EP0897595A1 - Electric component in integrated circuit form for hot insertion in a substrate and methods for manufacturing same - Google Patents

Electric component in integrated circuit form for hot insertion in a substrate and methods for manufacturing same

Info

Publication number
EP0897595A1
EP0897595A1 EP97921930A EP97921930A EP0897595A1 EP 0897595 A1 EP0897595 A1 EP 0897595A1 EP 97921930 A EP97921930 A EP 97921930A EP 97921930 A EP97921930 A EP 97921930A EP 0897595 A1 EP0897595 A1 EP 0897595A1
Authority
EP
European Patent Office
Prior art keywords
component
wafer
adhesive
face
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP97921930A
Other languages
German (de)
French (fr)
Inventor
Pascal Billebaud
Benoít Thevenot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axalto SA
Original Assignee
Solaic SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solaic SA filed Critical Solaic SA
Publication of EP0897595A1 publication Critical patent/EP0897595A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/8388—Hardening the adhesive by cooling, e.g. for thermoplastics or hot-melt adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01063—Europium [Eu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01094—Plutonium [Pu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Definitions

  • Electric component in the form of an integrated circuit for hot insertion into a substrate and methods for its manufacture
  • Portable objects with an integrated circuit include a chip which incorporates the integrated circuit and electrical conductors which allow the connection of this circuit with a separate device.
  • the position of the component in the reference frame of the card must be extremely precise (the tolerance is of the order of 50 ⁇ ) to meet the requirements of certain production techniques (for example by screen printing) of the electrical connections between the pads of the component and the contact pads carried by the card.
  • certain production techniques for example by screen printing
  • the patch in the reference frame of the card must be precisely position the patch in the reference frame of the card and to maintain this position against mechanical stresses that the card will undergo during its transport to hot insertion station.
  • substrates which are not made of thermoplastic material to meet other requirements such as increased longevity, improved resistance, lower cost (wood, cardboard, etc.).
  • the hot insertion is no longer then possible which requires from the manufacturer to have two different production facilities. This constraint is extremely burdensome financially since the manufacturing of smart cards is carried out in very large series and any alternative technology requires very large investments.
  • the invention firstly has an electronic component in the form of an integrated circuit chip having an active face and an inactive face, intended to be inserted hot into a substrate.
  • this component comprises at least on its inactive face a coating of heat-reactivable thermoplastic or thermosetting adhesive.
  • a chip with a layer of adhesive on its inactive side has many advantages.
  • One of them lies in the fact that by this layer, the chip can be held by gluing on the card in a fixed position, which makes it possible to transport the card and the chip to the insertion station.
  • the second resides in the fact that this layer of adhesive at the time of hot insertion since it is either thermoplastic or thermosetting, reactivable hot, will constitute a better bond between the component and the substrate.
  • this layer of adhesive will be able to constitute the hot deformable material which will bond the component to a non-thermo-substrate. plastic in which, for example, a cavity has already been arranged to house the component equipped with the adhesive coating.
  • the adhesive coating will advantageously form a base projecting from the inactive face of the component.
  • the lateral faces of the patch also include an adhesive coating.
  • the invention also has as other objects methods of manufacturing such components.
  • a first method which applies equally to a thermoplastic adhesive or a thermosetting adhesive
  • the manufacture made from a wafer of a suitable material, one face of which incorporates a plurality of integrated circuits consists in providing the other face of this wafer with an adhesive coating, to equip this face dressed with an adherent support film and to individualize each component practicing a network of grooves of depth equal to the cumulative thickness of the wafer and the coating of glue.
  • thermosetting adhesive another method can be used, namely providing the other side of the wafer with a coating of adhesive, equipping this coated side with an adherent support film, practicing a first network of grooves of depth equal to the thickness of the cake alone, and individualize each component by making a second network of grooves of width less than that of the grooves of the first network, at the bottom of these first grooves, and of depth equal to l thickness of the adhesive coating.
  • Components are thus obtained which have a coating in the form of an overhanging base.
  • thermosetting adhesives a second method consists in starting with a wafer, providing the inactive face of this wafer with a coating. of glue, to equip this face coated with an adherent support film, to practice a first network of grooves of depth equal to the thickness of the wafer, to fill this first network with a thermosetting glue and finally to individualize each component by practicing a second network of grooves inside the grooves of the first network, of width less than that of the first grooves and of depth equal to the combined thickness of the wafer and of the coating. A component is thus obtained which is covered with adhesive on its inactive face and each of its lateral faces.
  • FIG. 1 partially illustrates a set of components according to the invention maintained on a support film
  • FIG. 2 diagrammatically illustrates the means used for depositing fine adhesive on a silicon wafer
  • FIG. 3 illustrates a set of components according to the invention maintained by a support film and provided with a layer of thermosetting adhesive
  • FIG. 4 is an alternative embodiment of FIG. 3,
  • Figure 1 illustrates in partial section, a set of electronic components 1 in the form of integrated circuit pads retained by a film 2 support
  • each patch having an active face 3 and an inactive face 4.
  • a coating 5 of glue firmly adhering to the tablet 1.
  • FIG. 1 There are many ways to obtain the product represented in FIG. 1, but all of them comprise a first phase which consists, starting from a wafer 6 of a suitable material for incorporating integrated circuits on one of its faces 7, of cover the other face 8, that is to say the inactive face of this cake with a layer of the glue considered.
  • Figure 2 illustrates such a cake.
  • the wafer 6 incorporating a plurality of electronic circuits integrated on its face 7 is well known. Usually when this wafer is treated on its face 7, it is fitted directly with the film 2 on its face 8 and, by making a network of grooves in the wafer, each of the components forming an integrated circuit chip is individualized. These components are held by the film 2.
  • its inactive face 8 is covered with an adhesive coating.
  • the body to form the revé ⁇ ment of glue is a hot-melt or thermoplastic glue that low molecular weight or a polymerizable glue, being in liquid form
  • a way of proceeding with a regular deposition on the face 8 of the wafer 6 consists in rapidly rotating this wafer by means of a rotary drive 9 and in pouring a few drops of this liquid product into the center of the wafer, the centrifugal force proceeding to the uniform spreading of the product.
  • We can solidify this product by exposing side 8 as well coated either with the influence of temperature or with the influence of ultraviolet radiation depending on the nature of the adhesive used. This method is suitable when it is desired to obtain a relatively thin layer of adhesive 5 (FIG. 1).
  • thermoplastic glue whose material is similar to the material of the substrate in which it is subsequently desired to insert the electronic component hot (polycarbonate for example)
  • a cake is covered with a volatile solvent solution (ethanol for example) and immediately covered with a film of thermoplastic material (polycarbonate).
