EP0858668A1 - Vhv transfo-rectifier for surface mounting - Google Patents

Vhv transfo-rectifier for surface mounting

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Publication number
EP0858668A1
EP0858668A1 EP97937637A EP97937637A EP0858668A1 EP 0858668 A1 EP0858668 A1 EP 0858668A1 EP 97937637 A EP97937637 A EP 97937637A EP 97937637 A EP97937637 A EP 97937637A EP 0858668 A1 EP0858668 A1 EP 0858668A1
Authority
EP
European Patent Office
Prior art keywords
transformer
plate
winding
rectifier
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97937637A
Other languages
German (de)
French (fr)
Inventor
Guy Thomson-CSF SCPI ARNOULD
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Publication of EP0858668A1 publication Critical patent/EP0858668A1/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/22—Cooling by heat conduction through solid or powdered fillings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/40—Structural association with built-in electric component, e.g. fuse
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/16—Cascade transformers, e.g. for use with extra high tension

Definitions

  • the present invention relates to a transformer-rectifier T.H.T. (Very High Voltage) miniaturized for surface mounting on screen printed ceramic substrate.
  • T.H.T. Very High Voltage
  • FIG. 1 A specific example of an environment in which a T.H.T. according to the invention is typically integrated is shown in the electrical diagram of Figure 1 attached.
  • FIG. 1 it is a DC voltage step-up converter which supplies, for a DC input voltage VE which is typically a few hundred volts, a DC output voltage Vs which is for example order of a few kilovolts.
  • This circuit comprises a chopper 1, in itself very conventional, which comprises four static switches of the MOS transistor type, referenced 2 to 5, in bridge mounting, the input diagonal of which is supplied by the DC input voltage VE as shown.
  • the four transistors 2, 3, 4, 5 are respectively controlled on ignition by the recurrent pulse signal trains Q1, Q2, Ql, Q2, the signal trains Q1 and Q2 being offset between them as shown in FIGS. 2A and 2B joined, and of high frequency, for example of the order of a few hundred kilohertz.
  • a voltage Vp represented in FIG. 2C, which consists of a series of relatively brief pulses (of width equal to the offset between the trains of pulses Q1 and Q2) , spaced, and alternately positive and negative.
  • a transformer-rectifier 6 which comprises a low-voltage primary winding 7 and a plurality of windings secondary N1, N2, N3, ..., Nn. Each of these secondary windings supplies a respective diode bridge P1, P2, P3, ..., Pn, the rectified outputs of this plurality of bridges being connected in series as shown to obtain the output voltage Vs.
  • Current transformers manufacturing techniques do not allow them to be miniaturized without reducing the power they transmit, because of the cooling problems of these transformers.
  • the present invention relates to a transformer-rectifier, in particular THT, for surface mounting, which can be miniaturized as much as possible, while being capable of transmitting a significantly higher power than a conventional transformer of the same volume (or else which significantly smaller than a conventional transformer of the same power).
  • a high value series inductor L is connected in series between the bridge chopper 1 and the transformer 6.
  • the current Ip represented in FIG. 2D, which is supplied by the chopper 1 in primary 7 of the transformer is a sawtooth current, which is alternately positive and negative, the positive half-waves being symmetrical with the negative half-waves.
  • the transformer 6 therefore operates as a current transformer and not as a voltage transformer.
  • the invention proposes to integrate in a single block 8 not only the transformer-rectifier 6, therefore comprising the diode bridges P1 to Pn, but also the high inductance series L, this block 8, surrounded by dotted lines in FIG. 1 , being moreover miniaturized and, around an opening made in this plate, the different plates being arranged one next to the other, the magnetic circuit passing through their openings, rectifiers being arranged or formed on each support and connected to the winding corresponding, the directions of the windings being alternated from one plate to the next.
  • This alternation makes it possible to simply ensure the placing in series of wafers directly by the substrate on which they are mounted, this substrate also ensuring thermal interconnection between the transformer and an appropriate radiator, since this substrate can have excellent properties of thermal conduction.
  • FIGS. 1 and 2A to 2d are respectively an electrical diagram of a converter and the forms of signals noted in this converter
  • FIG. 3 is a top view of this transformer-rectifier
  • FIG. 4 is a cross section in the plane IV-IV of Figure 3
  • FIG. 5 is a view of the "secondary" side, in the direction V of Figure 3.
  • - Figure 6 is a view of the "primary" side, in the direction VI of Figure 3.
  • FIG. 7 is a perspective view of one of the stackable wafers which equip the "secondary" side.
  • This assembly comprises the transformer-rectifier 6, with its primary winding 7 which is for example single, its multiple secondary windings N1 to Nn, and its diode bridges P1 to Pn, and it further comprises the series L self-inductance which is an important element of the assembly.
  • the technology for producing this transformer-rectifier is studied so that the self-inductance L is constituted by the leakage inductance, brought back to the primary, of the windings of this transformer. This is obtained, as will be seen below, by moving the primary and secondary from the transformer in particular, so as to promote losses as much as possible instead of trying to avoid them as is usually the case.
  • this technology is such that it allows this assembly 8 to be produced in a sufficiently miniaturized form so that it can, like other components such as "chip” components, be mounted on the surface on a substrate.
  • screen-printed insulator that is to say a ceramic substrate, for example made of Alumina, which is both a good thermal conductor and a good electrical insulator.
  • this transformer-rectifier is designed for optimal heat dissipation, which is both favorable for its miniaturization and its ability to be mounted on the surface.
