EP0716432A1 - Planar inductor - Google Patents

Planar inductor Download PDF

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Publication number
EP0716432A1
EP0716432A1 EP95203290A EP95203290A EP0716432A1 EP 0716432 A1 EP0716432 A1 EP 0716432A1 EP 95203290 A EP95203290 A EP 95203290A EP 95203290 A EP95203290 A EP 95203290A EP 0716432 A1 EP0716432 A1 EP 0716432A1
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EP
European Patent Office
Prior art keywords
carrier
ferromagnetic
inductance
planar
ferromagnetic material
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Granted
Application number
EP95203290A
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German (de)
French (fr)
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EP0716432B1 (en
Inventor
Ulrich c/o Philips Rittner
Heiner c/o Philips Schmidt
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Philips Intellectual Property and Standards GmbH
Koninklijke Philips NV
Original Assignee
Philips Corporate Intellectual Property GmbH
Philips Patentverwaltung GmbH
Koninklijke Philips Electronics NV
Philips Electronics NV
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Publication of EP0716432A1 publication Critical patent/EP0716432A1/en
Application granted granted Critical
Publication of EP0716432B1 publication Critical patent/EP0716432B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F21/00—Variable inductances or transformers of the signal type
    • H01F21/02—Variable inductances or transformers of the signal type continuously variable, e.g. variometers
    • H01F21/06—Variable inductances or transformers of the signal type continuously variable, e.g. variometers by movement of core or part of core relative to the windings as a whole
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0046—Printed inductances with a conductive path having a bridge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0086—Printed inductances on semiconductor substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core

