EP0737760B1 - Platinum electroplating bath - Google Patents
Platinum electroplating bath Download PDFInfo
- Publication number
- EP0737760B1 EP0737760B1 EP96102799A EP96102799A EP0737760B1 EP 0737760 B1 EP0737760 B1 EP 0737760B1 EP 96102799 A EP96102799 A EP 96102799A EP 96102799 A EP96102799 A EP 96102799A EP 0737760 B1 EP0737760 B1 EP 0737760B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- acid
- platinum
- electroplating bath
- complex
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title claims description 57
- 229910052697 platinum Inorganic materials 0.000 title claims description 29
- 238000009713 electroplating Methods 0.000 title claims 5
- 239000002253 acid Substances 0.000 claims description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 7
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 claims description 7
- 239000003792 electrolyte Substances 0.000 claims description 6
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims description 6
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims description 5
- 239000000080 wetting agent Substances 0.000 claims description 2
- 125000001153 fluoro group Chemical group F* 0.000 claims 1
- 235000011149 sulphuric acid Nutrition 0.000 claims 1
- 239000001117 sulphuric acid Substances 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
- 230000008021 deposition Effects 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 5
- 239000000243 solution Substances 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 150000001447 alkali salts Chemical class 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 229940098779 methanesulfonic acid Drugs 0.000 description 2
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 2
- -1 platinum amine Chemical class 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- GKNWQHIXXANPTN-UHFFFAOYSA-N 1,1,2,2,2-pentafluoroethanesulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)F GKNWQHIXXANPTN-UHFFFAOYSA-N 0.000 description 1
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- JKPSQSMDEZAAQY-UHFFFAOYSA-N [Pt+2].[Pt+4] Chemical class [Pt+2].[Pt+4] JKPSQSMDEZAAQY-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- ABDBNWQRPYOPDF-UHFFFAOYSA-N carbonofluoridic acid Chemical class OC(F)=O ABDBNWQRPYOPDF-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 1
- UQSQSQZYBQSBJZ-UHFFFAOYSA-N fluorosulfonic acid Chemical compound OS(F)(=O)=O UQSQSQZYBQSBJZ-UHFFFAOYSA-N 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- OPUAWDUYWRUIIL-UHFFFAOYSA-N methanedisulfonic acid Chemical compound OS(=O)(=O)CS(O)(=O)=O OPUAWDUYWRUIIL-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000003058 platinum compounds Chemical class 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 1
- VYECFMCAAHMRNW-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O.NS(O)(=O)=O VYECFMCAAHMRNW-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
Definitions
- the invention relates to a galvanic platinum bath, especially for the deposition of thick layers, the 5 to 30 Contains g / l of platinum as an amine sulfamato complex and a pH value less than 1.
- Electrodeposition of platinum acidic and alkaline baths based on platinum (II) - and Platinum (IV) compounds are used.
- the main types of bath contain diamminodinitritoplatinum (II) (P salt), Sulfatodinitritoplatinic acid (DNA) or Hexahydroxoplatinic acid, or its alkali salts.
- the types of baths mentioned are mainly only suitable for Deposition of thin platinum layers of a few ⁇ m.
- the Deposition of thick layers for technical applications a general problem with platinum. Either the layers have high internal tensions, become cracked and burst even on, or the electrolytes are insufficient stable and decompose during the long electrolysis times relatively quickly.
- From DE-PS 11 82 924 is an acid bath for galvanic Deposition of platinum coatings known from a aqueous solution of a complex dinitroplatinate (II) compound exists and has a pH below 2.
- complex platinum compound can also Dinitrosulfamato complex can be used. After own Information can only be obtained with these platinum baths Layer thicknesses up to 25 ⁇ m. Layers over 25 ⁇ m tend to Tear and are therefore not suitable for many applications.
- the P salt is reacted with a large excess of sulfamic acid, NH 2 SO 3 H, so that a diluted bath with 6-20 g / l platinum and 20 Contains -100 g / l sulfamic acid (amidosulfuric acid).
- this electrolyte is only stable as long as the bath is in operation. Thick layers can only be obtained without cracks with a matt surface.
- Galvanic platinum bath especially for thicker deposition Develop layers that are 5 to 30 g / l platinum Contains amminsulfamato complex and a pH of has less than 1, with which also layer thicknesses over 100 ⁇ m can be deposited without cracks, smooth and shiny and that is stable even when not in use.
- Electrolyte at most 5 g / l free amidosulfuric acid (Sulfamic acid) and 20 to 400 g / l of a strong acid contains a pH of less than 1.
