EP0897585B1 - Hybrid relay - Google Patents

Hybrid relay Download PDF

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Publication number
EP0897585B1
EP0897585B1 EP97923744A EP97923744A EP0897585B1 EP 0897585 B1 EP0897585 B1 EP 0897585B1 EP 97923744 A EP97923744 A EP 97923744A EP 97923744 A EP97923744 A EP 97923744A EP 0897585 B1 EP0897585 B1 EP 0897585B1
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EP
European Patent Office
Prior art keywords
power semiconductor
relay according
contact
yoke
core yoke
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP97923744A
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German (de)
French (fr)
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EP0897585A1 (en
Inventor
Josef Kern
Bican Samray
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Siemens AG
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Siemens AG
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00Details of electromagnetic relays
    • H01H50/02Bases; Casings; Covers
    • H01H50/021Bases; Casings; Covers structurally combining a relay and an electronic component, e.g. varistor, RC circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00Details of electromagnetic relays
    • H01H50/02Bases; Casings; Covers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00Details of electromagnetic relays
    • H01H50/02Bases; Casings; Covers
    • H01H50/04Mounting complete relay or separate parts of relay on a base or inside a case
    • H01H2050/049Assembling or mounting multiple relays in one common housing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/54Circuit arrangements not adapted to a particular application of the switching device and for which no provision exists elsewhere
    • H01H9/541Contacts shunted by semiconductor devices
    • H01H9/542Contacts shunted by static switch means

Definitions

  • hybrid relays are used, which are specified in the introduction
  • the mechanical relay contacts use electronic switches, the latter temporally is actuated offset and so the load peak when and switching off takes over; the relay contacts are thereby "Dry” switched and can therefore be done with less effort achieve a longer lifespan.
  • Such hybrid circuits are for example from DE 37 01 838 A1 or the US 47 72 809 known. Depending on the circumstances, these are Circuits relay contacts in parallel or in series with the power semiconductor switched.
  • the aim of the present invention is to provide a hybrid relay to create the type mentioned, which is compact and with as few individual parts as possible a good and simple one Allows heat dissipation for the power semiconductor.
  • this goal is achieved with a hybrid relay type mentioned achieved in that the power semiconductor in thermal contact with the Kernjoch unit of the electromagnetic relay system.
  • the relay designed as a pole reversal relay, in which the core yoke by a is substantially flat sheet E-shaped, wherein between two side legs and a middle leg as three bays two center bars as cores one coil each wear and with the two anchors each one of the side legs and the middle leg with the formation of working air gaps bridge, with the power semiconductor on the middle leg is arranged.
  • the contacts of the hybrid relay be switched without load and therefore not exposed to erosion need no overstroke during construction to be considered. Therefore, the magnetic circuit parts at the same time carry the contact current, for example the Pole surfaces can be designed as contact surfaces. This gives a particularly simple structure with few individual parts.
  • the anchor stroke corresponds the contact stroke, and through these smaller working air gaps of the magnet system can either be the same Winding larger contact forces with smaller contact resistances generated in the load area or it can be used to generate same contact forces as with conventional systems a higher impedance winding with a correspondingly lower one Heating the coil can be used.
  • the relay shown in Figures 1 to 7 has as Carrier a magnetic circuit ( Figure 2) with a flat E-shaped Kernjoch 1, which symmetrically two side legs 11 and a middle leg 12, which is in one piece two core webs 13 are connected.
  • Each of the core webs 13 carries a winding 65.
  • Two flat anchors 2 are aligned and symmetrical Arranged parallel to the core yoke 1, and they bridge each a free end of a side leg 11 and one Part of the middle leg 12 with the formation of working air gaps 21 and 22.
  • Each of the armatures 2 is via an armature return spring 23 attached to a carrier plate 24, which forms a pin 25.
  • the two are at rest Armature 2 due to the restoring effect of the return springs 23 together on an NC contact plate 3, which is parallel to the central leg 12 of the core yoke opposite this is arranged and forms a pin 31.
  • an NC contact plate 3 which is parallel to the central leg 12 of the core yoke opposite this is arranged and forms a pin 31.
  • In addition to the break contact plate there is also a ground connection plate 4 provided with a pin 41.
  • the middle leg 12 of the core yoke 1 is so wide that that on the one hand the pole faces for the two working air gaps 22 forms in relation to the anchors 2 and on the other hand a large area for a power transistor 5 provides good heat transfer.
  • This power transistor 5 is with its three connections with one from the Kernjoch stamped out lug 14, with a connecting tab 32 of the NC contact plate 3 and with a connecting tab 42 of the ground connection plate 4 connected.
  • the two connecting tabs 32 and 42 are through openings 15 and 16 of the core yoke on the side of the power transistor 5 guided.
  • the core yoke 1 is made with thermoplastic plastic for formation overmoulded a bobbin 6, the mutually the Middle leg 12 each have a coil tube 61 for receiving each a winding 7 forms.
  • the windings are on both sides limited by flanges 62.
  • the core yoke is in each case an extension on the coil former 6 63 with a slot 64 for receiving the carrier plates 24 integrally formed for the armature return springs 23.
  • These carrier sheets but could also with the material of the bobbin extrusion-coated, that is, embedded in the bobbin 6.
  • the Armature return springs 23 are on the carrier plates 24 through a welded or riveted joint attached.
  • the surfaces of the magnetic circuit parts i.e. the core yoke 1 and the two anchors 2, are each at least in the area of Air gaps 21 and 22 between anchor and yoke legs with one Precious metal layer coated and serve at the same time Current routing of the load circuit in the normally open function of the relay.
  • the opening function of the two electromagnetic Changer relay systems is made possible by the already mentioned break contact plate 3, which is at least in the touch area with the two anchors 2 is coated with precious metal.
  • the required contact force is given by the armature return spring 23 applied.
  • the two are movable armature 2 for low-resistance contact and current supply all over with one, for example galvanic, Silver layer coated.
  • This layer can be economical run very thin because of the electromagnetic relay system only carry the load current, but do not switch got to.
  • Through the two air gaps 21 and 22 of each anchor 2 to the core yoke 1 results when the magnetic circuit is closed double contacting of the no-load switching Load circuit, which increases the contact security significantly.
  • the no-load switching of the two anchors 2 eliminates the otherwise conventional erosion of the contacts, which is used as an overstroke or Burn-off security is provided for the armature stroke of a relay must become.
  • the armature stroke in the air gaps 21 and 22 at the same time the distance between the contacting surfaces (Contact distance). Because not due to material migration arcing must be taken into account is not a lead clearance, the otherwise in addition to the distance of the required Dielectric strength can be provided between the contacts should be necessary.
  • the magnet system thus has smaller working air gaps than otherwise required; this allows at same design of the magnet system greater contact forces and thus achieved lower contact resistances in the load range become. On the other hand, if you keep the contact forces the same, compared to conventional magnet systems, this can be a higher impedance Winding can be provided by the less heating the coil is reached.
  • the relay is the caseless Power transistor 5 directly on the middle part or the middle leg of the core yoke 1 by a solder connection attached and thus directly with the normally open mating contacts of the polarity reversal relay connected because the drain terminal of the MOSFET power transistor with the metallic solder pad and the Normally open counter contacts - which are formed by the core yoke are - in the circuit arrangement provided according to FIG have common polarity in the polarity reversal circuit.
  • control electronics as is preferably assumed here, is also arranged in the relay, this connection does not require a connection to the outside, but only a connecting line to the control electronics, which can be carried out, for example, via bonding wires 70 from the connection lug 14 already mentioned.
  • the control electronics are in the form of a housing-free control IC (for example an ASIC) below the power transistor 5 and approximately at the level of the contact level of the armatures on the middle leg 12.
  • the core yoke 1 is thus the carrier of the power transistor 5 and the control electronics in the IC 8, whereby an additional component carrier, such as a printed circuit board or a ceramic carrier, is not required.
  • the internal connections in the relay between the power transistor 5, the control IC 8 and the outward control connections 71 to 74 are implemented, for example, via bond wires 70.
  • the control connections 71 to 74 are injected in the form of a lead frame into the thermoplastic material of the coil former 6.
  • two coil connections 66 for the two windings 65 are embedded in the internal coil flanges 62. After the windings 65 have been applied and after the winding ends 67 have been soldered, they are bent over in the winding region.
  • the two coil connections 66 each take up one winding end of each coil 65 (FIG. 5), the other two winding ends 68 (FIG. 7) are wound onto a common winding point 34, which is punched out of the sheet of the common break contact plate 3, and for example by Soldering connected.
  • thermoplastic injection molded part forming the bobbin 6 is also a collar 60 in the area of the middle leg 12 integrally formed, the trough-shaped cavity 69th forms around the power transistor 5 and the control IC 8.
  • This trough-shaped cavity 69 becomes after the bonding of the connecting wires between the transistor 5, the control IC 8 and the control connections 71 to 73 with a permanently elastic Potting compound (not shown) to protect the bond wires and the semiconductor poured out.
  • thermoplastic base plate 91 and a, for example thermoplastic injection-molded, cap 92 serve to stabilize the relay connections 25, 31, 41 and 71 to 74. These two parts are sealed by a casting compound after assembly.
  • this cap 92 can also be provided with cooling ribs and / or injection-molded from a metal-filled plastic (for example Al 2 O 3 for higher thermal conductivity.
  • the coil body could also consist of this Al 2 O 3.
  • Another possibility consists in producing the cap 92 from a metallic, non-magnetic material, for example by deep drawing.
  • Figure 8 is a possible control circuit for the relay shown in Figures 1 to 7.
  • the control IC 8 as ASIC is a simplified block diagram used the essential functions for the timer between the power semiconductor 5 and the relay system with the coils 65 and the armature contacts 2 shows. So the control IC 8 includes a logic circuit 81 which is its Receives clock from an oscillator 82 and optionally via a Driver circuit 83 applies one of the coils 65 to voltage. over a comparator 84 and a NOR gate 85 becomes the power semiconductor 5 controlled.
  • the logic circuit 81 ensures that the respective armature 2 in question is first switched over is before the via the power transistor 5 Circuit is closed. So the contacts will dry, i.e. de-energized, switched so that no arc arises.
  • the ASIC is supplied with power via the connections of the coils 65.
  • control circuit also can be constructed differently than shown in Figure 8.
  • the number of Connections can vary depending on the circuit.
  • the control IC shown in FIG 8 only three control connections from ASIC pins 1, 2 and 3 via the control connections 71, 72 and 73 together with pin 4 via the ground connection 41 to the outside while in the construction view according to Figures 1 to 7 four control connections 71 to 74 are shown. In this case it would remain the connection 74 is not connected.
  • the Control circuit can have four or more control connections be led outside. In the same way it is possible part of the control functions or the entire control circuit out of the relay into a socket or to be laid on a separate circuit board.
  • the invention In this case, too, there would be an advantage for them Arrangement of the power semiconductor on the core yoke obtained, namely the simple and effective cooling of the power semiconductor and the compact design of the hybrid load circuit.
  • a hybrid relay in FIG. 1 is comparable in FIG Representation shown, which differs from the hybrid relay there essentially differs in that only one Electromagnetic system with a changeover contact is provided. Accordingly, a core yoke 101 is included as a flat, U-shaped part two side legs 111 and 112 are provided and on the latter a winding 165 is not visible in the central web. A single Armature 102 is connected to an armature return spring 123 Carrier plate 124 fastened, which in an extension 163rd a bobbin 106 is anchored and a connector pin 125 forms. An NC contact plate 103 is with a pin 131 provided.
  • a power transistor 105 arranged together with a control IC 108.
  • the power transistor can be parallel in this case, for example be switched to the load circuit of the relay, the transistor the current briefly before switching the armature switches and the low-resistance load circuit of the relay contacts after turning off the transistor only leads the current. Consequently in this case the magnetic circuit can also be used as Contact circle - with appropriate contact coating on the Pole surfaces - can be used. With such a parallel connection the heating of the component is much less than with a power transistor that has the continuous current alone should lead.
  • the relay according to FIG Figure 9 shows a housing consisting of a base plate 191 and a cap 192.
  • FIGS. 10 and 11 again show a polarity reversal relay in the front and rear view shown, in which the mechanical relay system is constructed essentially exactly as in the figures 1 to 7. It should therefore no longer be in detail to be discribed.
  • This integrated circuit 205 is via bond wires 270 connected to terminal lugs 271 to 274, which are embedded in the bobbin 6. Form further bond wires Connections to the coil pins 67, to the tabs 32 and 42 and to the connecting lug 14.
  • This integrated Control circuit 205 is in the trough-shaped Shed cavity 69 in the same way as the previous one Embodiment. In this case, too, would be a relay realizable with a single magnet system analogous to FIG. 9.
  • Figures 12 and 13 is a relay in front and rear view shown, in which the basic mechanical structure in turn is substantially the same as in the first embodiment according to Figures 1 to 7.
  • housed Standard blocks used housed Standard blocks used.
  • a power transistor 305 is arranged on the front and on the middle leg 12 of the core yoke is largely secured by soldering or welding.
  • the terminals 371 and 372 of this standard transistor are led directly out of the relay by a base plate 391, while the gate connection 373 within the relay with is connected to a control circuit.
  • a lead frame 307 On the side opposite the power transistor 305 is in a coil former 306, into which the core yoke 1 is injected is embedded, a lead frame 307, its down ends protruding from the injection molded part control connections 374 of the relay.
  • Each conductor track of the lead frame forms an exposed, non-molded contact surface 375; on this, in one level lying contact surfaces 375 becomes a control IC (ASIC) 308 soldered with SMT connector lugs 381.
  • ASIC control IC
  • Figure 14 shows a double relay, in which on a flat Base 400 two electromagnetic systems, each with an angled Yoke 401 are arranged; from the two yokes only the outer legs 411 aligned with one another can be seen.
  • a bobbin center flange 406 second yoke legs are parallel to each other and are with each coupled to a core that is also not visible, via which each has a coil 465.
  • At the free ends of the Each yoke leg 411 has an armature 402, one attached contact spring 403 actuated.
  • the free ends of the contact springs 403 are between two mating contact elements 404 switchable.
  • the function of this earlier registered relay structure results for the specialist without further, so that no further description is required is.
  • the two contact systems can be separated from each other as individual systems or as changeover relays with external connected contact connections can be used.
  • Hybrid relays can be one in the inventive manner Hybrid relays can be expanded by using a packaged power transistor 405 on the aligned outer sides of the two yoke legs 411 electrically insulating, but applied with good heat conductivity, for example glued on, becomes.
  • a packaged power transistor 405 on the aligned outer sides of the two yoke legs 411 electrically insulating, but applied with good heat conductivity, for example glued on, becomes.
  • the housing on one Side extended; thus the existing double relay system placed on an extended base plate 491 and surrounded with a likewise enlarged cap 492 (Fig. 15).
  • This arrangement is in a side view in FIG shown with cut cap.
  • the three connection flags 451, 452 and 453 of the transistor are directly through the base plate 491 led out.
  • the advantage of cooling the power transistor via the magnetic circuit of the relay is also used here.
  • FIG. 16 shows another structure as in FIGS. 14 and 15, in which a control circuit in the form of an ASIC 408 is included in the design.
  • a control circuit in the form of an ASIC 408 is included in the design.
  • the double relay provided with the power transistor 405 soldered to a small printed circuit board 410, which the only control circuit 408 shown as a block.
  • the small circuit board 410 also carries the connecting pins which are led out downwards 409 of the entire hybrid relay.
  • the ASIC control becomes a thermoplastic injection molded tub-like Plastic cap 493 from below onto the base plate 491 snapped on.
  • Figure 17 shows another slightly modified from Figure 16 Embodiment of a double hybrid relay.
  • the double relay system already shown in FIGS. 14 to 16 equipped with the power transistor 405 without a cap and the one equipped with the control electronics 408 PCB 410 soldered.
  • One over the double relay with Transistor and die - for example with SMT connection technology populated - small circuit board 410 reaching Cap 494 is then up to the cap edge 495 with Potting compound 496.
  • the relay is sealed, the SMT components are encapsulated in a protected manner, and the connection pins 409 of the circuit board will be up to the later Shed the necessary length in a stable position.