  • the magnetic circuit of this transformer is ( Figure 3) a closed magnetic circuit, which consists for example of four bars or legs, arranged as shown to form the four sides of a rectangle:
  • leg 10 opposite and therefore parallel to leg 9, which receives a stack 1 1 of wafers G1 to G8 which each contain a secondary winding N1 to N8 and a diode bridge P1 to P8 ( Figure 1) respectively, as well as their respective connectors (connecting conductors, ...),
  • the entire circuit including the bridge chopper 1 ( Figure 1) and the output voltage regulation circuit Vs (not shown) are attached to a substrate 24A made of electrically insulating ceramic, but good conductor of the heat.
  • this ceramic electrically insulating but not thermally insulating, is alumina. It will be designated more simply, in what follows, by the term "ceramic”.
  • the primary winding 7 is also added, for example by gluing, to an external plate 16, made of the same ceramic as the aforementioned support substrate 24A.
  • the two end strands 17, 1 8 of the primary winding 7 pass through this ceramic plate 16 to end on its outer face, where they are connected respectively to two metallized parts 1 9 and 20 ( Figure 6) which each extend on the slice
  • This wafer 21 is itself bonded to the substrate 24A (see FIG. 4), the ceramic plate 16 being orthogonal to said substrate. This gives the electrical and thermal connection of the primary winding 7.
  • the aforementioned metal plates 14 and 1 5 are also positioned orthogonally to the substrate and so that their edge 22, 23 is in the plane 24 of the surface of this substrate, this common plane 24 therefore constituting an assembly plane for the three plates 14, 1 5, 1 6.
  • the metal plates 14 and 1 5 are orthogonal to the ceramic plate 1 6, the heat exchange surfaces being thus maximum since these plates 14, 1 5 are attached to the most large area of each leg 12, 1 3.
  • these exchange plates 14, 1 5 are copper plates which are bonded to the edges of the lateral legs 12 and 1 3 of the magnetic circuit.
  • FIG. 7 One of the eight wafers, for example G8, which make up the stack 8, is shown in FIG. 7, while the connection it contains is clearly visible in FIG. 4.
  • One of the secondary windings N1 to N8, for example N8, is wound around the mandrel 26 (or "gutter" in terms of profession).
  • the two end strands 28, 29 ( Figure 4) of this secondary winding N8 pass through the carcass 25 through holes 30 and are welded, on the face of the extension 27 which is opposite to this winding N8, on metallized elements 31 which are part of the connection, reported entirely on this extension 27, relating to the diode bridge P8 associated with this secondary winding N8 and therefore entirely attached to this face 27.
  • the outputs of the bridge P8 are connected to metallizations 33, 34 produced on the extension 27, these metallizations being connected to corresponding metallizations 35, 36 produced on the edge 32 of the plate 25 intended to be fixed on the substrate 24A.
  • the metallizations 35, 36 are welded to corresponding metallizations 37, 38 formed on the substrate 24A.
  • the ceramic plate 25 is, like the aforementioned ceramic plate 1 6, metallized on its edge 32 by which it is mounted upright on the aforementioned substrate 24A.
  • the planes of the eight plates 25 of the stackable elements G1 to G8 are all parallel to each other and parallel to the two copper plates 14 and 1 5.
  • Their metallized edges 32 are all located in the aforementioned plane 24, which is also the plane from the surface of the support and electrical connection substrate of the entire voltage converter.
  • the substrate 24A is fixed, for example by gluing, on a suitable radiator 24B which can advantageously be cooled in a manner known per se, for example by ventilation or by a cooling fluid.
  • the overall connection is such that the diode bridges P1 to P8 are connected in series according to the diagram in FIG. 1.
  • the desired value for this inductance L is adjusted by calculating accordingly the numbers of adequate turns at the primary and secondary of the transformer, while of course respecting the desired transformation ratios.
  • a voltage regulation device which converts the current signal supplied by the block 8 into constant voltage, the latter itself being a current transformer and not a voltage transformer.
  • the arrangements in accordance with the invention also have the advantage of allowing miniaturization of block 8, this miniaturization being sufficient to promote its mounting on the surface under widely acceptable conditions, which was not the case with the devices of the invention. 'prior art tried to date.
  • the continuous input voltage VE is typically of the order of 300 volts or 600 volts, depending on the value of the AC mains voltage which generates it. It goes without saying that the invention is not limited to the embodiment which has just been described.
  • thermal plates 14 and 15 can be made of a metal other than copper, and that each of the closing legs 12, 13 could be bordered by several plates, and therefore on several faces, for example three faces, instead of being bordered each on one side only.

Abstract

The invention concerns a miniaturised VHV transfo-rectifier (a few kilovolts) for surface mounting on a screen printed ceramic substrate. The primary coil (7) and the secondary coils (N1 to N8) are respectively wound on separate legs (9, 10) of the magnetic circuit, sufficiently distanced from each other for obtaining a substantial escape self-induction coil. The secondary coil is formed by stacked flat coils (G1 to G8) each comprising a respective coil (N1 to N8) and the associated diode bridge (P1 to P8), with their respective connections. The primary coil is glued on a ceramic interface plate (16) which, like said flat coils (G1 to G8), is electro-plated on its wafer to form a transfer plane blended with the receptor substrate surface.

Description

Transformateur-redresseur T.H.T. pour montage en surface Transformer-rectifier T.H.T. for surface mounting
La présente invention se rapporte à un transformateur- redresseur T.H.T. {Très Haute Tension) miniaturisé pour montage en surface sur substrat céramique sérigraphié.The present invention relates to a transformer-rectifier T.H.T. (Very High Voltage) miniaturized for surface mounting on screen printed ceramic substrate.