  • the solvent is evaporated at low temperature (40 °) for a few hours.
  • the film then adheres to the face 8 of the wafer.
  • the latter is introduced into an oven where it is brought to the temperature of 180 ° for one hour (in the horizontal position, the active face 7 of the cake being turned towards the bottom). This operation makes it possible to soften the thermoplastic (polycarbonate which becomes sticky and which sticks intimately to the face 8 of the wafer).
  • the above process can be accelerated by proceeding under pressure while maintaining the temperature.
  • the wafer is pressed against a support, for example in polished glass, the film being sandwiched between this support and the wafer, this support having a coefficient of expansion compatible with that of the material constituting the wafer.
  • the solvent operation can simply be omitted and the wafer and the film of thermoplastic material deposited on a flat surface, for example made of polished glass, and heating under compression of this assembly.
  • the surface of the pressing member in contact should be with the thermoplastic film is treated so that this film when softened does not adhere to it.
  • the adhesive used is a thermosetting adhesive which can be reactivated when hot, it suffices to present substrates at the appropriate temperature at the position for positioning the component on the substrate for adhesion to occur between the adhesive 5 and the upper surface of the substrate. It is even possible by an adequate formulation of the adhesive to obtain a solid adhesive under the component which, at room temperature, has a certain adhesive power (tack), allowing the component to be maintained on the substrate without even heating the latter. .
  • FIG. 5 is a diagram which illustrates this bonding between a substrate 10 and a component 1 provided with an adhesive 5 either thermosetting or thermoplastic.
  • thermosetting adhesive 5 substantially improves the connection between the component 1 and the substrate 10.
  • FIG. 7 illustrates the hot insertion of a component 1 into a thermoplastic substrate 10, the substrate having a layer of thermoplastic adhesive and preferably made of the same material (for example polycarbonate) as that of the substrate 10.
  • the two materials which were previously intimately bonded during bonding, for example by solvent or by addition of heat merge so that the insertion of component 1 has the same qualities as there had been no prior bonding of this component on the substrate.
  • This procedure has the advantage of not introducing foreign bodies around the component when it is hot pressed into the substrate and of not disturbing the quality of the connection obtained.
  • the materials 12, degraded on the one hand by the solvent or the heating during the bonding operation preceding the insertion operation are dispersed and distributed discontinuously away from the component, which is a pledge of good maintenance of this component in the mass of the substrate.
  • each of the components 1 can be equipped with a layer of glue of substantial thickness. Thanks to this layer of adhesive, it is of course possible to obtain the bonding prior to the hot insertion of the component on a substrate, but above all it is possible to fix a component 1 in a substrate 13 which is made of thermosetting material. .
  • Figures 8 and 9 illustrate this way of proceeding. In FIG. 8, it can be seen that the substrate 13 has been previously machined so that a cavity or a housing 14 is formed therein (by milling, by laser ablation, etc.).
  • Component 1 has a layer of glue relatively large 5a on its inactive face and, by means of a heating punch 15, causes the softening of this layer of glue which flows and fills the space of the cavity 14 left free by the component l when there is pressed in by the punch 15, the excess of material being able to overflow and constituting a thin film 16 covering the substrate around the edges of the cavity, the bonding material being unable to creep between the punch 15 and the component 1 count given the extremely careful quality of the contact between these two elements.
  • the adhesive which can be used can be a thermoplastic or a thermosetting material, hot reactivable, that is to say which will only reach its irreversible state after having been heated by the punch when it could have been deformed and creep during the heating operation.
  • the component according to the invention makes it possible, as illustrated by FIGS. 8 and 9, to use the technique of hot insertion of a component even opposite a substrate which is not thermoplastic.
  • the essential advantage of this arrangement is that the tools and installations for manufacturing portable objects carrying an integrated circuit can be unique whatever the substrates which are used to form the body of these portable objects.
  • the variant embodiments illustrated by FIGS. 3 and 4 of an electronic component in accordance with the invention relate more particularly to those equipped with a thermosetting adhesive to improve the behavior of the components facing bending stresses imprinted on the portable object, especially when it comes in the form of a card.
  • Figure 3 like Figure 1, illustrates a first embodiment in which after having equipped the wafer 6 with a uniform layer of thermosetting adhesive and having associated with this coated side a film support 2, the components were individualized in two stages. Firstly, on the wafer on the side of its active face, a network of grooves of width L and of depth equal to the thickness of the wafer 6, that is to say of each of the components 1, was produced. discover the coating 5 at the bottom of the groove. Then, inside the network of grooves 17, a second network of grooves 18 of width 1 less than the width L and of depth equal to the thickness of the adhesive coating was produced. Each component thus individualized therefore has a kind of glue base projecting from its inactive face.
  • the width d of this peripheral overflow is equal to half the difference in the widths of the grooves and will preferably be substantially equal to the thickness of each component.
  • this base 5 behaves as described above with regard to FIG. 5 with regard to the bonding of the component on a substrate.
  • the flange of width d is folded down along the lateral faces of the component when the component is pressed into the substrate so that a relatively homogeneous layer of thermosetting adhesive is interposed between the thermoplastic material of the substrate and the component. It has been realized that in particular as regards the connection of the side walls of the component with the material, connection which is most stressed during the bending stresses mentioned above, the presence of a thermosetting glue to this level greatly improves the quality.
  • FIG. 4 illustrates another embodiment of a component provided with a layer of thermosetting adhesive.
  • the grooves thus produced are then filled with a thermosetting adhesive, taking of course every precaution to mask the active face of each component, by the very fact that the filling can only be done by this active face, and we then proceed to the making of 'A second network of grooves in the first network, but of smaller width to allow to remain along each side wall of each component a coating 19 of adhesive.
  • the depth of the grooves in this second network is equal to the cumulative thickness of the wafer and of the layer of adhesive initially deposited on the inactive face of this wafer. It is therefore a component coated on five of its six faces which is hot pressed into a substrate made of thermoplastic material as illustrated in FIG. 8. The bonding of the component to this substrate is greatly improved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses an electronic component in the form of a circuit (10, 13) on a chip (1), comprising at least on its inactive surface (4) a thermoplastic or thermosetting heat-reactivatable adhesive coating (5).

Description

Composant électrique sous forme de circuit intégré pour insertion à chaud dans un substrat et procédés pour sa fabricationElectric component in the form of an integrated circuit for hot insertion into a substrate and methods for its manufacture
Les objets portatifs à circuit intégré (par exemple les cartes à puce) comportent une pastille qui incorpore le circuit intégré et des conducteurs électriques qui permettent la liaison de ce circuit avec un appareil séparé.Portable objects with an integrated circuit ( for example smart cards) include a chip which incorporates the integrated circuit and electrical conductors which allow the connection of this circuit with a separate device.
