EP0810458B1 - Matrice de miroirs commandés à couches minces et sa méthode de fabrication - Google Patents

Matrice de miroirs commandés à couches minces et sa méthode de fabrication Download PDF

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Publication number
EP0810458B1
EP0810458B1 EP97303427A EP97303427A EP0810458B1 EP 0810458 B1 EP0810458 B1 EP 0810458B1 EP 97303427 A EP97303427 A EP 97303427A EP 97303427 A EP97303427 A EP 97303427A EP 0810458 B1 EP0810458 B1 EP 0810458B1
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EP
European Patent Office
Prior art keywords
thin film
array
layer
electrodisplacive
electrode
Prior art date
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Expired - Lifetime
Application number
EP97303427A
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German (de)
English (en)
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EP0810458A2 (fr
EP0810458A3 (fr
Inventor
Yong-Ki Video Research Center Min
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WiniaDaewoo Co Ltd
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Daewoo Electronics Co Ltd
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Publication date
Priority claimed from KR1019960018382A external-priority patent/KR970073862A/ko
Priority claimed from KR1019960018393A external-priority patent/KR100243859B1/ko
Application filed by Daewoo Electronics Co Ltd filed Critical Daewoo Electronics Co Ltd
Publication of EP0810458A2 publication Critical patent/EP0810458A2/fr
Publication of EP0810458A3 publication Critical patent/EP0810458A3/fr
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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0858—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by piezoelectric means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/74—Projection arrangements for image reproduction, e.g. using eidophor
    • H04N5/7416—Projection arrangements for image reproduction, e.g. using eidophor involving the use of a spatial light modulator, e.g. a light valve, controlled by a video signal
    • H04N5/7458—Projection arrangements for image reproduction, e.g. using eidophor involving the use of a spatial light modulator, e.g. a light valve, controlled by a video signal the modulator being an array of deformable mirrors, e.g. digital micromirror device [DMD]

Definitions

  • the present invention relates to an optical projection system; and, more particularly, to an array of M x N thin film actuated mirrors for use in the system and a method for the manufacture thereof.
  • an optical projection system is known to be capable of providing high quality displays in a large scale.
  • light from a lamp is uniformly illuminated onto an array of, e.g., M x N, actuated mirrors, wherein each of the mirrors is coupled with each of the actuators.
  • the actuators may be made of an electrodisplacive material such as a piezoelectric or an electrostrictive material which deforms in response to an electric field applied thereto.
  • the reflected light beam from each of the mirrors is incident upon an aperture of, e.g., an optical baffle.
  • an electric signal to each of the actuators, the relative position of each of the mirrors to the incident light beam is altered, thereby causing a deviation in the optical path of the reflected beam from each of the mirrors.
  • the optical path of each of the reflected beams is varied, the amount of light reflected from each of the mirrors which passes through the aperture is changed, thereby modulating the intensity of the beam.
  • the modulated beams through the aperture are transmitted onto a projection screen via an appropriate optical device such as a projection lens, to thereby display an image thereon.
  • Fig. 1 there is illustrated a cross sectional view setting forth an array of M x N thin film actuated mirrors 100, wherein M and N are integers, disclosed in a copending commonly owned application, Eropean Patent Application No. 96 102 744.8, entitled "THIN FILM ACTUATED MIRROR ARRAY FOR USE IN AN OPTICAL PROJECTION SYSTEM".
  • the array 100 includes an active matrix 110, a passivation layer 116, an etchant stopping layer 118 and an array of M x N actuating structures 120.
  • the active matrix 110 includes a substrate 112, an array of M x N transistors(not shown) and an array of M x N connecting terminals 114. Each of the connecting terminals 114 is electrically connected to a corresponding transistor in the array of transistors.
  • the passivation layer 116 made of, e.g., a phosphor-silicate glass(PSG) or silicon nitride, and having a thickness of 0.1 - 2 ⁇ m, is located on top of the active matrix 110.
