EP0886347A2 - Connecteur for card edge mounting - Google Patents

Connecteur for card edge mounting Download PDF

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Publication number
EP0886347A2
EP0886347A2 EP98110144A EP98110144A EP0886347A2 EP 0886347 A2 EP0886347 A2 EP 0886347A2 EP 98110144 A EP98110144 A EP 98110144A EP 98110144 A EP98110144 A EP 98110144A EP 0886347 A2 EP0886347 A2 EP 0886347A2
Authority
EP
European Patent Office
Prior art keywords
connector
circuit board
contacts
printed circuit
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98110144A
Other languages
German (de)
French (fr)
Other versions
EP0886347A3 (en
Inventor
Dietmar Harting
Günter Dipl.-Ing. Pape
Dieter Dipl.-Ing. Lüttermann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harting Stiftung and Co KG
Original Assignee
Harting AG and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Harting AG and Co KG filed Critical Harting AG and Co KG
Publication of EP0886347A2 publication Critical patent/EP0886347A2/en
Publication of EP0886347A3 publication Critical patent/EP0886347A3/en
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board

Definitions

  • the invention relates to a connector for card edge mounting, in particular a 2- or multi-row connector for SMD connection with a circuit board, the circuit board connection side of the connector at least one rotatable or foldable with the connector insulating body connected pressure body in which the solder connections the contacts of the connector are held.
  • DE 195 11 508 A1 describes an electrical connector for card edge mounting known for connection to the surface of a printed circuit board, in which the PCB connection side a foldable with the connector insulator connected pressure body, in which the contact connections of the connector are held.
  • DE 195 30 994 C1 is a connector for card edge mounting known, in the contact springs in the inserted state of the circuit board rest on contact surfaces of the circuit board.
  • a connector for printed circuit boards is known from DE 38 22 980 C2, which has a pressure body, the resilient contact elements presses a flat electrical conductor.
  • the invention has for its object a connector of the beginning mentioned type to the effect that this in surface mounting can be attached to the circuit board, easy to assemble is and has a low overall height.
  • the connector of the invention has a high contact density and thus provided circuit board has only a small overall height, one optimal use of space for the common card height (320 contacts / 100 mm) is achieved by using both sides of the plug-in card simultaneously.
  • a Another advantage is the symmetrical arrangement of the connector to the daughter card (Straddle Mount).
  • the connector has the same installation conditions as existing 2.0 mm and 2.5 mm hard-metric "connector systems and the ability to be integrated into existing SMD assembly systems as well as an automatic fixation of the connector on the circuit board until soldering is also given.
  • the connection of the circuit board (daughter card) to a backplane circuit board (Backplane) via the connector in surface mounting technology the demand for components that are becoming ever flatter.
  • the connector can be built in two or more rows.
  • an insulating body 1 of a plug connector consisting of plastic is shown, in which two or more rows of a plurality of contact chambers 2 are embedded.
  • the connector is designed as a so-called SMD connector for surface mounting on or on a circuit board.
  • two guide elements 3 are attached laterally, which precenter the connector when plugged with a mating connector, for. B. ensure a male connector (which is not shown here).
  • the flanges 4 are provided with chambers 5 which are open on at least one side.
  • a trigger mechanism 6 is provided which, as shown in the figures, is rotatably mounted in a bearing 7 on the insulating body 1. Furthermore, there are two bearings 8 on the side of the insulating body 1. In the bearing 8, a pressure body 9, which likewise consists of insulating plastic, is rotatably mounted on the insulating body 1. Two flanges 10 are also attached to the pressure body 9 on the back.
  • the pressure body 9 is opened by the trigger mechanism 6, as shown in FIGS. 1, 2 and 4 and mouth-like "for inserting a circuit board.
  • the release mechanism 6 latches in this open position.
  • the pressure element 9 is pretensioned by springs 11, which are located in the flanges 4 and 10.
  • the contacts are in the insulating body 1 in the area of the fixed seats 12, 13, 14, 15 16, 17, 18, 19, preferably as double-leg twisted contact springs are executed.
  • the contacts 16, 17, 18, 19 consist of the areas contact tulip 20, 21, 22, 23, fixed seat 12, 13, 14, 15 and the Solder terminals 24, 25, 26, 27.
  • the insulating body 1 On the back of the insulating body 1 is an existing plastic insulating guide body 28 mounted.
  • the solder terminals 26 and 27 of the Contacts 18 and 19 are in the guide body 28 and the solder connections 24 and 25 of the contacts 16 and 17 in the pressure body 9 out.
  • Through the guide body 28 and the pressure body 9 results in a very high coplanarity the contacts 16, 17, 18, 19 in the area of the solder connections 24, 25, 26, 27 and at the same time a defined insertion depth into the solder paste 29 the circuit board 30 reached.
  • the flanges 4 on the insulating body 1 and Flange 10 on the pressure body 9 are four metal solderable mounting flanges 31 attached, which after mounting the connector with the Printed circuit board 30 are soldered.
  • the mounting flanges 31 catch the Pulling and mating forces that occur when plugging and unplugging the connector arise from.
  • Fig. 2 and Fig. 4 show the state of assembly of the connector with the open and latched pressure body 9 in the side view and in Cut.
  • a connector is shown in which the pressure body 9 is on one side is rotatably mounted in the bearing 8 with the insulating body 1. The connector is pushed laterally onto a printed circuit board 30 and positioned in the correct position.
  • the trigger mechanism 6 While placing the connector on the top of the circuit board 30, the trigger mechanism 6 is triggered and unlocks the opened one and by the spring 11 biased pressure body 9.
  • the connector By the position of the bearing 7 in connection with a pivotable tip of the Trigger mechanism 6, which when folding the pressure body on the Acts on the top of the circuit board and exerts an axial force component, the connector is pulled to the front of the circuit board 30.
  • the connector is replaced by the spring force of the solder connections 24, 25, 26, 27 of contacts 16, 17, 18, 19 or by additional springs 11 fixed on the circuit board 30 until soldering.
  • Fig. 3 and Fig. 5 show the final state of the connector in a side view and on average with the release mechanism 6 unlocked and folded Pressure body 9.
  • the PCB is populated with the SMD components page by page, i.e. it is only one side of the circuit board with solder paste provided, then equipped with surface-mountable components and soldered. With a double-sided printed circuit board, this is then turned and the second side is provided with solder paste, equipped and soldered.
  • solder paste equipped and soldered.
  • the connection contacts of the surface-mounted components must pressed vertically into the solder paste at a defined depth be.
  • Another condition in surface mounting technology is conditional due to the placement machine itself, a weak or low-power Assembly of the components.
  • the Movable pressure body 9 presses on the circuit board 30 to support.
  • the necessary spring force can be achieved through the contacts 16, 17, 18, 19 or generated by additional springs 11.
  • solder connections 24, 25, 26, 27 of the Contacts 16, 17, 18, 19 of the connector in a guide body 28 or guided in the pressure body 9. This is necessary to achieve very high coplanarities to ensure.
  • solder connections 24, 25, 26, 27 of the connector with a defined depth in the solder paste 29 on the Printed circuit board 30 and the connector is simultaneously on the Printed circuit board 30 fixed.
  • solder as a solid Solder deposit on at least one of the two solder connections 24, 25 or 26, 27 the contacts of the connector is provided. This is because double-sided printed circuit boards the second side of the circuit board, only after the first page completely equipped with surface mounted components and is soldered, can be provided with solder paste.

