EP0797558B1 - Electrically conductive connection - Google Patents

Electrically conductive connection Download PDF

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Publication number
EP0797558B1
EP0797558B1 EP95905584A EP95905584A EP0797558B1 EP 0797558 B1 EP0797558 B1 EP 0797558B1 EP 95905584 A EP95905584 A EP 95905584A EP 95905584 A EP95905584 A EP 95905584A EP 0797558 B1 EP0797558 B1 EP 0797558B1
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EP
European Patent Office
Prior art keywords
adhesion
metal
metal layer
layer
connecting piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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EP95905584A
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German (de)
French (fr)
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EP0797558A1 (en
Inventor
Ulrich SCHÖNAUER
Michael Tafferner
Hagen Fischer
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Epiq Sensor Nite NV
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Heraeus Electro Nite International NV
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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/0004—Gaseous mixtures, e.g. polluted air
    • G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6683—Structural association with built-in electrical component with built-in electronic circuit with built-in sensor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/029—Welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
    • H01R4/4809—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0221—Laser welding
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
    • C04B2235/665—Local sintering, e.g. laser sintering
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/72—Forming laminates or joined articles comprising at least two interlayers directly next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/47—Molded joint
    • Y10T403/477—Fusion bond, e.g., weld, etc.

Definitions

  • the invention relates to an electrically conductive connection between a metallic connector and one on a ceramic substrate, which is preferably glass and / or glass ceramic has in small amounts, at least applied by a sintered compound a metal-containing metal layer on which the connector is welded.
  • EP-A-0 113 895 discloses a method for laser soldering flexible ones Wiring on glass substrates. In the process, wires are held down using a hold-down device pressed onto a glass substrate. The hold-down device is translucent so that the laser beam the solder can melt.
  • the invention has for its object a composite as well as a Propose processes for its production, which allows better and lasting connections.
  • a metallic connector as a contact spring, Contact clip or metal foil applied and with whole special advantage because it is very quick and contactless, electrically conductive on the one hand by means of laser welding, and mechanically extremely stable on the other hand with the Connected metal layer.
  • appropriate high temperature resistant metals e.g. Precious metals like Platinum or its alloys results in one high temperature resistant and electrically conductive as well mechanically extremely robust connection. It is suitable especially in strongly oxidizing and corrosive High temperature environments such as in the hot and pulsating exhaust gas from internal combustion engines as Connection technology for gas sensors e.g. Lambda probes.
  • the electrically conductive connection is mechanically so stable is that they also serve as a mechanical bracket can. So overall there is a fixed and permanent, electrically reliable connection that simple and inexpensive with high reproducibility and Process reliability in handling and manufacturing represents. In addition, there is an inexpensive Integrability in the process and assembly process, in which already has connections between two metals can be produced by means of laser welding. Also results laser welding has the advantage of high Service life. When choosing suitable materials, e.g. Precious metals is used at high temperatures and oxidizing and corrosive environment possible without that the mechanical or electrical connection below it suffers. The is particularly advantageous Connection when the metal of the metal layer and that of the metal particles of the adhesive layer compared to only metallurgically similar or related metals or their alloys.
  • the ceramic substrate is designated 5 and has predominantly Al 2 O 3 with a small proportion of glass and / or glass ceramic of approximately 4%.
  • the adhesion-promoting layer 7 according to the invention is applied over this by means of a fusion bond.
  • the adhesive layer contains metal particles in tinsel and / or powder or the like form and glass and has (on the finished end product with all other layers) a thickness of the adhesive layer of 7 to 8 ⁇ m .
  • the actual metal layer 9 is sintered over the adhesion-promoting layer 7, which in the initial state contains metal, preferably noble metal in particle form, for example as a powder, flakes or the like.
  • a metal connecting piece 11, for example a clip or the like, is then placed on this metal layer 9 and then connected to the metal layer 9 by means of a laser welding spot.
  • the area melted here is indicated by dashed lines at 13 and shows that not only the electrical connection piece that is greater than 100 ⁇ m thick, but also the approximately 40 to 60 ⁇ m thick metal layer (on the finished end product with all other layers) is somewhat melted in some areas, whereby the intimate mechanical as well as good electrical connection is formed between the connector 11 and the metal layer 9 leading to an electrical arrangement on the ceramic substrate 5.
  • Laser welding also has the advantage that extremely small spots can be welded very precisely and with high reproducibility.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Food Science & Technology (AREA)
  • Combustion & Propulsion (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Medicinal Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Oxygen Concentration In Cells (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Measuring Fluid Pressure (AREA)
  • Laser Beam Processing (AREA)
  • Ceramic Products (AREA)

Description

Die Erfindung betrifft eine elektrisch leitende Verbindung zwischen einem metallischen Anschlußstück und einer auf einem Keramiksubstrat, welches vorzugsweise Glas und/oder Glaskeramik in geringen Mengen aufweist, durch eine Sinterverbindung aufgebrachten, zumindest ein Metall aufweisenden Metallschicht, auf die das Anschlußstück geschweißt ist.The invention relates to an electrically conductive connection between a metallic connector and one on a ceramic substrate, which is preferably glass and / or glass ceramic has in small amounts, at least applied by a sintered compound a metal-containing metal layer on which the connector is welded.