  • PSG phosphor-silicate glass
  • silicon nitride silicon nitride
  • the etchant stopping layer 118 made of silicon nitride, and having a thickness of 0.1 - 2 ⁇ m, is positioned on top of the passivation layer 116.
  • Each of the actuating structures 120 has a distal and a proximal ends, and further includes a tip(not shown) at the distal end thereof and an etching aperture(not shown) traversing vertically therethrough.
  • Each of the actuating structures 120 is provided with a first thin film electrode 132, a thin film electrodisplacive member 126, a second thin film electrode 124, an elastic member 122 and a conduit 128.
  • the first thin film electrode 132 made of an electrically conducting and light reflecting material, e.g., aluminum(Al) or silver(Ag), is located on top of the thin film electrodisplacive member 126, and is divided into an actuating and a light reflecting portions 130, 140 by a horizontal stripe 134, wherein the horizontal stripe 134 disconnects electrically the actuating and the light reflecting portions 130, 140.
  • the actuating portion 130 thereof is electrically connected to ground, thereby functioning as a mirror as well as a common bias electrode.
  • the light reflecting portion 140 thereof functions as the mirror.
  • the thin film electrodisplacive member 126 made of a piezoelectric material, e.g., lead zirconium titanate(PZT), or an electrostrictive material, e.g., lead magnesium niobate(PMN), is placed on top of the second thin film electrode 124.
  • a piezoelectric material e.g., lead zirconium titanate(PZT)
  • an electrostrictive material e.g., lead magnesium niobate(PMN)
  • the second thin film electrode 124 made of an electrically conducting material, e.g., platinum/tantalum(Pt/Ta), is located on top of the elastic member 126, and is electrically connected to a corresponding transistor through the conduit 128 and the connecting terminal 114, wherein the second thin film layer 124 is iso-cut into an array of M x N second thin film electrodes 124 by using a dry etching method such that each of the second thin film electrodes 124 is electrically disconnected from other second thin film electrodes 124(not shown), thereby allowing it to function as a signal electrode.
  • the elastic member 122 made of a nitride, e.g., silicon nitride, is positioned below the second thin film electrode 124.
  • a bottom portion at the proximal end thereof is attached to top of the active matrix 110, with the etchant stopping 118 and the passivation layers 116 partially intervening therebetween, thereby cantilevering the actuating structure 120.
  • the conduit 128, made of a metal, e.g., tungsten(W), extends from top of the thin film electrodisplacive member 126 to top of a corresponding connecting terminal 114, thereby connecting electrically the second thin film electrode 122 to the connecting terminal 114.
  • the conduit 128 extending downward from top of the thin film electrodisplacive member 126 and the first thin film electrode 132 placed on top of the thin film electrodisplacive member 126 in each of the thin film actuated mirrors 150 are not electrically connected to each other.
  • a primary object of the present invention to provide an array of M x N thin film actuated mirrors, each of the thin film actuated mirrors having a novel structure capable of preventing the occurrence of the short-circuit between a first and a second electrodes.
  • an array of M x N thin film actuated mirrors wherein M and N are integers, for use in an optical projection system, the array comprising: an active matrix; and an array of M x N actuating structures, each of the actuating structures being provided with an elastic member, a bottom portion at a proximal end thereof secured to the active matrix to thereby cantilever the elastic member, a first thin film electrode electrically connected to ground, thereby allow the first thin film electrode to function as a mirror and a bias electrode, a second thin film electrode, a conduit extending downward from top of the second thin film electrode to the active matrix for electrically connecting therebetween to thereby allow the second thin film electrode to function as a signal electrode, a thin film electrodisplacive member located between the first and the second thin film electrodes, and an insulating member, wherein the insulating member is located between top of the conduit and bottom of the first thin film electrode, thereby electrically disconnecting the first and the second thin film electrode
  • a method for manufacturing an array of M x N thin film actuated mirrors comprising the steps of: preparing an active matrix including a substrate and an array of M x N connecting terminals; forming a passivation laye on top of the active matrix; depositing an etchant stopping layer on top of the passivation layer; forming a thin film sacrificial layer on top of the etchant stopping layer; creating an array of M x N pairs of empty cavities in the thin film sacrificial layer in such a way that one of the empty cavities in each pair encompasses one of the connecting terminals; depositing an elastic layer, a second thin film layer and a thin film electrodisplacive layer, successively, on top of the thin film sacrificial layer including the empty cavities; patterning the electrodisplacive layer and the second thin film layer to form an array of M x N electrodisplacive members and
  • Fig. 1 is a schematic partial cross sectional view illustrating an array of M x N thin film actuated mirrors previously disclosed.