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  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

The plug connector has at least one press-in insert (9) on the circuit board side connected to the plug connector insulating body (1) by a rotational or hinged joint and which holds the solder connections (24,25) for the plug connector's contacts. The plug connector is opened for the assembly process, so that a trigger (6) opens the press-in insert against the force of the contact springs for insertion of the circuit board. At least one side of each solder connection is pressed against the circuit board by the press-in body, whose pressure is applied by the spring force of the contact springs.

Description

Die Erfindung betrifft einen Steckverbinder für Kartenrandmontage, insbesondere einen 2- oder mehrreihigen Steckverbinder zur SMD - Verbindung mit einer Leiterplatte, wobei die Leiterplattenanschlußseite des Steckverbinders mindestens einen drehbar bzw. klappbar mit dem Steckverbinder-Isolierkörper verbundenen Andruckkörper aufweist, in dem die Lötanschlüsse der Kontakte des Steckverbinders gehalten sind.The invention relates to a connector for card edge mounting, in particular a 2- or multi-row connector for SMD connection with a circuit board, the circuit board connection side of the connector at least one rotatable or foldable with the connector insulating body connected pressure body in which the solder connections the contacts of the connector are held.

Es ist bekannt, oberflächenmontierbare Bauteile beidseitig auf einer Leiterplatte zu montieren. Aus Platzgründen sind die oberflächenmontierbaren Bauteile (Surface Mounted Device, SMD) sehr flach und klein gehalten, um möglichst viele Bauteile auf einer Leiterplatte unterbringen zu können und um die Baugruppe flach zu halten.It is known to mount components on both sides of a circuit board to assemble. For space reasons, the surface mountable Components (Surface Mounted Device, SMD) kept very flat and small to to be able to accommodate as many components as possible on a circuit board and to keep the assembly flat.