Man hat schon daran gedacht, solche vorstehend angegebenen Verbindungen herzustellen. Eine derartige Verbindung ist aus DE-B-10 22 957 bekannt. Hier ist ein Metall-Keramik-Verbundkörper beschrieben, der aus dünnen Schichten gebildet und für die Herstellung von Kondensatoren geeignet ist. EP-A-0 113 895 offenbart ein Verfahren zum Laserlöten von flexiblen Verdrahtungen auf Glassubstraten. Bei dem Verfahren werden Drähte mittels eines Niederhalters auf ein Glassubstrat gedrückt. Der Niederhalter ist lichtdurchlässig, so daß der Laserstrahl das Lot aufschmelzen kann.It has already been considered to produce such compounds as mentioned above. Such a connection is known from DE-B-10 22 957. Here is a metal-ceramic composite body described, which consists of thin layers and for the production of capacitors suitable is. EP-A-0 113 895 discloses a method for laser soldering flexible ones Wiring on glass substrates. In the process, wires are held down using a hold-down device pressed onto a glass substrate. The hold-down device is translucent so that the laser beam the solder can melt.

Solche im Labor hergestellten Verbindungen weisen jedoch diverse Nachteile auf. So ist die Verbindung zwischen dem Keramiksubstrat und dem Metall aufgrund der sehr unterschiedlichen Eigenschaften der Werkstoffe der zu verbindenden Teile, insbesondere der unterschiedlichen Ausdehnungskoeffizienten und chemischen Zusammensetzungen kritisch. Die Haftung an der Grenzfläche zwischen dem Keramiksubstrat einerseits und der aufgesinterten Metallschicht andererseits ist äußerst gering, weil das Metall und die Keramik nur einen geringen Verbund bilden, andererseits die Adhäsionskräfte sehr gering sind. Insbesondere beim Einsatz im Hochtemperaturbereich, insbesondere wenn mechanische Belastungen hinzukommen, kann eine hinreichend zuverlässige Verbindung nicht gewährleistet werden. Hinzu kommt, daß durch die Schweißung, wenn sie nicht auf einer hinreichend dicken Metallschicht und/oder einem metallischen Anschlußstück erfolgt, eine Zerstörung der Metallschicht bzw. der darunter liegenden Schichten, z.B. des Keramiksubstrates bewirkt wird, wobei dann die auf dem Keramiksubstrat aufgebrachte elektrische und /oder mechanische Anordnung nicht mehr funktionsfähig ist. Insgesamt wird also bei der Herstellung der elektrisch leitenden Verbindung entweder ein hoher Ausschuß erzeugt, oder aber die elektrische Verbindung ist nicht hinreichend mechanisch stabil und temperaturfest.However, such connections made in the laboratory have various disadvantages. So is the connection between the ceramic substrate and the metal due to the very different Properties of the materials of the parts to be joined, in particular the different expansion coefficients and chemical compositions critical. The adhesion at the interface between the ceramic substrate on the one hand and the sintered on Metal layer on the other hand is extremely small because the metal and the ceramic only form a low bond, on the other hand the adhesive forces are very low. Especially when used in the high temperature range, especially when mechanical A sufficiently reliable connection cannot add stress be guaranteed. In addition, that through the Weld if they are not on a sufficiently thick Metal layer and / or a metallic connector takes place, destruction of the metal layer or underlying layers, e.g. of the ceramic substrate is effected, which then on the ceramic substrate applied electrical and / or mechanical arrangement is no longer functional. So overall, at Establish the electrically conductive connection either produces a high scrap, or the electrical Connection is not sufficiently mechanically stable and temperature resistant.

Der Erfindung liegt die Aufgabe zugrunde, einen Verbund sowie ein Verfahren zu dessen Herstellung vorzuschlagen, welche bessere und dauerhafte Verbindungen zuläßt.The invention has for its object a composite as well as a Propose processes for its production, which allows better and lasting connections.