- the strong acid is sulfuric acid, Methanesulfonic acid or perchloric acid used.
- Besides can also use other mineral acids, such as fluorosulfuric acid or fluoroboric acid, alkanesulfonic acids, such as Methane disulfonic acid, ethanesulfonic acid, Hydroxiethan sulfonic acid and homologues, or perfluorinated Alkanesulfonic acids, such as trifluoromethanesulfonic acid or Pentafluoroethanesulfonic acid, and perfluorocarboxylic acids, such as Trifluoroacetic acid can be used.
- mineral acids such as fluorosulfuric acid or fluoroboric acid
- alkanesulfonic acids such as Methane disulfonic acid, ethanesulfonic acid, Hydroxiethan sulfonic acid and homologues
- perfluorinated Alkanesulfonic acids such as trifluoromethanesulf
- electrolyte is additional Contains 0.01 to 0.2 g / l of a fluorosurfactant as a wetting agent.
- amminsulfamato complex Product from the reaction of 1 mol of P salt (Platinum diamminodinitrito complex) with 4 to 6 mol Amidosulfuric acid is used.
- the bath may also contain 0.01-0.2 g / l of a fluorosurfactant to suppress spray. It is operated at a temperature between 60 and 90 ° C and at current densities of 1-4 A / dm 2 .
- the platinum amine sulfamato complex solution was found in the strongly acidic bath without free amidosulfuric acid as surprisingly stable.
- the bathroom showed even with long ones Electrolysis times no precipitation. In the Separation of the platinum liberated sulfamate becomes rapid does not hydrolyze and accumulate in the electrolyte.
- the platinum coatings deposited from these baths are crack-free, glossy and ductile even with layer thicknesses above 100 ⁇ m.
- a galvanic platinum bath is prepared as follows: 80 ml of sulfuric acid (97%) are diluted in approx. 600 ml of water. 16 g of platinum in the form of the platinum amine sulfamato complex solution and 0.1 g of a fluorosurfactant are added to this solution. After filling with water, 1 l of the finished bath is obtained. At a bath temperature of 80 ° C and a current density of 2 A / dm 2 , a part made of silver is coated while rotating. After approx. 13 hours, an approx. 120 ⁇ m thick, shiny platinum layer has deposited evenly. After removing the silver with nitric acid, diluted 1: 1, a stable, crack-free platinum foil is obtained.
Description
Die Erfindung betrifft ein galvanisches Platinbad, insbesondere zur Abscheidung dicker Schichten, das 5 bis 30 g/l Platin als Amminsulfamato-Komplex enthält und einen pH-Wert von weniger als 1 aufweist.The invention relates to a galvanic platinum bath, especially for the deposition of thick layers, the 5 to 30 Contains g / l of platinum as an amine sulfamato complex and a pH value less than 1.
Für die galvanische Abscheidung von Platin werden saure und alkalische Bäder auf der Basis von Platin(II)- und Platin(IV)-Verbindungen verwendet. Die wichtigsten Badtypen enthalten Diamminodinitritoplatin(II) (P-Salz), Sulfatodinitritoplatinsäure (DNS) oder Hexahydroxoplatinsäure, beziehungsweise deren Alkalisalze. Die genannten Badtypen eignen sich überwiegend nur für die Abscheidung dünner Platinschichten von wenigen µm. Die Abscheidung dicker Schichten für technische Anwendungen ist bei Platin ein generelles Problem. Entweder die Schichten haben hohe innere Spannungen, werden rissig und platzen sogar auf, oder die Elektrolyte sind nicht ausreichend stabil und zersetzen sich bei den langen Elektrolysezeiten relativ rasch.For the electrodeposition of platinum, acidic and alkaline baths based on platinum (II) - and Platinum (IV) compounds are used. The main types of bath contain diamminodinitritoplatinum (II) (P salt), Sulfatodinitritoplatinic acid (DNA) or Hexahydroxoplatinic acid, or its alkali salts. The types of baths mentioned are mainly only suitable for Deposition of thin platinum layers of a few µm. The Deposition of thick layers for technical applications a general problem with platinum. Either the layers have high internal tensions, become cracked and burst even on, or the electrolytes are insufficient stable and decompose during the long electrolysis times relatively quickly.