Zur Vereinfachung der automatischen Bestückung von Leiterplatten mit elektronischen Bauteilen wurde als Ersatz für die herkömmliche Einlöttechnik die sogenannte Oberflächen- Löttechnik (Surface Mounted Technology, SMT) entwickelt. Bei dieser Technik werden auf Oberflächenbereiche (Lötpads) der Leiterplatten Lotdepots mittels Lotpasten aufgetragen, in welche die Anschlußkontakte der Bauteile senkrecht eingetaucht werden. Dabei bestücken und Positionieren spezielle Bestückungsautomaten die oberflächenmontierbaren Bauteile (Surface Mounted Device, SMD) lagerichtig auf einer Leiterplatte. Anschließend findet das Verlöten der kompletten Leiterplatte in einer Lötanlage statt. Bei einer doppelseitig bestückten Platine wird diese gewendet und die zweite Seite wird mit Lotpaste versehen, bestückt und verlötet. To simplify the automatic assembly of printed circuit boards with electronic components was used as a replacement for conventional soldering technology the so-called surface soldering technology (Surface Mounted Technology, SMT) developed. This technique focuses on surface areas (Solder pads) of the printed circuit boards solder deposits applied by means of solder pastes, in which the connection contacts of the components are immersed vertically. Here equip and position the special assembly machines that are surface-mountable Components (Surface Mounted Device, SMD) in the correct position a circuit board. Then the entire circuit board is soldered held in a soldering system. With a double-sided printed circuit board this is turned over and the second side is provided with solder paste and soldered.

Zur Verbindung der Leiterplatte mit einer Rückwandleiterplatte eines Einschubrahmens bzw. Gestells werden überwiegend Steckverbinder in Einpresstechnik oder hochaufbauende mehrreihige SMD-Steckverbinder an die Leiterplatte montiert. Die Einbaubreite einer SMD-Einschubbaugruppe wird dadurch nur noch durch die Höhe der Steckverbinder bestimmt. Die erarbeitete Platzgewinnung der oberflächenmontierten Bauteile geht somit durch die relativ

Figure 00020001
großen" Steckverbinder wieder verloren.To connect the printed circuit board to a backplane printed circuit board of a slide-in frame or frame, mainly plug-in connectors using press-fit technology or high-build multi-row SMD connectors are mounted on the printed circuit board. The installation width of an SMD plug-in module is only determined by the height of the plug connector. The space gained for the surface-mounted components thus goes through the relative
Figure 00020001
large "connector lost again.

Aus der DE 195 11 508 A1 ist ein elektrischer Verbinder für Kartenrandmontage zur Verbindung mit der Oberfläche einer Leiterplatte bekannt, bei dem die Leiterplattenanschlußseite einen klappbar mit dem Verbinder-Isolierkörper verbundenen Andruckkörper aufweist, in dem die Kontaktanschlüsse des Verbinders gehalten sind.DE 195 11 508 A1 describes an electrical connector for card edge mounting known for connection to the surface of a printed circuit board, in which the PCB connection side a foldable with the connector insulator connected pressure body, in which the contact connections of the connector are held.

Daneben ist aus der DE 195 30 994 C1 ein Steckverbinder für Kartenrandmontage bekannt, bei dem Kontaktfedern in eingesetztem Zustand der Leiterplatte an Kontaktflächen der Leiterplatte aufliegen.In addition, DE 195 30 994 C1 is a connector for card edge mounting known, in the contact springs in the inserted state of the circuit board rest on contact surfaces of the circuit board.

Weiterhin ist aus der DE 38 22 980 C2 ein Verbinder für Leiterplatten bekannt, der einen Andruckkörper aufweist, der federnde Kontaktelemente auf einen flachen elektrischen Leiter drückt.Furthermore, a connector for printed circuit boards is known from DE 38 22 980 C2, which has a pressure body, the resilient contact elements presses a flat electrical conductor.

Der Erfindung liegt die Aufgabe zugrunde, einen Steckverbinder der eingangs genannten Art dahingehend auszubilden, daß dieser in Oberflächenmontage an der Leiterplatte angebracht werden kann, einfach zu montieren ist und dabei eine geringe Bauhöhe aufweist.The invention has for its object a connector of the beginning mentioned type to the effect that this in surface mounting can be attached to the circuit board, easy to assemble is and has a low overall height.