Abstract

PCT No. PCT/DE97/00804 Sec. 371 Date Nov. 9, 1998 Sec. 102(e) Date Nov. 9, 1998 PCT Filed Apr. 22, 1997 PCT Pub. No. WO97/42642 PCT Pub. Date Nov. 13, 1997A hybrid relay with an electromagnetic relay system having at least one coil one core yoke unit, at least one armature which switches contacts and one power semiconductor whose switching path, in combination with the contacts switches the load circuit of the relay wherein the contacts are switched on no-load by offsetting the control of the power semiconductor in time resulting in good heat dissipation and a compact design with few individual parts.

Description

Die Erfindung betrifft ein Hybridrelais mit

  • einem elektromagnetischen Relaissystem, das mindestens eine Spule, eine die Spule durchsetzende Kernjoch-Einheit, mindestens einen Anker sowie mindestens ein von dem Anker geschaltetes Kontaktpaar umfaßt und
  • einem Leistungshalbleiter, dessen Schaltstrecke gemeinsam mit dem mindestens einen Kontaktpaar den Lastkreis des Relais schaltet und dessen Schaltzeitpunkt gegenüber dem des elektromagnetischen Relaissystems derart zeitlich versetzt steuerbar ist, daß das Kontaktpaar jeweils lastfrei geschaltet wird.
The invention relates to a hybrid relay
  • an electromagnetic relay system which comprises at least one coil, a core yoke unit passing through the coil, at least one armature and at least one contact pair connected by the armature and
  • a power semiconductor, the switching path of which switches the load circuit of the relay together with the at least one pair of contacts and the switching time of which can be controlled in such a time-offset manner that that of the electromagnetic relay system that the contact pair is in each case switched without load.