Diese Aufgabe wird erfindungsgemäß durch die Gegenstände von Anspruch 1 und 12 gelöst. Die Verwendung des Verbundes ist in Anspruch 11 beansprucht. Vorteilhafte Ausführungsformen des Verbundes und des Verfahrens sind in der Ansprüchen 2 bis 10 und 13 bis 15 beansprucht. Nach der erfindungsgemäßen Lehre wird also die 20 bis 100 µm dicke Metallschicht nicht direkt auf das Keramiksubstrat aufgebracht, sondern zwischen diesen beiden Schichten wird eine 5 bis 15 µm dicke Haftvermittlungsschicht aufgebracht, die Glas und/oder Glaskeramik sowie Metallteilchen als Flitter, in Pulverform oder dergleichen enthält und auf das Keramiksubstrat , vorzugsweise vermittels einer Schmelzverbindung aufgeschmolzen wird. Hierbei findet eine Schmelzverbindung zwischen dem in der Haftvermittlungsschicht enthalten , Glas und/oder der Glaskeramik einerseits und den Glasanteilen sowie dem Keramiksubstrat oder diesem alleine andererseits statt. Infolgedessen ergibt sich eine kraftschlüssige Verbindung zwischen dem Keramiksubstrat und der Haftvermittlungsschicht. Zugleich verbinden sich die Metallteilchen der Haftvermittlungsschicht mit den aufschmelzenden bzw. erweichenden Glasbestandteilen. Durch dieses Umfließen wird ein Formschluß der verschiedenen, kornförmigen Bestandteile und damit eine innige Verbindung zwischen den Teilchen der Haftvermittlungsschicht erzielt. Auf diese Haftvermittlungsschicht wird dann die reine Metallschicht z.B. in Dickschichttechnik aufgebracht, und durch Sintern mit ihr verbunden. Bei dieser Sinterverbindung wird eine intermetallische Verbindung der metallischen Teile der Metallschicht mit den Metallteilchen in der Haftvermittlungsschicht bewirkt. An dieser wird durch eine Sinterverbindung ein mechanisch fester Verbund erzielt. Auf die Metallschicht wird dann ein metallisches Anschlußstück als Kontaktfeder, Kontaktklipp oder Metallfolie aufgelegt und mit ganz besonderem Vorteil, weil sehr schnell und berührungslos, mittels Laserschweißung elektrisch gut leitend einerseits, sowie mechanisch äußerst stabil andererseits mit der Metallschicht verbunden. Bei Einsatz entsprechender hochtemperaturbeständiger Metalle, z.B. Edelmetalle wie Platin oder deren Legierungen ergibt sich eine hochtemperaturfeste und elektrisch gutleitende sowie mechanisch äußerst robuste Verbindung. Sie eignet sich insbesondere in stark oxidierenden sowie korrosiven Umgebungen bei hoher Temperatur, wie z.B. im heißen und pulsierenden Abgas von Verbrennungsmotoren als Verbindungstechnik bei Gassensoren z.B. Lambda-Sonden.This object is achieved by the subjects of Claims 1 and 12 solved. The use of the composite is claimed in claim 11. Advantageous embodiments of the composite and the method are claimed in claims 2 to 10 and 13 to 15. According to the teaching of the invention 20 to 100 µm thick metal layer not directly on the ceramic substrate is applied, but between these two layers a 5 to 15 µm thick adhesive layer, the glass and / or glass ceramic and metal particles as tinsel, in Contains powder or the like and on the Ceramic substrate, preferably by means of a Melt connection is melted. Here one finds Fusion connection between that in the Adhesion promoting layer contain glass and / or the Glass ceramic on the one hand and the glass parts and the Ceramic substrate or this alone on the other hand. As a result, there is a positive connection between the ceramic substrate and the Bonding layer. At the same time they connect Metal particles of the adhesive layer with the melting or softening glass components. By this flowing around becomes a form fit of the different granular components and thus an intimate connection achieved between the particles of the adhesive layer. The pure adhesion layer is then the pure one Metal layer e.g. applied in thick film technology, and connected to it by sintering. At this Sintered compound becomes an intermetallic compound metallic parts of the metal layer with the Metal particles in the adhesive layer causes. On this becomes mechanical by a sintered connection firm bond achieved. Then on the metal layer a metallic connector as a contact spring, Contact clip or metal foil applied and with whole special advantage because it is very quick and contactless, electrically conductive on the one hand by means of laser welding, and mechanically extremely stable on the other hand with the Connected metal layer. When using appropriate high temperature resistant metals, e.g. Precious metals like Platinum or its alloys results in one high temperature resistant and electrically conductive as well mechanically extremely robust connection. It is suitable especially in strongly oxidizing and corrosive High temperature environments such as in the hot and pulsating exhaust gas from internal combustion engines as Connection technology for gas sensors e.g. Lambda probes.