Un exemple spécifique d'environnement dans lequel un transformateur-redresseur T.H.T. selon l'invention s'intègre typiquement est représenté sur le schéma électrique de la figure 1 jointe.A specific example of an environment in which a T.H.T. according to the invention is typically integrated is shown in the electrical diagram of Figure 1 attached.
Il s'agit sur cette figure 1 d'un convertisseur-élévateur de tension continue qui fournit, pour une tension d'entrée continue VE qui est typiquement de quelques centaines de volts, une tension de sortie continue Vs qui est par exemple de l'ordre de quelques kilovolts. Ce circuit comporte un hacheur 1 , en soi très classique, qui comporte quatre interrupteurs statiques de type transistor MOS, référencés 2 à 5, en montage en pont dont la diagonale d'entrée est alimentée par la tension d'entrée continue VE comme représenté. Les quatre transistors 2, 3, 4, 5 sont respectivement commandés à l'allumage par les trains de signaux impulsionnels récurrents Q1 , Q2, Ql, Q2 , les trains de signaux Q1 et Q2 étant décalés entre eux comme représenté sur les figures 2A et 2B jointes, et de fréquence élevée, par exemple de l'ordre de quelques centaines de kilohertz.In this FIG. 1, it is a DC voltage step-up converter which supplies, for a DC input voltage VE which is typically a few hundred volts, a DC output voltage Vs which is for example order of a few kilovolts. This circuit comprises a chopper 1, in itself very conventional, which comprises four static switches of the MOS transistor type, referenced 2 to 5, in bridge mounting, the input diagonal of which is supplied by the DC input voltage VE as shown. The four transistors 2, 3, 4, 5 are respectively controlled on ignition by the recurrent pulse signal trains Q1, Q2, Ql, Q2, the signal trains Q1 and Q2 being offset between them as shown in FIGS. 2A and 2B joined, and of high frequency, for example of the order of a few hundred kilohertz.
Il en résulte, sur la diagonale de sortie de ce pont, une tension Vp, représentée en Figure 2C, qui se compose d'une suite d'impulsions relativement brèves (de largeur égale au décalage entre les trains d'impulsions Q1 et Q2), espacées, et alternativement positives et négatives.As a result, on the output diagonal of this bridge, a voltage Vp, represented in FIG. 2C, which consists of a series of relatively brief pulses (of width equal to the offset between the trains of pulses Q1 and Q2) , spaced, and alternately positive and negative.
Pour obtenir une tension redressée Vs de valeur absolue de bien plus forte amplitude (ou "T.H.T.") que celle de la tension Vp, il est utilisé un transformateur-redresseur 6 qui comporte un enroulement primaire basse-tension 7 et une pluralité d'enroulements secondaires N1 , N2, N3, ..., Nn. Chacun de ces enroulements secondaires alimente un pont de diodes respectif P1 , P2, P3, ..., Pn, les sorties redressées de cette pluralité de ponts étant branchées en série comme représenté pour obtenir la tension de sortie Vs. Les techniques actuelles de réalisation des transformateurs ne permettent pas de les miniaturiser sans réduire la puissance qu'ils transmettent, à cause de problèmes de refroidissement de ces transformateurs. La présente invention a pour objet un transformateur- redresseur, en particulier T.H.T, pour montage en surface, pouvant être miniaturisé le plus possible, tout en étant capable de transmettre une puissance nettement plus élevée qu'un transformateur classique de même volume (ou bien qui soit nettement plus petit qu'un transformateur classique de même puissance).To obtain a rectified voltage Vs of absolute value of much greater amplitude (or "THT") than that of the voltage Vp, a transformer-rectifier 6 is used which comprises a low-voltage primary winding 7 and a plurality of windings secondary N1, N2, N3, ..., Nn. Each of these secondary windings supplies a respective diode bridge P1, P2, P3, ..., Pn, the rectified outputs of this plurality of bridges being connected in series as shown to obtain the output voltage Vs. Current transformers manufacturing techniques do not allow them to be miniaturized without reducing the power they transmit, because of the cooling problems of these transformers. The present invention relates to a transformer-rectifier, in particular THT, for surface mounting, which can be miniaturized as much as possible, while being capable of transmitting a significantly higher power than a conventional transformer of the same volume (or else which significantly smaller than a conventional transformer of the same power).
Conformément à une caractéristique de l'invention, une inductance série L de forte valeur est branchée en série entre le hacheur en pont 1 et le transformateur 6. De la sorte, le courant Ip, représenté sur la figure 2D, qui est fourni par le hacheur 1 au primaire 7 du transformateur est un courant en dents de scie, qui est alternativement positif et négatif, les alternances positives étant symétriques des alternances négatives. Le transformateur 6 fonctionne en conséquence en transformateur de courant et non pas en transformateur de tension.In accordance with a characteristic of the invention, a high value series inductor L is connected in series between the bridge chopper 1 and the transformer 6. In this way, the current Ip, represented in FIG. 2D, which is supplied by the chopper 1 in primary 7 of the transformer is a sawtooth current, which is alternately positive and negative, the positive half-waves being symmetrical with the negative half-waves. The transformer 6 therefore operates as a current transformer and not as a voltage transformer.