Beim Schalten von Relaiskontakten unter Last werden diese vor allem durch den entstehenden Schaltlichtbogen stark beansprucht, und die dabei erzeugte hohe Erwärmung kann zum Verschweißen der Kontakte, zumindest aber zu einer unerwünschten Materialwanderung, zum Abbrand und damit zur Verminderung der Lebensdauer führen. Um diese Effekte zu vermeiden, werden sog. Hybridrelais verwendet, die in der eingangs angegebenen Weise zusätzlich zu den mechanischen Relaiskontakten einen elektronischen Schalter verwenden, wobei letzterer zeitlich versetzt betätigt wird und so die Belastungsspitze beim Ein- und Ausschalten übernimmt; die Relaiskontakte werden dabei "trocken" geschaltet und können dadurch mit weniger Aufwand eine höhere Lebensdauer erreichen. Derartige Hybridschaltungen sind beispielsweise aus der DE 37 01 838 A1 oder der US 47 72 809 bekannt. Je nach den Umständen werden in diesen Schaltungen Relaiskontakte parallel oder in Serie zum Leistungshalbleiter geschaltet. Im ersteren Fall wird zunächst der Leistungshalbleiter durchgesteuert und danach der Relaiskontakt geschlossen, so daß die Last im Dauerbetrieb über den Relaiskontakt fließt, während der Halbleiter dann nur noch einen geringeren Stromanteil führen muß oder ganz abgeschaltet werden kann. Beim Abschalten gilt die umgekehrte Reihenfolge. Im zweiten Fall, d.h. bei der Serienschaltung, wird zunächst der Relaiskontakt geschlossen und dann der Leistungshalbleiter durchgesteuert bzw. beim Abschalten der Leistungshalbleiter zuerst abgeschaltet, bevor die stromlos gewordenen Kontakte geöffnet werden. In diesem zweiten Fall fließt der Laststrom auch dauernd über den Leistungshalbleiter, so daß dieser auch einen beträchtlichen Wärmeverlust bewältigen muß. Diese Serienschaltung hat beispielsweise dann Bedeutung, wenn an einem Doppelrelais oder Umpolrelais zwei Stromkreise genau gleichzeitig geschlossen oder geöffnet werden müssen.When switching relay contacts under load, these are before heavily stressed by the resulting switching arc, and the resulting high heating can be used for welding of contacts, at least to an undesirable one Material migration, to burn and thus to reduce the Lead life. To avoid these effects So-called hybrid relays are used, which are specified in the introduction In addition to the mechanical relay contacts use electronic switches, the latter temporally is actuated offset and so the load peak when and switching off takes over; the relay contacts are thereby "Dry" switched and can therefore be done with less effort achieve a longer lifespan. Such hybrid circuits are for example from DE 37 01 838 A1 or the US 47 72 809 known. Depending on the circumstances, these are Circuits relay contacts in parallel or in series with the power semiconductor switched. In the former case, first the power semiconductor is turned on and then the relay contact closed, so that the load in continuous operation over the Relay contact flows while the semiconductor then only must lead a lower proportion of electricity or switched off completely can be. The reverse order applies when switching off. In the second case, i.e. in series connection, will first the relay contact is closed and then the power semiconductor activated or when switching off the power semiconductors first turned off before the de-energized Contacts are opened. In this second case the load current also flows continuously through the power semiconductor, so that it also copes with considerable heat loss got to. This series connection then has, for example Meaning if two on a double relay or reversing relay Circuits are closed or opened exactly at the same time have to.

Bei den herkömmlichen Hybridrelais bzw. Hybridschaltungen werden herkömmlich aufgebaute elektromagnetische Systeme und Standard-Halbleiter in üblicher Schaltungstechnik verbunden. Das bedeutet in der Regel die Anordnung der beiden Systeme auf einer gemeinsamen Leiterplatte mit entsprechendem Platzbedarf. In diesem Fall muß die Verlustwärme des Halbleiters auch auf herkömmliche Weise über Kühlkörper abgeführt werden.With conventional hybrid relays or hybrid circuits are conventionally constructed electromagnetic systems and Standard semiconductors connected in conventional circuit technology. This usually means the arrangement of the two systems on a common circuit board with a corresponding space requirement. In this case, the heat loss of the semiconductor can also be dissipated in a conventional manner via heat sinks.

Ziel der vorliegenden Erfindung ist es, ein Hybridrelais der eingangs genannten Art zu schaffen, das kompakt aufgebaut ist und mit möglichst wenig Einzelteilen auch eine gute und einfache Wärmeableitung für den Leistungshalbleiter ermöglicht. The aim of the present invention is to provide a hybrid relay to create the type mentioned, which is compact and with as few individual parts as possible a good and simple one Allows heat dissipation for the power semiconductor.

Erfindungsgemäß wird dieses Ziel bei einem Hybridrelais der eingangs genannten Art dadurch erreicht, daß der Leistungshalbleiter in thermischem Kontakt mit der Kernjoch-Einheit des elektromagnetischen Relaissystems steht.According to the invention, this goal is achieved with a hybrid relay type mentioned achieved in that the power semiconductor in thermal contact with the Kernjoch unit of the electromagnetic relay system.

Zwar ist verschiedentlich bereits vorgeschlagen worden, im Gehäuse eines elektromagnetischen Relais auch einen Halbleiter bzw. eine Halbleiterschaltung unterzubringen (EP 0484 587 B1), doch geschah dies bisher immer unabhängig vom Magnetsystem und ohne schaltungsmäßige Verknüpfung mit den Kontakten. Bei dem erfindungsgemäßen Relais dagegen ist der Leistungshalbleiter direkt auf dem Kernjoch des elektromagnetischen Relais befestigt, welches durch seinen relativ großen Querschnitt die im Transistor entstehende Wärme rasch ableitet, nämlich zum Teil über die eigene große Oberfläche und zum Teil über die Spulenwicklung. Dabei stellt der Magnetkreis des Relais zusätzlich die Funktion eines Bauelementträgers zumindest für den Leistungshalbleiter dar; er kann aber in weiterer Ausgestaltung zusätzlich auch applikationsspezifische integrierte Schaltungsbausteine tragen. Dadurch wird einerseits die Baugröße und das Volumen des Hybridrelais verringert, und es können Halbleiter ohne eigenes Gehäuse verwendet werden, da sie in dem Relaisgehäuse gegen Umwelteinflüsse geschützt werden können.Various proposals have already been made in Housing of an electromagnetic relay also a semiconductor or to accommodate a semiconductor circuit (EP 0484 587 B1), but so far this has always been done independently of the magnet system and without a connection to the contacts. In the relay according to the invention, however, is the power semiconductor directly on the core yoke of the electromagnetic Relay attached, which due to its relatively large cross section quickly dissipates the heat generated in the transistor, namely partly over its own large surface and partly Part about the coil winding. The magnetic circuit the relay also functions as a component carrier at least for the power semiconductor; but he can in further configuration also application-specific carry integrated circuit components. This will on the one hand reduces the size and volume of the hybrid relay, and semiconductors without their own package can be used as they are in the relay housing against environmental influences can be protected.

In einer besonders bevorzugten Ausführungsform ist das Relais als Umpolrelais ausgebildet, bei dem das Kernjoch durch ein im wesentlichen ebenes Blech E-förmig ausgebildet ist, wobei zwischen zwei Seitenschenkeln und einem Mittelschenkel als drei Jochen zwei Mittelstege als Kerne jeweils eine Spule tragen und bei dem zwei Anker jeweils einen der Seitenschenkel und den Mittelschenkel unter Bildung von Arbeitsluftspalten überbrücken, wobei der Leistungshalbleiter auf dem Mittelschenkel angeordnet ist. Da bei dem Hybridrelais die Kontakte lastlos geschaltet werden und somit keinem Abbrand ausgesetzt sind, braucht bei der Konstruktion auch kein Überhub berücksichtigt zu werden. Deshalb können die Magnetkreisteile zugleich den Kontaktstrom führen, also beispielsweise die Polflächen als Kontaktflächen ausgebildet sein. Dadurch ergibt sich ein besonders einfacher Aufbau mit wenig Einzelteilen. Wegen des fehlenden Überhubs entspricht also der Ankerhub dem Kontakthub, und durch diese kleineren Arbeitsluftspalte des Magnetsystems können entweder bei gleicher Wicklung größere Kontaktkräfte mit kleineren Übergangswiderständen im Lastbereich erzeugt werden oder es kann zur Erzeugung gleicher Kontaktkräfte wie bei herkömmlichen Systemen eine hochohmigere Wicklung mit einer entsprechend geringeren Erwärmung der Spule verwendet werden.In a particularly preferred embodiment, the relay designed as a pole reversal relay, in which the core yoke by a is substantially flat sheet E-shaped, wherein between two side legs and a middle leg as three bays two center bars as cores one coil each wear and with the two anchors each one of the side legs and the middle leg with the formation of working air gaps bridge, with the power semiconductor on the middle leg is arranged. Because the contacts of the hybrid relay be switched without load and therefore not exposed to erosion need no overstroke during construction to be considered. Therefore, the magnetic circuit parts at the same time carry the contact current, for example the Pole surfaces can be designed as contact surfaces. This gives a particularly simple structure with few individual parts. Because of the lack of overstroke, the anchor stroke corresponds the contact stroke, and through these smaller working air gaps of the magnet system can either be the same Winding larger contact forces with smaller contact resistances generated in the load area or it can be used to generate same contact forces as with conventional systems a higher impedance winding with a correspondingly lower one Heating the coil can be used.

Besonders vorteilhafte Ausgestaltungen und Weiterbildungen der Erfindung sind in den Unteransprüchen abgegeben.Particularly advantageous refinements and developments the invention are given in the subclaims.