Pour fabriquer ces objets il faut donc fixer la pastille au substrat du support (la carte) en satisfaisant un certain nombre d'exigences quant à la solidité de cette fixation et la précision de la localisation de la pastille sur la carte dans les trois dimensions d'un repère attaché à celle-ci .To manufacture these objects it is therefore necessary to fix the patch to the substrate of the support (the card) while satisfying a certain number of requirements as for the solidity of this fixation and the precision of the location of the patch on the card in the three dimensions d 'a marker attached to it.
L'une des méthodes qui permet de procéder à cette fixation de manière économique est l'insertion à chaud de la pastille dans le substrat de la carte. Cette méthode n'est applicable cependant que si le matériau de la carte est thermoplastique. En outre, l'un de ces inconvénients réside dans le fait que la liaison entre le composant et le substrat résiste mal aux contraintes de flexion de la carte qui tendent à écarter les bords du logement par rapport à la pastille. En effet, la force du collage entre le substrat et la pastille à ce niveau peut se révéler insuffisante ce qui peut entraîner des ruptures dans les conducteurs qui passent de la pastille au substrat.One of the methods which makes it possible to carry out this fixing in an economical manner is the hot insertion of the patch in the substrate of the card. This method is only applicable, however, if the card material is thermoplastic. In addition, one of these drawbacks lies in the fact that the connection between the component and the substrate does not withstand the flexural stresses of the card which tend to spread the edges of the housing relative to the patch. Indeed, the strength of the bonding between the substrate and the pellet at this level may prove to be insufficient, which may cause breaks in the conductors which pass from the pellet to the substrate.
Par ailleurs la position du composant dans le repère de la carte doit être extrêmement précise (la tolérance est de l'ordre de 50 μ) pour satisfaire aux exigences de certaines techniques de réalisation (par exemple par sérigraphie) des liaisons électriques entre les plots du composant et les plages de contact portées par la carte. Il existe donc une nécessité, avant son enchâssement dans le substrat de la carte, de positionner précisément la pastille dans le repère de la carte et de maintenir cette position à l' encontre de sollicitations mécaniques que la carte va subir pendant son transport jusqu'au poste d'insertion à chaud. Enfin il existe des substrats qui ne sont pas en matière thermoplastique pour répondre à d'autres exigences telles que longévité accrue, résistance améliorée, coût moindre (bois, carton...) .... L'insertion à chaud n'est plus alors possible ce qui demande de la part du fabricant de disposer de deux installations de production différen¬ tes. Cette contrainte est extrêmement lourde au plan financier car la fabrication de cartes à puce s'opère par très grandes séries et toute technologie alternative demande des investissements très importants.Furthermore, the position of the component in the reference frame of the card must be extremely precise (the tolerance is of the order of 50 μ) to meet the requirements of certain production techniques (for example by screen printing) of the electrical connections between the pads of the component and the contact pads carried by the card. There is therefore a need, before being embedded in the substrate of the card, to precisely position the patch in the reference frame of the card and to maintain this position against mechanical stresses that the card will undergo during its transport to hot insertion station. Finally there are substrates which are not made of thermoplastic material to meet other requirements such as increased longevity, improved resistance, lower cost (wood, cardboard, etc.). The hot insertion is no longer then possible which requires from the manufacturer to have two different production facilities. This constraint is extremely burdensome financially since the manufacturing of smart cards is carried out in very large series and any alternative technology requires very large investments.
Dans l'optique de répondre au mieux à toutes ces contraintes, c'est-à-dire permettre de traiter par une même technologie les cartes thermoplastiques et les cartes thermodurcissables, assurer une mise en place précise du composant sur la carte sans perturber l'insertion qui doit suivre, améliorer la fixation du composant dans le substrat de la carte l'invention a pour premier objet un composant électronique en forme de pastille de circuit intégré comportant une face active et une face inactive, destinée à être insérée à chaud dans un substrat. Selon l'invention ce composant comporte au moins sur sa face inactive un revêtement de colle thermoplastique ou thermo- durcissable réactivable à chaud.In order to best respond to all these constraints, that is to say to allow the same technology to process the thermoplastic cards and the thermosetting cards, ensuring precise positioning of the component on the card without disturbing the insertion which must follow, improve the fixing of the component in the substrate of the card the invention firstly has an electronic component in the form of an integrated circuit chip having an active face and an inactive face, intended to be inserted hot into a substrate. According to the invention, this component comprises at least on its inactive face a coating of heat-reactivable thermoplastic or thermosetting adhesive.
En effet, pourvoir une puce d'une couche de colle sur sa face inactive présente de nombreux avantages. L'un d'entre eux réside dans le fait que par cette couche on peut maintenir par collage la puce sur la carte dans une position fixe, ce qui permet de transporter la carte et la puce jusqu'au poste d'insertion. Le second réside dans le fait que cette couche de colle au moment de l'insertion à chaud puisqu'elle est soit thermoplastique, soit thermodur- cissable réactivable à chaud, va constituer un meilleur lien entre le composant et le substrat. Enfin, cette couche de colle va pouvoir constituer le matériau déformable à chaud qui va lier le composant à un substrat non thermo- plastique dans lequel, par exemple, on aura préalablement aménagé une cavité pour loger le composant équipé du revêtement de colle.Indeed, providing a chip with a layer of adhesive on its inactive side has many advantages. One of them lies in the fact that by this layer, the chip can be held by gluing on the card in a fixed position, which makes it possible to transport the card and the chip to the insertion station. The second resides in the fact that this layer of adhesive at the time of hot insertion since it is either thermoplastic or thermosetting, reactivable hot, will constitute a better bond between the component and the substrate. Finally, this layer of adhesive will be able to constitute the hot deformable material which will bond the component to a non-thermo-substrate. plastic in which, for example, a cavity has already been arranged to house the component equipped with the adhesive coating.
Dans la mesure où la colle est thermodurcissable, le revêtement de colle formera avantageusement une embase débordant de la face inactive du composant. Dans une variante de ce mode de réalisation, les faces latérales de la pastille comportent également un revêtement de colle.Insofar as the adhesive is thermosetting, the adhesive coating will advantageously form a base projecting from the inactive face of the component. In a variant of this embodiment, the lateral faces of the patch also include an adhesive coating.