L'invention se propose d'intégrer dans un seul bloc 8 non seulement le transformateur-redresseur 6, comportant donc les ponts de diodes P1 à Pn, mais encore la forte inductance série L, ce bloc 8, entouré en pointillés sur la figure 1 , étant par ailleurs miniaturisé et, autour d'une ouverture pratiquée dans cette plaque, les différentes plaques étant disposées les unes à côté des autres, le circuit magnétique passant dans leurs ouvertures, des redresseurs étant disposés ou formés sur chaque support et reliés au bobinage correspondant, les sens des bobinages étant alternés d'une plaque à la suivante.The invention proposes to integrate in a single block 8 not only the transformer-rectifier 6, therefore comprising the diode bridges P1 to Pn, but also the high inductance series L, this block 8, surrounded by dotted lines in FIG. 1 , being moreover miniaturized and, around an opening made in this plate, the different plates being arranged one next to the other, the magnetic circuit passing through their openings, rectifiers being arranged or formed on each support and connected to the winding corresponding, the directions of the windings being alternated from one plate to the next.
Cette alternance permet d'assurer simplement la mise en série de galettes directement par le substrat sur lequel elles sont montées, ce substrat assurant également l'interconnexion thermique entre le transformateur et un radiateur approprié, du fait que ce substrat peut avoir d'excellentes propriétés de conduction thermique.This alternation makes it possible to simply ensure the placing in series of wafers directly by the substrate on which they are mounted, this substrate also ensuring thermal interconnection between the transformer and an appropriate radiator, since this substrate can have excellent properties of thermal conduction.
La présente invention sera mieux comprise à la lecture de la description détaillée d'un mode de réalisation, pris à titre d'exemple non limitatif et illustré par le dessin annexé sur lequel : - les figures 1 et 2A à 2d, mentionnées ci-dessus, sont respectivement un schéma électrique d'un convertisseur et des formes de signaux relevées dans ce convertisseur,The present invention will be better understood on reading the detailed description of an embodiment, taken by way of nonlimiting example and illustrated by the appended drawing in which: FIGS. 1 and 2A to 2d, mentioned above, are respectively an electrical diagram of a converter and the forms of signals noted in this converter,
- la figure 3 est une vue de dessus de ce transformateur- redresseur,FIG. 3 is a top view of this transformer-rectifier,
- la figure 4 en est une coupe transversale dans le plan IV-IV de la figure 3- Figure 4 is a cross section in the plane IV-IV of Figure 3
- la figure 5 en est une vue du côté "secondaire", selon la direction V de la figure 3. - la figure 6 en est une vue du côté "primaire", selon la direction VI de la figure 3.- Figure 5 is a view of the "secondary" side, in the direction V of Figure 3. - Figure 6 is a view of the "primary" side, in the direction VI of Figure 3.
- la figure 7 est une vue en perspective d'une des galettes empilables qui équipent le côté "secondaire".- Figure 7 is a perspective view of one of the stackable wafers which equip the "secondary" side.
En se référant à l'ensemble des figures 3 à 7, il s'agit de la réalisation de l'ensemble qui est désigné par la référence 8 sur le schéma décrit précédemment en référence à la figure 1 .Referring to the assembly of FIGS. 3 to 7, this is the embodiment of the assembly which is designated by the reference 8 on the diagram described previously with reference to FIG. 1.
Cet ensemble comprend le transformateur-redresseur 6, avec son enroulement primaire 7 qui est par exemple unique, ses enroulements secondaires multiples N1 à Nn, et ses ponts de diodes P1 à Pn, et il comprend en outre la self-inductance série L qui est un élément important du montage. Conformément à un aspect de l'invention, la technologie de réalisation de ce transformateur-redresseur est étudiée pour que la self-inductance L soit constituée par l'inductance de fuite, ramenée au primaire, des enroulements de ce transformateur. Ceci est obtenu, comme on le verra ci-après, en éloignant en particulier l'un de l'autre le primaire et le secondaire du transformateur afin de favoriser au maximum les pertes au lieu de chercher à les éviter comme on le fait ordinairement.This assembly comprises the transformer-rectifier 6, with its primary winding 7 which is for example single, its multiple secondary windings N1 to Nn, and its diode bridges P1 to Pn, and it further comprises the series L self-inductance which is an important element of the assembly. In accordance with one aspect of the invention, the technology for producing this transformer-rectifier is studied so that the self-inductance L is constituted by the leakage inductance, brought back to the primary, of the windings of this transformer. This is obtained, as will be seen below, by moving the primary and secondary from the transformer in particular, so as to promote losses as much as possible instead of trying to avoid them as is usually the case.
On remplace ainsi une self-inductance série qui aurait, si on devait la prévoir comme composant distinct, sensiblement la même taille que le transformateur lui-même, par une inductance de fuite qui n'est pas un composant matérialisé et qui n'occupe en elle-même aucune place. En outre, ce composant distinct devrait nécessairement être, pour avoir une valeur d'inductance suffisamment élevée, une self-inductance à noyau magnétique, de sorte qu'il se produirait alors, pour des courants trop élevés, un classique phénomène de saturation de ce noyau magnétique. Pour ces courants élevés, la valeur de l'inductance de ce composant distinct chuterait alors brusquement, de sorte que le montage ne pourrait alors plus fonctionner. Tel n'est pas le cas avec le transformateur de l'invention puisque l'inductance L est une inductanceWe thus replace a series self-inductance which would, if it were to be provided as a separate component, substantially the same size as the transformer itself, by a leakage inductor which is not a material component and which does not occupy itself no place. In addition, this separate component would necessarily have to be, for a sufficiently high inductance value, a self-inductance with a magnetic core, so that it would then occur, for currents too high, a classic phenomenon of saturation of this magnetic core. For these high currents, the value of the inductance of this separate component would then drop suddenly, so that the circuit could no longer function. This is not the case with the transformer of the invention since the inductance L is an inductance
•*% de fuite, équivalente à une inductance à bobine à air et donc ignorant le phénomène précité de saturation.• *% leakage, equivalent to an air coil inductance and therefore ignoring the aforementioned saturation phenomenon.
