a lid 2, two solder preforms 3, and an array 4 consisting of seven individually precoated optical fibres
  • Figure 2 shows the assembly of Figure 1 after the application of heat and pressure
  • the solder preforms 3 have formed a continuous solder seam 5
  • Hermetically sealed packages with up to 9 fibre feedthroughs were made with the process described below
  • the packages had a single fibre feedthrough at the input side and a fibre array feedthrough containing as many as 8 fibres on the output side
  • All of the package housings described hereinbelow were made of alumina and had gold over nickel plated Kovar seal rings brazed onto gold plated pads on the package sealing surface
  • the lids were also made of Kovar with gold over nickel plating
  • the optical fibres were all Corning SMF-28 Pure indium was used as the solder to make the seals.
  • the fibre feedthrough fabrication and package sealing process was comprised of the following steps.
  • Indium was applied to the top surface of the package seal ring and to the sealing surface of the lid by first coating the sealing surfaces with a thin layer of flux. Indium rings, each 0.010" thick, were then pressed onto the flux layers. The package bodies and lids were placed in a nitrogen purged reflow oven and heated until the indium melted and completely wetted the sealing surfaces. The package bodies and the lids were allowed to cool to near room temperature in the oven. Flux residues were removed from the coated sealing surfaces in an isopropanol bath.
  • Both the input single fibres and the output fibre arrays were also coated with indium prior to package sealing. This was done by first stripping off the acrylate coating from the sections of the fibres or fibre arrays that would be sealed into the indium package/lid seam. The exposed silica surfaces of the fibres were cleaned with isopropanol and lens tissue and then blown dry. The cleaned portions were then slowly passed back and forth through molten indium on a glass stage which was heated from the bottom by a heated brass block and from the top by a heating element dipped into the indium. For the fibre arrays, the fibres were maintained in a linear array by external clamps. A stream of nitrogen was directed over and around the molten indium. After being in the molten indium for about 30 seconds (about 2 or 3 passes), the fibres or fibre arrays were removed and allowed to cool.
  • the fibre feedthroughs were formed by first positioning the indium coated sections of the fibres or fibre arrays over the package seal ring at the input and output locations and then holding them in place with external clamps. Next, the lid was positioned directly above the package seal ring and held in place by external guides. Heat and pressure were then applied to the input and output ends of the lids until the indium on the lid, then on the fibres, and finally on the package seal ring melted and flowed together to form a continuous indium seal between the seal ring and the lid and around the fibres The heat was removed and the lid was held in place until the indium had frozen
  • the package assembly was allowed to cool and was then transported directly into a nitrogen purged dry box
  • the package sealing was completed by applying heat and pressure to the remaining unsealed section until the indium on the lid and on the package seal ring melted and flowed together to form a continuous indium seal between the seal
  • Sectioning of 8-fibre feedthroughs sealed with the above process clearly shows that the fibres are completely surrounded by indium and that the indium completely fills the space between the package and the lid Packages having a 1 -fibre input feedthrough and an 8-fibre output feedthrough sealed with the above procedure have been helium leak tested and then subjected to a number of environmental stress tests before being leak tested again The leak rates measured before and after the environmental stress tests were all under the 1 x 10E-6 atm-cc/sec air equivalent standard leak rate limit specified by MIL-STD-883 for hermetic packages of the size sealed These tests, and the associated package counts, include. Low Temperature Storage (-40°C), 920 hours: Two packages. High Temperature Storage (71°C), 600 hours: Two packages. Temperature Cycling (-40 to 70°C, 20 cycles/day), 120 cycles: Three packages. Thermal Shock (0 to 100°C in water baths, 2 minutes per bath), 15 cycles: Five packages.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Light Guides In General And Applications Therefor (AREA)

Abstract

Cette invention se rapporte à un procédé très efficace de fabrication d'un boîtier hermétique comportant un logement (1), un couvercle (2) et une traversée conçue pour au moins une fibre optique dénudée (4). Ledit procédé consiste à placer la (ou les) fibre(s) optique(s) et au moins une préforme de brasure (3) entre la surface d'étanchéité du couvercle et la surface d'étanchéité du logement, et à sceller l'ensemble en exerçant une pression et en chauffant de façon à pousser la (ou les) fibre(s) à l'intérieur de la brasure.
EP97930492A 1996-07-03 1997-07-01 Procede de fabrication d'un boitier hermetique comportant au moins une traversee pour fibre optique Withdrawn EP0909400A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP97930492A EP0909400A1 (fr) 1996-07-03 1997-07-01 Procede de fabrication d'un boitier hermetique comportant au moins une traversee pour fibre optique

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US2120196P 1996-07-03 1996-07-03
US21201P 1996-07-03
EP96202047 1996-07-19
EP96202047 1996-07-19
EP97930492A EP0909400A1 (fr) 1996-07-03 1997-07-01 Procede de fabrication d'un boitier hermetique comportant au moins une traversee pour fibre optique
PCT/EP1997/003492 WO1998001783A1 (fr) 1996-07-03 1997-07-01 Procede de fabrication d'un boitier hermetique comportant au moins une traversee pour fibre optique

Publications (1)

Publication Number Publication Date
EP0909400A1 true EP0909400A1 (fr) 1999-04-21

Family

ID=56289777

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97930492A Withdrawn EP0909400A1 (fr) 1996-07-03 1997-07-01 Procede de fabrication d'un boitier hermetique comportant au moins une traversee pour fibre optique

Country Status (5)

Country Link
EP (1) EP0909400A1 (fr)
JP (1) JP2001508184A (fr)
AU (1) AU3442297A (fr)
CA (1) CA2259971A1 (fr)
WO (1) WO1998001783A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0110366D0 (en) 2001-04-27 2001-06-20 Tyco Electronics Raychem Nv Optical fibre sealing
US7113686B2 (en) * 2002-04-12 2006-09-26 Tyco Electronics Raychem Nv Optical circuit enclosure
DE102020114952B4 (de) 2020-06-05 2024-07-18 Schott Ag Hermetisch dichtes optoelektronisches Modul mit erhöhter Auskopplung von elektromagnetischer Strahlung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5433683A (en) * 1977-07-08 1979-03-12 Hitachi Ltd Air seal mounting for light emitting element
US4788406A (en) * 1987-01-23 1988-11-29 Battelle Memorial Institute Microattachment of optical fibers
US5061035A (en) * 1990-09-27 1991-10-29 Hughes Aircraft Company Hermetically sealed optical fiber arrays and method for forming same
US5412748A (en) * 1992-12-04 1995-05-02 Kabushiki Kaisha Toshiba Optical semiconductor module
CA2135758A1 (fr) * 1993-03-31 1994-10-01 Toshiaki Kakii Reseau de fibres optiques

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9801783A1 *

Also Published As

Publication number Publication date
CA2259971A1 (fr) 1998-01-15
WO1998001783A1 (fr) 1998-01-15
AU3442297A (en) 1998-02-02
JP2001508184A (ja) 2001-06-19

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