Überraschenderweise hat sich ferner herausgestellt, daß die elektrisch leitende Verbindung mechanisch so stabil ist, daß sie zugleich als mechanische Halterung dienen kann. Insgesamt ergibt sich also eine feste und dauerhafte, elektrisch zuverlässige Verbindung, die sich einfach und kostengünstig mit hoher Reproduzierbarkeit und Prozeßsicherheit beim Handling und bei der Herstellung darstellen läßt. Außerdem ergibt sich eine kostengünstige Integrierbarkeit in dem Prozeß- und Montageablauf, in welchem bereits Verbindungen zwischen zwei Metallen mittels Laserschweißen hergestellt werden. Außerdem ergibt sich beim Laserschweißen der Vorteil einer hohen Standzeit. Bei der Wahl geeigneter Materialien, z.B. Edelmetallen ist der Einsatz bei hohen Temperaturen und oxidierender sowie korrosiver Umgebung gut möglich, ohne daß die mechanische oder elektrische Verbindung hierunter leidet. Von besonderem Vorteil gestaltet sich die Verbindung, wenn das Metall der Metallschicht und jenes der Metallteilchen der Haftvermittlungsschicht identisch ist, gegenüber nur metallurgisch ähnlichen bzw. verwandten Metallen oder deren Legierungen.Surprisingly, it has also been found that the electrically conductive connection is mechanically so stable is that they also serve as a mechanical bracket can. So overall there is a fixed and permanent, electrically reliable connection that simple and inexpensive with high reproducibility and Process reliability in handling and manufacturing represents. In addition, there is an inexpensive Integrability in the process and assembly process, in which already has connections between two metals can be produced by means of laser welding. Also results laser welding has the advantage of high Service life. When choosing suitable materials, e.g. Precious metals is used at high temperatures and oxidizing and corrosive environment possible without that the mechanical or electrical connection below it suffers. The is particularly advantageous Connection when the metal of the metal layer and that of the metal particles of the adhesive layer compared to only metallurgically similar or related metals or their alloys.

Zweckmäßige Ausgestaltungen und Weiterbildungen der Erfindung sind in den Unteransprüchen gekennzeichnet. Ein Ausführungsbeispiel der Erfindung wird nachfolgend unter Bezugnahme auf die Zeichnung näher erläutert, welche einen schematischen Querschnitt durch eine Verbindung zeigt.Appropriate refinements and developments of Invention are characterized in the subclaims. On Embodiment of the invention is below With reference to the drawing, which explains one shows a schematic cross section through a connection.

Hierbei ist das Keramiksubstrat mit 5 bezeichnet und weist überwiegend Al2O3 mit einem geringen Anteil von Glas und/oder Glaskeramik von ca. 4 % auf. Darüber ist die erfindungsgemäße Haftvermittlungsschicht 7 mittels einer Schmelzverbindung aufgebracht. Die Haftvermittlungsschicht enthält Metallteilchen in Flitter- und/oder Pulver- oder dergleichen Form sowie Glas und weist (am fertigen Endprodukt mit allen anderen Schichten) eine Dicke der Haftvermittlungsschicht von 7 bis 8 µm auf.Here, the ceramic substrate is designated 5 and has predominantly Al 2 O 3 with a small proportion of glass and / or glass ceramic of approximately 4%. The adhesion-promoting layer 7 according to the invention is applied over this by means of a fusion bond. The adhesive layer contains metal particles in tinsel and / or powder or the like form and glass and has (on the finished end product with all other layers) a thickness of the adhesive layer of 7 to 8 μm .

