EP0783773B1 - Oberflächenmontierter richtungskoppler - Google Patents

Oberflächenmontierter richtungskoppler Download PDF

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Publication number
EP0783773B1
EP0783773B1 EP96924332A EP96924332A EP0783773B1 EP 0783773 B1 EP0783773 B1 EP 0783773B1 EP 96924332 A EP96924332 A EP 96924332A EP 96924332 A EP96924332 A EP 96924332A EP 0783773 B1 EP0783773 B1 EP 0783773B1
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EP
European Patent Office
Prior art keywords
interdigital
electrically conductive
coupler
conductive elements
directional coupler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP96924332A
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English (en)
French (fr)
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EP0783773A1 (de
Inventor
Michael J. Culling
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Harris Corp
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Harris Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
    • H01P5/185—Edge coupled lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
    • H01P5/187—Broadside coupled lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Definitions

  • the present invention relates to a microwave directional coupler, and specifically to such a coupler having interdigital coupling line elements disposed on opposing sides of a dielectric substrate which determine the even and odd mode impedances of the coupler independent of the parent circuit board on which the coupler is mounted.
  • a microwave directional coupler is a four port microwave device used as a power divider or combiner.
  • the four ports are designed Port 1, Port 2, Port 3, and Port 4.
  • Port 1 When a signal is input to Port 1, it is coupled into Ports 2 and 3 but not into Port 4.
  • a signal input to Port 4 is similarly coupled into Ports 2 and 3 but not into Port 1. Because there is no coupling between Ports 1 and 4, these ports are known as uncoupled or isolated ports relative to each other. Signals may also be input, or result from reflections, in Ports 2 and 3.
  • a signal input to Port 2 is coupled to Ports 1 and 4 but not to Port 3, while a signal input to Part 3 is coupled to Ports 1 and 4 but not to Port 2.
  • Parts 2 and 3 are isolated ports relative to each other.
  • a typical application for a directional coupler is in a radar system for monitoring transmitter power.
  • the radar transmitter is connected to Port 1 of the directional coupler.
  • the antenna is then connected to Port 2, a microwave power detector to Port 3, and Port 4 is terminated in a matched load.
  • Port 2 and 3 are isolated ports and a signal input to Port 2 is not coupled to Port 3.
  • a microstrip directional coupler is disclosed in the specification of U.S. Patent No. 4,823,097.
  • the coupler comprises a first dielectric board which stands erect on the upper surface of a parent dielectric board.
  • a coupling line part is disposed on each side of the first dielectric board.
  • Lead lines are disposed on the upper surface of the parent dielectric board and are connected to both ends of each coupling line part.
  • a ground plane is formed by a conductive layer disposed on the lower surface of the parent dielectric board.
  • the design of the coupler requires knowledge and consideration of the type of parent dielectric board on which the first dielectric board will be mounted.
  • microstrip directional coupler is disclosed in the specification of U.S. Patent No.5,373,266.
  • This coupler is comprised of a pair of microstrip coupling elements having remote edges which are straight and adjacent edges which follow curved paths having reversals in curvature such as sinusoidal or half circle patterns.
  • the coupling elements are disposed on one surface of a dielectric substrate.
  • a ground plane conducting layer is disposed on the opposite surface of the dielectric substrate.
  • the even mode impedance is formed by coupling between the straight remote edges of the microstrip coupling elements and the ground plane. Therefore, the composition and physical dimensions of the single dielectric substrate affect the coupler even mode impedance and thus the coupler design.
  • a directional coupler including comb electrodes having an elongated bus bar with a plurality of spaced teeth is disclosed in the specification of U.S. Patent No. 4,394,630.
  • a first comb electrode is disposed on one side of a dielectric substrate and a second comb electrode is disposed on the other side of the dielectric substrate.
  • a generally rectangular hollow conductor encases and supports the dielectric substrate.