  • Fig. 2 depicts a partial cross sectional view setting forth an array of M x N thin film actuated mirrors in accordance with a first preferred embodiment of the present invention.
  • Figs. 3A to 3M represent partial cross sectional views setting forth a method for the manufacture of an array of M x N thin film actuated mirrors shown in Fig. 2.
  • Fig. 4 illustrates a partial cross sectional view setting forth an array of M x N thin film actuated mirrors in accordance with a second preferred embodiment of the present invention.
  • Figs. 5A to 5D present partial cross sectional views illustrating a method for manufacturing the array of M x N thin film actuated mirrors illustrated in Fig. 4.
  • FIGs. 2, 4, 3A to 3M and 5A to 5D cross sectional views setting forth arrays 200, 300 of M x N thin film actuated mirrors 295, 395, wherein M and N are integers, for use in an optical projection system in accordance with a first and a second preferred embodiments of the present invention and schematic cross sectional views illustrating methods for manufacturing the arrays 200, 300 of M x N thin film actuated mirrors 295, 395, shown in Figs. 2 and 4, respectively.
  • like parts appearing in Figs. 2, 4, 3A to 3M and 5A to 5D are represented by like reference numerals.
  • FIG. 2 there is provided a cross sectional view setting forth an array 200 of M x N thin film actuated mirrors 295 in accordance with a first embodiment of the present invention, the array 200 comprising an active matrix 210 and an array of M x N actuating structures 220.
  • the active matrix 210 includes a substrate 212, an array of M x N transistors(not shown) and an array of M x N connecting terminals 214. Each of the connecting terminals 214 is electrically connected to a corresponding transistor in the array of transistors.
  • the passivation layer 216 made of, e.g., a phosphor-silicate glass(PSG) or silicon nitride, and having a thickness of 0.1 - 2 ⁇ m, is located on top of the active matrix 210.
  • PSG phosphor-silicate glass
  • silicon nitride silicon nitride
  • Each of the actuating structures 220 is provided with a first thin film electrode 292, a thin film electrodisplacive member 275, a second thin film electrode 265, an elastic member 255, a conduit 282 and an insulating member 284.
  • the first thin film electrode 292 made of an electrically conducting and light reflecting material, e.g., aluminum(Al) or silver(Ag), is located on top of the thin film electrodisplacive member 275.
  • the first thin film electrode 292 is electrically connected to ground, thereby functioning as a mirror as well as a common bias electrode.
  • the thin film electrodisplacive member 275 made of a piezoelectric material, e.g., lead zirconium titanate(PZT), or an electrostrictive material, e.g., lead magnesium niobate(PMN), is located between the first and the second thin film electrodes 292, 265.
  • a piezoelectric material e.g., lead zirconium titanate(PZT)
  • an electrostrictive material e.g., lead magnesium niobate(PMN)
  • the elastic member 255 made of a nitride, e.g., silicon nitride, is positioned below the second thin film electrode 265. A bottom portion at the proximal end thereof is secured to top of the active matrix 210, thereby cantilevering the actuating structure 220.
  • the conduit 282 made of a metal, e.g., tungsten(W), extends from top of the second thin film electrode 265 to top of the corresponding connecting terminal 214, thereby connecting electrically the second thin film electrode 265 to the connecting terminal 214.
  • the insulating member 284 is formed between top of the conduit 282 and bottom of the first thin film electrode 292, thereby preventing the first thin film electrode 292 from electrically connected to the second thin film electrode 265.