Die Erfindung wird nachfolgend an Ausführungsbeispielen anhand der Zeichnung näher erläutert. Es zeigt

  • Figur 1 ein erfindungsgemäß gestaltetes Umpolrelais mit offenem Gehäuse in perspektivischer Darstellung,
  • Figur 2 den Magnet- und Lastkreis des Relais von Figur 1 mit aufgesetztem Leistungshalbleiter, jedoch ohne Spulen und Isolierung gezeichnet,
  • Figur 3 den Magnet- und Kontaktkreis von Figur 2 in einer Ansicht von der Rückseite,
  • Figur 4 den Magnet- und Lastkreis des Relais von Figur 1 mit einer einstückigen Kunststoffumspritzung, die einen Spulenkörper bildet und alle Anschlüsse fixiert,
  • Figur 5 den Relaisaufbau von Figur 4 mit zusätzlich aufgebrachten Wicklungen in einer etwas anderen perspektivischen Ansicht,
  • Figur 6 den Relaisaufbau von Figur 5 in einer perspektivischen, mittig geschnittenen Ansicht,
  • Figur 7 den Relaisaufbau von Figur 5 von der Rückseite gesehen,
  • Figur 8 ein Blockschaltbild für ein Hybridrelais gemäß Figur 1,
  • Figur 9 ein Hybridrelais mit einem einzigen Elektromagnetsystem in einer Figur 1 entsprechenden Darstellung,
  • Figur 10 ein Hybridrelais in einer Ausführung ähnlich Figur 1, jedoch mit einem den Leistungshalbleiter und eine Steuerschaltung enthaltenden integrierten Schaltkreis,
  • Figur 11 eine rückseitige Ansicht des Relais von Figur 10,
  • Figur 12 ein Umpolrelais ähnlich Figur 10, jedoch mit gehäusten Standardbausteinen für den Leistungshalbleiter und die Steuerschaltung,
  • Figur 13 eine Ansicht der Rückseite des Relais von Figur 12,
  • Figur 14 ein Hybrid-Umpolrelais mit einem andersartigen Aufbau und mit einem seitlich aufgebrachten Leistungshalbleiter,
  • Figur 15 eine Seitenansicht des Relais von Figur 14,
  • Figur 16 und 17 zwei Weiterbildungen des Umpolrelais von Figur 15 in Kombination mit einer die Steuerschaltung tragenden Leiterplatte.
  • The invention is explained in more detail below using exemplary embodiments with reference to the drawing. It shows
  • 1 shows a polarity reversal relay designed according to the invention with an open housing in a perspective view,
  • FIG. 2 shows the magnetic and load circuit of the relay from FIG. 1 with the power semiconductor attached, but without coils and insulation,
  • 3 shows the magnetic and contact circuit of FIG. 2 in a view from the rear,
  • FIG. 4 shows the magnetic and load circuit of the relay from FIG. 1 with a one-piece plastic encapsulation, which forms a coil former and fixes all connections,
  • FIG. 5 shows the relay structure from FIG. 4 with additionally applied windings in a somewhat different perspective view,
  • FIG. 6 shows the relay structure from FIG. 5 in a perspective view cut in the middle,
  • FIG. 7 the relay structure of FIG. 5 seen from the rear,
  • FIG. 8 shows a block diagram for a hybrid relay according to FIG. 1,
  • FIG. 9 shows a hybrid relay with a single electromagnet system in a representation corresponding to FIG. 1,
  • 10 shows a hybrid relay in an embodiment similar to FIG. 1, but with an integrated circuit containing the power semiconductor and a control circuit,
  • FIG. 11 shows a rear view of the relay from FIG. 10,
  • FIG. 12 shows a polarity reversal relay similar to FIG. 10, but with housed standard components for the power semiconductor and the control circuit,
  • FIG. 13 shows a view of the rear of the relay from FIG. 12,
  • FIG. 14 shows a hybrid polarity reversal relay with a different type of construction and with a power semiconductor attached to the side,
  • FIG. 15 shows a side view of the relay from FIG. 14,
  • FIGS. 16 and 17 show two developments of the polarity reversal relay from FIG. 15 in combination with a printed circuit board carrying the control circuit.
  • Das in den Figuren 1 bis 7 dargestellte Relais besitzt als Träger einen Magnetkreis (Figur 2) mit einem planen E-förmigen Kernjoch 1, welches symmetrisch zwei Seitenschenkel 11 und einen Mittelschenkel 12 aufweist, die einstückig über zwei Kernstege 13 verbunden sind. Jeder der Kernstege 13 trägt eine Wicklung 65.The relay shown in Figures 1 to 7 has as Carrier a magnetic circuit (Figure 2) with a flat E-shaped Kernjoch 1, which symmetrically two side legs 11 and a middle leg 12, which is in one piece two core webs 13 are connected. Each of the core webs 13 carries a winding 65.

    Zwei flache Anker 2 sind zueinander fluchtend und symmetrisch parallel zum Kernjoch 1 angeordnet, und sie überbrücken jeweils ein freies Ende eines Seitenschenkels 11 sowie einen Teil des Mittelschenkels 12 unter Bildung von Arbeitsluftspalten 21 und 22. Jeder der Anker 2 ist über eine Ankerrückstellfeder 23 an einem Trägerblech 24 befestigt, welches einen Anschlußstift 25 bildet. Im Ruhezustand liegen die beiden Anker 2 aufgrund der Rückstellwirkung der Rückstellfedern 23 gemeinsam an einem Öffnerkontaktblech 3 an, welches parallel zum Mittelschenkel 12 des Kernjoches diesem gegenüberliegend angeordnet ist und einen Anschlußstift 31 bildet. Im Bereich neben dem Öffnerkontaktblech ist außerdem ein Masseanschlußblech 4 mit einem Anschlußstift 41 vorgesehen.Two flat anchors 2 are aligned and symmetrical Arranged parallel to the core yoke 1, and they bridge each a free end of a side leg 11 and one Part of the middle leg 12 with the formation of working air gaps 21 and 22. Each of the armatures 2 is via an armature return spring 23 attached to a carrier plate 24, which forms a pin 25. The two are at rest Armature 2 due to the restoring effect of the return springs 23 together on an NC contact plate 3, which is parallel to the central leg 12 of the core yoke opposite this is arranged and forms a pin 31. In the area In addition to the break contact plate there is also a ground connection plate 4 provided with a pin 41.

    Der Mittelschenkel 12 des Kernjoches 1 ist so breit ausgeführt, daß er einerseits die Polflächen für die beiden Arbeitsluftspalte 22 gegenüber den Ankern 2 bildet und andererseits eine großflächige Auflage für einen Leistungstransistor 5 mit guter Wärmeübertragung bietet. Dieser Leistungstransistor 5 ist mit seinen drei Anschlüssen mit einer aus dem Kernjoch herausgeprägten Anschlußnase 14, mit einem Anschlußlappen 32 des Öffnerkontaktbleches 3 sowie mit einem Anschlußlappen 42 des Masseanschlußbleches 4 verbunden. Die beiden Anschlußlappen 32 und 42 sind durch Durchbrüche 15 und 16 des Kernjoches auf die Seite des Leistungstransistors 5 geführt. The middle leg 12 of the core yoke 1 is so wide that that on the one hand the pole faces for the two working air gaps 22 forms in relation to the anchors 2 and on the other hand a large area for a power transistor 5 provides good heat transfer. This power transistor 5 is with its three connections with one from the Kernjoch stamped out lug 14, with a connecting tab 32 of the NC contact plate 3 and with a connecting tab 42 of the ground connection plate 4 connected. The two connecting tabs 32 and 42 are through openings 15 and 16 of the core yoke on the side of the power transistor 5 guided.

    Das Kernjoch 1 ist mit thermoplastischem Kunststoff zur Bildung eines Spulenkörpers 6 umspritzt, der beiderseitig des Mittelschenkels 12 jeweils ein Spulenrohr 61 zur Aufnahme je einer Wicklung 7 bildet. Die Wicklungen werden beiderseits von Flanschen 62 begrenzt. Im Bereich der Seitenschenkel 11 des Kernjochs ist an dem Spulenkörper 6 jeweils ein Fortsatz 63 mit einem Steckschacht 64 zur Aufnahme der Trägerbleche 24 für die Ankerrückstellfedern 23 angeformt. Diese Trägerbleche könnten aber auch mit dem Material des Spulenkörpers umspritzt, also in den Spulenkörper 6 eingebettet werden. Die Ankerrückstellfedern 23 sind auf den Trägerblechen 24 durch eine Schweiß- oder Nietverbindung befestigt.The core yoke 1 is made with thermoplastic plastic for formation overmoulded a bobbin 6, the mutually the Middle leg 12 each have a coil tube 61 for receiving each a winding 7 forms. The windings are on both sides limited by flanges 62. In the area of the side legs 11 the core yoke is in each case an extension on the coil former 6 63 with a slot 64 for receiving the carrier plates 24 integrally formed for the armature return springs 23. These carrier sheets but could also with the material of the bobbin extrusion-coated, that is, embedded in the bobbin 6. The Armature return springs 23 are on the carrier plates 24 through a welded or riveted joint attached.

