EP0883328A1 - Circuit board comprising a high frequency transmission line - Google Patents
Circuit board comprising a high frequency transmission line Download PDFInfo
- Publication number
- EP0883328A1 EP0883328A1 EP98301480A EP98301480A EP0883328A1 EP 0883328 A1 EP0883328 A1 EP 0883328A1 EP 98301480 A EP98301480 A EP 98301480A EP 98301480 A EP98301480 A EP 98301480A EP 0883328 A1 EP0883328 A1 EP 0883328A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- transmission line
- dielectric
- line
- holes
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/088—Stacked transmission lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/04—Fixed joints
- H01P1/047—Strip line joints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09336—Signal conductors in same plane as power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09718—Clearance holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Waveguides (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (9)
- A wiring board equipped with a laminated waveguide as a high-frequency signal transmission line, wherein the laminated waveguide is composed of a dielectric substrate, a pair of main conductive layers laminated on the upper surface and the lower surface of the dielectric substrate, a plurality of via-holes extending in a thickness direction in the dielectric substrate so that they electrically connect the main conductive layers, and a sub-conduct layer is provided in the dielectric substrate so that it is parallel to the main conductive layers and is electrically connected to the via-holes; the plurality of the via-holes form two rows extending in a signal transmitting direction with a mutual distance from each other, and the distance between adjacent via-holes in each row is adjusted to less than 1/2 of a signal wavelength, a region surrounded by the pair of the main conductive layers and the two rows of the via-holes forms a signal transmitting region, and on both sides in the outside of the signal transmitting region, the sub-conductive layer is provided.
- A wiring board according to claim 1, wherein the dielectric substrate is formed by laminating a plurality of dielectric layers, the dielectric layer positioned at the central portion in the signal transmitting region has a higher dielectric constant than the other dielectric layers, and the sub-conductive layer is provided between the layers of the individual dielectric layers.
- A wiring board according to claim 1, or 2 wherein the board has another high-frequency signal transmission line together with the laminated waveguide, at least one of the main conductive layers of the laminated waveguide has a hole or notched portion, a connecting via-hole is provided in the terminal portion of the other high-frequency signal transmission line, the connecting via-hole is inserted into the signal transmitting region of the laminated waveguide through the hole or notched portion so that the connecting via-hole does not contact the main conductive layer, and another high-frequency signal transmission line is coupled with the laminated waveguide by the connecting via-hole.
- A wiring board according to claim 3, wherein the other high-frequency signal transmission line is a strip line, a microstrip line, a coplanar line, a grounded coplanar line, or a laminated waveguide.
- A wiring board according to claim 1, or 2 wherein the board has another high-frequency signal transmission line together with the laminated waveguide, and the terminal portion of the other high-frequency signal transmission line is inserted into the signal transmitting region through the dielectric body substrate of the laminated waveguide whereby the other high-frequency signal transmission line is coupled with the laminated waveguide.
- A wiring board according to claim 5, wherein the other high-frequency signal transmission line is a strip line, a microstrip line, a coplanar line, a grounded coplanar line, or a laminated waveguide.
- A wiring board according to claim 1, or 2 wherein the board has another high-frequency signal transmission line together with the laminated waveguide, a slot hole is formed in one of the main conductive layers, and the other high-frequency signal transmission line is electromagnetically coupled with the laminated waveguide through the slot hole.
- A wiring board according to claim 7 wherein the other high-frequency signal transmission line is a strip line, a microstrip line, a coplanar line, or a grounded coplanar line.