  • a filling material having predetermined dielectric characteristics is used to fill the volume between the one side of the dielectric substrate and the adjacent side of the hollow rectangular conductor.
  • a filling material is used to fill the volume between the other side of the dielectric substrate and the adjacent side of the hollow rectangular conductor.
  • the even and odd mode impedances of the coupler are determined by the composition and physical dimensions of both the dielectric substrate and the filling material.
  • a drawback common to these prior art couplers is that the conductor line patterns which form the coupling elements are required to be printed on the parent printed circuit board containing the other peripheral electronic circuitry.
  • a further disadvantage in prior art couplers is where coupling is produced from structures having mixed dielectrics or where the fields are contained in media having different permittivity values.
  • the different permittivity values produce differing phase velocities of the fields which result in non-optimum coupler directivity.
  • end effects are so called "end effects", where discontinuities occur between the unbalanced feed connections and the balanced coupled lines.
  • the present invention includes a microwave directional coupler comprising:
  • the invention also includes a microwave directional coupler as specified above wherein said lower interdigital electrically conductive elements having a straight bottom edge and a top edge having a plurality of teeth disposed thereon with the teeth interdigitated with the teeth disposed on the respective bottom edges of said upper interdigital electrically conductive elements.
  • the present invention is directed to a microwave directional coupler which is mounted to a parent circuit board.
  • the coupler comprises a coupler dielectric board which is mounted substantially perpendicular to the surface of the parent circuit board.
  • Upper interdigital elements are disposed on opposing surfaces of the coupler dielectric board. Electrical coupling between the upper interdigital elements determines the odd mode impedance Z 00 of the microwave directional coupler.
  • Lower interdigital elements are also disposed on opposing surfaces of the coupler dielectric board. The lower interdigital elements are connected to ground and are arranged so that electrical coupling between the lower interdigital elements and the upper interdigital elements determines the even mode impedance Z oe of the microwave directional coupler.
  • a microwave directional coupler 20 in accordance with the present invention is shown in Figs. 1-3.
  • the coupler 20 includes a coupler dielectric board 22 having planar surfaces 22a and 22b.
  • the coupler 20 is mounted on a parent circuit board 24 having planar surfaces 24a and 24b.
  • the coupler 20 is mounted with its planar surfaces 22a and 22b normal to the planar surfaces 24a and 24b of the parent circuit board 24.
  • other peripheral circuitry associated with the circuit in which the coupler 20 is being used is also mounted on the parent circuit board 24.
  • the coupler 20 includes interdigitated coupling elements 26 and 28 disposed on surfaces 22a and 22b, respectively.
  • the interdigitated coupling element 26 includes an upper interdigital element 26a and a lower interdigital element 26b.
  • the upper interdigital element 26a comprises two side sections 30 and 32 each connected to one end of a longitudinal section 34 having a predetermined length and width.
  • the longitudinal section 34 has a straight upper edge 36 and a lower edge 38 having teeth 40. Interdigitated with the teeth 40 are teeth 42 formed on an upper edge 44 of the lower interdigital element 26b.
  • Interdigitated coupling element 28 is symmetrically disposed on the planar surface 22b.
  • the interdigitated coupling element 28 includes an upper interdigital element 28a and a lower interdigital element 28b.
  • the upper interdigital element 28a comprises two side sections 46 and 48 each connected to one end of a longitudinal section 50 having a predetermined length and width.
  • the longitudinal section 50 has a straight upper edge 52 and a lower edge 54 having teeth 56. Interdigitated with the teeth 56 are teeth 58 formed on an upper edge 60 of the lower interdigital element 28b.
  • the coupling elements 26 and 28 are shown and described as being symmetrical, this need not be true.
  • the widths of the upper interdigital elements 26a and 28a can be different to adjust the desired coupling factor of the coupler 20.