Über der Haftvermittlungsschicht 7 ist die eigentliche Metallschicht 9 aufgesintert, welche im Ausgangszustand Metall, vorzugsweise Edelmetall in Teilchenform, z.B. als Pulver, Flitter oder dergleichen enthält. Auf diese Metallschicht 9 wird dann ein metallisches Anschlußstück 11, beispielsweise ein Klipp oder dergleichen aufgelegt und dann mittels eines Laserschweißpunktes mit der Metallschicht 9 verbunden. Der hierbei aufgeschmolzene Bereich ist gestrichelt mit 13 bezeichnet und zeigt, daß nicht nur das größer als 100 µm dicke elektrische Anschlußstück, sondern auch die etwa 40 bis 60 µm dicke Metallschicht (am fertigen Endprodukt mit allen anderen Schichten) bereichsweise etwas aufgeschmolzen wird, wodurch sich die innige mechanische sowie elektrisch gut leitende Verbindung zwischen dem Anschlußstück 11 und der zu einer elektrischen Anordnung auf dem Keramiksubstrat 5 führenden Metallschicht 9 bildet. Die Laserschweißung hat überdies den Vorteil, daß extrem kleine Punkte sehr genau und mit hoher Reproduzierbarkeit geschweißt werden können.The actual metal layer 9 is sintered over the adhesion-promoting layer 7, which in the initial state contains metal, preferably noble metal in particle form, for example as a powder, flakes or the like. A metal connecting piece 11, for example a clip or the like, is then placed on this metal layer 9 and then connected to the metal layer 9 by means of a laser welding spot. The area melted here is indicated by dashed lines at 13 and shows that not only the electrical connection piece that is greater than 100 μm thick, but also the approximately 40 to 60 μm thick metal layer (on the finished end product with all other layers) is somewhat melted in some areas, whereby the intimate mechanical as well as good electrical connection is formed between the connector 11 and the metal layer 9 leading to an electrical arrangement on the ceramic substrate 5. Laser welding also has the advantage that extremely small spots can be welded very precisely and with high reproducibility.

Claims (15)

  1. Composite comprising a ceramic substrate (5), an adhesion-promoting layer (7), a metal layer (9) and a connecting piece (11), an electrically conducting connection being provided between the metallic connecting piece (11) and the metal layer (9) which is connected to the ceramic substrate (5) by sintering and/or fusion and comprises at least one metal and to which the connecting piece (11) is welded, the glass and/or glass ceramic as well as the adhesion-promoting layer (7) comprising metal particles being applied to the ceramic substrate (5) and the metal layer (9) being applied to said adhesion-promoting layer, the adhesion-promoting layer (7) having a thickness of from 5 to 15 µm and the metal layer (9) having a thickness of from 20 to 100 µm, based in each case on the finished electrically conducting connection, and the connection piece (11) being connected to the metal layer by means of a weld joint.
  2. Composite according to Claim 1, characterized in that the connecting piece (11) is connected to the metal layer (9) by means of a laser weld joint.
  3. Composite according to Claim 1 or 2, characterized in that the adhesion-promoting layer (7) has a thickness of from 7 to 12 µm.
  4. Composite according to Claim 1, 2 or 3, characterized in that the metal layer (9) has a thickness of from 25 to 60 µm.
  5. Composite according to any of Claims 1 to 4, characterized in that the adhesion-promoting layer (7) in its initial state comprises metal particles as pulverulent metal and/or metal spangles.
  6. Composite according to any of Claims 1 to 5, characterized in that the metallic connecting piece (11) is a foil, a lamella, a wire or a clip.
  7. Composite according to Claim 6, characterized in that the thickness of the metallic connecting piece (11) is between 10 and 300 µm.
  8. Composite according to any of Claims 1 to 7, characterized in that the adhesion-promoting layer (7) and/or the metal layer (9) comprises at least one noble metal, preferably platinum.
  9. Composite according to any of Claims 1 to 8, characterized in that the connecting piece (11) consists of a corrosion-resistant material.
  10. Composite according to any of Claims 1 to 9, characterized in that the ceramic substrate (5) comprises glass and/or glass ceramic in small amounts.
  11. Use of a composite according to any of Claims 1 to 10 in a hot exhaust gas from internal combustion engines as an electrical connection and/or mechanical fastening for a ceramic substrate (5) of a sensor, preferably a lambda probe.
  12. Process for the production of an electrically conducting connection between a metallic connecting piece (11) and a metal layer (9) which is connected to a ceramic substrate (5) by sintering and comprises at least one metal and to which the connecting piece (11) is welded, a glass and/or glass ceramic as well as an adhesion-promoting layer (7) comprising metal particles being applied to the ceramic substrate (5) by the thick-film technique and then being sintered on and/or fused on, the metal layer (9) being applied to the adhesion-promoting layer (7) by the thick-film technique and being sintered on, the adhesion-promoting layer (7) having a thickness of from 5 to 15 µm and the metal layer (9) having a thickness of from 20 to 100 µm, based in each case on the finished electrically conducting connection, and the connecting piece (11) being welded thereon, preferably by laser welding.
  13. Process according to Claim 12, characterized in that the ceramic substrate (5) comprises glass and/or glass ceramic in small amounts.
  14. Process according to Claim 12 or 13, characterized in that the metal layer (9) is applied to the adhesion-promoting layer (7) and the two layers are then sintered together.
  15. Process according to any of Claims 12 to 14, characterized in that the adhesion-promoting layer (7) and/or the metal layer (9) are applied as a thick film by the screen printing and/or stencil printing technique.
EP95905584A 1994-01-05 1994-12-23 Electrically conductive connection Expired - Lifetime EP0797558B1 (en)