Aus der DE-PS 11 82 924 ist ein saures Bad zum galvanischen Abscheiden von Platinüberzügen bekannt, das aus einer wässrigen Lösung einer komplexen Dinitroplatinat(II)-Verbindung besteht und einen pH-Wert unter 2 aufweist. Als komplexe Platinverbindung kann auch der Dinitrosulfamatokomplex eingesetzt werden. Nach eigenen Angaben erhält man mit diesen Platinbädern nur Schichtdicken bis zu 25 µm. Schichten über 25 µm neigen zum Reißen und sind daher für viele Anwendungen nicht geeignet.From DE-PS 11 82 924 is an acid bath for galvanic Deposition of platinum coatings known from a aqueous solution of a complex dinitroplatinate (II) compound exists and has a pH below 2. As complex platinum compound can also Dinitrosulfamato complex can be used. After own Information can only be obtained with these platinum baths Layer thicknesses up to 25 µm. Layers over 25 µm tend to Tear and are therefore not suitable for many applications.
In der DE-PS 12 56 992 wird ein galvanisches Platinbad beschrieben, das aus einer wässrigen Lösung von Platindiamminodinitrit (P-Salz) und Alkalisalzen der Sulfamidsäure besteht und bei pH-Werten von 6,5 bis 8 betrieben wird. Auch hier bekommt man nach eigenen Angaben nur Schichtdicken bis zu etwa 20 µm. Allerdings muß der pH-Wert in engen Grenzen konstant gehalten werden. Bei pH-Werten unterhalb 3 löst sich die Platinschicht wieder ab.In DE-PS 12 56 992 a galvanic platinum bath described that from an aqueous solution of Platinum diamminodinitrite (P salt) and alkali salts of Sulphamic acid exists and at pH values from 6.5 to 8 is operated. Here too you get according to your own information only layer thicknesses up to about 20 µm. However, the pH be kept constant within narrow limits. At pH values below 3 the platinum layer comes off.
Nach der DE-AS 11 44 074 wird das P-Salz mit einem hohen Überschuß an Sulfamidsäure, NH2SO3H, umgesetzt, so daß man nach Verdünnen mit Wasser ein gebrauchsfertiges Bad erhält, das 6-20 g/l Platin und 20-100 g/l Sulfamidsäure (Amidoschwefelsäure)enthält. Jedoch ist dieser Elektrolyt nur so lange stabil, wie das Bad in Betrieb ist. Dicke Schichten können rißfrei nur mit matter Oberfläche erhalten werden.According to DE-AS 11 44 074, the P salt is reacted with a large excess of sulfamic acid, NH 2 SO 3 H, so that a diluted bath with 6-20 g / l platinum and 20 Contains -100 g / l sulfamic acid (amidosulfuric acid). However, this electrolyte is only stable as long as the bath is in operation. Thick layers can only be obtained without cracks with a matt surface.
Es war daher Aufgabe der vorliegenden Erfindung, ein galvanisches Platinbad insbesondere zur Abscheidung dicker Schichten zu entwickeln, das 5 bis 30 g/l Platin als Amminsulfamato-Komplex enthält und einen pH-Wert von weniger als 1 aufweist, mit dem auch Schichtdicken über 100 µm rißfrei, glatt und glänzend abgeschieden werden können und das auch bei Nichtbenutzung stabil ist.It was therefore an object of the present invention Galvanic platinum bath, especially for thicker deposition Develop layers that are 5 to 30 g / l platinum Contains amminsulfamato complex and a pH of has less than 1, with which also layer thicknesses over 100 µm can be deposited without cracks, smooth and shiny and that is stable even when not in use.
Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß der Elektrolyt höchstens 5 g/l freie Amidoschwefelsäure (Sulfamidsäure) und 20 bis 400 g/l einer starken Säure mit einem pH-Wert kleiner 1 enthält.This object is achieved in that the Electrolyte at most 5 g / l free amidosulfuric acid (Sulfamic acid) and 20 to 400 g / l of a strong acid contains a pH of less than 1.
Vorzugsweise wird als starke Säure Schwefelsäure, Methansulfonsäure oder Perchlorsäure eingesetzt. Daneben können auch andere Mineralsäuren, wie Fluorschwefelsäure oder Fluoroborsäure, Alkansulfonsäuren, wie Methandisulfonsäure, Ethansulfonsäure, Hydroxiethansulfonsäure und Homologe, oder perfluorierte Alkansulfonsäuren, wie Trifluormethansulfonsäure oder Pentafluorethansulfonsäure, und Perfluorcarbonsäuren, wie Trifluoressigsäure, eingesetzt werden. Preferably, the strong acid is sulfuric acid, Methanesulfonic acid or perchloric acid used. Besides can also use other mineral acids, such as fluorosulfuric acid or fluoroboric acid, alkanesulfonic acids, such as Methane disulfonic acid, ethanesulfonic acid, Hydroxiethan sulfonic acid and homologues, or perfluorinated Alkanesulfonic acids, such as trifluoromethanesulfonic acid or Pentafluoroethanesulfonic acid, and perfluorocarboxylic acids, such as Trifluoroacetic acid can be used.