Diese Aufgabe wird dadurch gelöst, daß der Steckverbinder für den Montageprozeß "maulartig" geöffnet ist, wobei ein Auslösemechanismus den Andruckkörper gegen die Federkraft der Kontaktfedern für das Einsetzen der Leiterplatte öffnet, daß mindestens eine Seite der Lötanschlüsse der Kontakte mittels des Andruckkörpers auf der drehbar gelagerten Seite an die Leiterplatte gedrückt werden, und daß die Anpreßkraft des Andruckkörpers durch die Federkraft der Kontaktfedern aufgebracht wird.This object is achieved in that the connector for the assembly process "Mouth-like" is opened, with a trigger mechanism the pressure body against the spring force of the contact springs for the insertion of the PCB opens that at least one side of the solder connections of the contacts by means of the pressure body on the rotatably mounted side of the circuit board are pressed, and that the contact pressure of the pressure body is applied by the spring force of the contact springs.

Vorteilhafte Ausgestaltungen der Erfindung sind in den Ansprüchen 2 bis 9 angegeben.Advantageous embodiments of the invention are in claims 2 to 9 specified.

Die mit der Erfindung erzielten Vorteile bestehen insbesondere darin, daß der erfindungsgemäße Steckverbinder eine hohe Kontaktdichte und die damit versehene Leiterplatte nur eine geringe Bauhöhe aufweist, wobei eine optimale Platzausnutzung der gängigen Kartenhöhe (320 Kontakte /100 mm) durch gleichzeitige Nutzung beider Seiten der Steckkarte erzielt wird. Ein weiterer Vorteil liegt in der symmetrischen Anordnung des Steckverbinders zur Tochterkarte (Straddle Mount).The advantages achieved by the invention are in particular that the connector of the invention has a high contact density and thus provided circuit board has only a small overall height, one optimal use of space for the common card height (320 contacts / 100 mm) is achieved by using both sides of the plug-in card simultaneously. A Another advantage is the symmetrical arrangement of the connector to the daughter card (Straddle Mount).

Weiterhin weist der Steckverbinder die gleichen Einbaubedingungen wie vorhandene 2,0 mm und 2,5 mm hart-metrische" Steckverbindersysteme auf und die Integrierbarkeit in vorhandene SMD - Montageanlagen sowie eine automatische Fixierung des Steckverbinders auf der Leiterplatte bis zur Lötung ist ebenfalls gegeben.Furthermore, the connector has the same installation conditions as existing 2.0 mm and 2.5 mm hard-metric "connector systems and the ability to be integrated into existing SMD assembly systems as well as an automatic fixation of the connector on the circuit board until soldering is also given.

Die Verbindung der Leiterplatte (Tochterkarte) zu einer Rückwandleiterplatte (Backplane) über den Steckverbinder in Oberflächenmontagetechnik erfüllt die Forderung nach immer flacher werdenden Bauteilen. Der Steckverbinder kann 2- oder mehrreihig aufgebaut sein.The connection of the circuit board (daughter card) to a backplane circuit board (Backplane) via the connector in surface mounting technology the demand for components that are becoming ever flatter. The connector can be built in two or more rows.

Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung dargestellt und wird im folgenden näher beschrieben. Es zeigen

Fig. 1
eine Ansicht eines Steckverbinders,
Fig. 2
die Ansicht des Steckverbinders mit aufgeklapptem und verrastetem Andruckkörper, und
Fig. 3
die Ansicht des Steckverbinders mit entrastetem Andruckkörper, und
Fig. 4
eine Ansicht des Steckverbinders gem. Fig. 2 im Schnitt entlang der Linie 4 - 4, und
Fig. 5
eine Ansicht des Steckverbinders gem. Fig. 3 im Schnitt entlang der Linie 5 - 5.
An embodiment of the invention is shown in the drawing and will be described in more detail below. Show it
Fig. 1
a view of a connector,
Fig. 2
the view of the connector with the pressure body opened and locked, and
Fig. 3
the view of the connector with unlocked pressure body, and
Fig. 4
a view of the connector acc. Fig. 2 in section along the line 4 - 4, and
Fig. 5
a view of the connector acc. 3 in section along the line 5-5.

