EP0717371A3 - Manufacturing method and device for chip cards and chip card - Google Patents

Manufacturing method and device for chip cards and chip card Download PDF

Info

Publication number
EP0717371A3
EP0717371A3 EP95119842A EP95119842A EP0717371A3 EP 0717371 A3 EP0717371 A3 EP 0717371A3 EP 95119842 A EP95119842 A EP 95119842A EP 95119842 A EP95119842 A EP 95119842A EP 0717371 A3 EP0717371 A3 EP 0717371A3
Authority
EP
European Patent Office
Prior art keywords
chip
card
manufacturing
adhesive
radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP95119842A
Other languages
German (de)
French (fr)
Other versions
EP0717371A2 (en
EP0717371B1 (en
Inventor
Frank-Thomas Dr Dipl-C Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus GmbH
Original Assignee
ODS R OLDENBOURG DATENSYSTEME GmbH
Ods & Co KG GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ODS R OLDENBOURG DATENSYSTEME GmbH, Ods & Co KG GmbH filed Critical ODS R OLDENBOURG DATENSYSTEME GmbH
Publication of EP0717371A2 publication Critical patent/EP0717371A2/en
Publication of EP0717371A3 publication Critical patent/EP0717371A3/en
Application granted granted Critical
Publication of EP0717371B1 publication Critical patent/EP0717371B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Paints Or Removers (AREA)

Abstract

The chip card mfg. system uses at least chip module fitted into a recess in the surface of the card and secured in place by a liquid adhesive, which is hardened by applied radiation immediately before or after the insertion of the chip module. Pref. the adhesive is hardened by application of radiation and pressure, with the inserted chip card pressed in place for a limited duration after its insertion, after previous treatment of the adhesive with the hardening radiation.
EP95119842A 1994-12-15 1995-12-15 Manufacturing method and device for chip cards and chip card Expired - Lifetime EP0717371B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4444789A DE4444789C3 (en) 1994-12-15 1994-12-15 Method for producing chip cards, chip card and device for carrying out the method
DE4444789 1994-12-15

Publications (3)

Publication Number Publication Date
EP0717371A2 EP0717371A2 (en) 1996-06-19
EP0717371A3 true EP0717371A3 (en) 1997-02-26
EP0717371B1 EP0717371B1 (en) 2001-10-17

Family

ID=6535946

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95119842A Expired - Lifetime EP0717371B1 (en) 1994-12-15 1995-12-15 Manufacturing method and device for chip cards and chip card

Country Status (6)

Country Link
EP (1) EP0717371B1 (en)
CN (1) CN1110014C (en)
AT (1) ATE207226T1 (en)
DE (2) DE4444789C3 (en)
ES (1) ES2164739T3 (en)
ZA (1) ZA9510646B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998006062A1 (en) * 1996-08-05 1998-02-12 Gemplus S.C.A. Improvement to a method for making smart cards, and resulting cards
DE19826971C2 (en) * 1998-06-18 2002-03-14 Reiner Goetzen Process for the mechanical and electrical connection of system components
FI112288B (en) * 2000-01-17 2003-11-14 Rafsec Oy Procedure for producing an input path for smart labels
FI112287B (en) 2000-03-31 2003-11-14 Rafsec Oy Procedure for producing product sensor and product sensor
DE10110939B4 (en) * 2001-03-07 2004-07-08 Mühlbauer Ag Method and device for hot press connecting a chip module to a carrier substrate
DE10160390A1 (en) * 2001-12-10 2003-06-18 Cubit Electronics Gmbh Coil arrangement and method for its manufacture
DE10353648A1 (en) * 2003-11-17 2005-06-16 Giesecke & Devrient Gmbh Method for fixing a chip module
CN105593030B (en) * 2013-08-21 2019-07-12 X卡控股有限公司 The apparatus and method of card and the product of formation are carried for manufacturing information by radiation curing
DE102015000006B4 (en) * 2015-01-06 2019-09-26 Jenoptik Optical Systems Gmbh Component device and method for joining components

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02178096A (en) * 1988-12-28 1990-07-11 Citizen Watch Co Ltd Ic card
EP0390046A2 (en) * 1989-03-28 1990-10-03 Matsushita Electric Industrial Co., Ltd. Apparatus for connecting semiconductor devices to wiring boards
US5057679A (en) * 1988-03-22 1991-10-15 Schlumberger Industries Technique for attaching an electronic module to a card body to form an electronic memory card
DE4229639C1 (en) * 1992-09-04 1993-12-09 Tomas Meinen IC card manufacturing method - delivering volume of adhesive determined by variation of pressure and duration in which adhesive is supplied via tubule
EP0691626A2 (en) * 1994-07-05 1996-01-10 Giesecke & Devrient GmbH Data carrier comprising an integrated circuit module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5057679A (en) * 1988-03-22 1991-10-15 Schlumberger Industries Technique for attaching an electronic module to a card body to form an electronic memory card
JPH02178096A (en) * 1988-12-28 1990-07-11 Citizen Watch Co Ltd Ic card
EP0390046A2 (en) * 1989-03-28 1990-10-03 Matsushita Electric Industrial Co., Ltd. Apparatus for connecting semiconductor devices to wiring boards
DE4229639C1 (en) * 1992-09-04 1993-12-09 Tomas Meinen IC card manufacturing method - delivering volume of adhesive determined by variation of pressure and duration in which adhesive is supplied via tubule
EP0691626A2 (en) * 1994-07-05 1996-01-10 Giesecke & Devrient GmbH Data carrier comprising an integrated circuit module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 014, no. 447 (M - 1029) 25 September 1990 (1990-09-25) *

Also Published As

Publication number Publication date
DE4444789A1 (en) 1996-06-27
DE4444789C3 (en) 2001-05-10
DE4444789C2 (en) 1997-08-28
ATE207226T1 (en) 2001-11-15
EP0717371A2 (en) 1996-06-19
EP0717371B1 (en) 2001-10-17
CN1110014C (en) 2003-05-28
DE59509719D1 (en) 2001-11-22
ES2164739T3 (en) 2002-03-01
CN1132375A (en) 1996-10-02
ZA9510646B (en) 1996-07-11

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