  • Figs. 3A to 3M there are provided partial schematic cross sectional views illustrating a method for the manufacture of the array 200 of M x N thin film actuated mirrors 295 as shown in Fig. 2.
  • the process for the manufacture of the array 200 begins with the preparation of an active matrix 210 including a substrate 212, an array of M x N connecting terminals 214 and an array of M x N transistors(not shown).
  • the substrate 212 is made of an insulating material, e.g., Si-wafer.
  • Each of the connecting terminals 214 is electrically connected to a corresponding transistor in the array of transistors.
  • a passivation layer 216 made of, e.g., a phosphor-silicate glass(PSG) or silicon nitride, and having a thickness of 0.1 - 2 ⁇ m, on top of the active matrix 210 by using, e.g., a CVD or a spin coating method.
  • a thin film sacrificial layer 240 is formed on top of the etchant stopping layer 218, as shown in Fig. 3B.
  • the thin film sacrificial layer 240 is formed by using a sputtering or an evaporation method if the thin film sacrificial layer 240 is made of a metal, a CVD or a spin coating method if the thin film sacrificial layer 240 is made of a PSG, or a CVD method if the thin film sacrificial layer 240 is made of a poly-Si.
  • top of the thin film sacrificial layer 240 is made flat by using a spin on glass(SOG) method or a chemical mechanical polishing(CMP) method, followed by a scrubbing method, as shown in Fig. 3C.
  • SOG spin on glass
  • CMP chemical mechanical polishing
  • an array of M x N pairs of empty cavities 242 is created in the thin film sacrificial layer 240 in such a way that one of the empty cavities 242 in each pair is aligned with one of the connecting terminals 214 by using a dry or an wet etching method, as shown in Fig. 3D.
  • an elastic layer 250 made of nitride, e.g., silicon nitride, and having a thickness of 0.1 - 2 ⁇ m, is deposited on top of the thin film sacrificial layer 240 including the empty cavities 242 by using a CVD method, as shown in Fig. 3E.
  • the stress inside the elastic layer 250 is controlled by changing the ratio of the reactant gases as a function of time.
  • a second thin film layer 260 made of an electrically conducting material, e.g., Pt/Ta, and having a thickness of 0.1 - 2 ⁇ m, is formed on top of the elastic layer 250 by using a sputtering or a vacuum evaporation method, as shown in Fig, 3F.
  • the second thin film layer 260 is then iso-cut into an array of M x N second thin film electrodes 265, illustrated in Fig. 2, by using a dry etching method, wherein each of the second thin film electrodes 265 is electrically disconnected from other second thin film electrodes 265.
  • a thin film electrodisplacive layer 270 made of a piezoelectric material, e.g., PZT, or an electrostrictive material, e.g., PMN, and having a thickness of 0.1 - 2 ⁇ m, is deposited on top of the array of M x N second thin film electrodes 265 by using an evaporation, a Sol-Gel, a sputtering or a CVD method, as shown in Fig. 3G.
  • the thin film electrodisplacive layer 270 is then heat treated to allow a phase transition to take place by using a rapid thermal annealing(RTA) method.
  • RTA rapid thermal annealing
  • the thin film electrodisplacive layer 270 is sufficiently thin, there is no need to pole it in case it is made of a piezoelectric material: for it can be poled with the electric signal applied during the operation of the thin film actuated mirrors 295.
  • an array of M x N holes 280 is created by using an etching method, wherein each of the holes extends from top of the thin film electrodisplacive layer 270 to top of a corresponding connecting terminal 214, as shown in Fig. 3H.
  • the conduit 282 is formed by filling a portion of each of the holes 280 with a metal, e.g., tungsten(W), using, e.g., a lift-off method, in such a way that the conduit 282 is an electrical contact with the second thin film layer 260 and the corresponding connecting terminal 214, as shown in Fig. 3I.