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DE4400220 1994-01-05
PCT/EP1994/004297 WO1995018777A1 (en) 1994-01-05 1994-12-23 Electrically conductive connection

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Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19523911C5 (en) * 1995-06-30 2004-07-15 Robert Bosch Gmbh Connection cable for a sensor
DE19638208C2 (en) * 1996-09-19 2000-03-23 Bosch Gmbh Robert High temperature stable electrical contacting of a sensor element and method for their production
DE19638209A1 (en) * 1996-09-19 1998-03-26 Bosch Gmbh Robert High-melting electrically conductive connection and method for its production
JP2001524252A (en) * 1997-03-21 2001-11-27 ヘレウス・エレクトロナイト・インタナショナル・エヌ・ヴィー Mineral insulated wire
DE29724000U1 (en) * 1997-09-25 1999-09-09 Heraeus Electro Nite Int Electrical sensor, in particular temperature sensor, with printed circuit board
DE19825451A1 (en) * 1998-06-06 1999-12-09 Ego Elektro Geraetebau Gmbh Ceramic support with an electrical circuit and with a connection device
US6415647B1 (en) * 1998-10-30 2002-07-09 Denso Corporation Compact structure of gas sensor and production method thereof
US6341519B1 (en) * 1998-11-06 2002-01-29 Reuter-Stokes, Inc. Gas-sensing probe for use in a combustor
JP2000241382A (en) * 1999-02-22 2000-09-08 Ngk Spark Plug Co Ltd Gas sensor
DE19911516C1 (en) * 1999-03-16 2000-09-28 Heraeus Electro Nite Int Sensor arrangement for gaseous media
US6401521B1 (en) * 1999-10-27 2002-06-11 Delphi Technologies, Inc. Method of preventing movement of a planar sensor element packaged in a mat support
DE19958762C2 (en) * 1999-12-07 2001-09-27 Heraeus Electro Nite Int Connection arrangement of a mineral-insulated pipe
DE10038001B4 (en) * 2000-08-04 2008-09-18 Balluff Gmbh sensor arrangement
US6658916B2 (en) * 2000-12-15 2003-12-09 Delphi Technologies, Inc. Oxygen sensor for multiple port applications
DE10103084B4 (en) * 2001-01-24 2006-08-03 Infineon Technologies Ag Semiconductor module and method for its production
WO2002077625A1 (en) * 2001-03-22 2002-10-03 University Of Maryland Sensor probe for measuring temperature and liquid volumetric fraction of a liquid droplet laden hot gas and method of using same
DE10127871C1 (en) * 2001-03-29 2003-03-13 Epiq Sensor Nite N V Housing used for temperature or gas sensor comprises metal plates arranged between fiber packet and connecting line vertical to longitudinal axis of support element
DE10132825A1 (en) * 2001-07-06 2003-01-30 Bosch Gmbh Robert Gas sensor for use in road vehicle has individual strands of wire joined to form single matrix in vicinity of connector and has housing, one end of which has electrical connector to insulated cable
US7128818B2 (en) * 2002-01-09 2006-10-31 General Electric Company Method and apparatus for monitoring gases in a combustion system
US6634210B1 (en) * 2002-04-17 2003-10-21 Delphi Technologies, Inc. Particulate sensor system
WO2005073717A1 (en) * 2004-01-27 2005-08-11 H2Scan Corporation Method and apparatus for thermal isolation of a gas sensor
DE102004010593B4 (en) * 2004-03-02 2012-06-28 Enotec Gmbh, Prozess- Und Umweltmesstechnik Measuring probe and method for its production