In den Fig. 1 - 5 ist ein aus Kunststoff bestehender Isolierkörper 1 eines Steckverbinders, in dem zwei- oder mehrreihig eine Vielzahl von Kontaktkammern 2 eingelassen sind, dargestellt. Der Steckverbinder ist dabei als sogenannter SMD-Steckverbinder für die Oberfächenmontage auf bzw. an einer Leiterplatte ausgebildet. An der Stirnseite des Isolierkörpers 1 sind seitlich zwei Führungselemente 3 angebracht, die eine Vorzentrierung des Steckverbinders beim Stecken mit einem Gegenstecker, z. B. einer Messerleiste (die hier nicht näher dargestellt ist) sicherstellen. Auf der Rückseite des Isolierkörpers 1, d.h. der Leiterplattenanschlußseite, befinden sich seitlich zwei Flansche 4. Die Flansche 4 sind mit Kammern 5 versehen, die auf mindestens einer Seite geöffnet sind. In diesen Kammern 5 ist ein Auslösemachanismus 6 vorgesehen, der wie in den Figuren dargestellt, in einem Lager 7 an dem Isolierkörper 1 drehbar gelagert ist. Des weiteren befinden sich seitlich am Isolierkörper 1 zwei Lager 8. Im Lager 8 ist ein Andruckkörper 9, der ebenfalls aus isolierendem Kunststoff besteht, drehbar an dem Isolierkörper 1 gelagert. Am Andruckkörper 9 sind auf der Rückseite ebenfalls zwei Flansche 10 angebracht. Der Andruckkörper 9 wird durch den Auslösemechanismus 6, wie in Fig. 1, 2 und 4 dargestellt, aufgeklappt und maulartig" für das Einsetzen einer Leiterplatte geöffnet. Dabei verrastet der Auslösemechanismus 6 in dieser geöffneten Stellung. Der Andruckkörper 9 wird durch Federn 11, die sich in den Flanschen 4 und 10 befinden, vorgespannt. 1 - 5, an insulating body 1 of a plug connector consisting of plastic is shown, in which two or more rows of a plurality of contact chambers 2 are embedded. The connector is designed as a so-called SMD connector for surface mounting on or on a circuit board. At the end of the insulating body 1, two guide elements 3 are attached laterally, which precenter the connector when plugged with a mating connector, for. B. ensure a male connector (which is not shown here). On the back of the insulating body 1, ie the circuit board connection side, there are two flanges 4 on the side. The flanges 4 are provided with chambers 5 which are open on at least one side. In these chambers 5 a trigger mechanism 6 is provided which, as shown in the figures, is rotatably mounted in a bearing 7 on the insulating body 1. Furthermore, there are two bearings 8 on the side of the insulating body 1. In the bearing 8, a pressure body 9, which likewise consists of insulating plastic, is rotatably mounted on the insulating body 1. Two flanges 10 are also attached to the pressure body 9 on the back. The pressure body 9 is opened by the trigger mechanism 6, as shown in FIGS. 1, 2 and 4 and mouth-like "for inserting a circuit board. The release mechanism 6 latches in this open position. The pressure element 9 is pretensioned by springs 11, which are located in the flanges 4 and 10.

Im Isolierkörper 1 werden im Bereich der Festsitze 12, 13, 14, 15 die Kontakte 16, 17, 18, 19, die vorzugsweise als doppelschenklige getwistete Kontaktfedern ausgeführt sind, gehalten. Die Kontakte 16, 17, 18, 19 bestehen aus den Bereichen Kontakttulpe 20, 21, 22, 23, Festsitz 12, 13, 14, 15 sowie den Lötanschlüssen 24, 25, 26, 27.The contacts are in the insulating body 1 in the area of the fixed seats 12, 13, 14, 15 16, 17, 18, 19, preferably as double-leg twisted contact springs are executed. The contacts 16, 17, 18, 19 consist of the areas contact tulip 20, 21, 22, 23, fixed seat 12, 13, 14, 15 and the Solder terminals 24, 25, 26, 27.

Auf der Rückseite des Isolierkörpers 1 ist ein aus Kunststoff bestehender isolierender Führungskörper 28 montiert. Die Lötanschlüsse 26 und 27 der Kontakte 18 und 19 sind im Führungskörper 28 und die Lötanschlüsse 24 und 25 der Kontakte 16 und 17 im Andruckkörper 9 geführt. Durch den Führungskörper 28 sowie durch den Andruckkörper 9 wird eine sehr hohe Koplanarität der Kontakte 16, 17, 18, 19 im Bereich der Lötanschlüsse 24, 25, 26, 27 und gleichzeitig eine definierte Einpresstiefe in die Lotpaste 29 auf der Leiterplatte 30 erreicht. In den Flanschen 4 am Isolierkörper 1 und im Flansch 10 am Andruckkörper 9 sind vier metallisch lötbare Befestigungsflansche 31 befestigt, die nach dem Montieren des Steckverbinders mit der Leiterplatte 30 verlötet werden. Die Befestigungsflansche 31 fangen die Zieh- und Steckkräfte, die beim Stecken und Ziehen der Steckverbinders entstehen, ab.On the back of the insulating body 1 is an existing plastic insulating guide body 28 mounted. The solder terminals 26 and 27 of the Contacts 18 and 19 are in the guide body 28 and the solder connections 24 and 25 of the contacts 16 and 17 in the pressure body 9 out. Through the guide body 28 and the pressure body 9 results in a very high coplanarity the contacts 16, 17, 18, 19 in the area of the solder connections 24, 25, 26, 27 and at the same time a defined insertion depth into the solder paste 29 the circuit board 30 reached. In the flanges 4 on the insulating body 1 and Flange 10 on the pressure body 9 are four metal solderable mounting flanges 31 attached, which after mounting the connector with the Printed circuit board 30 are soldered. The mounting flanges 31 catch the Pulling and mating forces that occur when plugging and unplugging the connector arise from.