  • the lengths of both the upper interdigital elements 26a and 28a and the lower interdigital elements 26b and 28b (shown as W2 in Fig. 2) are also adjusted. These lengths are scaled as a function of the desired operating frequency of the coupler 20.
  • the interdigitated coupling elements 26 and 28 are formed by etching the surfaces of the coupler dielectric board 22 in accordance with photographic masters which have been produced to a very high degree of accuracy. Prior to etching, the surface of the coupler dielectric board 22 is covered on its planar surfaces 22a and 22b by a layer of rolled or electro-deposited copper film. Registration marks added to the photographhic masters ensure a high degree of back-to-front registration of the patterns.
  • conductive traces which must be disposed on the parent circuit board 24 to facilitate the mounting of the coupler 20.
  • On the planar surface 24a of the parent circuit board 24 are disposed four conductive traces 62, 64, 66, and 68.
  • the traces 62, 64, 66, and 68 provide direct connection to the sections 30, 32, 46, and 48, respectively, with minimal end effects. This provides good impedance matching between a conductive trace and its associated side section.
  • two ground planes 70 and 72 are also disposed on the planar surface 24a of the parent circuit board 24.
  • the ground planes 70 and 72 are made the same width W2 as the lower interdigital coupling elements 26b and 28b.
  • a lower ground plane 74 is disposed on the planar surface 24b of the parent circuit board 24.
  • Each ground plane 70 and 72 is connected to this lower ground plane 74 by a plurality of vias 76.
  • the lower ground plane 74 is connected to system ground potential, and the vias 76 result in the ground planes 70 and 72 also being at system ground potential.
  • the directional coupler 20 is connected to the parent circuit board 24 by soldering the conductor traces disposed on the coupler dielectric board 22 to those disposed on the parent circuit board.
  • the side sections 30 and32 are soldered at lower edge 78 of the coupler dielectric board 22 to the conductive traces 62 and 64, respectively.
  • the side sections 46 and 48 are likewise soldered at lower edge 78 to the conductive traces 66 and 68, respectively.
  • the lower interdigitall coupling element 26b is soldered at lower edge 78 to the ground plane 70 while the lower interdigital coupling element 28b is soldered at lower edge 78 to the ground plane 72. All these solder connections form fillet solder joints 80. Other methods such as a suitable conductive adhesive may be used in place of the fillet solder joints 80.
  • mounting pegs 82 and 84 Proper mechanical alignment of the coupler dielectric board 22 during soldering or other means of connection is accomplished by the use of mounting pegs 82 and 84. Each of the mounting pegs 82 and 84 fits into an associated mounting hole (not shown) on the parent circuit board 24.
  • the use of the mounting pegs 82 and 84 for alignment, and the use of fillet solder joints 80 for mechanical and electrical connection should be easily automated using known "pick-and-place" assembly techniques.
  • the electrical characteristics of the directional coupler 20 are determinned by the coupling factor C of the coupler.
  • an even mode impedance designated Z oe exists between each element and ground.
  • an odd mode impedance designated Z oo exists between each element and ground.
  • Equations (1) and (2) show the functional relationship between the coupling factor C and the even and odd mode impedances Z oe and Z oo .
  • a desired coupling factor C is selected (e.g., 3 dB).
  • equations (1) and (2) yield the even and odd mode impedance Z oe and Z oo . required to achieve that coupling factor.
  • Equations (1) and (2) assume the phase velocities of the waves associated with both the even and odd mode impedances Z oe and Z oo are equal. When these phase velocities are not equal, the specific phase velocity of each mode must be used to determine the associated impedance. If not, the bandwidth and directivity of the directional coupler are adversely affected by the differing phase velocities.
  • Figs. 5 and 6 illustrate the cause of the differing phase velocities.
  • the effective permittivity ' ⁇ eff is somewhere in between the permittivity of free space ⁇ o and the relative permittiivity ⁇ r of the dielectric board 22.
  • the effective permittivity ⁇ eff for the even mode impedance Z oe is different than that for odd mode impedance Z oo as illustrated in Fig. 6.