Außerdem ist es von Vorteil, wenn der Elektrolyt zusätzlich 0,01 bis 0,2 g/l eines Fluortensids als Netzmittel enthält.It is also advantageous if the electrolyte is additional Contains 0.01 to 0.2 g / l of a fluorosurfactant as a wetting agent.
Bewährt hat es sich, wenn als Amminsulfamato-Komplex das Produkt aus der Umsetzung von 1 Mol P-Salz (Platindiamminodinitrito-Komplex) mit 4 bis 6 Mol Amidoschwefelsäure eingesetzt wird.It has proven to be useful if this is the amminsulfamato complex Product from the reaction of 1 mol of P salt (Platinum diamminodinitrito complex) with 4 to 6 mol Amidosulfuric acid is used.
Sehr gute Abscheideergebnisse erhält man, wenn das Platin-P-Salz mit Amidoschwefelsäure in äquivalenten Mengen umgesetzt wird und die resultierende Platinsulfamato-Komplexlösung einer wäßrigen Lösung einer starken Säure zugegeben wird, wobei die Säure z.B. Schwefelsäure, Methansulfonsäure oder Perchlorsäure sein kann. Dabei muß das Bad eine ausreichende Menge der starken Säure enthalten. Bewährt haben sich Mengen von 20 bis 400 g/l.Very good deposition results are obtained when the platinum P salt with amidosulfuric acid in equivalent amounts is implemented and the resulting platinum sulfamato complex solution an aqueous solution of a strong acid is added, the acid e.g. Sulfuric acid, Can be methanesulfonic acid or perchloric acid. It must the bath has a sufficient amount of strong acid contain. Quantities of 20 to 400 g / l have proven effective.
Das Bad kann außerdem 0,01-0,2 g/l eines Fluortensids zur Unterdrückung von Sprühnebeln enthalten. Es wird bei Temperatur zwischen 60 und 90° C und bei Stromdichten von 1-4 A/dm2 betrieben.The bath may also contain 0.01-0.2 g / l of a fluorosurfactant to suppress spray. It is operated at a temperature between 60 and 90 ° C and at current densities of 1-4 A / dm 2 .
Die Platinamminsulfamato-Komplexlösung erwies sich in dem stark sauren Bad ohne freie Amidoschwefelsäure als überraschend stabil. Das Bad zeigte auch bei langen Elektrolysezeiten keinerlei Niederschlagsbildung. Bei der Abscheidung des Platins freiwerdendes Sulfamat wird rasch hydrolysiert und reichert sich nicht im Elektrolyten an.The platinum amine sulfamato complex solution was found in the strongly acidic bath without free amidosulfuric acid as surprisingly stable. The bathroom showed even with long ones Electrolysis times no precipitation. In the Separation of the platinum liberated sulfamate becomes rapid does not hydrolyze and accumulate in the electrolyte.
Die aus diesen Bädern abgeschiedenen Platinüberzüge sind rißfrei, glänzend und duktil auch bei Schichtdicken über 100 µm.The platinum coatings deposited from these baths are crack-free, glossy and ductile even with layer thicknesses above 100 µm.
Folgendes Beispiel zeigt die Vorteile des erfindungsgemäßen Bades:The following example shows the advantages of the invention Bades:
Ein galvanisches Platinbad wird wie folgt bereitet:
80 ml Schwefelsäure (97 %) werden in ca. 600 ml Wasser
verdünnt. Dieser Lösung werden 16 g Platin in Form der
Platinamminsulfamato-Komplexlösung und 0,1 g eines
Fluortensids zugegeben. Nach Auffüllen mit Wasser erhält
man 1 l fertiges Bad. Bei einer Badtemperatur von 80° C und
einer Stromdichte von 2 A/dm2 wird ein Teil aus Silber bei
rotierender Bewegung beschichtet. Nach ca. 13 Stunden hat
sich eine ca. 120 µm dicke, glänzende Platinschicht
gleichmäßig abgeschieden. Nach Ablösen des Silbers mit
Salpetersäure, verdünnt 1:1, erhält man eine stabile,
rißfreie Platinfolie.A galvanic platinum bath is prepared as follows:
80 ml of sulfuric acid (97%) are diluted in approx. 600 ml of water. 16 g of platinum in the form of the platinum amine sulfamato complex solution and 0.1 g of a fluorosurfactant are added to this solution. After filling with water, 1 l of the finished bath is obtained. At a bath temperature of 80 ° C and a current density of 2 A / dm 2 , a part made of silver is coated while rotating. After approx. 13 hours, an approx. 120 µm thick, shiny platinum layer has deposited evenly. After removing the silver with nitric acid, diluted 1: 1, a stable, crack-free platinum foil is obtained.