Fig. 2 und Fig. 4 zeigen den Montagezustand des Steckverbinders mit aufgeklapptem und verrastetem Andruckkörper 9 in der Seitenansicht sowie im Schnitt. Dargestellt ist ein Steckverbinder, bei dem der Andruckkörper 9 einseitig mit dem Isolierkörper 1 drehbar im Lager 8 gelagert ist. Der Steckverbinder wird seitlich auf eine Leiterplatte 30 geschoben und lagerichtig positioniert.Fig. 2 and Fig. 4 show the state of assembly of the connector with the open and latched pressure body 9 in the side view and in Cut. A connector is shown in which the pressure body 9 is on one side is rotatably mounted in the bearing 8 with the insulating body 1. The connector is pushed laterally onto a printed circuit board 30 and positioned in the correct position.

Während des Aufsetzens des Steckverbinders auf die Oberseite der Leiterplatte 30 wird der Auslösemechanismus 6 ausgelöst und entriegelt den aufgeklappten und durch die Feder 11 vorgespannten Andruckkörper 9. Durch die Position des Lagers 7 in Verbindung mit einer schwenkbaren Spitze des Auslösemechanismus 6, die beim Anklappen des Andruckkörpers auf die Oberseite der Leiterplatte einwirkt und eine axiale Kraftkomponente ausübt, wird der Steckverbinder an die Stirnseite der Leiterplatte 30 gezogen. Gleichzeitig wird der Steckverbinder durch die Federkraft der Lötanschlüsse 24, 25, 26, 27 der Kontakte 16, 17, 18, 19 bzw. durch zusätzliche Federn 11 bis zur Lötung auf der Leiterplatte 30 fixiert.While placing the connector on the top of the circuit board 30, the trigger mechanism 6 is triggered and unlocks the opened one and by the spring 11 biased pressure body 9. By the position of the bearing 7 in connection with a pivotable tip of the Trigger mechanism 6, which when folding the pressure body on the Acts on the top of the circuit board and exerts an axial force component, the connector is pulled to the front of the circuit board 30. At the same time, the connector is replaced by the spring force of the solder connections 24, 25, 26, 27 of contacts 16, 17, 18, 19 or by additional springs 11 fixed on the circuit board 30 until soldering.

Fig. 3 und Fig. 5 zeigen den Endzustand des Steckverbinders in der Seitenansicht und im Schnitt bei entriegeltem Auslösemechanismus 6 und angeklapptem Andruckkörper 9.Fig. 3 and Fig. 5 show the final state of the connector in a side view and on average with the release mechanism 6 unlocked and folded Pressure body 9.

Beim Fertigungsprozeß erfolgt die Bestückung der Leiterplatte mit den SMD-Bauteilen seitenweise, d.h. es wird erst eine Seite der Leiterplatte mit Lotpaste versehen, dann mit oberflächenmontierbaren Bauteilen bestückt und verlötet. Bei einer doppelseitig bestückten Leiterplatte, wird diese anschließend gewendet und die zweite Seite wird mit Lotpaste versehen, bestückt und verlötet. Die Anschlußkontakte der oberflächenmontierten Bauteile müssen dabei senkrecht und mit definierter Tiefe in die Lotpaste eingedrückt sein. Eine weitere Bedingung in der Oberflächenmontagetechnik ist, bedingt durch den Bestückungsautomaten selbst, eine kraftlose bzw. kraftarme Montage der Bauteile. Um beide Bedingungen bei einem 2- oder mehrreihigen Steckverbinder, der zudem nicht zu sehr aufbauen soll, zu erfüllen, ist es notwendig die geringe Montagekraft des Automaten durch eine zusätzliche Federkraft, die nach dem Auslösen des Auslösemechanismus 6, den beweglichen Andruckkörper 9 an die Leiterplatte 30 drückt, zu unterstützen. Die notwendige Federkraft kann dabei durch die Kontakte 16, 17, 18, 19 oder durch zusätzliche Federn 11 erzeugt werden.During the manufacturing process, the PCB is populated with the SMD components page by page, i.e. it is only one side of the circuit board with solder paste provided, then equipped with surface-mountable components and soldered. With a double-sided printed circuit board, this is then turned and the second side is provided with solder paste, equipped and soldered. The connection contacts of the surface-mounted components must pressed vertically into the solder paste at a defined depth be. Another condition in surface mounting technology is conditional due to the placement machine itself, a weak or low-power Assembly of the components. To both conditions in a two or more row Connector, which should also not build too much, has to be fulfilled the low assembly force of the machine is necessary due to an additional Spring force after the triggering of the trigger mechanism 6, the Movable pressure body 9 presses on the circuit board 30 to support. The necessary spring force can be achieved through the contacts 16, 17, 18, 19 or generated by additional springs 11.