    Die Oberflächen der Magnetkreisteile, also des Kernjochs 1 und der beiden Anker 2, sind jeweils zumindest im Bereich der Luftspalte 21 und 22 zwischen Anker und Jochschenkeln mit einer Edelmetallschicht überzogen und dienen gleichzeitig zur Stromführung des Lastkreises in der Schließerfunktion des Relais. Die Öffnerfunktion der beiden elektromagnetischen Wechsler-Relaissysteme wird durch das bereits erwähnte Öffnerkontaktblech 3, welches mindestens im Berührungsbereich mit den beiden Ankern 2 edelmetallbeschichtet ist, erfüllt. Die erforderliche Kontaktkraft wird jeweils von der Ankerrückstellfeder 23 aufgebracht. Vorzugsweise sind die beiden beweglichen Anker 2 zur niederohmigen Kontaktgabe und Stromführung vollflächig mit einer, zum Beispiel galvanischen, Silberschicht überzogen. Diese Schicht kann wirtschaftlich sehr dünn ausgeführt werden, da das elektromagnetische Relaissystem nur den Laststrom führen, jedoch nicht schalten muß. Durch die beiden Luftspalte 21 und 22 eines jeden Ankers 2 zu dem Kernjoch 1 ergibt sich beim Schließen des Magnetkreises eine Doppelkontaktierung des lastlos schaltenden Lastkreises, die die Kontaktsicherheit wesentlich erhöht. Außerdem wird im dargestellten Beispiel durch je zwei Prägewarzen 33 auch auf dem Öffnerkontaktblech 3 (siehe Figur 3) erreicht, daß der Anker durch die Torsion der Ankerfeder 23 jeweils an zwei Stellen kontaktiert wird. Durch die Zusammenlegung des Magnetkreises und des elektrischen Lastkreises wird für dieses Umpolrelais nur eine geringe Anzahl von einfachen und deshalb kostengünstigen Teilen benötigt.The surfaces of the magnetic circuit parts, i.e. the core yoke 1 and the two anchors 2, are each at least in the area of Air gaps 21 and 22 between anchor and yoke legs with one Precious metal layer coated and serve at the same time Current routing of the load circuit in the normally open function of the relay. The opening function of the two electromagnetic Changer relay systems is made possible by the already mentioned break contact plate 3, which is at least in the touch area with the two anchors 2 is coated with precious metal. The required contact force is given by the armature return spring 23 applied. Preferably the two are movable armature 2 for low-resistance contact and current supply all over with one, for example galvanic, Silver layer coated. This layer can be economical run very thin because of the electromagnetic relay system only carry the load current, but do not switch got to. Through the two air gaps 21 and 22 of each anchor 2 to the core yoke 1 results when the magnetic circuit is closed double contacting of the no-load switching Load circuit, which increases the contact security significantly. Furthermore is in the example shown by two embossing pins 33 also reached on the NC contact plate 3 (see FIG. 3), that the armature by the torsion of the armature spring 23 each is contacted in two places. By merging of the magnetic circuit and the electrical load circuit only a small number of simple ones for this pole-changing relay and therefore needed inexpensive parts.

    Durch das lastlose Umschalten der beiden Anker 2 entfällt der sonst übliche Abbrand der Kontakte, welcher als Überhub bzw. Abbrandsicherheit für den Ankerhub eines Relais vorgehalten werden muß. Bei der erfindungsgemäßen Relaisausführung entspricht jedoch der Ankerhub in den Luftspalten 21 und 22 gleichzeitig dem Abstand zwischen den kontaktgebenden Flächen (Kontaktabstand). Da nicht mit einer Materialwanderung aufgrund von Lichtbögen gerechnet werden muß, ist kein Vorhalteabstand, der sonst zusätzlich zum Abstand der erforderlichen Spannungsfestigkeit zwischen den Kontakten vorgesehen werden müßte, notwendig. Somit hat das Magnetsystem kleinere Arbeitsluftspalte als sonst erforderlich; dadurch können bei gleicher Auslegung des Magnetsystems größere Kontaktkräfte und somit kleinere Übergangswiderstände im Lastbereich erzielt werden. Hält man andererseits die Kontaktkräfte gleich, so kann gegenüber herkömmlichen Magnetsystemen eine hochohmigere Wicklung vorgesehen werden, durch die eine geringere Erwärmung der Spule erreicht wird. The no-load switching of the two anchors 2 eliminates the otherwise conventional erosion of the contacts, which is used as an overstroke or Burn-off security is provided for the armature stroke of a relay must become. Corresponds to the relay design according to the invention however, the armature stroke in the air gaps 21 and 22 at the same time the distance between the contacting surfaces (Contact distance). Because not due to material migration arcing must be taken into account is not a lead clearance, the otherwise in addition to the distance of the required Dielectric strength can be provided between the contacts should be necessary. The magnet system thus has smaller working air gaps than otherwise required; this allows at same design of the magnet system greater contact forces and thus achieved lower contact resistances in the load range become. On the other hand, if you keep the contact forces the same, compared to conventional magnet systems, this can be a higher impedance Winding can be provided by the less heating the coil is reached.

    Im vorliegenden Ausführungsbeispiel des Relais ist der gehäuselose Leistungstransistor 5 direkt auf dem Mittelteil bzw. dem Mittelschenkel des Kernjoches 1 durch eine Lötverbindung befestigt und somit direkt mit den Schließer-Gegenkontakten des Umpolrelais verbunden, da der Drain-Anschluß des MOSFET-Leistungstransistors mit der metallischen Lötfläche und die Schließer-Gegenkontakte- die durch das Kernjoch gebildet sind - bei der gemäß Figur 8 vorgesehenen Schaltungsanordnung gemeinsame Polarität in der Umpolschaltung besitzen.In the present embodiment of the relay is the caseless Power transistor 5 directly on the middle part or the middle leg of the core yoke 1 by a solder connection attached and thus directly with the normally open mating contacts of the polarity reversal relay connected because the drain terminal of the MOSFET power transistor with the metallic solder pad and the Normally open counter contacts - which are formed by the core yoke are - in the circuit arrangement provided according to FIG have common polarity in the polarity reversal circuit.

    Wenn die Steuerelektronik, wie hier bevorzugt angenommen, ebenfalls in dem Relais angeordnet ist, benötigt diese Verbindung keinen Anschluß nach außen, sondern nur eine Verbindungsleitung zu der Steuerelektronik, die beispielsweise über Bonddrähte 70 von der bereits erwähnten Anschlußnase 14 vorgenommen werden kann. Die Steuerelektronik liegt im vorliegenden Beispiel als gehäuseloser Steuer-IC (beispielsweise ein ASIC) unterhalb des Leistungstransistors 5 und etwa in Höhe der Kontaktebene der Anker auf dem Mittelschenkel 12. Das Kernjoch 1 ist somit Träger des Leistungstransistors 5 und der Steuerelektronik in dem IC 8, wodurch ein zusätzlicher Bauelementeträger, etwa eine Leiterplatine oder ein Keramikträger, nicht erforderlich ist.
    Die internen Verbindungen im Relais zwischen dem Leistungstransistor 5, dem Steuer-IC 8 und den nach außen gehenden Steueranschlüssen 71 bis 74 werden beispielsweise über Bonddrähte 70 realisiert. Die Steueranschlüsse 71 bis 74 sind in Form eines Stanzgitters in das Thermoplastmaterial des Spulenkörpers 6 mit eingespritzt. Außerdem sind in den innenliegenden Spulenflanschen 62 zwei Spulenanschlüsse 66 für die beiden Wicklungen 65 eingebettet. Sie werden nach dem Aufbringen der Wicklungen 65 und nach dem Verlöten der Wicklungsenden 67 in dem Wicklungsbereich umgebogen. Die beiden Spulenanschlüsse 66 nehmen jeweils ein Wicklungsende von jeder Spule 65 auf (Figur 5), die beiden anderen Wicklungsenden 68 (Figur 7) werden auf einen gemeinsamen Anwickelpunkt 34, der aus dem Blech des gemeinsamen Öffnerkontaktblechs 3 gestanzt ist, gewickelt und zum Beispiel durch Löten verbunden.
    If the control electronics, as is preferably assumed here, is also arranged in the relay, this connection does not require a connection to the outside, but only a connecting line to the control electronics, which can be carried out, for example, via bonding wires 70 from the connection lug 14 already mentioned. In the present example, the control electronics are in the form of a housing-free control IC (for example an ASIC) below the power transistor 5 and approximately at the level of the contact level of the armatures on the middle leg 12. The core yoke 1 is thus the carrier of the power transistor 5 and the control electronics in the IC 8, whereby an additional component carrier, such as a printed circuit board or a ceramic carrier, is not required.
    The internal connections in the relay between the power transistor 5, the control IC 8 and the outward control connections 71 to 74 are implemented, for example, via bond wires 70. The control connections 71 to 74 are injected in the form of a lead frame into the thermoplastic material of the coil former 6. In addition, two coil connections 66 for the two windings 65 are embedded in the internal coil flanges 62. After the windings 65 have been applied and after the winding ends 67 have been soldered, they are bent over in the winding region. The two coil connections 66 each take up one winding end of each coil 65 (FIG. 5), the other two winding ends 68 (FIG. 7) are wound onto a common winding point 34, which is punched out of the sheet of the common break contact plate 3, and for example by Soldering connected.

    An dem den Spulenkörper 6 bildenden thermoplastischen Spritzgießteil ist weiterhin ein Kragen 60 im Bereich des Mittelschenkels 12 angeformt, der einen wannenförmigen Hohlraum 69 um den Leistungstransistor 5 sowie den Steuer-IC 8 bildet. Diese wannenförmige Hohlraum 69 wird nach dem Bonden der Verbindungsdrähte zwischen dem Transistor 5, dem Steuer-IC 8 und den Steueranschlüssen 71 bis 73 mit einer dauerelastischen Vergußmasse (nicht dargestellt) zum Schutz der Bonddrähte und der Halbleiter ausgegossen.On the thermoplastic injection molded part forming the bobbin 6 is also a collar 60 in the area of the middle leg 12 integrally formed, the trough-shaped cavity 69th forms around the power transistor 5 and the control IC 8. This trough-shaped cavity 69 becomes after the bonding of the connecting wires between the transistor 5, the control IC 8 and the control connections 71 to 73 with a permanently elastic Potting compound (not shown) to protect the bond wires and the semiconductor poured out.