En outre, cette technologie est telle qu'elle permet de réaliser cet ensemble 8 sous une forme suffisamment miniaturisée pour qu'il puisse, à l'instar d'autres composants tels que des composants "chips", être monté en surface sur un substrat isolant sérigraphié, c'est-à-dire un substrat céramique, par exemple en Alumine, qui soit à la fois bon conducteur thermique et bon isolant électrique. On verra pour ceci que ce transformateur-redresseur est prévu pour une évacuation optimale des calories, ce qui est à la fois favorable à sa miniaturisation et à sa capacité d'être monté en surface.In addition, this technology is such that it allows this assembly 8 to be produced in a sufficiently miniaturized form so that it can, like other components such as "chip" components, be mounted on the surface on a substrate. screen-printed insulator, that is to say a ceramic substrate, for example made of Alumina, which is both a good thermal conductor and a good electrical insulator. We will see for this that this transformer-rectifier is designed for optimal heat dissipation, which is both favorable for its miniaturization and its ability to be mounted on the surface.
Le circuit magnétique de ce transformateur est (Figure 3) un circuit magnétique fermé, qui se compose par exemple de quatre barreaux ou jambes, agencés comme représenté pour former les quatre côtés d'un rectangle :The magnetic circuit of this transformer is (Figure 3) a closed magnetic circuit, which consists for example of four bars or legs, arranged as shown to form the four sides of a rectangle:
- une jambe 9 autour de laquelle est bobiné l'enroulement primaire 7 du transformateur.a leg 9 around which the primary winding 7 of the transformer is wound.
- une jambe 10, opposée et donc parallèle à la jambe 9, qui reçoit un empilage 1 1 de galettes G1 à G8 qui contiennent chacune un enroulement secondaire N1 à N8 et un pont de diodes P1 à P8 (Figure 1 ) respectifs, ainsi que leur connectique respective (conducteurs de liaison, ...),a leg 10, opposite and therefore parallel to leg 9, which receives a stack 1 1 of wafers G1 to G8 which each contain a secondary winding N1 to N8 and a diode bridge P1 to P8 (Figure 1) respectively, as well as their respective connectors (connecting conductors, ...),
- deux jambes 1 2, 13 de fermeture du circuit magnétique qui sont respectivement bordées extérieurement par des plaques respectives métalliques 14, 1 5 destinées à l'évacuation thermique des calories engendrées dans ces deux jambes 12, 1 3.- Two legs 1 2, 13 for closing the magnetic circuit which are respectively bordered externally by respective metal plates 14, 1 5 intended for the thermal evacuation of the calories generated in these two legs 12, 1 3.
Il convient de noter que l'ensemble du circuit, y compris le hacheur en pont 1 (Figure 1 ) et le circuit de régulation de la tension de sortie Vs (non représenté) sont rapportés sur un substrat 24A en céramique isolante électriquement, mais bonne conductrice de la chaleur. Typiquement, cette céramique, isolante électriquement mais non thermiquement, est de l'alumine. Elle sera désignée plus simplement, dans ce qui va suivre, par le terme "céramique".It should be noted that the entire circuit, including the bridge chopper 1 (Figure 1) and the output voltage regulation circuit Vs (not shown) are attached to a substrate 24A made of electrically insulating ceramic, but good conductor of the heat. Typically, this ceramic, electrically insulating but not thermally insulating, is alumina. It will be designated more simply, in what follows, by the term "ceramic".
Conformément à une des caractéristiques de l'invention, l'enroulement primaire 7 est en outre rapporté, par exemple par collage, sur une plaque externe 16, en même céramique que le substrat de support 24A précité.In accordance with one of the characteristics of the invention, the primary winding 7 is also added, for example by gluing, to an external plate 16, made of the same ceramic as the aforementioned support substrate 24A.
Les deux brins d'extrémité 17, 1 8 de l'enroulement primaire 7 traversent cette plaque céramique 16 pour aboutir sur sa face extérieure, où ils se raccordent respectivement sur deux parties métallisées 1 9 et 20 (Figure 6) qui se prolongent chacune sur la trancheThe two end strands 17, 1 8 of the primary winding 7 pass through this ceramic plate 16 to end on its outer face, where they are connected respectively to two metallized parts 1 9 and 20 (Figure 6) which each extend on the slice
21 de la plaque céramique 16.21 of the ceramic plate 16.
Cette tranche 21 est elle-même collée sur le substrat 24A (voir fig. 4), la plaque céramique 16 étant orthogonale audit substrat. On obtient ainsi la connexion à la fois électrique et thermique de l'enroulement primaire 7.This wafer 21 is itself bonded to the substrate 24A (see FIG. 4), the ceramic plate 16 being orthogonal to said substrate. This gives the electrical and thermal connection of the primary winding 7.
A noter que, à l'instar de cette plaque 1 6, les plaques métalliques 14 et 1 5 précitées sont elles aussi positionnées orthogonalement au substrat et de manière que leur tranche 22, 23 soit dans le plan 24 de la surface de ce substrat, ce plan commun 24 constituant donc un plan d'assemblage pour les trois plaques 14, 1 5, 1 6.Note that, like this plate 1 6, the aforementioned metal plates 14 and 1 5 are also positioned orthogonally to the substrate and so that their edge 22, 23 is in the plane 24 of the surface of this substrate, this common plane 24 therefore constituting an assembly plane for the three plates 14, 1 5, 1 6.