DE102004034192A1 (en) 2004-07-14 2006-02-09 Heraeus Sensor Technology Gmbh Platform chip useful in gas sensors comprises a conductor structure comprising an electrically conductive oxide and/or comprising components with durable stable resistance characteristics at high temperatures
US20060037394A1 (en) * 2004-08-20 2006-02-23 Honeywell International, Inc. High temperature sensor sleeve
US20110268975A1 (en) * 2005-01-25 2011-11-03 Massachusetts Institute Of Technology Transient Migrating Phase Low Temperature Joining of Co-Sintered Particulate Materials Including a Chemical Reaction
DE102007027491A1 (en) 2007-06-14 2008-12-18 Robert Bosch Gmbh Gas sensor for determining physical characteristic of measuring gas, particularly concentration of gas component or temperature of measuring gas, has sensor element that carries contact area
DE102007035324A1 (en) * 2007-07-27 2009-01-29 Robert Bosch Gmbh Electronic component e.g. power transistor, fastening method for e.g. reluctance, synchronous, asynchronous or commutator machine, involves utilizing power element as electronic component, which is fastened to stator of machine by sintering
US8151626B2 (en) * 2007-11-05 2012-04-10 Honeywell International Inc. System and method for sensing high temperature particulate matter
JP2009175135A (en) * 2007-12-27 2009-08-06 Yamaha Motor Co Ltd Gas sensor, and air-fuel ratio control system and transportation apparatus equipped with the same
US7966862B2 (en) 2008-01-28 2011-06-28 Honeywell International Inc. Electrode structure for particulate matter sensor
DE102008006707A1 (en) * 2008-01-30 2009-08-06 Robert Bosch Gmbh Sensor with housing, sensor module and insert
US8186051B2 (en) * 2008-03-28 2012-05-29 Intel Corporation Method for fabricating package substrate and die spacer layers having a ceramic backbone
US7644609B2 (en) * 2008-06-04 2010-01-12 Honeywell International Inc. Exhaust sensor apparatus and method
DE102008043219A1 (en) 2008-10-28 2010-04-29 Robert Bosch Gmbh Gas sensor i.e. lambda oxygen sensor, for determining e.g. concentration of oxygen in exhaust gas of internal combustion engine of motor-cycle, has mounting surface directly fixed on metal-sheathed lead in gas-proof manner
NO330346B1 (en) * 2009-07-20 2011-03-28 Sinvent As Local thermal management
DE102010020338A1 (en) * 2010-05-12 2011-11-17 Hydrometer Gmbh Housing arrangement for ultrasonic flowmeter and ultrasonic flowmeter
US8969928B2 (en) * 2010-08-31 2015-03-03 Micron Technology, Inc. Transistors having a control gate and one or more conductive structures
US9980384B2 (en) * 2012-06-21 2018-05-22 Kyocera Corporation Circuit board and electronic apparatus including the same
JP6017401B2 (en) * 2013-11-05 2016-11-02 愛三工業株式会社 Rotation angle detection sensor
DE102014114808B4 (en) * 2014-10-13 2018-03-08 Infineon Technologies Ag Electronic module and method for producing an electronic module
JP6641079B2 (en) * 2014-10-29 2020-02-05 タツタ電線株式会社 Printed circuit board manufacturing method and conductive member joining method
KR101597302B1 (en) 2014-12-17 2016-02-24 주식회사 동양센서 Temperature sensor and method of manufacturing thereof
US20170299545A1 (en) * 2016-04-19 2017-10-19 Tyco Electronics Corporation Sensor package having an electrical contact
WO2018016482A1 (en) * 2016-07-19 2018-01-25 日本特殊陶業株式会社 Gas sensor
KR102511323B1 (en) 2021-06-09 2023-03-17 주식회사 코멧센서 Laser welding method and temperature sensor manufacturing method using the same