    Zur Stabilisierung der Relaisanschlüsse 25, 31, 41 sowie 71 bis 74 dienen eine thermoplastische Sockelplatte 91 und eine, beispielsweise thermoplastisch gespritzte, Kappe 92. Diese beiden Teile werden nach der Montage durch eine Vergußmasse abgedichtet. Zur Oberflächenvergrößerung und somit zur besseren Wärmeableitung kann diese Kappe 92 auch mit Kühlrippen versehen und/oder aus einem metallgefüllten Kunststoff (z.B. Al2O3 für eine höhere Wärmeleitfähigkeit spritzgegossen sein. Auch der Spulenkörper könnte aus diesem Al2O3 bestehen. Eine andere Möglichkeit besteht darin, die Kappe 92 aus einem metallischen, nichtmagnetischen Werkstoff zu fertigen, beispielsweise durch Tiefziehen. A thermoplastic base plate 91 and a, for example thermoplastic injection-molded, cap 92 serve to stabilize the relay connections 25, 31, 41 and 71 to 74. These two parts are sealed by a casting compound after assembly. To increase the surface area and thus for better heat dissipation, this cap 92 can also be provided with cooling ribs and / or injection-molded from a metal-filled plastic (for example Al 2 O 3 for higher thermal conductivity. The coil body could also consist of this Al 2 O 3. Another possibility consists in producing the cap 92 from a metallic, non-magnetic material, for example by deep drawing.

    In Figur 8 ist eine mögliche Steuerschaltung für das Relais gemäß den Figuren 1 bis 7 gezeigt. Dabei sind für die Relaisteile, soweit sie übereinstimmen, die gleichen Bezugszeichen wie in der Konstruktionsdarstellung verwendet. Für den Steuer-IC 8 als ASIC ist ein vereinfachtes Blockschaltbild verwendet, das die wesentlichen Funktionen für die Zeitschaltung zwischen dem Leistungshalbleiter 5 und dem Relaissystem mit den Spulen 65 und den Ankerkontakten 2 zeigt. So enthält der Steuer-IC 8 eine Logikschaltung 81, die ihren Takt von einem Oszillator 82 erhält und wahlweise über eine Treiberschaltung 83 eine der Spulen 65 an Spannung legt. Über einen Komparator 84 und ein NOR-Glied 85 wird der Leistungshalbleiter 5 angesteuert. Durch entsprechende Erregung der einen oder anderen Spule 65 wird so ein Motor M wahlweise mit unterschiedlichen Polaritäten zwischen eine am Anschluß 31 liegende Spannung und die am Anschluß 41 liegende Masse geschaltet. Über die Logikschaltung 81 wird dabei sichergestellt, daß jeweils zunächst der betreffende Anker 2 umgeschaltet wird, bevor über den Leistungstransistor 5 der Stromkreis geschlossen wird. Die Kontakte werden also trokken, d.h. stromlos, geschaltet, so daß kein Lichtbogen entsteht. Die Stromversorgung für den ASIC erfolgt über die Anschlüsse der Spulen 65.In Figure 8 is a possible control circuit for the relay shown in Figures 1 to 7. Here are for the Relay parts, if they match, the same reference numerals as used in the design representation. For the control IC 8 as ASIC is a simplified block diagram used the essential functions for the timer between the power semiconductor 5 and the relay system with the coils 65 and the armature contacts 2 shows. So the control IC 8 includes a logic circuit 81 which is its Receives clock from an oscillator 82 and optionally via a Driver circuit 83 applies one of the coils 65 to voltage. over a comparator 84 and a NOR gate 85 becomes the power semiconductor 5 controlled. By appropriate excitement of the one or the other coil 65 is a motor M optionally with different polarities between one at terminal 31 lying voltage and the ground lying at terminal 41 switched. The logic circuit 81 ensures that the respective armature 2 in question is first switched over is before the via the power transistor 5 Circuit is closed. So the contacts will dry, i.e. de-energized, switched so that no arc arises. The ASIC is supplied with power via the connections of the coils 65.

    Für den Fachmann ist es klar, daß die Steuerschaltung auch anders aufgebaut werden kann als in Figur 8 dargestellt. In diesem Zusammenhang sei noch erwähnt, daß auch die Zahl der Anschlüsse je nach Schaltung unterschiedlich ausfallen kann. Beispielsweise gehen bei dem in Figur 8 dargestellten Steuer-IC 8 nur drei Steueranschlüsse von den ASIC-Pins 1,2 und 3 über die Steueranschlüsse 71,72 und 73 zusammen mit dem Pin 4 über den Masseanschluß 41 nach außen, während in der Konstruktionsdarstellung gemäß den Figuren 1 bis 7 vier Steueranschlüsse 71 bis 74 gezeigt sind. In diesem Fall bliebe also der Anschluß 74 unbeschaltet. Bei einer anderen Auslegung der Steuerschaltung können vier oder auch mehr Steueranschlüsse nach außen geführt werden. In gleicher Weise ist es aber auch möglich, einen Teil der Steuerfunktionen oder die gesamte Ansteuerschaltung aus dem Relais nach außen in einen Sockel oder auf eine getrennte Leiterplatte zu verlegen. Der erfindungsgemäße Vorteil bliebe aber auch in diesem Fall für die Anordnung des Leistungshalbleiters auf dem Kernjoch erhalten, nämlich die einfache und wirksame Kühlung des Leistungshalbleiters und der kompakte Aufbau des Hybrid-Lastkreises.It is clear to a person skilled in the art that the control circuit also can be constructed differently than shown in Figure 8. In In this connection it should be mentioned that the number of Connections can vary depending on the circuit. For example, the control IC shown in FIG 8 only three control connections from ASIC pins 1, 2 and 3 via the control connections 71, 72 and 73 together with pin 4 via the ground connection 41 to the outside while in the construction view according to Figures 1 to 7 four control connections 71 to 74 are shown. In this case it would remain the connection 74 is not connected. In another interpretation of the Control circuit can have four or more control connections be led outside. In the same way it is possible part of the control functions or the entire control circuit out of the relay into a socket or to be laid on a separate circuit board. The invention In this case, too, there would be an advantage for them Arrangement of the power semiconductor on the core yoke obtained, namely the simple and effective cooling of the power semiconductor and the compact design of the hybrid load circuit.

    In Figur 9 ist ein Hybridrelais in einer Figur 1 vergleichbaren Darstellung gezeigt, welches sich von dem dortigen Hybridrelais im wesentlichen dadurch unterscheidet, daß nur ein Elektromagnetsystem mit einem Wechslerkontakt vorgesehen ist. Demnach ist ein Kernjoch 101 als planes, U-förmiges Teil mit zwei Seitenschenkeln 111 und 112 vorgesehen und auf dessen nicht sichtbarem Mittelsteg eine Wicklung 165 sitzt. Ein einziger Anker 102 ist über eine Ankerrückstellfeder 123 an einem Trägerblech 124 befestigt, welches in einem Fortsatz 163 eines Spulenkörpers 106 verankert ist und einen Anschlußstift 125 bildet. Ein Öffnerkontaktblech 103 ist mit einem Anschlußstift 131 versehen. Außerdem ist auf dem breiten Seitenschenkel 112 des Kernjoches ein Leistungstransistor 105 zusammen mit einem Steuer-IC 108 angeordnet. Der Leistungstransistor kann in diesem Fall beispielsweise parallel zum Lastkreis des Relais geschaltet werden, wobei der Transistor vor dem Umschalten des Ankers den Strom kurzzeitig schaltet und der niederohmige Lastkreis der Relaiskontakte nach dem Abschalten des Transistors den Strom nur führt. Somit kann auch in diesem Fall der Magnetkreis zugleich als Kontaktkreis - mit entsprechender Kontaktbeschichtung der Polflächen - verwendet werden. Bei einer derartigen Parallelschaltung ist die Erwärmung des Bauteiles wesentlich geringer als bei einem Leistungstransistor, der den Dauerstrom allein führen müßte. Analog zu Figur 1 besitzt auch das Relais gemäß Figur 9 ein Gehäuse, bestehend aus einer Sockelplatte 191 und einer Kappe 192.A hybrid relay in FIG. 1 is comparable in FIG Representation shown, which differs from the hybrid relay there essentially differs in that only one Electromagnetic system with a changeover contact is provided. Accordingly, a core yoke 101 is included as a flat, U-shaped part two side legs 111 and 112 are provided and on the latter a winding 165 is not visible in the central web. A single Armature 102 is connected to an armature return spring 123 Carrier plate 124 fastened, which in an extension 163rd a bobbin 106 is anchored and a connector pin 125 forms. An NC contact plate 103 is with a pin 131 provided. It is also on the wide side leg 112 of the core yoke, a power transistor 105 arranged together with a control IC 108. The power transistor can be parallel in this case, for example be switched to the load circuit of the relay, the transistor the current briefly before switching the armature switches and the low-resistance load circuit of the relay contacts after turning off the transistor only leads the current. Consequently in this case the magnetic circuit can also be used as Contact circle - with appropriate contact coating on the Pole surfaces - can be used. With such a parallel connection the heating of the component is much less than with a power transistor that has the continuous current alone should lead. Analogous to FIG. 1, the relay according to FIG Figure 9 shows a housing consisting of a base plate 191 and a cap 192.