- A wiring board equipped with a laminated waveguide as a high-frequency signal transmission line, wherein the laminated waveguide has a laminated structure composed of dielectric layers and conductive layers laminated alternately, a plurality of via-holes are extending parallel in a laminating direction and are circumferentially spaced from each other, each conductive layer is- positioned at the outside of the via-holes and electrically connected to the via-holes, and by a region surrounded with these via-holes and the conductive layers, high-frequency signals are transmitted in a laminated direction.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP104907/97 | 1997-04-22 | ||
JP10490797A JP3366552B2 (en) | 1997-04-22 | 1997-04-22 | Dielectric waveguide line and multilayer wiring board including the same |
JP10490797 | 1997-04-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0883328A1 true EP0883328A1 (en) | 1998-12-09 |
EP0883328B1 EP0883328B1 (en) | 2001-11-14 |
Family
ID=14393200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP98301480A Expired - Lifetime EP0883328B1 (en) | 1997-04-22 | 1998-02-27 | Circuit board comprising a high frequency transmission line |
Country Status (4)
Country | Link |
---|---|
US (1) | US5982256A (en) |
EP (1) | EP0883328B1 (en) |
JP (1) | JP3366552B2 (en) |
DE (1) | DE69802467T2 (en) |
Cited By (15)
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EP1014772A2 (en) * | 1998-12-14 | 2000-06-28 | Hitachi, Ltd. | High frequency circuit packaging structure |
WO2000063742A1 (en) * | 1999-04-19 | 2000-10-26 | Gemfire Corporation | Electrical connection scheme for optical devices |
WO2001004986A1 (en) * | 1999-07-09 | 2001-01-18 | Nokia Corporation | Method for creating waveguides in multilayer ceramic structures and a waveguide |
EP1081989A2 (en) * | 1999-08-11 | 2001-03-07 | Kyocera Corporation | High frequency wiring board and its connecting structure |
WO2002021708A2 (en) * | 2000-09-07 | 2002-03-14 | E. I. Du Pont De Nemours And Company | Cryogenic devices |
EP1300908A1 (en) * | 2000-07-07 | 2003-04-09 | NEC Corporation | Filter |
EP1318563A2 (en) * | 2001-12-04 | 2003-06-11 | Murata Manufacturing Co., Ltd. | Transmission line and transceiver |
EP1416577A1 (en) * | 2002-10-29 | 2004-05-06 | TDK Corporation | RF module and mode converting structure and method |
EP1501152A1 (en) * | 2003-07-25 | 2005-01-26 | M/A-Com, Inc. | Millimeter-wave signal transition device |
WO2010018098A1 (en) * | 2008-08-15 | 2010-02-18 | Endress+Hauser Conducta Gesellschaft Für Mess- Und Regeltechnik Mbh+Co. Kg | Inductive conductivity sensor |
FR2951321A1 (en) * | 2009-10-08 | 2011-04-15 | St Microelectronics Sa | SEMICONDUCTOR DEVICE COMPRISING AN ELECTROMAGNETIC WAVEGUIDE |
CN104218296A (en) * | 2014-09-05 | 2014-12-17 | 西安空间无线电技术研究所 | Multilayer printing technology based waveguide and preparation method thereof |
CN109661749A (en) * | 2016-08-26 | 2019-04-19 | 株式会社藤仓 | Transmission lines |
EP3633786A4 (en) * | 2017-05-30 | 2021-03-10 | Fujikura Ltd. | Filter device and filter |
US11342648B2 (en) | 2017-05-30 | 2022-05-24 | Fujikura Ltd. | Transmission line and post-wall waveguide |
Families Citing this family (70)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2778024B1 (en) * | 1998-04-23 | 2004-10-22 | Kyocera Corp | CONNECTION STRUCTURE FOR DIELECTRIC WAVEGUIDE LINES |
US6154176A (en) * | 1998-08-07 | 2000-11-28 | Sarnoff Corporation | Antennas formed using multilayer ceramic substrates |
KR100584003B1 (en) * | 1999-12-02 | 2006-05-29 | 삼성전자주식회사 | Method for manufacturing stack chip package |
FI114585B (en) * | 2000-06-09 | 2004-11-15 | Nokia Corp | Transfer cable in multilayer structures |
JP3804407B2 (en) * | 2000-07-07 | 2006-08-02 | 日本電気株式会社 | filter |
US6566975B2 (en) * | 2000-08-29 | 2003-05-20 | Kabushiki Kaisha Toshiba | Wiring board having parallel transmission lines to transmit equivalent signals in parallel |
US6927653B2 (en) * | 2000-11-29 | 2005-08-09 | Kyocera Corporation | Dielectric waveguide type filter and branching filter |