Comme on le voit en particulier sur la figure 3, les plaques métalliques 14 et 1 5 sont orthogonales à la plaque céramique 1 6, les surfaces d'échange thermique étant ainsi maximales du fait que ces plaques 14, 1 5 sont rapportées sur la plus grand surface de chaque jambe 12, 1 3.As can be seen in particular in FIG. 3, the metal plates 14 and 1 5 are orthogonal to the ceramic plate 1 6, the heat exchange surfaces being thus maximum since these plates 14, 1 5 are attached to the most large area of each leg 12, 1 3.
Avantageusement, ces plaques d'échange 14, 1 5 sont des plaques de cuivre qui sont collées sur les bords des jambes latérales 12 et 1 3 du circuit magnétique.Advantageously, these exchange plates 14, 1 5 are copper plates which are bonded to the edges of the lateral legs 12 and 1 3 of the magnetic circuit.
Une des huit galettes, par exemple G8, qui composent l'empilage 8, est représentée sur la figure 7, tandis que la connectique qu'elle contient est bien visible sur la figure 4.One of the eight wafers, for example G8, which make up the stack 8, is shown in FIG. 7, while the connection it contains is clearly visible in FIG. 4.
Il s'agit d'une galette dont la plaque-support 25, réalisée dans une céramique de même type, préférentiellement identique, que celle constitutive de la plaque 1 6 et du substrat, et qui comprend essentiellement un mandrin de bobinage 26, de section rectangulaire, qui vient enserrer étroitement la jambe 10 du circuit magnétique, et une extension latérale extérieure 27 (voir la figure 4). Autour du mandrin 26 (ou "caniveau" en terme de métier) est bobiné un des enroulements secondaires N1 à N8 par exemple N8. Les deux brins d'extrémité 28, 29 (Figure 4) de cet enroulement secondaire N8 traversent la carcasse 25 par des trous 30 et sont soudés, sur la face de l'extension 27 qui est opposée à cet enroulement N8, sur des éléments métallisés 31 qui font partie de la connectique, rapportée entièrement sur cette extension 27, relative au pont de diodes P8 associé à cet enroulement secondaire N8 et donc entièrement rapporté sur cette face 27. Les sorties du pont P8 sont reliées à des métallisations 33, 34 réalisées sur l'extension 27, ces métallisations étant reliées à des métallisations correspondantes 35, 36 réalisées sur la tranche 32 de la plaque 25 destinée à être fixée sur le substrat 24A. Les métallisations 35, 36 sont soudées sur des métallisations correspondantes 37, 38 formées sur le substrat 24A. Ainsi, grâce à l'inversion du sens de bobinage d'une galette à la suivante et à des tracés appropriés des métallisations, en particulier des métallisations 37, 38, on réalise facilement la mise en série des enroulements secondaires, pour obtenir la THT désirée.It is a wafer whose support plate 25, made of a ceramic of the same type, preferably identical, to that constituting the plate 1 6 and the substrate, and which essentially comprises a winding mandrel 26, of rectangular section, which tightly encloses the leg 10 of the magnetic circuit, and an external lateral extension 27 (see Figure 4). One of the secondary windings N1 to N8, for example N8, is wound around the mandrel 26 (or "gutter" in terms of profession). The two end strands 28, 29 (Figure 4) of this secondary winding N8 pass through the carcass 25 through holes 30 and are welded, on the face of the extension 27 which is opposite to this winding N8, on metallized elements 31 which are part of the connection, reported entirely on this extension 27, relating to the diode bridge P8 associated with this secondary winding N8 and therefore entirely attached to this face 27. The outputs of the bridge P8 are connected to metallizations 33, 34 produced on the extension 27, these metallizations being connected to corresponding metallizations 35, 36 produced on the edge 32 of the plate 25 intended to be fixed on the substrate 24A. The metallizations 35, 36 are welded to corresponding metallizations 37, 38 formed on the substrate 24A. Thus, thanks to the reversal of the direction of winding from one wafer to the next and to suitable plots of metallizations, in particular metallizations 37, 38, it is easy to carry out the placing in series of the secondary windings, in order to obtain the desired THT .
A noter que la plaque céramique 25 est, à l'instar de la plaque céramique 1 6 précitée, métallisée sur sa tranche 32 par laquelle elle est montée debout sur le substrat 24A précité. En fait, les plans des huit plaques 25 des éléments empilables G1 à G8 sont tous parallèles entre eux et parallèles aux deux plaques de cuivre 14 et 1 5. Leurs tranches métallisées 32 sont toutes situées dans le plan 24 précité, qui est aussi le plan de la surface du substrat de support et de liaison électrique de l'ensemble du convertisseur de tension. Le substrat 24A est fixé, par exemple par collage, sur un radiateur approprié 24B qui peut avantageusement être refroidi de façon connue en soi, par exemple par ventilation ou par un fluide de refroidissement.Note that the ceramic plate 25 is, like the aforementioned ceramic plate 1 6, metallized on its edge 32 by which it is mounted upright on the aforementioned substrate 24A. In fact, the planes of the eight plates 25 of the stackable elements G1 to G8 are all parallel to each other and parallel to the two copper plates 14 and 1 5. Their metallized edges 32 are all located in the aforementioned plane 24, which is also the plane from the surface of the support and electrical connection substrate of the entire voltage converter. The substrate 24A is fixed, for example by gluing, on a suitable radiator 24B which can advantageously be cooled in a manner known per se, for example by ventilation or by a cooling fluid.