    In den Figuren 10 und 11 ist wiederum ein Umpolrelais in Vorder- und Rückansicht gezeigt, bei dem das mechanische Relaissystem im wesentlichen genau so aufgebaut ist wie in den Figuren 1 bis 7. Es soll deshalb auch nicht mehr im einzelnen beschrieben werden. Im Unterschied zu dem vorherigen Beispiel ist hier ein integrierter Schaltkreis 205 auf dem Mittelschenkel 12 des Kernjoches 1 angeordnet, der sowohl die Funktion des Leistungstransistors als auch die Steuerschaltung enthält. Dieser integrierte Schaltkreis 205 ist über Bonddrähte 270 mit Anschlußfahnen 271 bis 274 verbunden, welche im Spulenkörper 6 eingebettet sind. Weitere Bonddrähte bilden Verbindungen zu den Spulenanschlußstiften 67, zu den Anschlußlappen 32 und 42 und zu der Anschlußnase 14. Diese integrierte Steuerschaltung 205 wird in dem wannenförmigen Hohlraum 69 in gleicher Weise vergossen wie bei dem vorherigen Ausführungsbeispiel. Auch in diesem Fall wäre ein Relais mit einem Einzel-Magnetsystem analog zu Figur 9 realisierbar.FIGS. 10 and 11 again show a polarity reversal relay in the front and rear view shown, in which the mechanical relay system is constructed essentially exactly as in the figures 1 to 7. It should therefore no longer be in detail to be discribed. In contrast to the previous example here is an integrated circuit 205 on the middle leg 12 of the core yoke 1 arranged, both the function of the power transistor as well as the control circuit contains. This integrated circuit 205 is via bond wires 270 connected to terminal lugs 271 to 274, which are embedded in the bobbin 6. Form further bond wires Connections to the coil pins 67, to the tabs 32 and 42 and to the connecting lug 14. This integrated Control circuit 205 is in the trough-shaped Shed cavity 69 in the same way as the previous one Embodiment. In this case, too, would be a relay realizable with a single magnet system analogous to FIG. 9.

    In den Figuren 12 und 13 ist ein Relais in Vorder- und Rückansicht gezeigt, bei dem der mechanische Grundaufbau wiederum im wesentlichen der gleiche ist wie bei dem ersten Ausführungsbeispiel gemäß den Figuren 1 bis 7. In diesem Fall sind im Unterschied zu dem vorherigen Ausführungsbeispiel gehäuste Standardbausteine verwendet. Ein Leistungstransistor 305 ist auf der Vorderseite angeordnet und auf dem Mittelschenkel 12 des Kernjochs großflächig durch Lötung bzw. Schweißung befestigt. Die Anschlüsse 371 und 372 dieses Standardtransistors werden durch eine Sockelplatte 391 direkt aus dem Relais geführt, während der Gate-Anschluß 373 innerhalb des Relais mit einer Steuerschaltung verbunden ist.In Figures 12 and 13 is a relay in front and rear view shown, in which the basic mechanical structure in turn is substantially the same as in the first embodiment according to Figures 1 to 7. In this case in contrast to the previous embodiment housed Standard blocks used. A power transistor 305 is arranged on the front and on the middle leg 12 of the core yoke is largely secured by soldering or welding. The terminals 371 and 372 of this standard transistor are led directly out of the relay by a base plate 391, while the gate connection 373 within the relay with is connected to a control circuit.

    Auf der dem Leistungstransistor 305 gegenüberliegenden Seite ist in einen Spulenkörper 306, in den das Kernjoch 1 eingespritzt ist, ein Stanzgitter 307 eingebettet, dessen nach unten aus dem Spritzgießteil herausragende Enden Steueranschlüsse 374 des Relais bilden. Jede Leiterbahn des Stanzgitters bildet am gegenüberliegenden Ende eine freiliegende, nicht umspritzte Kontaktfläche 375; auf diese, in einer Ebene liegenden Kontaktflächen 375 wird ein Steuer-IC (ASIC) 308 mit SMT-Anschlußfahnen 381 gelötet.On the side opposite the power transistor 305 is in a coil former 306, into which the core yoke 1 is injected is embedded, a lead frame 307, its down ends protruding from the injection molded part control connections 374 of the relay. Each conductor track of the lead frame forms an exposed, non-molded contact surface 375; on this, in one level lying contact surfaces 375 becomes a control IC (ASIC) 308 soldered with SMT connector lugs 381.

    Diese Ausführungsform, die für kleinere bis mittlere Stückzahlen besonders kostengünstig ist, verzichtet wegen der Standardbauteile auf einige relaisinterne Schaltungsverbindungen, die bei dem ersten Ausführungsbeispiel vorgesehen waren, doch können diese Schaltungsverbindungen extern auf einer Leiterplatte einfach überbrückt werden. Auch für diese Ausführungsform mit gehäusten Standardbauteilen kann analog zu Figur 9 ein Einzelrelais, also mit nur einem Magnetsystem und einem Wechslerkontakt, konstruiert werden. Die erfindungsgemäße Unterbringung eines Leistungstransistors auf dem gut wärmeleitenden Kernjoch des Magnetkreises kann auch bei anderen Relaiskonstruktionen verwirklicht werden.This embodiment, for small to medium quantities is particularly inexpensive, because of the Standard components on some internal circuit connections, which were provided in the first embodiment, however, these circuit connections can be made externally on a PCB can be bridged easily. For this too Embodiment with housed standard components can be analog 9 shows a single relay, ie with only one magnet system and a changeover contact. The invention Housing a power transistor on the good heat-conducting core yoke of the magnetic circuit can also other relay designs can be realized.

    Figur 14 zeigt ein Doppelrelais, bei dem auf einem flachen Sockel 400 zwei Elektromagnetsysteme mit jeweils einem abgewinkelten Joch 401 angeordnet sind; von den beiden Jochen sind nur die miteinander fluchtenden Außenschenkel 411 zu sehen. Die in einem Spulenkörper-Mittelflansch 406 angeordneten zweiten Jochschenkel liegen parallel aneinander und sind mit jeweils einem ebenfalls nicht sichtbaren Kern gekoppelt, über dem jeweils eine Spule 465 sitzt. An den freien Enden der Jochschenkel 411 ist jeweils ein Anker 402 gelagert, der eine an ihm befestigte Kontaktfeder 403 betätigt. Die freien Enden der Kontaktfedern 403 sind zwischen je zwei Gegenkontaktelementen 404 umschaltbar. Die Funktion dieses bereits früher angemeldeten Relaisaufbaus ergibt sich für den Fachmann ohne weiteres, so daß hierzu keine weitere Beschreibung erforderlich ist. Die beiden Kontaktsysteme können getrennt voneinander als Einzelsysteme oder als Umschaltrelais mit extern verbundenen Kontaktanschlüssen verwendet werden.Figure 14 shows a double relay, in which on a flat Base 400 two electromagnetic systems, each with an angled Yoke 401 are arranged; from the two yokes only the outer legs 411 aligned with one another can be seen. Arranged in a bobbin center flange 406 second yoke legs are parallel to each other and are with each coupled to a core that is also not visible, via which each has a coil 465. At the free ends of the Each yoke leg 411 has an armature 402, one attached contact spring 403 actuated. The free ends of the contact springs 403 are between two mating contact elements 404 switchable. The function of this earlier registered relay structure results for the specialist without further, so that no further description is required is. The two contact systems can be separated from each other as individual systems or as changeover relays with external connected contact connections can be used.

    Dieses Doppelrelais kann in erfindungsgemäßer Weise zu einem Hybridrelais erweitert werden, indem ein gehäuster Leistungstransistor 405 auf die miteinander fluchtenden Außenseiten der beiden Jochschenkel 411 elektrisch isolierend, aber gut wärmeleitend aufgebracht, beispielsweise aufgeklebt, wird. Zu diesem Zweck wird lediglich das Gehäuse an einer Seite verlängert; somit wird das bestehende Doppel-Relaissystem auf einer verlängerten Sockelplatte 491 aufgesetzt und mit einer ebenfalls vergrößerten Kappe 492 umgeben (Fig. 15). Diese Anordnung ist in Figur 15 in einer Seitenansicht mit aufgeschnittener Kappe gezeigt. Die drei Anschlußfahnen 451,452 und 453 des Transistors werden direkt durch die Sockelplatte 491 herausgeführt. Somit werden die Verbindungen zwischen den Relaiskontakten und der Schaltstrecke des Leistungstransistors 405 ebenso wie die Ansteuerung der Relaisspulen und des Transistors extern auf einer Leiterplatte durchgeführt. Der Vorteil der Kühlung des Leistungstransistors über den Magnetkreis des Relais wird aber auch hier genutzt.This double relay can be one in the inventive manner Hybrid relays can be expanded by using a packaged power transistor 405 on the aligned outer sides of the two yoke legs 411 electrically insulating, but applied with good heat conductivity, for example glued on, becomes. For this purpose, only the housing on one Side extended; thus the existing double relay system placed on an extended base plate 491 and surrounded with a likewise enlarged cap 492 (Fig. 15). This arrangement is in a side view in FIG shown with cut cap. The three connection flags 451, 452 and 453 of the transistor are directly through the base plate 491 led out. Thus the connections between the relay contacts and the switching path of the Power transistor 405 as well as the control of the relay coils and the transistor externally on a circuit board carried out. The advantage of cooling the power transistor via the magnetic circuit of the relay is also used here.