  • the electric field 90 associated with the odd mode impedance Z oo primarily propagates in the dielectric board 22 and will accordingly have an effective permittivity ⁇ eff which is closer to the relative permittivity ⁇ r of the dielectric board.
  • Z oo 1/(V po x C oo )
  • Z oe 1/(V pe x C oe )
  • V po is the phase velocity associated with the odd mode impedance Z oo
  • V pe the phase velocity associated with the even mode impedance Z oe
  • C oo the effective capacitance per unit length of one line to ground for the odd mode impedance
  • C oe the effective capacitance per unit length of one line to ground for the even mode impedance.
  • the present invention compensates for the differing phase velocities by equalizing the. propagation delays of each mode.
  • the wave associated with the even mode impedance Z OE is caused to meander around the gap created by the teeth 40, 42, 56, and 58 forming the interdigitated patterns.
  • the propagation delay to the wave associated with the even mode impedance Z OE is a function of the number or periodicity of the teeth.
  • equations (4) and (5) cannot be used directly to determine Z OO and Z OE since the phase velocities V PO and V PE cannot be easily measured. Instead, the capacitances C OO and C OE must be determined by modeling, mapping, measuring, or calcutlating. Thereafter, the determined capacitances C OO and C OE are used to approximate the odd and even impedances Z OO and Z OE . The phase velocities are then adjusted by varying the physical layout of the interdigitated pattern until the required Z OO and Z OE are realized to obtain the desired coupling factor C.
  • the coupler dielectric board 22 in this embodiment was made from a woven glass/PTFE composite.
  • Figs. 7 to 9 The test results of the preferred embodimentare shown in Figs. 7 to 9.
  • lines 92 and 94 are plots which show the output from Ports 2 and 3, respectively, when a signal is input to Port 1 and Port 4 is determined in a matched load.
  • the vertical axis represents power, with each vertical division being 1 dB.
  • the horizontal axis represents frequency and goes from 450 Mhz to 950 Mhz.
  • the arrow 96 shows the falf power or -3 dB reference level. Over the entire 500 Mhz freqeuncy range, the graph of Fig. 7 shows good performance of the coupler20.
  • the power input to Port 1 is coupled approximately one half into Port 2 and one half into Port 3.
  • the power in Port 3 is approximately -2.76 dB while the power in Port 2 is approximately -3.45 dB.
  • Fig. 8 shows that the coupler 20 exhibits good input return loss.
  • the vertical axis once again represents power and the horizontal axis frequency.
  • Each vertical divisio represents 10 dB and the arrow 100 is the 0 dB reference level.
  • the line 102 is a plot of reflected power resulting from an input signal into one of the coupler 20 ports when the other three ports are terminated in matched loads. Ideally, the reflected power should be zero with this configuration. Over the entire frequency range, the line 102 shows the reflected power is at a level of approximately -25 dB or less. At the center frequency of 700 Mhz, the reflected power level is -27.917 dB as shown by the arrow 104.
  • Fig. 9 shows that the coupler 20 exhibits good isolation and therefore directivity over the relevant frequency range.
  • the vertical axis is again power with each vertical division being 10 dB.
  • the horizontal axis is again frequency.
  • the arrow 106 is the 0 dB reference level.
  • the line 108 is a plot of the power output from Port 4 when a signal is input to Port 1 and Ports 2 and 3 are terminated in matched loads. Recall that ideally Ports 1 and 4 are isolated, meaning that no power is coupled from Port 1 to Port 4 (i.e., infinite directivity).
  • the power in Port 4 is at approximately -47.015 dB.
  • line 108 shows the power in Port 4 is at a level of -38 dB or less, which is excellent isolation and directivity for such a coupler.
  • a microwave directional coupler comprises a coupler dielectric board which is mounted substantially perpendicular to the surface of a parent circuit board.
  • Upper interdigital elements are disposed on opposing surfaces of the coupler dielectric board. The coupling between the upper interdigital elements determines the odd mode impedance Z oo of the microwave directional coupler.
  • Lower interdigital elements are also disposed on opposing surfaces of the coupler dielectric board. The lower interdigital elements are connected to ground and are arranged so that coupling between the lower interdigital elements and the upper interdigital elements determines the even mode impedance Z oe of the microwave directional coupler.