Um dieses zu realisieren, werden die Lotanschlüsse 24, 25, 26, 27 der Kontakte 16, 17, 18, 19 des Steckverbinders in einem Führungskörper 28 bzw. im Andruckkörper 9 geführt. Dieses ist notwendig, um sehr hohe Koplanaritäten zu gewährleisten. Gleichzeitig werden die Lötanschlüsse 24, 25, 26, 27 des Steckverbinders mit definierter Tiefe in die Lotpaste 29 auf der Leiterplatte 30 eingedrückt und der Steckverbinder wird gleichzeitig auf der Leiterplatte 30 fixiert. To achieve this, the solder connections 24, 25, 26, 27 of the Contacts 16, 17, 18, 19 of the connector in a guide body 28 or guided in the pressure body 9. This is necessary to achieve very high coplanarities to ensure. At the same time, the solder connections 24, 25, 26, 27 of the connector with a defined depth in the solder paste 29 on the Printed circuit board 30 and the connector is simultaneously on the Printed circuit board 30 fixed.

Für den Lötprozeß des Steckverbinders ist es erforderlich, daß Lot als festes Lotdepot auf mindestens einer der beiden Lötanschlüsse 24, 25 oder 26, 27 der Kontakte des Steckverbinders vorgesehen ist. Dies liegt daran, daß bei doppelseitig bestückten Platinen die zweite Leiterplattenseite, erst nachdem die erste Seite komplett mit oberflächenmontierten Bauteilen bestückt und verlötet ist, mit Lotpaste versehen werden kann.For the soldering process of the connector, it is necessary that solder as a solid Solder deposit on at least one of the two solder connections 24, 25 or 26, 27 the contacts of the connector is provided. This is because double-sided printed circuit boards the second side of the circuit board, only after the first page completely equipped with surface mounted components and is soldered, can be provided with solder paste.

Claims (9)