  • a metal e.g., tungsten(W)
  • an insulating member 284 is formed in the remaining portion of each of the holes 280 by filling therein with an insulating material, e.g., oxide or nitride, using a lift-off method until top of the insulating member 284 is in level with top of the thin film electrodisplacive layer 270, thereby reducing a possibility of an electrical contact forming between the second thin film electrode 265 and a first thin film layer 290 to be formed on top of the thin film electrodisplacive layer 270, as shown in Fig. 3J.
  • an insulating material e.g., oxide or nitride
  • a first thin film layer 290 made of an electrically conducting and light reflecting material, e.g., aluminum(Al) or silver(Ag), and having a thickness of 0.1 - 2 ⁇ m, is formed on top of the thin film electrodisplacive layer 270 and the insulating member 284 by using a sputtering or a vacuum evaporation method, thereby forming a multiple layered structure 252, as shown in Fig. 3K.
  • an electrically conducting and light reflecting material e.g., aluminum(Al) or silver(Ag)
  • the multiple layered structure 252 is patterned into an array of M x N semifinished actuated mirrors 245 by using a photolithography or a laser trimming method, until the thin film sacrificial layer 240 is exposed.
  • Each of the M x N semifinished actuated mirrors 245 includes a first thin film electrode 292, a thin film electrodisplacive member 275, the second thin film electrode 265 and an elastic member 255.
  • the preceding step is then followed by completely covering each of the semifinished actuated mirrors 245 with a thin film protection layer(not shown).
  • the thin film sacrificial layer 240 is then removed by using an wet etching method using an etchant or a chemical, e.g., hydrogen fluoride(HF) vapor, thereby forming a driving space for each of the thin film actuated mirrors 295.
  • an etchant or a chemical, e.g., hydrogen fluoride(HF) vapor
  • the thin film protection layer is removed.
  • the active matrix 210 is completely diced into a desired shape, by using a photolithography or a laser trimming method to thereby form the array 200 of M x N thin film actuated mirrors 295, as shown in Fig. 3M.
  • FIG. 4 there is provided a cross sectional view setting forth an array 300 of M x N thin film actuated mirrors 395 in accordance with a first embodiment of the present invention, the array 300 comprising an active matrix 310 and an array of M x N actuating structures 320.
  • FIG. 4 a cross sectional view of a second embodiment of an array 300 of M x N thin film actuated mirrors 395, wherein the second embodiment is similar to the first embodiment except that the insulating member 284 is formed in such away that it covers top of the conduit 282 and also the thin film electrodisplacive member 275.
  • the insulating member 284 is in a layer form and is interposed between the first thin film electrode 292 and the thin film electrodisplacive member 275, the insulating member 284 extending from the top surface of the conduit 282 to a distal end of the thin film electrodisplacive member 275.
  • the insulating member 284 is made of an electrodisplacive ceramic material, e.g., MZr x Ti y O 3 , wherein M is Pb which may be partly or indeed completely replaced by one or more of Ca, Ba, Mg, Li, Cu, Ag, Au or Cd. Furthermore, MZr x Ti y O 3 may also be doped with small amounts of Mg, Na, Nb, La or Zn.
  • MZr x Ti y O 3 may also be doped with small amounts of Mg, Na, Nb, La or Zn.
  • FIGs. 5A to 5D there are shown partial cross sectional views illustrating a method for manufacturing the array of M x N thin film actuated mirrors in accordance with a second preferred embodiment of the present invention, wherein the steps for forming the second embodiment is identical to the steps for forming the first embodiment shown in Figs. 3A to 3I, until it reaches the step for forming the insulating member 284 on top of the conduit 282 and the thin film electrodisplacive member 275.
  • the insulating member 284 is formed on top of the conduit 282 and the thin film electrodisplacive layer 270 in each of the actuating structures 320 by using an evaporation, a Sol-Gel, a sputtering or a CVD method, the insulating member completely covering the conduits 282 and the thin electrodisplacive layer 270.
  • a first thin film layer 390 made of an electrically conducting and light reflecting material, e.g., aluminum(Al) or silver(Ag), and having a thickness of 0.1 - 2 ⁇ m, is formed on top of the insulating member 284 by using a sputtering or a vacuum evaporation method, thereby forming a multiple layered structure 352, as shown in Fig. 5B.