L'invention a également comme autres objets des procédés de fabrication de tels composants. Ainsi, dans un premier procédé s'appliquant indifféremment à une colle thermoplastique ou une colle thermodurcissable, la fabrica¬ tion réalisée à partir d'une galette d'un matériau appro¬ prié dont une face incorpore une pluralité de circuits intégrés, consiste à pourvoir l'autre face de cette galette d'un revêtement de colle, à équiper cette face vêtue d'un film support adhérent et à individualiser chaque composant pratiquant un réseau de saignées de profondeur égale à l'épaisseur cumulée de la galette et du revêtement de colle.The invention also has as other objects methods of manufacturing such components. Thus, in a first method which applies equally to a thermoplastic adhesive or a thermosetting adhesive, the manufacture made from a wafer of a suitable material, one face of which incorporates a plurality of integrated circuits, consists in providing the other face of this wafer with an adhesive coating, to equip this face dressed with an adherent support film and to individualize each component practicing a network of grooves of depth equal to the cumulative thickness of the wafer and the coating of glue.
Dans le cas d'une colle thermodurcissable, un autre procédé peut être utilisé à savoir pourvoir l'autre face de la galette d'un revêtement de colle, équiper cette face revêtue d'un film support adhérent, pratiquer un premier réseau de saignées de profondeur égale à l'épais¬ seur de la galette seule, et individualiser chaque compo¬ sant en pratiquant un second réseau de saignées de largeur inférieure à celle des saignées du premier réseau, au fond de ces premières saignées, et de profondeur égale à l'épaisseur du revêtement de colle. On obtient ainsi des composants qui comportent un revêtement en forme d'embase débordante.In the case of a thermosetting adhesive, another method can be used, namely providing the other side of the wafer with a coating of adhesive, equipping this coated side with an adherent support film, practicing a first network of grooves of depth equal to the thickness of the cake alone, and individualize each component by making a second network of grooves of width less than that of the grooves of the first network, at the bottom of these first grooves, and of depth equal to l thickness of the adhesive coating. Components are thus obtained which have a coating in the form of an overhanging base.
Enfin, toujours pour des colles thermodurcissa¬ bles, un second procédé consiste à partir d'une galette, à pourvoir la face inactive de cette galette d'un revêtement de colle, à équiper cette face revêtue d'un film support adhérent, à pratiquer un premier réseau de saignées de profondeur égale à l'épaisseur de la galette, à remplir ce premier réseau d'une colle thermodurcissable et enfin à individualiser chaque composant en pratiquant un second réseau de saignées à l'intérieur des saignées du premier réseau, de largeur inférieure à celle des premières saignées et de profondeur égale à l'épaisseur cumulée de la galette et du revêtement. On obtient ainsi un composant qui est recouvert de colle sur sa face inactive et chacune de ses faces latérales.Finally, still for thermosetting adhesives, a second method consists in starting with a wafer, providing the inactive face of this wafer with a coating. of glue, to equip this face coated with an adherent support film, to practice a first network of grooves of depth equal to the thickness of the wafer, to fill this first network with a thermosetting glue and finally to individualize each component by practicing a second network of grooves inside the grooves of the first network, of width less than that of the first grooves and of depth equal to the combined thickness of the wafer and of the coating. A component is thus obtained which is covered with adhesive on its inactive face and each of its lateral faces.
D'autres avantages et caractéristiques de l'in¬ vention ressortiront de la description donnée ci-après à titre purement indicatif. II sera fait référence aux dessins annexés parmi lesquels :Other advantages and characteristics of the invention will emerge from the description given below for information only. Reference will be made to the accompanying drawings, in which:
- la figure 1 illustre partiellement un ensemble de composants selon l'invention maintenus sur un film support, - la figure 2 illustre schématiquement les moyens utilisés pour procéder à un dépôt de colle fin sur une galette de silicium,FIG. 1 partially illustrates a set of components according to the invention maintained on a support film, FIG. 2 diagrammatically illustrates the means used for depositing fine adhesive on a silicon wafer,
- la figure 3 illustre un ensemble de composants selon l'invention maintenus par un film support et pourvu d'une couche de colle thermodurcissable,FIG. 3 illustrates a set of components according to the invention maintained by a support film and provided with a layer of thermosetting adhesive,
- la figure 4 est une variante de réalisation de la figure 3,FIG. 4 is an alternative embodiment of FIG. 3,
- les figures 5 à 10 illustrent par des schémas différentes applications possibles du composant conforme à l'invention.- Figures 5 to 10 illustrate by diagrams different possible applications of the component according to the invention.
La figure 1 illustre par une coupe partielle, un ensemble de composants électroniques 1 sous forme de pastilles de circuit intégré retenues par un film 2 supportFigure 1 illustrates in partial section, a set of electronic components 1 in the form of integrated circuit pads retained by a film 2 support
(cet ensemble porte le nom de wafer) , chaque pastille comportant une face active 3 et une face inactive 4. Entre le film 2 et la face inactive 4 de chaque pastille, il existe un revêtement 5 de colle adhérant solidement à la pastille 1.(this set is called wafer), each patch having an active face 3 and an inactive face 4. Between the film 2 and the inactive face 4 of each tablet, there is a coating 5 of glue firmly adhering to the tablet 1.
Il existe de nombreuses manières pour obtenir le produit représenté à la figure l mais toutes comportent une première phase qui consiste, à partir d'une galette 6 d'un matériau approprié pour incorporer des circuits intégrés sur l'une de ses faces 7, de recouvrir l'autre face 8 c'est-à-dire celle inactive de cette galette d'une couche de la colle considérée. La figure 2 illustre une telle galette. La galette 6 incorporant une pluralité de circuits électroniques intégrés sur sa face 7 est bien connue. Usuellement lorsque cette galette est traitée sur sa face 7, elle est équipée directement du film 2 sur sa face 8 et, par réalisation d'un réseau de saignées dans la galette, on individualise chacun des composants formant pastille circuit intégré. Ces composants sont maintenus par le film 2. Ainsi donc, selon l'invention, avant d'équiper la galette 6 de ce film 2, on recouvre sa face inactive 8 d'un revêtement de colle.There are many ways to obtain the product represented in FIG. 1, but all of them comprise a first phase which consists, starting from a wafer 6 of a suitable material for incorporating integrated circuits on one of its faces 7, of cover the other face 8, that is to say the inactive face of this cake with a layer of the glue considered. Figure 2 illustrates such a cake. The wafer 6 incorporating a plurality of electronic circuits integrated on its face 7 is well known. Usually when this wafer is treated on its face 7, it is fitted directly with the film 2 on its face 8 and, by making a network of grooves in the wafer, each of the components forming an integrated circuit chip is individualized. These components are held by the film 2. Thus, according to the invention, before equipping the wafer 6 with this film 2, its inactive face 8 is covered with an adhesive coating.