KR100450376B1 (en) * | 2001-01-12 | 2004-09-30 | 가부시키가이샤 무라타 세이사쿠쇼 | Transmission line, integrated circuit and transmitting-receiving device |
US20020121707A1 (en) * | 2001-02-27 | 2002-09-05 | Chippac, Inc. | Super-thin high speed flip chip package |
US8143108B2 (en) | 2004-10-07 | 2012-03-27 | Stats Chippac, Ltd. | Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate |
JP3827535B2 (en) * | 2001-03-22 | 2006-09-27 | 京セラ株式会社 | Wiring board module |
JP3864093B2 (en) * | 2002-01-10 | 2006-12-27 | シャープ株式会社 | Printed circuit board, radio wave receiving converter and antenna device |
US7064633B2 (en) * | 2002-07-13 | 2006-06-20 | The Chinese University Of Hong Kong | Waveguide to laminated waveguide transition and methodology |
US7276987B2 (en) | 2002-10-29 | 2007-10-02 | Kyocera Corporation | High frequency line-to-waveguide converter and high frequency package |
JP2004153367A (en) * | 2002-10-29 | 2004-05-27 | Tdk Corp | High frequency module, and mode converting structure and method |
JP4015938B2 (en) * | 2002-12-16 | 2007-11-28 | Tdk株式会社 | Resonator |
US6995465B2 (en) * | 2003-06-04 | 2006-02-07 | Intel Corporation | Silicon building block architecture with flex tape |
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JP2005217996A (en) * | 2004-02-02 | 2005-08-11 | Tdk Corp | Rectangular waveguide tube type waveguide |
US7088199B2 (en) * | 2004-05-28 | 2006-08-08 | International Business Machines Corporation | Method and stiffener-embedded waveguide structure for implementing enhanced data transfer |
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US7271680B2 (en) * | 2005-06-29 | 2007-09-18 | Intel Corporation | Method, apparatus, and system for parallel plate mode radial pattern signaling |
KR100714451B1 (en) * | 2005-12-08 | 2007-05-04 | 한국전자통신연구원 | Transit structure of standard waveguide and dielectric waveguide |
US7613009B2 (en) * | 2006-03-15 | 2009-11-03 | Tdk Corporation | Electrical transition for an RF component |
US7612638B2 (en) * | 2006-07-14 | 2009-11-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Waveguides in integrated circuits |
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US8008997B2 (en) * | 2007-10-09 | 2011-08-30 | Itt Manufacturing Enterprises, Inc. | Printed circuit board filter having rows of vias defining a quasi cavity that is below a cutoff frequency |
US8159316B2 (en) * | 2007-12-28 | 2012-04-17 | Kyocera Corporation | High-frequency transmission line connection structure, circuit board, high-frequency module, and radar device |
WO2009116934A1 (en) * | 2008-03-18 | 2009-09-24 | Cheng Shi | Substrate integrated waveguide |
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KR101055425B1 (en) * | 2010-04-30 | 2011-08-08 | 삼성전기주식회사 | Wideband transmission line-waveguide transition apparatus |
JP5978149B2 (en) | 2013-02-18 | 2016-08-24 | 株式会社フジクラ | Mode converter manufacturing method |
US9059498B2 (en) * | 2013-02-27 | 2015-06-16 | Microelectronics Technology, Inc. | Laminated waveguide diplexer |
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JPS5521665A (en) * | 1978-08-04 | 1980-02-15 | Mitsubishi Electric Corp | Constituent of multi-layer transmission line |
JPH0413845Y2 (en) * | 1985-09-30 | 1992-03-30 | ||
US4918411A (en) * | 1988-10-31 | 1990-04-17 | Westinghouse Electric Corp. | Dielectric aperture assembly and method for fabricating the same |
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-
1997
- 1997-04-22 JP JP10490797A patent/JP3366552B2/en not_active Expired - Lifetime
-
1998
- 1998-02-27 DE DE69802467T patent/DE69802467T2/en not_active Expired - Lifetime
- 1998-02-27 EP EP98301480A patent/EP0883328B1/en not_active Expired - Lifetime
- 1998-02-27 US US09/032,244 patent/US5982256A/en not_active Expired - Lifetime
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Also Published As
Publication number | Publication date |
---|---|
DE69802467T2 (en) | 2002-08-08 |
US5982256A (en) | 1999-11-09 |
JPH10303608A (en) | 1998-11-13 |
DE69802467D1 (en) | 2001-12-20 |
JP3366552B2 (en) | 2003-01-14 |
EP0883328B1 (en) | 2001-11-14 |
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