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  • Structure Of Printed Boards (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)
  • Paper (AREA)
  • Combinations Of Printed Boards (AREA)
  • Waveguide Switches, Polarizers, And Phase Shifters (AREA)

Claims (10)

  1. Ein Mikrowellen-Richtungskoppler, der umfaßt:
    Eine Trägerleiterplatte, die einander gegenüberliegende Oberflächen aufweist;
    eine dielektrische Kopplerplatine, die einander gegenüberliegende Oberflächen aufweist und mit den einander gegenüberliegenden Oberflächen im wesentlichen senkrecht stehend auf einer der einander gegenüberliegenden Oberflächen der Trägerleiterplatte montiert ist;
    erste und zweite obere, elektrisch leitende Doppelkamm-Elemente, die entsprechend auf den einander gegenüberliegenden Oberflächen der dielektrischen Kopplerleiterplatte angeordnet sind, wobei die oberen elektrisch leitenden Doppelkamm-Elemente zusammengekoppelt sind, um zu bewirken, daß der Koppler eine ungeradzahlige Impedanz zeigt, die eine Funktion des Koppelns ist; und
    erste und zweite untere elektrisch leitende Doppelkamm-Elemente entsprechend auf den einander gegenüberliegenden Oberflächen der dielektrischen Kopplerleiterplatte angeordnet sind, wobei jedes der unteren elektrisch leitenden Doppelkamm-Elemente beabstandet von dem entsprechenden oberen elektrisch leitenden Doppelkamm-Element angeordnet ist, die unteren elektrisch leitenden Doppelkamm-Elemente und die oberen elektrisch leitenden Doppelkamm-Elemente elektrisch zusammengekoppelt sind, um zu bewirken, daß der Koppler eine geradzahlige Impedanz zeigt, die eine Funktion des Koppelns zwischen den unteren elektrisch leitenden Doppelkamm-Elementen und den oberen elektrisch leitenden Doppelkamm-Elementen ist.
  2. Ein Mikrowellen-Richtungskoppler gemäß Anspruch 1, in dem die ersten und die zweiten oberen elektrisch leitenden Doppelkamm-Elemente symmetrisch sind, und in dem die ersten und die zweiten unteren elektrisch leitenden Doppelkamm-Elemente symmetrisch sind.
  3. Ein Mikrowellen-Richtungskoppler gemäß Anspruch 1 oder Anspruch 2, in dem die dielektrische Kopplerleiterplatte eine Dielektrizitätskonstante ∈ r aufweist und die Trägerleiterplatte eine Dielektrizitätskonstante ∈ aufweist, und die Werte der Dielektrizitätskonstanten ∈ r und ∈ nicht gleich sind.
  4. Ein Mikrowellen-Richtungskoppler gemäß einem beliebigen der Ansprüche 1 bis 3, einschließlich Mittel zum elektrischen Anschließen der ersten und der zweiten unteren elektrisch leitenden Doppelkamm-Elemente an das Massepotential, und in dem vorzugsweise die ersten und die zweiten oberen elektrisch leitenden Doppelkamm-Elemente nicht gleich breit sind.
  5. Ein Mikrowellen-Richtungskoppler gemäß einem beliebigen der Ansprüche 1 bis 4, der eine gewünschte Betriebsfrequenz hat, und in dem die ersten und die zweiten oberen und unteren elektrisch leitenden Doppelkamm-Elemente Längen aufweisen, die als Funktion der gewünschten Betriebsfrequenz skaliert sind.
  6. Ein Mikrowellen-Richtungskoppler gemäß Anspruch 1, in dem die oberen elektrisch leitenden Doppelkamm-Elemente eine gerade obere Kante und eine untere Kante mit einer Vielzahl darauf angeordneter Zähne aufweisen, die unteren elektrisch leitenden Doppelkamm-Elemente eine gerade untere Kante und eine obere Kante mit einer Vielzahl von darauf angeordneten Zähnen aufweisen, wobei die Zähne zwischen die Zähne auf den entsprechenden unteren Kanten der oberen elektrisch leitenden Doppelkamm-Elemente eingeschoben angeordnet sind.
  7. Ein Mikrowellen-Richtungskoppler gemäß Anspruch 6, in dem die Anzahl der auf der unteren Kante der oberen elektrisch leitenden Doppelkamm-Elemente angeordneten Zähne eine gerade Zahl ist, und in dem vorzugsweise die Anzahl der auf der oberen Kante der unteren elektrisch leitenden Doppelkamm-Elemente angeordneten Zähne eine ungerade Zahl ist.
  8. Ein Mikrowellen-Richtungskoppler gemäß Anspruch 6, in dem in dem die ersten und die zweiten oberen elektrisch leitenden Doppelkamm-Elemente symmetrisch sind, und in dem die ersten und die zweiten unteren elektrisch leitenden Doppelkamm-Elemente symmetrisch sind.
  9. Ein Mikrowellen-Richtungskoppler gemäß einem beliebigen der Ansprüche 6 bis 8, in dem die dielektrische Kopplerleiterplatte eine Dielektrizitätskonstante ∈r aufweist und die Trägerleiterplatte eine Dielektrizitätskonstante ∈ aufweist, und die Werte der Dielektrizitätskonstanten ∈r und ∈ nicht gleich sind.
  10. Ein Mikrowellen-Richtungskoppler gemäß einem beliebigen der Ansprüche 6 bis 9, einschließlich Mittel zum elektrischen Anschließen der ersten und der zweiten unteren elektrisch leitenden Doppelkamm-Elemente an Masse-Potential.
EP96924332A 1995-06-30 1996-07-01 Oberflächenmontierter richtungskoppler Expired - Lifetime EP0783773B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US497237 1995-06-30
US08/497,237 US5539362A (en) 1995-06-30 1995-06-30 Surface mounted directional coupler
PCT/US1996/011150 WO1997002620A1 (en) 1995-06-30 1996-07-01 Surface mounted directional coupler