Steckverbinder für Kartenrandmontage, insbesondere 2- oder mehrreihiger Steckverbinder zur SMD-Verbindung mit einer Leiterplatte, wobei die Leiterplattenanschlußseite des Steckverbinders mindestens einen drehbar bzw. klappbar mit dem Steckverbinder-Isolierkörper (1) verbundenen Andruckkörper (9) aufweist, in dem die Lötanschlüsse (24, 25, 26, 27) der Kontakte (16, 17, 18, 19) des Steckverbinders gehalten sind, dadurch gekennzeichnet, daß der Steckverbinder für den Montageprozeß "maulartig" geöffnet ist, wobei ein Auslösemechanismus (6) den Andruckkörper (9) gegen die Federkraft der Kontaktfedern für das Einsetzen der Leiterplatte öffnet daß mindestens eine Seite der Lötanschlüsse (24, 25, 26, 27) der Kontakte (16, 17, 18, 19) mittels des Andruckkörpers (9) auf der drehbar gelagerten Seite an die Leiterplatte (30) gedrückt werden, und daß die Anpreßkraft des Andruckkörpers (9) durch die Federkraft der Kontaktfedern aufgebracht wird. Plug connector for card edge mounting, in particular 2-row or multi-row plug connector for SMD connection to a printed circuit board, the printed circuit board connection side of the plug connector having at least one pressure body (9) which can be rotated or folded with the plug connector insulating body (1) and in which the solder connections (24 , 25, 26, 27) of the contacts (16, 17, 18, 19) of the plug connector, characterized in that that the connector for the assembly process is "mouth-like" open, a trigger mechanism (6) opening the pressure body (9) against the spring force of the contact springs for inserting the circuit board that at least one side of the solder connections (24, 25, 26, 27) of the contacts (16, 17, 18, 19) are pressed against the printed circuit board (30) on the rotatably mounted side by means of the pressure element (9), and that the contact pressure of the pressure body (9) is applied by the spring force of the contact springs. Steckverbinder nach Anspruch 1, dadurch gekennzeichnet, daß die Kontaktierung der Lötanschlüsse (24, 25, 26, 27) der Kontakte (16, 17, 18, 19) beidseitig auf der Leiterplatte (30) erfolgt. Connector according to claim 1, characterized in that the contacting of the solder connections (24, 25, 26, 27) of the contacts (16, 17, 18, 19) takes place on both sides on the printed circuit board (30). Steckverbinder nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß der Steckverbinder symmetrisch aufgebaut ist. Connector according to claim 1 or 2, characterized in that the connector is constructed symmetrically. Steckverbinder nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß die Anpreßkraft des Andruckkörpers (9) durch zusätzliche Federn (11) aufgebracht wird. Connector according to one of the preceding claims, characterized in that that the contact pressure of the pressure body (9) is applied by additional springs (11). Steckverbinder nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß die zusätzlichen Federn (11) zur Erzielung der notwendig Federkraft zum Andrücken des Andruckkörpers (9) an die Leiterplatte (30) als Rechteck,- Dreieck, - Parabelfeder oder eine Kombination dieser Federarten bzw. durch Federdraht ausgebildet sind. Connector according to one of the preceding claims, characterized in that that the additional springs (11) to achieve the necessary spring force for pressing the pressure element (9) against the printed circuit board (30) as a rectangle, - triangle, - parabolic spring or a combination of these types of springs or by spring wire. Steckverbinder nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß die Lötanschlüsse (24, 25, 26, 27) der Kontakte (16, 17, 18, 19) in einem Führungskörper (28) bzw. im Andruckkörper (9) geführt sind. Connector according to one of the preceding claims, characterized in that that the solder connections (24, 25, 26, 27) of the contacts (16, 17, 18, 19) are guided in a guide body (28) or in the pressure body (9). Steckverbinder nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß die Lötanschlüsse (24, 25, 26, 27) der Kontakte (16, 17, 18, 19) auf der Leiterplatte (30) gestaffelt angeordnet sind. Connector according to one of the preceding claims, characterized in that that the solder connections (24, 25, 26, 27) of the contacts (16, 17, 18, 19) on the printed circuit board (30) are staggered. Steckverbinder nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß Befestigungsflansche (31) im Flansch (4) des Isolierkörpers (1) und im Flansch (10) des Andruckkörpers (9) eingesetzt sind. Connector according to one of the preceding claims, characterized in that that mounting flanges (31) in the flange (4) of the insulating body (1) and in the flange (10) of the pressure body (9) are used. Steckverbinder nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß Lot als festes Lotdepot auf mindestens einem der beiden Lötanschlüsse (24,25 oder 26,27) der Kontakte (16,17 oder 18,19) des Steckverbinders vorgesehen ist. Connector according to one of the preceding claims, characterized in that that solder is provided as a fixed solder deposit on at least one of the two solder connections (24, 25 or 26, 27) of the contacts (16, 17 or 18, 19) of the connector.
EP98110144A 1997-06-19 1998-06-04 Connecteur for card edge mounting Withdrawn EP0886347A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19725966 1997-06-19
DE19725966A DE19725966C1 (en) 1997-06-19 1997-06-19 Card edge connector

Publications (2)

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EP0886347A2 true EP0886347A2 (en) 1998-12-23
EP0886347A3 EP0886347A3 (en) 2000-03-22

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EP98110144A Withdrawn EP0886347A3 (en) 1997-06-19 1998-06-04 Connecteur for card edge mounting

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US (1) US6030243A (en)
EP (1) EP0886347A3 (en)
JP (1) JP2911879B2 (en)
CA (1) CA2240967C (en)
DE (1) DE19725966C1 (en)

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US7563118B1 (en) * 2008-06-20 2009-07-21 Delphi Technologies, Inc. High temperature connector
JP5565790B2 (en) * 2009-06-30 2014-08-06 日本モレックス株式会社 Edge connector
CN101847793B (en) * 2010-04-20 2013-01-23 番禺得意精密电子工业有限公司 Electric connector and assembly method thereof with circuit board
CN102064402B (en) * 2010-10-22 2014-07-09 番禺得意精密电子工业有限公司 Electronic element and method for assembling electronic element and circuit board

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Also Published As

Publication number Publication date
EP0886347A3 (en) 2000-03-22
JP2911879B2 (en) 1999-06-23
CA2240967A1 (en) 1998-12-19
US6030243A (en) 2000-02-29
JPH1186989A (en) 1999-03-30
DE19725966C1 (en) 1998-12-17
CA2240967C (en) 2000-12-12

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