Claims (4)
- Platinum electroplating bath, in particular for depositing thick layers, containing 5 to 30 g/l of platinum as an amminsulphamato complex and having a pH of less than 1, characterized in that the electrolyte contains not more than 5 g/l of free amidosulphuric acid and 20 to 400 g/l of a strong acid having a pH of less than 1.
- Platinum electroplating bath according to Claim 1, characterized in that sulphuric acid, methanesulphonic acid or perchloric acid is used as strong acid.
- Platinum electroplating bath according to Claim 1 or 2, characterized in that it contains 0.01 to 0.2 g/l of a fluoro surfactant as wetting agent.
- Platinum electroplating bath according to Claim 1, characterized in that the product of reacting 1 mol of diamminodinitroplatinum(II) with 4 to 6 mol of amidosulphuric acid is used as amminsulphamato complex.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19514253 | 1995-04-15 | ||
| DE19514253 | 1995-04-15 | ||
| DE19547900 | 1995-12-21 | ||
| DE19547900A DE19547900C2 (en) | 1995-04-15 | 1995-12-21 | Galvanic platinum bath |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0737760A1 EP0737760A1 (en) | 1996-10-16 |
| EP0737760B1 true EP0737760B1 (en) | 2000-04-19 |
Family
ID=26014434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP96102799A Expired - Lifetime EP0737760B1 (en) | 1995-04-15 | 1996-02-24 | Platinum electroplating bath |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5620583A (en) |
| EP (1) | EP0737760B1 (en) |
| JP (1) | JPH08319595A (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6294425B1 (en) | 1999-10-14 | 2001-09-25 | Samsung Electronics Co., Ltd. | Methods of forming integrated circuit capacitors by electroplating electrodes from seed layers |
| US20020000380A1 (en) * | 1999-10-28 | 2002-01-03 | Lyndon W. Graham | Method, chemistry, and apparatus for noble metal electroplating on a microelectronic workpiece |
| KR100331570B1 (en) | 2000-06-13 | 2002-04-06 | 윤종용 | Method for manufacturing capacitor of semiconductor memory device using electroplating method |
| US7150820B2 (en) * | 2003-09-22 | 2006-12-19 | Semitool, Inc. | Thiourea- and cyanide-free bath and process for electrolytic etching of gold |
| US20050230262A1 (en) * | 2004-04-20 | 2005-10-20 | Semitool, Inc. | Electrochemical methods for the formation of protective features on metallized features |
| FR2974582A1 (en) * | 2011-04-27 | 2012-11-02 | Commissariat Energie Atomique | PROCESS FOR GROWING METALLIC PARTICLES BY ELECTRODEPOSITION WITH IN SITU INHIBITION |
| GB201200482D0 (en) * | 2012-01-12 | 2012-02-22 | Johnson Matthey Plc | Improvements in coating technology |
| US10612149B1 (en) | 2019-09-05 | 2020-04-07 | Chow Sang Sang Jewellery Company Limited | Platinum electrodeposition bath and uses thereof |
| DE102020007789A1 (en) | 2020-12-18 | 2022-06-23 | Umicore Galvanotechnik Gmbh | Stabilization of the deposition rate of platinum electrolytes |
| TWI784601B (en) * | 2021-01-08 | 2022-11-21 | 日商Ｅｅｊａ股份有限公司 | Platinum electroplating baths and platinum-plated products |
| DE102021107826A1 (en) | 2021-03-29 | 2022-09-29 | Umicore Galvanotechnik Gmbh | platinum electrolyte |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL123540C (en) * | 1958-08-06 | |||
| GB8821005D0 (en) * | 1988-09-07 | 1988-10-05 | Johnson Matthey Plc | Improvements in plating |
| JPH04297592A (en) * | 1991-03-25 | 1992-10-21 | Tanaka Kikinzoku Kogyo Kk | Platinum electroplating bath |
-
1996
- 1996-02-24 EP EP96102799A patent/EP0737760B1/en not_active Expired - Lifetime
- 1996-03-27 US US08/624,806 patent/US5620583A/en not_active Expired - Fee Related
- 1996-04-11 JP JP8089750A patent/JPH08319595A/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08319595A (en) | 1996-12-03 |
| US5620583A (en) | 1997-04-15 |
| EP0737760A1 (en) | 1996-10-16 |
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