Publications (2)

Publication Number Publication Date
EP0783773A1 EP0783773A1 (de) 1997-07-16
EP0783773B1 true EP0783773B1 (de) 2002-09-25

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US (1) US5539362A (de)
EP (1) EP0783773B1 (de)
AT (1) ATE225083T1 (de)
CA (1) CA2202364C (de)
DE (1) DE69623921T2 (de)
WO (1) WO1997002620A1 (de)

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US6664932B2 (en) * 2000-01-12 2003-12-16 Emag Technologies, Inc. Multifunction antenna for wireless and telematic applications
US6549089B2 (en) * 2001-07-13 2003-04-15 Filtronic Pty Ltd. Microstrip directional coupler loaded by a pair of inductive stubs
US6590472B2 (en) 2001-08-17 2003-07-08 Harris Corporation Surface mounted broadside directional coupler
US6903625B2 (en) * 2003-10-16 2005-06-07 Northrop Grumman Corporation Microstrip RF signal combiner
KR100706211B1 (ko) 2005-12-19 2007-04-12 삼성전자주식회사 전송구조 변환장치
JP4729464B2 (ja) * 2006-09-20 2011-07-20 ルネサスエレクトロニクス株式会社 方向性結合器および高周波回路モジュール
JP2011053354A (ja) * 2009-08-31 2011-03-17 Toshiba Corp 光電気配線フィルムおよび光電気配線モジュール
DE102013214818A1 (de) * 2013-04-29 2014-10-30 Rohde & Schwarz Gmbh & Co. Kg Gekoppeltes Leitungssystem mit steuerbarem Übertragungsverhalten
WO2020198455A1 (en) * 2019-03-26 2020-10-01 The Trustees Of Indiana University High-throughput acoustofluidic fabrication of cell spheroids

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US4394630A (en) * 1981-09-28 1983-07-19 General Electric Company Compensated directional coupler
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US5373266A (en) * 1993-11-09 1994-12-13 The United States Of America As Represented By The Secreatry Of The Army Microstrip directional coupler
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WO1997002620A1 (en) 1997-01-23
DE69623921T2 (de) 2003-05-15
CA2202364A1 (en) 1997-01-23
CA2202364C (en) 2008-03-04
US5539362A (en) 1996-07-23
ATE225083T1 (de) 2002-10-15
DE69623921D1 (de) 2002-10-31
EP0783773A1 (de) 1997-07-16

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