Il existe plusieurs procédés pour procéder à ce revêtement, ces procédés dépendant essentiellement de la nature de la colle employée. De plus, la nature de cette colle dépendra de l'application envisagée pour le compo- sant.There are several methods for carrying out this coating, these methods essentially depending on the nature of the adhesive used. In addition, the nature of this adhesive will depend on the application envisaged for the component.
Dans le cas où le corps devant former le revête¬ ment de colle est une colle thermofusible ou thermoplasti¬ que à faible poids moléculaire ou une colle polymérisable, se présentant sous forme liquide, une manière de procéder à un dépôt régulier sur la face 8 de la galette 6 consiste à faire tourner rapidement cette galette au moyen d'un entraîneur en rotation 9 et à déverser quelques gouttes de ce produit liquide au centre de la galette, la force centrifuge procédant à l'étalement uniforme du produit. On peut solidifier ce produit en exposant la face 8 ainsi revêtue soit à l'influence de la température soit à l'influence d'un rayonnement ultraviolet selon la nature de la colle utilisée. Ce procédé convient lorsque l'on souhaite obtenir une couche de colle 5 (figure 1) relative- ment fine.In the case where the body to form the revè¬ ment of glue is a hot-melt or thermoplastic glue that low molecular weight or a polymerizable glue, being in liquid form, a way of proceeding with a regular deposition on the face 8 of the wafer 6 consists in rapidly rotating this wafer by means of a rotary drive 9 and in pouring a few drops of this liquid product into the center of the wafer, the centrifugal force proceeding to the uniform spreading of the product. We can solidify this product by exposing side 8 as well coated either with the influence of temperature or with the influence of ultraviolet radiation depending on the nature of the adhesive used. This method is suitable when it is desired to obtain a relatively thin layer of adhesive 5 (FIG. 1).
Lorsqu'on souhaite obtenir une couche de colle plus épaisse et notamment une couche de colle thermoplasti¬ que dont la matière soit semblable à la matière du substrat dans lequel on souhaite par la suite insérer le composant électronique à chaud (du polycarbonate par exemple) , on peut procéder de la manière suivante. Une galette est recouverte d'une solution de solvant volatile (de l'ethanol par exemple) et immédiatement recouverte par un film de matière thermoplastique (polycarbonate) . On évapore le solvant à faible température (40°) pendant quelques heures. Le film adhère alors à la face 8 de la galette. Pour améliorer la liaison entre le film et la galette, celle-ci est introduite dans un four où elle est portée à la température de 180° pendant une heure (en position horizon- taie, la face active 7 de la galette étant tournée vers le bas) . Cette opération permet de ramollir le thermoplastique (polycarbonate qui devient poisseux et qui colle intimement à la face 8 de la galette) .When it is desired to obtain a thicker layer of glue and in particular a layer of thermoplastic glue whose material is similar to the material of the substrate in which it is subsequently desired to insert the electronic component hot (polycarbonate for example), we can proceed as follows. A cake is covered with a volatile solvent solution (ethanol for example) and immediately covered with a film of thermoplastic material (polycarbonate). The solvent is evaporated at low temperature (40 °) for a few hours. The film then adheres to the face 8 of the wafer. To improve the connection between the film and the cake, the latter is introduced into an oven where it is brought to the temperature of 180 ° for one hour (in the horizontal position, the active face 7 of the cake being turned towards the bottom). This operation makes it possible to soften the thermoplastic (polycarbonate which becomes sticky and which sticks intimately to the face 8 of the wafer).
On peut accélérer le processus ci-dessus en procédant sous pression pendant le maintien en température. A cet effet, on presse la galette contre un support par exemple en verre poli, le film étant pris en sandwich entre ce support et la galette, ce support ayant un coefficient de dilatation compatible avec celui du matériau constituant la galette. Dans une variante de réalisation on peut supprimer tout simplement l'opération de solvantage et déposer la galette et le film de matériau thermoplastique sur une surface plane, par exemple en verre poli et procéder à une chauffe sous compression de cet ensemble. Il conviendra que la surface de l'organe presseur en contact avec le film thermoplastique soit traitée pour que ce film lorsqu'il est ramolli n'y adhère pas.The above process can be accelerated by proceeding under pressure while maintaining the temperature. To this end, the wafer is pressed against a support, for example in polished glass, the film being sandwiched between this support and the wafer, this support having a coefficient of expansion compatible with that of the material constituting the wafer. In an alternative embodiment, the solvent operation can simply be omitted and the wafer and the film of thermoplastic material deposited on a flat surface, for example made of polished glass, and heating under compression of this assembly. The surface of the pressing member in contact should be with the thermoplastic film is treated so that this film when softened does not adhere to it.
Quelle que soit l'épaisseur du revêtement de colle 5 prévue sur la face inactive de chaque composant, l'un des avantages fondamentaux de cette présence de colle réside dans la capacité au composant à être fixé par collage sur un substrat à l'endroit même où il y sera inséré à chaud. Le mode de fixation dépendra essentiel¬ lement du caractère thermoplastique ou thermodurcissable de la colle employée.Whatever the thickness of the adhesive coating 5 provided on the inactive face of each component, one of the fundamental advantages of this presence of adhesive lies in the ability of the component to be fixed by bonding to a substrate at the same location. where it will be inserted hot. The method of fixing will essentially depend on the thermoplastic or thermosetting nature of the adhesive used.
Au cas où la colle employée est une colle thermo¬ durcissable réactivable à chaud, il suffit de présenter au poste de positionnement du composant sur le substrat des substrats à température appropriée pour qu'une adhérence se produise entre la colle 5 et la surface supérieure du substrat. Il est même possible par une formulation adéquate de la colle d'obtenir une colle solide sous le composant qui, à température ambiante, possède un certain pouvoir adhésif (tack) , permettant au composant d'être maintenu sur le substrat sans même chauffer ce dernier.In the case where the adhesive used is a thermosetting adhesive which can be reactivated when hot, it suffices to present substrates at the appropriate temperature at the position for positioning the component on the substrate for adhesion to occur between the adhesive 5 and the upper surface of the substrate. It is even possible by an adequate formulation of the adhesive to obtain a solid adhesive under the component which, at room temperature, has a certain adhesive power (tack), allowing the component to be maintained on the substrate without even heating the latter. .