  • an electrically conducting and light reflecting material e.g., aluminum(Al) or silver(Ag)
  • the multiple layered structure 352 is patterned into an array of M x N semifinished actuated mirrors 345 by using a photolithography or a laser trimming method, until the thin film sacrificial layer 240 is exposed.
  • Each of the M x N semifinished actuated mirrors 345 includes a first thin film electrode 392, an insulating member 284, a thin film electrodisplacive member 275, the second thin film electrode 265 and an elastic member 255.
  • the ensuing steps are similar to those for forming the first embodiment, thereby forming the array 300 of M x N thin film actuated mirrors 395, as shown in Fig. 5D.

Claims (13)

  1. Réseau de M x N miroirs actionnés à films minces, dans lequel M et N sont des entiers, destiné à être utilisé dans un système de projection optique, le réseau comportant:
    une matrice active (210); et
    un réseau de M x N structures d'actionnement (220), chacune des structures d'actionnement étant pourvue d'un élément élastique, d'une partie inférieure à une extrémité proximale de cette structure, fixée à la matrice active (210) pour mettre ainsi en porte-à-faux l'élément élastique, d'une première électrode à film mince (292) connectée électriquement à la masse, permettant ainsi à la première électrode à film mince de fonctionner en tant que miroir et en tant qu'électrode de polarisation, d'une seconde électrode (265) à film mince, d'un conduit (282) s'étendant vers le bas depuis le dessus de la seconde électrode (265) à film mince jusqu'à la matrice active (210) et connectant électriquement le conduit (282) et la seconde électrode (265) pour permettre ainsi à la seconde électrode à film mince de fonctionner en tant qu'électrode de signal, d'un élément (275) à film mince pouvant être déplacé électriquement, placé entre les première et seconde électrodes à film mince, et d'un élément isolant (284), dans laquelle l'élément isolant est placé entre le dessus du conduit (282) et le dessous de la première électrode à film mince, grâce à quoi les première et seconde électrodes à film mince sont maintenues électriquement isolées par l'élément isolant et la couche (275) à déplacement électrique.
  2. Réseau selon la revendication 1, dans lequel l'élément isolant (284) est formé d'un nitrure.
  3. Réseau selon la revendication 1, dans lequel l'élément isolant (284) est formé d'une matière pouvant être déplacée électriquement.
  4. Réseau selon la revendication 3, dans lequel l'élément isolant (284) est sous la forme d'une couche.
  5. Réseau selon la revendication 4, dans lequel l'élément isolant (284) recouvre le dessus du conduit et l'élément à film mince à déplacement électrique.
  6. Procédé pour la fabrication d'un réseau de M x N miroirs activés à films minces, dans lequel M et N sont des entiers, destiné à être utilisé dans un système de projection optique, le procédé comprenant les étapes dans lesquelles:
    on prépare une matrice active (210) comprenant un substrat et un réseau de M x N bornes de connexion (214) ;
    on forme une couche de passivation (116) sur le dessus de la matrice active;
    on dépose une couche (118) d'arrêt d'agent d'attaque sur le dessus de la couche de passivation;
    on forme une couche sacrificielle (240) à film mince sur le dessus de la couche d'arrêt d'agent d'attaque;
    on crée un réseau de M x N paires de cavités vides dans la couche sacrificielle à film mince d'une manière telle que l'une des cavités vides de chaque paire renferme l'une des bornes de connexion (214) ;
    on dépose une couche élastique (255), une seconde couche (265) à film mince et une couche (275) à film mince pouvant être déplacée électriquement, successivement, sur le dessus de la couche sacrificielle (240) à film mince présentant les cavités vides;
    on soumet à la formation d'un motif la couche (275) pouvant être déplacée électriquement et la seconde couche à film mince pour former un réseau de M x N éléments pouvant être déplacés électriquement et un réseau de M x N secondes électrodes (265, 292) à film mince;
    on forme un réseau de M x N conduits (282), chacun des conduits s'étendant depuis les secondes électrodes (265) à film mince jusque sur le dessus de la bande de connexion correspondante;
    on forme un réseau de M x N éléments isolants afin que les dessus des conduits (282) soient recouverts;
    on dépose une première couche (292) à film mince sur le dessus du réseau de M x N éléments isolants et sur les éléments à film mince pouvant être déplacés électriquement pour former ainsi une structure stratifiée multiple;
    on soumet à la formation d'un motif la structure stratifiée multiple pour former un réseau de M x N structures de miroirs actionnés, jusqu'à ce que la couche sacrificielle (240) à film mince soit à découvert; et
    on enlève la couche sacrificielle à film mince en utilisant un agent d'attaque ou une substance chimique pour former ainsi le réseau de M x N miroirs actionnés à film mince.