La connectique d'ensemble est telle que les ponts de diodes P1 à P8 soient connectés en série selon le schéma de la figure 1 . Le fait que les enroulements primaire 7 et secondaires N1 -N8 sont respectivement bobinés autour des jambes 9 et 10, physiquement assez éloignées l'une de l'autre, engendre pour ce transformateur une self-inductance de fuite très importante, de quelques dizaines de microhenrys, par exemple d'environ 40μH, cette self de fuite étant, du point de vue électrique, branchée en série avec l'enroulement primaire 7, à l'instar de la self-inductance L de la figure 1 qu'elle remplace finalement de manière très avantageuse, comme expliqué précédemment. La valeur souhaitée pour cette inductance L est ajustée en calculant en conséquence les nombres de spires adéquats au primaire et au secondaire du transformateur, tout en respectant bien entendu les rapports de transformation souhaités.The overall connection is such that the diode bridges P1 to P8 are connected in series according to the diagram in FIG. 1. The fact that the primary 7 and secondary windings N1 -N8 are respectively wound around the legs 9 and 10, physically far enough apart from each other, gives this transformer a very large leakage self-inductance, of a few tens of microhenrys, for example around 40 μH, this leakage choke being, from the electrical point of view, connected in series with the primary winding 7, like the self-inductance L of FIG. 1 which it finally replaces very advantageously, as explained above. The desired value for this inductance L is adjusted by calculating accordingly the numbers of adequate turns at the primary and secondary of the transformer, while of course respecting the desired transformation ratios.
En parallèle sur la sortie Vs est prévu, de manière connue en soi, un dispositif de régulation de tension qui convertit en tension constante le signal de courant fourni par le bloc 8, ce dernier étant lui- même un transformateur de courant et non pas un transformateur de tension.In parallel on the output Vs is provided, in a manner known per se, a voltage regulation device which converts the current signal supplied by the block 8 into constant voltage, the latter itself being a current transformer and not a voltage transformer.
L'intégration des ponts de diodes P1 à P8 dans le bloc 8, comportant en outre le transformateur et la self-inductance série L, évite les risques de claquage au secondaire, et est un des éléments de l'invention.The integration of the diode bridges P1 to P8 in the block 8, further comprising the transformer and the self-inductance series L, avoids the risks of breakdown in the secondary, and is one of the elements of the invention.
Les dispositions conformes à l'invention ont en outre l'avantage de permettre une miniaturisation du bloc 8, cette miniaturisation étant suffisante pour favoriser son montage en surface dans des conditions largement acceptables, ce qui n'était pas le cas avec les dispositifs de l'art antérieur essayés jusqu'à ce jour.The arrangements in accordance with the invention also have the advantage of allowing miniaturization of block 8, this miniaturization being sufficient to promote its mounting on the surface under widely acceptable conditions, which was not the case with the devices of the invention. 'prior art tried to date.
Le tension d'entrée continue VE est typiquement de l'ordre de 300 volts ou de 600 volts, selon la valeur de la tension du secteur alternatif qui l'engendre. Comme il va de soi, l'invention n'est pas limitée à l'exemple de réalisation qui vient d'être décrit.The continuous input voltage VE is typically of the order of 300 volts or 600 volts, depending on the value of the AC mains voltage which generates it. It goes without saying that the invention is not limited to the embodiment which has just been described.
C'est ainsi par exemple que d'autres matériaux céramique, isolants électriquement mais bons conducteurs thermiques, tels que l'alumine précitée peuvent être utilisés pour l'un et/ou l'autre des supports et du substrat céramique précités. C'est ainsi également que les plaques thermiques 14 et 15 peuvent être en un métal autre que le cuivre, et que chacune des jambes de fermeture 12, 13 pourrait être bordée par plusieurs plaques, et donc sur plusieurs faces, par exemple trois faces, au lieu de n'être bordées chacune que sur une seule face. Thus, for example, other ceramic materials, electrically insulating but good thermal conductors, such as the aforementioned alumina can be used for one and / or the other of the aforementioned supports and ceramic substrate. It is also thus that the thermal plates 14 and 15 can be made of a metal other than copper, and that each of the closing legs 12, 13 could be bordered by several plates, and therefore on several faces, for example three faces, instead of being bordered each on one side only.

Claims

REVENDICATIONS
1. Transformateur-redresseur T.H.T. compact, pour montage en surface, comportant un circuit magnétique (9-10-1 2-1 3) sur une partie de la longueur duquel est disposé un enroulement primaire (7), et sur une autre'- partie de la longueur duquel est disposé au moins un enroulement secondaire (IM1 à N8), dans lequel chaque enroulement secondaire est disposé sur sa propre plaque de support (25), autour d'une ouverture (10) pratiquée dans cette plaque, les différentes plaques étant disposées les unes à côté des autres, le circuit magnétique passant dans leurs ouvertures, des redresseurs (P1 à P8) étant disposés ou formés sur chaque support et reliés au bobinage correspondant, caractérisé en ce que les sens des bobinages des enroulements secondaires sont alternés d'une plaque à la suivante, en ce que les plaques assemblées forment un empilement (1 1 ) de galettes (G) qui sont rapportées, par leur tranche (32) métallisée sur un substrat récepteur (24A), les sorties des redresseurs de chaque galette étant reliées à des métallisations (35, 36) réalisées sur la tranche de la galette, ces métallisations étant soudées sur des métallisations correspondantes (37, 38) formées sur le substrat, et en ce que les plaques de support des enroulements et le substrat sont réalisés en matériau isolant électriquement et bon conducteur thermique.1. Transformer-rectifier T.H.T. compact, for surface mounting, comprising a magnetic circuit (9-10-1 2-1 3) on a part of the length of which is disposed a primary winding (7), and on another part of the length of which is arranged at least one secondary winding (IM1 to N8), in which each secondary winding is arranged on its own support plate (25), around an opening (10) formed in this plate, the different plates being arranged one at a time side of the others, the magnetic circuit passing through their openings, rectifiers (P1 to P8) being arranged or formed on each support and connected to the corresponding winding, characterized in that the directions of the windings of the secondary windings are alternated from one plate to the next one, in that the assembled plates form a stack (1 1) of wafers (G) which are added, by their edge (32) metallized on a receiving substrate (24A), the outputs of the rectifiers of each wafer both connected to metallizations (35, 36) produced on the edge of the wafer, these metallizations being welded on corresponding metallizations (37, 38) formed on the substrate, and in that the winding support plates and the substrate are made of electrically insulating material and good thermal conductor.