Pour ce qui concerne une colle à base de thermo¬ plastique, l'adhérence du composant sur le substrat peut être obtenue au moyen d'une goutte de solvant disposée sur le substrat sur laquelle viendra reposer le composant. La couche de colle 5 et le substrat vont réagir avec le solvant et des liaisons entre eux vont s'établir pour réaliser une liaison correcte. La figure 5 est un schéma qui illustre ce collage entre un substrat 10 et un compo¬ sant 1 pourvu d'une colle 5 soit thermodurcissable soit thermoplastique.As regards an adhesive based on thermoplastic, the adhesion of the component to the substrate can be obtained by means of a drop of solvent placed on the substrate on which the component will come to rest. The adhesive layer 5 and the substrate will react with the solvent and connections between them will be established to achieve a correct connection. FIG. 5 is a diagram which illustrates this bonding between a substrate 10 and a component 1 provided with an adhesive 5 either thermosetting or thermoplastic.
Au poste d'insertion à chaud, dans un substrat 10 thermoplastique, si le composant 1 est équipé d'un revête¬ ment de colle thermodurcissable, il ne se produit pas ou très peu de fluage de ce revêtement de colle lors de l'enfoncement du composant et le résultat obtenu est illustré par la figure 6. La colle 5 thermodurcissable améliore sensiblement la liaison entre le composant 1 et le substrat 10.At the hot insertion station, in a thermoplastic substrate 10, if the component 1 is equipped with a coating of thermosetting glue, there is no or very little creep of this coating of glue during insertion of the component and the result is illustrated by FIG. 6. The thermosetting adhesive 5 substantially improves the connection between the component 1 and the substrate 10.
A la figure 7 on a illustré l'insertion à chaud d'un composant 1 dans un substrat thermoplastique 10, le substrat possédant une couche de colle thermoplastique et de préférence réalisée dans le même matériau (par exemple polycarbonate) que celui du substrat 10. Sous l'effet de la chaleur, les deux matériaux qui ont été auparavant intime- ment liés lors du collage par exemple par solvant ou par apport de chaleur, se confondent si bien que l'insertion du composant 1 possède les mêmes qualités que s'il n'y avait pas eu de collage préalable de ce composant sur le subs¬ trat. Cette manière de procéder possède l'avantage de ne pas introduire de corps étrangers autour du composant lors de son enfoncement à chaud dans le substrat et de ne pas perturber la qualité de la liaison obtenue. Par ailleurs les matériaux 12, dégradés par d'une part le solvant ou le chauffage lors de l'opération de collage précédant l'opéra- tion d'insertion, sont dispersés et répartis de manière discontinue à distance du composant, ce qui est un gage de bon maintien de ce composant dans la masse du substrat.FIG. 7 illustrates the hot insertion of a component 1 into a thermoplastic substrate 10, the substrate having a layer of thermoplastic adhesive and preferably made of the same material (for example polycarbonate) as that of the substrate 10. Under the effect of heat, the two materials which were previously intimately bonded during bonding, for example by solvent or by addition of heat, merge so that the insertion of component 1 has the same qualities as there had been no prior bonding of this component on the substrate. This procedure has the advantage of not introducing foreign bodies around the component when it is hot pressed into the substrate and of not disturbing the quality of the connection obtained. Furthermore, the materials 12, degraded on the one hand by the solvent or the heating during the bonding operation preceding the insertion operation, are dispersed and distributed discontinuously away from the component, which is a pledge of good maintenance of this component in the mass of the substrate.
En utilisant la technique d'un film transféré à chaud de matériaux thermoplastiques ou thermodurcissables au dos d'une galette 6, on peut équiper chacun des compo¬ sants 1 d'une couche de colle d'épaisseur substantielle. Grâce à cette couche de colle, on peut bien entendu obtenir le collage préalable à l'insertion à chaud du composant sur un substrat mais surtout il est possible de procéder à la fixation d'un composant 1 dans un substrat 13 qui soit en matériau thermodurcissable. Les figures 8 et 9 illustrent cette manière de procéder. A la figure 8, on remarque que le substrat 13 a été préalablement usiné pour qu'une cavité ou un logement 14 y soit ménagé (par fraisage, par ablation laser, ... ) . Le composant 1 porte une couche de colle relativement importante 5a sur sa face inactive et, au moyen d'un poinçon chauffant 15 on provoque le ramollisse¬ ment de cette couche de colle qui flue et vient remplir l'espace de la cavité 14 laissée libre par le composant l lorsqu'il y est enfoncé par le poinçon 15, l'excédant de matière pouvant déborder et constituer une fine pellicule 16 venant recouvrir le substrat autour des bords de la cavité, le matériau de collage ne pouvant pas s'insinuer entre le poinçon 15 et le composant 1 compte tenu de la qualité extrêmement soignée du contact entre ces deux éléments. La colle utilisable peut être un thermoplastique ou un matériau thermodurcissable, réactivable à chaud c'est-à-dire qui n'atteindra son état irréversible qu'après avoir été chauffé par le poinçon alors qu'il a pu être déformé et fluer lors de l'opération de chauffage. On comprend que le composant selon l'invention permet, comme illustré par les figures 8 et 9, d'utiliser la technique d'insertion à chaud d'un composant même en regard d'un substrat qui ne soit pas thermoplastique. L'avantage essentiel de cette disposition est que l'outillage et les installations de fabrication d'objets portatifs porteurs de circuit intégré peuvent être uniques quels que soient les substrats qui sont utilisés pour former le corps de ces objets portatifs. Les variantes de réalisation illustrées par les figures 3 et 4 d'un composant électronique conforme à l'invention concernent plus particulièrement ceux équipés d'une colle thermodurcissable pour améliorer la tenue des composants en regard de contraintes de flexion imprimées à l'objet portatif, notamment lorsqu'il se présente sous la forme d'une carte.By using the technique of a hot transferred film of thermoplastic or thermosetting materials on the back of a wafer 6, each of the components 1 can be equipped with a layer of glue of substantial thickness. Thanks to this layer of adhesive, it is of course possible to obtain the bonding prior to the hot insertion of the component on a substrate, but above all it is possible to fix a component 1 in a substrate 13 which is made of thermosetting material. . Figures 8 and 9 illustrate this way of proceeding. In FIG. 8, it can be seen that the substrate 13 has been previously machined so that a cavity or a housing 14 is formed therein (by milling, by laser ablation, etc.). Component 1 has a layer of glue relatively large 5a on its inactive face and, by means of a heating punch 15, causes the softening of this layer of glue which flows and fills the space of the cavity 14 left free by the component l when there is pressed in by the punch 15, the excess of material being able to overflow and constituting a thin film 16 covering the substrate around the edges of the cavity, the bonding material being unable to creep between the punch 15 and the component 1 count given the extremely careful quality of the contact between these two elements. The adhesive which can be used can be a thermoplastic or a thermosetting material, hot reactivable, that is to say which will only reach its irreversible state after having been heated by the punch when it could have been deformed and creep during the heating operation. It is understood that the component according to the invention makes it possible, as illustrated by FIGS. 8 and 9, to use the technique of hot insertion of a component even opposite a substrate which is not thermoplastic. The essential advantage of this arrangement is that the tools and installations for manufacturing portable objects carrying an integrated circuit can be unique whatever the substrates which are used to form the body of these portable objects. The variant embodiments illustrated by FIGS. 3 and 4 of an electronic component in accordance with the invention relate more particularly to those equipped with a thermosetting adhesive to improve the behavior of the components facing bending stresses imprinted on the portable object, especially when it comes in the form of a card.