  7. Procédé selon la revendication 6, dans lequel ladite étape de formation d'une couche sacrificielle (240) à film mince comprend en outre une étape pour aplanir son dessus.
  8. Procédé selon la revendication 6, dans lequel ladite étape de formation du réseau de M x N conduits (282) comprend en outre une étape pour mettre en forme un réseau de M x N trous, chacun des trous s'étendant depuis le dessus de la couche (275) à film mince pouvant être déplacée électriquement jusqu'au-dessus d'une bande de connexion correspondante.
  9. Procédé selon la revendication 8, dans lequel le réseau de M x N conduits (284) est formé par remplissage de chacun des trous avec un métal jusqu'à la seconde couche à film mince pour former ainsi un réseau de M x N conduits, chacun des conduits s'étendant depuis le dessus de la bande de connexion correspondante jusqu'à la seconde électrode à film mince.
  10. Procédé selon la revendication 6, dans lequel l'élément isolant (284) est formé d'un nitrure.
  11. Procédé selon la revendication 6, dans lequel l'élément isolant (284) est formé d'une matière pouvant être déplacée électriquement.
  12. Procédé selon la revendication 6, dans lequel les éléments isolants se présentent sous la forme d'une couche recouvrant complètement chacun des conduits et la couche à film mince pouvant être déplacée électriquement.
  13. Procédé selon la revendication 12, dans lequel l'élément isolant (284) est formé en utilisant l'un d'un procédé d'évaporation, d'un procédé à Sol-Gel, d'un procédé de pulvérisation ou d'un procédé de dépôt chimique en phase vapeur.
EP97303427A 1996-05-29 1997-05-20 Matrice de miroirs commandés à couches minces et sa méthode de fabrication Expired - Lifetime EP0810458B1 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR9618393 1996-05-29
KR9618382 1996-05-29
KR1019960018382A KR970073862A (ko) 1996-05-29 1996-05-29 공작기계의 과부하 보호 장치
KR9618392 1996-05-29
KR1019960018393A KR100243859B1 (ko) 1996-05-29 1996-05-29 광로 조절 장치의 제조 방법

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EP0810458A2 EP0810458A2 (fr) 1997-12-03
EP0810458A3 EP0810458A3 (fr) 1998-07-15
EP0810458B1 true EP0810458B1 (fr) 2001-09-19

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WO1999049667A1 (fr) * 1998-03-20 1999-09-30 Daewoo Electronics Co., Ltd. Ensemble miroirs commandes par couches minces dans un systeme de projection optique

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PE18996A1 (es) * 1994-03-09 1996-08-11 Daewoo Electronics Co Ltd Disposicion de espejos compuestos por peliculas delgadas accionadas para uso en un conjunto de proyeccion optica y metodo para fabricar la misma
KR100213281B1 (ko) * 1994-10-31 1999-08-02 전주범 광로조절장치
KR0149215B1 (ko) * 1994-11-11 1998-10-15 배순훈 픽셀 구동 회로
KR960018646A (ko) * 1994-11-14 1996-06-17 배순훈 광로조절장치의 제조방법

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EP0810458A2 (fr) 1997-12-03
EP0810458A3 (fr) 1998-07-15

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