2. Transformateur selon la revendication 1 , caractérisé en ce que l'on forme ou fixe sur chaque plaque un mandrin (26), ou2. Transformer according to claim 1, characterized in that a mandrel (26) is formed or fixed on each plate, or
"caniveau", qui entoure la jambe correspondante (10) du circuit magnétique et autour duquel est bobiné l'enroulement secondaire associé (N), et que chaque plaque comporte une partie latérale (27) s'étendant vers l'extérieur qui reçoit le circuit redresseur (P) associé à cet enroulement secondaire ainsi que sa connectique (31 )."channel", which surrounds the corresponding leg (10) of the magnetic circuit and around which the associated secondary winding (N) is wound, and that each plate has a lateral part (27) extending outwards which receives the rectifier circuit (P) associated with this secondary winding as well as its connection (31).
3. Transformateur selon l'une des revendications précédentes, caractérisé en ce que l'enroulement primaire, qui est disposé sur une jambe distincte (9) du circuit magnétique, est rapporté sur une plaque d'interface (16) en matériau isolant électriquement et bon conducteur thermique, cette plaque d'interface ( 1 6) comportant deux électrodes métallisées (20, 22) de connexion électrique des deux extrémités (1 8, 17) de l'enroulement et étant elle-même rapportée par la tranche (21 ), elle-aussi métallisée selon la connectique, sur ledit substrat récepteur (24).3. Transformer according to one of the preceding claims, characterized in that the primary winding, which is arranged on a separate leg (9) of the magnetic circuit, is attached to an interface plate (16) made of electrically insulating material and good thermal conductor, this interface plate (1 6) comprising two electrodes metallized (20, 22) electrical connection of the two ends (1 8, 17) of the winding and being itself attached by the edge (21), also metallized according to the connection, on said receiving substrate (24) .
4. Transformateur selon l'une des revendications précédentes, caractérisé en ce que l'enroulement primaire (7) d'une part, et l'ensemble des enroulements secondaires (N1 -N8) d'autre part, sont respectivement bobinés autour de deux jambes (9, 10) opposées dudit circuit magnétique.4. Transformer according to one of the preceding claims, characterized in that the primary winding (7) on the one hand, and all of the secondary windings (N1 -N8) on the other hand, are respectively wound around two opposite legs (9, 10) of said magnetic circuit.
5. Transformateur-redresseur selon la revendication 4, caractérisé en ce que ces deux jambes opposées (9, 1 0) sont des jambes parallèles.5. transformer-rectifier according to claim 4, characterized in that these two opposite legs (9, 1 0) are parallel legs.
6. Transformateur-redresseur selon la revendication 4, caractérisé en ce que ces deux jambes opposées (9; , 1 0) sont reliées par deux jambes de retour (1 2, 13) qui sont bordées chacune par au moins une plaque métallique d'échange thermique (14, 1 5), la tranche (22, 23) de chacune de ces plaques étant contenue dans le plan (24) formé à la fois par la surface du substrat, les tranches d'appui métallisées respectives desdites galettes secondaires (G1 -G8), et ladite plaque d'interface ( 1 6) de l'enroulement primaire (7) . 6. transformer-rectifier according to claim 4, characterized in that these two opposite legs (9;, 1 0) are connected by two return legs (1 2, 13) which are each bordered by at least one metal plate of heat exchange (14, 1 5), the edge (22, 23) of each of these plates being contained in the plane (24) formed at the same time by the surface of the substrate, the respective metallized support edges of said secondary wafers ( G1 -G8), and said interface plate (1 6) of the primary winding (7).
EP97937637A 1996-08-20 1997-08-19 Vhv transfo-rectifier for surface mounting Withdrawn EP0858668A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9610304A FR2752642B1 (en) 1996-08-20 1996-08-20 TRANSFORMER-RECTIFIER T.H.T. FOR SURFACE MOUNTING
FR9610304 1996-08-20
PCT/FR1997/001500 WO1998008237A1 (en) 1996-08-20 1997-08-19 Vhv transfo-rectifier for surface mounting

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EP (1) EP0858668A1 (en)
JP (1) JPH11514160A (en)
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WO (1) WO1998008237A1 (en)

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WO2006115196A1 (en) * 2005-04-22 2006-11-02 Daifuku Co., Ltd. Secondary-side power receiving circuit of noncontact power supplying equipment
WO2006117739A1 (en) 2005-05-03 2006-11-09 Philips Intellectual Property & Standards Gmbh Winding arrangement for planar transformer and inductor
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FR2752642A1 (en) 1998-02-27
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JPH11514160A (en) 1999-11-30
FR2752642B1 (en) 1998-11-06

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