La figure 3, à l'instar de la figure 1, illustre un premier mode de réalisation dans lesquels après avoir équipé la galette 6 d'une couche uniforme de colle thermo- durcissable et d'avoir associé à cette face revêtue un film support 2, on a procédé à l'individualisation des compo¬ sants en deux temps. Dans un premier temps on a réalisé sur la galette du côté de sa face active, un réseau de saignées de largeur L et de profondeur égale à l'épaisseur de la galette 6, c'est-à-dire de chacun des composants 1 pour découvrir en fond de saignée le revêtement 5. On a ensuite réalisé à l'intérieur du réseau de saignées 17 un second réseau de saignées 18 de largeur 1 inférieure à la largeur L et de profondeur égale à l'épaisseur du revêtement de colle. Chaque composant ainsi individualisé possède donc une sorte d'embase de colle débordant de sa face inactive. La largeur d de ce débordement périphérique est égale à la moitié de la différence des largeurs des saignées et sera de préférence sensiblement égale à l'épaisseur de chaque composant. Bien entendu cette embase 5 se comporte comme décrit précédemment au regard de la figure 5 pour ce qui concerne le collage du composant sur un substrat. Dans la phase d'insertion à chaud de ce composant, le rebord de largeur d est rabattu le long des faces latérales du composant au moment de l'enfoncement du composant dans le substrat si bien qu'une couche relativement homogène de colle thermodurcissable est interposée entre la matière thermoplastique du substrat et le composant. On s'est rendu compte que notamment en ce qui concerne la liaison des parois latérales du composant avec le matériau, liaison qui est la plus sollicitée lors des contraintes en flexion rappelées ci-dessus, la présence d'une colle thermodurcis¬ sable à ce niveau en améliore grandement la qualité.Figure 3, like Figure 1, illustrates a first embodiment in which after having equipped the wafer 6 with a uniform layer of thermosetting adhesive and having associated with this coated side a film support 2, the components were individualized in two stages. Firstly, on the wafer on the side of its active face, a network of grooves of width L and of depth equal to the thickness of the wafer 6, that is to say of each of the components 1, was produced. discover the coating 5 at the bottom of the groove. Then, inside the network of grooves 17, a second network of grooves 18 of width 1 less than the width L and of depth equal to the thickness of the adhesive coating was produced. Each component thus individualized therefore has a kind of glue base projecting from its inactive face. The width d of this peripheral overflow is equal to half the difference in the widths of the grooves and will preferably be substantially equal to the thickness of each component. Of course, this base 5 behaves as described above with regard to FIG. 5 with regard to the bonding of the component on a substrate. During the hot insertion phase of this component, the flange of width d is folded down along the lateral faces of the component when the component is pressed into the substrate so that a relatively homogeneous layer of thermosetting adhesive is interposed between the thermoplastic material of the substrate and the component. It has been realized that in particular as regards the connection of the side walls of the component with the material, connection which is most stressed during the bending stresses mentioned above, the presence of a thermosetting glue to this level greatly improves the quality.
A la figure 4 on a illustré un autre mode de réalisation d'un composant pourvu d'une couche de colle thermodurcissable. Ainsi, après avoir revêtu la face inactive 8 de la galette 6 d'une couche de colle thermodur¬ cissable 5 et après avoir mis en place le film support 2, on procède à un premier réseau de saignées à partir de la face active 3 de la galette, ce premier réseau étant de O 97/42657 PC17FR97/00789FIG. 4 illustrates another embodiment of a component provided with a layer of thermosetting adhesive. Thus, after having coated the inactive face 8 of the wafer 6 with a layer of thermosetting adhesive 5 and after having put in place the support film 2, a first network of grooves is carried out from the active face 3 of the cake, this first network being of O 97/42657 PC17FR97 / 00789
11 profondeur limitée à l'épaisseur de la galette. Les saignées ainsi réalisées sont ensuite remplies d'une colle thermodurcissable en prenant bien entendu toute précaution pour masquer la face active de chaque composant du fait même que le remplissage ne peut se faire que par cette face active, et on procède ensuite à la confection d'un deuxième réseau de saignées dans le premier réseau, mais de largeur inférieure pour laisser subsister le long de chaque paroi latérale de chaque composant un revêtement 19 de colle. La profondeur des saignées de ce second réseau est égale à l'épaisseur cumulée de la galette et de la couche de colle initialement déposée sur la face inactive de cette galette. C'est donc un composant revêtu sur cinq de ses six faces qui est enfoncé à chaud dans un substrat en matière thermoplastique comme illustré par la figure 8. La liaison du composant à ce substrat en est grandement améliorée. 11 depth limited to the thickness of the cake. The grooves thus produced are then filled with a thermosetting adhesive, taking of course every precaution to mask the active face of each component, by the very fact that the filling can only be done by this active face, and we then proceed to the making of 'A second network of grooves in the first network, but of smaller width to allow to remain along each side wall of each component a coating 19 of adhesive. The depth of the grooves in this second network is equal to the cumulative thickness of the wafer and of the layer of adhesive initially deposited on the inactive face of this wafer. It is therefore a component coated on five of its six faces which is hot pressed into a substrate made of thermoplastic material as illustrated in FIG. 8. The bonding of the component to this substrate is greatly improved.

Claims

REVENDICATIONS
1. Composant électronique en forme de pastille (1) de circuit (10, 13), caractérisé en ce qu'il comporte au moins sur sa face inactive (4) un revêtement (5) de colle thermoplastique ou thermodurcissable réactivable à chaud.1. Electronic component in the form of a pellet (1) of a circuit (10, 13), characterized in that it comprises at least on its inactive face (4) a coating (5) of thermoplastic or thermosetting glue which can be reactivated hot.