    In Figur 16 ist nochmals ein Aufbau wie in den Figuren 14 und 15 gezeigt, bei dem zusätzlich eine Steuerschaltung in Form eines ASIC 408 in die Konstruktion einbezogen ist. Hierbei wird das mit dem Leistungstransistor 405 versehene Doppelrelais auf eine kleine Leiterplatte 410 gelötet, welche die nur als Block gezeigte Steuerschaltung 408 trägt. Die kleine Leiterplatte 410 trägt auch die nach unten herausgeführten Anschlußstifte 409 des gesamten Hybridrelais. Zur Stabilisierung der Lage der Anschlußstifte und zum Schutz der Bauteile der ASIC-Steuerung wird eine thermoplastisch gespritzte, wannenförmige Kunststoffkappe 493 von unten auf die Sockelplatte 491 aufgerastet.FIG. 16 shows another structure as in FIGS. 14 and 15, in which a control circuit in the form of an ASIC 408 is included in the design. Here becomes the double relay provided with the power transistor 405 soldered to a small printed circuit board 410, which the only control circuit 408 shown as a block. The small circuit board 410 also carries the connecting pins which are led out downwards 409 of the entire hybrid relay. For stabilization the location of the pins and to protect the components the ASIC control becomes a thermoplastic injection molded tub-like Plastic cap 493 from below onto the base plate 491 snapped on.

    Figur 17 zeigt noch eine gegenüber Figur 16 leicht abgewandelte Ausführungsform eines Doppel-Hybridrelais. Hierbei wird das in den Figuren 14 bis 16 bereits gezeigte Doppel-Relaissystem ohne Kappe mit dem Leistungstransistor 405 bestückt und auf die mit der Steuerungselektronik 408 bestückte Leiterplatte 410 gelötet. Eine über das Doppelrelais mit Transistor und die - beispielsweise mit SMT-Verbindungstechnik bestückte - kleine Leiterplatte 410 reichende Kappe 494 wird anschließend bis zum Kappenrand 495 mit Vergußmasse 496 vergossen. Hierbei wird das Relais abgedichtet, die SMT-Bauteile werden geschützt vergossen, und die Anschlußstifte 409 der Leiterplatte werden bis auf die später notwendige Länge lagestabil vergossen.Figure 17 shows another slightly modified from Figure 16 Embodiment of a double hybrid relay. Here will the double relay system already shown in FIGS. 14 to 16 equipped with the power transistor 405 without a cap and the one equipped with the control electronics 408 PCB 410 soldered. One over the double relay with Transistor and die - for example with SMT connection technology populated - small circuit board 410 reaching Cap 494 is then up to the cap edge 495 with Potting compound 496. Here the relay is sealed, the SMT components are encapsulated in a protected manner, and the connection pins 409 of the circuit board will be up to the later Shed the necessary length in a stable position.

    Claims (18)

    1. Hybrid relay having
      an electromagnetic relay system which comprises at least one coil (65; 165; 465), a core yoke unit (1; 101; 401) which passes through the coil, at least one armature (2; 102; 402) as well as at least one contact pair (2, 11, 12, 3; 102, 111, 112, 103; 403, 404) which is switched by the armature, and
      a power semiconductor (5; 105; 205; 305; 405), whose switching path, together with the at least one contact pair, switches the load circuit of the relay and whose switching time can be controlled to be offset in time with respect to that of the electromagnetic relay system, in such a manner that the contact pair is in each case switched on no-load,
      characterized in that the power semiconductor (5; 105; 205; 305; 405) is in thermal contact with the core yoke unit (1; 101; 401) of the electromagnetic relay system.
    2. Hybrid relay according to Claim 1,
      characterized in that the core yoke (101) is formed in a U-shape by means of an essentially flat plate having two side limbs (111, 112) and one centre web (113), in that the centre web is fitted, as the core, with a coil (165), and the side limbs (111, 112) are each bridged, as a yoke, by an armature (102) forming operating air gaps, and in that the power semiconductor (105) is arranged on one of the yokes.
    3. Hybrid relay according to Claim 1,
      characterized in that the core yoke (1) is formed in an E-shape by an essentially flat plate, two core webs (13) each being fitted, as yoke, with a coil (65) between two side limbs (11) and one centre limb (12), in that two armatures (2) each bridge one of the side limbs (11) and the centre limb (12) forming operating air gaps (21, 22), and in that the power semiconductor (5) is arranged on the centre limb (12).
    4. Hybrid relay according to Claim 2 or 3,
      characterized in that each armature (2; 102) on the one hand and the core yoke (1; 101) on the other hand are each provided, insulated from one another, with load connections (14, 24) and in that those pole surfaces which form the operating air gaps on the respective armature (2; 102) and the core yoke (1; 101) are at the same time used as contact sections.
    5. Hybrid relay according to Claim 4,
      characterized in that a break contact plate (3; 103), which is parallel to the core yoke, is arranged on that side of the respective armature (2; 102) which is opposite the core yoke (1; 101).
    6. Hybrid relay according to Claim 4 or 5,
      characterized in that the contact sections of the armature or of the armatures (2; 102) and of the core yoke (1; 101) as well as, if appropriate, of the break contact plate (3; 103) are coated with noble metal.
    7. Hybrid relay according to one of Claims 4 to 6,
      characterized in that two embossed studs (33) are provided at least on in each case one of the contact sections in order to achieve a double contact.
    8. Hybrid relay according to one of Claims 1 to 7,
      characterized in that an insulating coil former (6; 106), which partially sheaths the core yoke (1; 101), forms a collar (60) on the core yoke (1; 101), which collar (60) encloses the power semiconductor in the form of a trough.
    9. Hybrid relay according to Claim 8,
      characterized in that the power semiconductor (5; 105) is mounted on the core yoke (1; 101) without any casing, and is potted in the trough (69) formed by the collar (60).
    10. Hybrid relay according to Claim 8 or 9,
      characterized in that additional conductor tracks (70) in the form of a stamped grid are embedded in the coil former.
    11. Hybrid relay according to one of Claims 1 to 10,
      characterized in that an integrated control circuit (8; 108) for the power semiconductor (5; 105) and/or the coil is arranged adjacent to the power semiconductor on the core yoke (1; 101).
    12. Hybrid relay according to one of Claims 1 to 11,
      characterized in that at least one connecting element (32, 34) is passed through a cut-out in the yoke section (12; 112) which is fitted with the power semiconductor (5; 105) and, possibly, with the control circuit (8; 108), and forms a contact-making surface in the region of the connecting elements of the power semiconductor (5; 105) and/or of the control circuit (8; 108).
    13. Hybrid relay according to Claim 11 or 12,
      characterized in that a contact-making tab (14) is stamped from the core yoke (1) in the region of the contact-making plane of the power semiconductor (5; 105) and of the control circuit (8; 108).
    14. Hybrid relay according to one of Claims 1 to 10,
      characterized in that the power semiconductor and a control circuit are formed on a common integrated module (205).
    15. Hybrid relay according to one of Claims 1 to 10,
      characterized in that the power semiconductor (305) and a control circuit (308) are arranged as standard modules on two opposite sides of the core yoke (1).
    16. Hybrid relay according to Claim 1,
      characterized in that the electromagnetic relay system has at least one angled yoke (401) having a yoke limb (411) which extends alongside a coil winding (465), and on whose outside the power semiconductor (405) is mounted in a thermally conductive manner.
    17. Hybrid relay according to Claim 16,
      characterized in that the electromagnetic relay system which is provided with the power semiconductor (405) is arranged on a printed circuit board (410) which is fitted with a control circuit (408) as well as the connections between the relay contacts and the switching path of the power semiconductor.
    18. Hybrid relay according to Claim 17,
      characterized in that the electromagnetic relay system which is provided with the power semiconductor (405) is accommodated together with the printed circuit board (410) and the control circuit (408) in a common cap (494), and is tightly sealed.
    EP97923744A 1996-05-07 1997-04-22 Hybrid relay Expired - Lifetime EP0897585B1 (en)

    Applications Claiming Priority (3)

    Application Number Priority Date Filing Date Title
    DE19618288 1996-05-07
    DE19618288 1996-05-07
    PCT/DE1997/000804 WO1997042642A1 (en) 1996-05-07 1997-04-22 Hybrid relay

    Publications (2)

    Publication Number Publication Date
    EP0897585A1 EP0897585A1 (en) 1999-02-24
    EP0897585B1 true EP0897585B1 (en) 1999-10-06

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    EP (1) EP0897585B1 (en)
    JP (1) JP2000509547A (en)
    KR (1) KR20000010803A (en)
    CN (1) CN1217813A (en)
    AT (1) ATE185449T1 (en)
    BR (1) BR9708931A (en)
    DE (1) DE59700541D1 (en)
    WO (1) WO1997042642A1 (en)

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    Publication number Publication date
    US6078491A (en) 2000-06-20
    WO1997042642A1 (en) 1997-11-13
    JP2000509547A (en) 2000-07-25
    CN1217813A (en) 1999-05-26
    DE59700541D1 (en) 1999-11-11
    KR20000010803A (en) 2000-02-25
    EP0897585A1 (en) 1999-02-24
    BR9708931A (en) 1999-08-03
    ATE185449T1 (en) 1999-10-15

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