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2523691A (en) * 1949-06-21 1950-09-26 Nat Fitch Corp Combined thermometer and sampling unit
DE1022957B (en) * 1952-11-26 1958-01-16 Gulton Mfg Corp Process for producing a flat, electrically conductive connection between a metallic and a ceramic workpiece
US2996401A (en) * 1955-09-30 1961-08-15 Eitel Mccullough Inc Method of making ceramic structures for electron tubes
US3154503A (en) * 1961-01-12 1964-10-27 Int Resistance Co Resistance material and resistor made therefrom
NL294370A (en) * 1963-06-20
US3523357A (en) * 1967-12-14 1970-08-11 Sylvania Electric Prod Electrical contact material and method of making and utilizing the same
US3824368A (en) * 1971-12-30 1974-07-16 Avco Corp Laser welding
JPS5119592A (en) * 1974-08-09 1976-02-16 Nissan Motor Gasunodo kenshutsuki
JPS52100287A (en) * 1976-02-19 1977-08-23 Nissan Motor Oxygen concentration detector
US4058789A (en) * 1976-04-05 1977-11-15 The Carborundum Company Electrical connector
DE2702578A1 (en) * 1977-01-22 1978-07-27 Bosch Gmbh Robert ELECTROCHEMICAL SENSOR FOR DETERMINING THE OXYGEN CONTENT IN EXHAUST GASES, IN PARTICULAR EXHAUST GASES FROM COMBUSTION ENGINES
GB1595421A (en) * 1977-04-12 1981-08-12 Lucas Industries Ltd Device for minitoring the composition of the exhaust emission of a combustion process
US4230930A (en) * 1979-01-25 1980-10-28 Ford Motor Company Laser welding method for electrical wire connection to a terminal pin of an exhaust gas sensor
JPS5613745U (en) * 1979-07-12 1981-02-05
DE3109101C2 (en) * 1981-03-10 1984-02-23 Franz 8359 Ortenburg Frischen Process for the manufacture of electrical cables
US4512827A (en) * 1981-09-21 1985-04-23 Associated Electrical Industries Limited Method of manufacturing mineral insulated electric cable and like elements
DE3247338A1 (en) * 1982-12-21 1984-06-28 Siemens AG, 1000 Berlin und 8000 München METHOD FOR LASER SOLDERING FLEXIBLE WIRING
US4569817A (en) * 1983-05-17 1986-02-11 Westinghouse Electric Corp. Miniature fission chamber and signal cable assembly
DE3562953D1 (en) * 1984-02-20 1988-06-30 Pio Meyer Sample taking device
US4750062A (en) * 1984-04-19 1988-06-07 Alpine Electronics Ltd. Rotatable tape loading device in a magnetic tape recorder-reproducer apparatus
JPS60226464A (en) * 1984-04-20 1985-11-11 日本特殊陶業株式会社 Joint structure of ceramic and metal
DE3427207A1 (en) * 1984-07-24 1986-02-06 Hotset Heizpatronen und Zubehör GmbH, 5880 Lüdenscheid LADDER CONNECTING DEVICE ON AN ELECTRIC CARTRIDGE RADIATOR
JPH0719643B2 (en) * 1984-10-26 1995-03-06 日本電装株式会社 Ceramic heater and method for producing the same
FR2575321B1 (en) * 1984-12-21 1988-01-15 Thermocoax Cie ARMORED CABLE WITH MINERAL INSULATION
US4883643A (en) * 1985-06-20 1989-11-28 Ngk Spark Plug Co., Ltd. Oxygen sensor protected against contaminants
JPS62163961A (en) * 1986-01-16 1987-07-20 Fujikura Ltd Oxygen sensor element
US4713520A (en) * 1986-03-24 1987-12-15 Tektronix, Inc. Method and apparatus for interconnecting and hermetically sealing ceramic components
US4742717A (en) * 1986-09-16 1988-05-10 Kaijo Denki Co., Ltd. Gas flow rate measuring device
US4978052A (en) * 1986-11-07 1990-12-18 Olin Corporation Semiconductor die attach system
EP0277645A1 (en) * 1987-02-02 1988-08-10 Sumitomo Electric Industries Limited Ceramics-metal jointed body
US4750256A (en) * 1987-04-13 1988-06-14 Allied Corporation Method of assembly of an O2 sensor
FR2636737B1 (en) * 1988-09-16 1993-12-03 Thomson Csf RESISTIVE TYPE SENSOR FOR MEASURING RELATIVE CONCENTRATIONS OF FLUID REACTIVE SPECIES, TEMPERATURE COMPENSATED
JPH02146364U (en) * 1989-05-15 1990-12-12
DE59107034D1 (en) * 1990-10-26 1996-01-18 Bosch Gmbh Robert GAS DETECTORS, ESPECIALLY FOR DETERMINING THE OXYGEN CONTENT IN EXHAUST GASES FROM COMBUSTION ENGINES.
US5171517A (en) * 1990-12-10 1992-12-15 General Electric Company Method for monitoring corrosion on a member in a nuclear reactor core
US5108025A (en) * 1991-05-20 1992-04-28 Gte Laboratories Incorporated Ceramic-metal composite article and joining method
DE4204850A1 (en) * 1992-02-18 1993-08-19 Roth Technik Gmbh HOUSING FOR A GAS SENSOR
US5306891A (en) * 1992-04-02 1994-04-26 Motorola, Inc. Laser welding process for attaching metal to ceramic substrate
US5329806A (en) * 1993-05-11 1994-07-19 General Motors Corporation Exhaust sensor with tubular shell
DE4415938C2 (en) * 1994-05-05 2000-02-24 Heraeus Electro Nite Int Gas sensor
US5536478A (en) * 1994-12-01 1996-07-16 Corning Incorporated Electrical leads for a fluid heaters

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DE29522062U1 (en) 1999-07-15
WO1995018777A1 (en) 1995-07-13
EP0797558A1 (en) 1997-10-01
DE59510271D1 (en) 2002-08-14
EP0738385B1 (en) 2002-07-10
EP0738385A1 (en) 1996-10-23
US6055847A (en) 2000-05-02
US5730543A (en) 1998-03-24
DE29521966U1 (en) 1999-02-11
JPH10505406A (en) 1998-05-26
US6067843A (en) 2000-05-30
WO1995018965A1 (en) 1995-07-13
DE59409959D1 (en) 2001-12-20
US6158268A (en) 2000-12-12

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