2. Composant selon la revendication 1, caracté¬ risé en ce que la colle (5) étant thermodurcissable, le revêtement de colle forme une embase débordant (d) de la face inactive (4) du composant.2. Component according to claim 1, caracté¬ ized in that the adhesive (5) being thermosetting, the coating of adhesive forms a base projecting (d) from the inactive face (4) of the component.
3. Composant selon la revendication 2, caracté¬ risé en ce que la largeur (d) de la partie débordante de l'embase (5) est sensiblement égale à l'épaisseur de la pastille (1) . 3. Component according to claim 2, caracté¬ ized in that the width (d) of the projecting part of the base (5) is substantially equal to the thickness of the patch (1).
4. Composant selon la revendication 1, caracté¬ risé en ce que la colle étant thermodurcissable, les faces latérales de la pastille (1) comportent un revêtement de colle (19) .4. Component according to claim 1, caracté¬ ized in that the glue being thermosetting, the lateral faces of the patch (1) comprise a coating of glue (19).
5. Procédé de fabrication de composants selon la revendication 1, à partir d'une galette (6) d'un matériau approprié dont une face (7) incorpore une pluralité de circuits intégrés, caractérisé en ce qu'il consiste à pourvoir l'autre face (8) de la galette (6) d'un revêtement de colle, à équiper cette face revêtue d'un film (2) support adhérent et à individualiser chaque composant en pratiquant un réseau de saignées de profondeur égale à l'épaisseur cumulée de la galette (6) et du revêtement de colle (5) .5. A method of manufacturing components according to claim 1, from a wafer (6) of a suitable material, one face (7) incorporates a plurality of integrated circuits, characterized in that it consists in providing the other face (8) of the wafer (6) with an adhesive coating, to equip this face coated with a film (2) adherent support and to individualize each component by practicing a network of grooves of depth equal to the thickness cumulative of the wafer (6) and the adhesive coating (5).
6. Procédé de fabrication de composants selon la revendication 2, à partir d'une galette (6) d'un matériau approprié dont une face (7) incorpore une pluralité de circuits intégrés, caractérisé en ce qu'il consiste à pourvoir l'autre face (8) de la galette (6) d'un revêtement de colle thermodurcissable (5) , à équiper cette face revêtue d'un film support (2) adhérent, à pratiquer un premier réseau de saignées (17) de profondeur égale à l'épaisseur de la galette (6) et à individualiser chaque composant en pratiquant un second réseau de saignées (18) de largeur inférieure à celle des saignées (17) du premier réseau au fond de ces premières saignées, de profondeur égale à l'épaisseur du revêtement de colle (5) .6. A method of manufacturing components according to claim 2, from a wafer (6) of a suitable material, one face (7) of which incorporates a plurality of integrated circuits, characterized in that it consists in providing the other face (8) of the wafer (6) with a coating of thermosetting adhesive (5), to be fitted on this face coated with an adhesive support film (2), first network of grooves (17) of depth equal to the thickness of the wafer (6) and to individualize each component by making a second network of grooves (18) of width less than that of the grooves (17) of the first network at the bottom of these first grooves, of depth equal to the thickness of the adhesive coating (5).
7. Procédé de fabrication de composants selon la revendication 4, à partir d'une galette (6) d'un matériau approprié dont une face (7) incorpore une pluralité de circuits intégrés, caractérisé en ce qu'il consiste à pourvoir l'autre face (8) de cette galette (6) d'un revêtement de colle (5) thermodurcissable, à équiper cette face revêtue d'un film (2) support adhérant, à pratiquer un premier réseau de saignées de profondeur égale à l'épais- seur de la galette (6), à remplir ce premier réseau d'une colle thermodurcissable et à individualiser chaque compo¬ sant en pratiquant un second réseau de saignées à l'inté¬ rieur des saignées du premier réseau, de largeur inférieure à celle des premières saignées et de profondeur égale à l'épaisseur cumulée de la galette (6) et du revêtement (5) . 7. A method of manufacturing components according to claim 4, from a wafer (6) of a suitable material, one face (7) incorporates a plurality of integrated circuits, characterized in that it consists in providing the other face (8) of this wafer (6) with a coating of thermosetting adhesive (5), to be fitted on this face coated with an adhering support film (2), to make a first network of grooves of depth equal to the thickness of the wafer (6), filling this first network with a thermosetting adhesive and individualizing each component by making a second network of grooves inside the grooves of the first network, of width less than that of the first grooves and of depth equal to the cumulative thickness of the wafer (6) and of the coating (5).
EP97921930A 1996-05-06 1997-05-05 Electric component in integrated circuit form for hot insertion in a substrate and methods for manufacturing same Ceased EP0897595A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9605625A FR2748350B1 (en) 1996-05-06 1996-05-06 ELECTRONIC COMPONENT IN THE FORM OF AN INTEGRATED CIRCUIT FOR HOT INSERTION IN A SUBSTRATE AND METHODS OF MAKING SAME
FR9605625 1996-05-06
PCT/FR1997/000789 WO1997042657A1 (en) 1996-05-06 1997-05-05 Electric component in integrated circuit form for hot insertion in a substrate and methods for manufacturing same

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EP0897595A1 true EP0897595A1 (en) 1999-02-24

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US6541872B1 (en) 1999-01-11 2003-04-01 Micron Technology, Inc. Multi-layered adhesive for attaching a semiconductor die to a substrate
CN112599653B (en) * 2020-12-04 2023-03-10 杭州大和热磁电子有限公司 Thermoelectric module suitable for cold-hot alternation and manufacturing method thereof

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US3600246A (en) * 1968-05-17 1971-08-17 Rca Corp Method of making laminated semiconductor devices
JPS59200438A (en) * 1983-04-28 1984-11-13 Oki Electric Ind Co Ltd Manufacture of semiconductor device
JPH0715087B2 (en) * 1988-07-21 1995-02-22 リンテック株式会社 Adhesive tape and method of using the same
MX9305603A (en) * 1992-09-14 1994-05-31 Pierre Badehi METHOD AND APPARATUS FOR PRODUCING INTEGRATED CIRCUIT DEVICES.
ZA941671B (en) * 1993-03-11 1994-10-12 Csir Attaching an electronic circuit to a substrate.
JPH06349866A (en) * 1993-06-10 1994-12-22 Sumitomo Electric Ind Ltd Die bonding of semiconductor wafer and semiconductor element

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* Cited by examiner, † Cited by third party
Title
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WO1997042657A1 (en) 1997-11-13
FR2748350B1 (en) 2000-07-13
FR2748350A1 (en) 1997-11-07

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