Definitions

  • the invention relates to a planar inductor with at least one essentially spiral coil applied to a flat carrier and with an essentially layered, ferromagnetic material arranged on this carrier.
  • EP-OS 310 396 discloses a planar inductance with spiral conductors which are used in a so-called sandwich construction between ferromagnetic layers with insulating layers arranged between them.
  • the spiral-shaped conductors form two coils of the same contour, which are aligned and close to each other. Furthermore, the two spiral coils are electrically connected to one another in such a way that currents flow in different directions through the individual coils.
  • the ferromagnetic layers have a planar extent which is greater than the sum of the areas of the two conductor coils. Such an arrangement is intended to prevent a reduction in the inductance when the individual parts are put together and to increase the inductance value per unit volume.
  • the inductors shown in this document are composed of numerous layers or cuboid insulating pieces or ferromagnetic components in a relatively complicated manner. On the one hand, this considerably increases the cost of production and, on the other hand, there is no possibility of varying the magnetic coupling during production, i.e. also not for a comparison.
  • the object of the invention is to design a planar inductor in such a way that its inductance value can be precisely adjusted or adjusted with simple means during manufacture and / or that the magnetic coupling of several coils or windings of an inductor can be set accordingly simply and precisely.
  • Planar inductors of the type according to the invention can advantageously be used in hybrid technology or multichip module technology, in which a plurality of electronic ones Components, which in turn can be integrated circuits, are arranged on a flat carrier, for example a circuit board.
  • This flat support is provided with a conductive layer, from which predetermined conductor structures have preferably been worked out by etching technology.
  • These (electrically conductive) conductor structures serve for the electrical connection of the components arranged on the carrier. They can also preferably be used to form planar inductors that are simple, precise and robust to manufacture.
  • a protective layer is finally applied in a so-called coating process, consisting of a curable covering compound through which the components and their connections are encased.
  • insulating material windows are then applied beforehand, e.g. glued on, which, like a frame, delimit the partial surfaces of the carrier equipped with components. The covering compound is then introduced into this insulating material window in the coating process.
  • an insulating material window is also arranged above the coil or coils. This can delimit the entire planar inductance, but only partially overlap it. Also the height of the insulating material window perpendicular to The surface of the carrier can be chosen differently; however, a height is preferably used for this, as is also used for covering the other components mentioned, so that simplification and standardization is achieved during production.
  • the inductance value or the coupling between several coils of the planar inductor can be set by the dimensions of the insulating window parallel to the surface of the carrier and by the positioning of the insulating material window over a more or less large portion of the total area of the carrier covered by the planar inductor.
  • the insulating material window is filled with ferromagnetic material in the coating process.
  • the same manufacturing steps and systems are used as for covering the components mentioned above, which greatly simplifies manufacturing. Largely the same masking compound is used; only a ferromagnetic admixture is added to increase the magnetic coupling or the inductance values.
  • the ferromagnetic material can thus be obtained in a very simple manner from the covering compound, which is also referred to as coating material, the mixing ratio of the ferromagnetic admixture to the coating material and the amount of material applied in the respective insulating material window being selectable for setting the coupling or inductances.
  • These parameters can preferably be determined in such a way that the size, shape and position of the insulating material window and the composition of the ferromagnetic material are predetermined for a specific planar inductance to be manufactured.
  • the exact setting to the desired values for the inductances or the coupling can then be made by metering the amount of the ferromagnetic material when it is applied to the carrier within the insulating window take place, possibly in the form of an adjustment during electrical measurement taking place during the application of the ferromagnetic material.
  • the manufacturing process is mechanically very easy to control through the insulating material window, ie very narrow tolerances can be maintained with little effort.
  • the inventive configuration of the planar inductance means that mechanical protection of the conductor structures, in particular of connecting wires, can be obtained with the ferromagnetic material, in particular when the coil (s) are completely covered. Since the ferromagnetic material is preferably non-conductive, adjacent electronic components for mechanical protection can also be covered in one work step in addition to the planar inductance. The influence of the ferromagnetic material on the conductor structures and their transmission properties must then be taken into account accordingly.
  • the reference symbol denotes a section from a flat carrier, as is preferably used in hybrid technology or multichip module technology.
  • Two flat, essentially spiral coils 2 and 3 are arranged on this flat support, which are preferably applied to the flat support in the form of a so-called printed conductor structure.
  • Bond wires 4 and 5 form connecting bridges between connection surfaces 6, 7 and 8, 9 and thus establish a conductive connection between the coil ends in the centers of the spirals and conductor structures 10 and 11 arranged outside the spirals.
  • On the flat carrier 1 - not shown in FIG. 1 - further components, including integrated circuits in the form of doped semiconductor bodies, are arranged, the electrical connections of which are made via conductor structures that correspond to those of the coils 2 or 3 or the conductor structures 10, 11 correspond and can be produced in the same production process.
  • An insulating material window 12 is applied to the flat carrier 1 - partially covering the coils 2 and 3 - and glued to the carrier 1.
  • the assembly of this insulating material window 12 can preferably be carried out in the assembly step of the other mentioned, not shown Components are included.
  • the part of the surface of the carrier 1 which is bordered by the insulating material window 12 is covered with a ferromagnetic material 13, a mixture of a covering compound (coating material) with ferromagnetic admixture, which can be introduced into the insulating material window in the liquid state and then hardens in the latter.
  • FIG. 2 shows the planar inductance on the flat carrier in a longitudinal section along the section line Z - Z. This illustration also shows the material thicknesses only schematically.
  • the ferromagnetic material 13 In the exemplary embodiment according to FIG. 2, only a part of the planar inductance is covered by the ferromagnetic material 13; in particular, the bond wires 4, 5 remain unprotected.
  • the dimensions of the insulating material window 12 it is advantageous for the dimensions of the insulating material window 12 to be such that, as far as possible, the entire planar inductor, including the associated bonding wires and connections, is surrounded and can be covered with ferromagnetic material.
  • FIG. 3 Such an arrangement is shown schematically in FIG. 3, for example, in top view, in which a modified shape with spiral coils nested one inside the other is also selected. In this case, a first coil 20 between connection areas A and B surrounds a second coil 21 between connection areas C and D.
  • Bonding wires 22, 23 connect the connection areas B and C or D to conductor structures 24 for connecting the inner coil connections of the planar inductance to outside, in Fig. 3 parts of a circuit arrangement not shown on the carrier 1.
  • the ferromagnetic material 13 then covers the entire planar inductance.
  • the arrangement of the coils 20 and 21 can be used for different functions or dimensions.
  • a coiled series connection of the coils 20, 21 or an oppositely coiled series connection of the coils 20, 21 can form the desired inductance. If the geometry of the planar inductors remains unchanged, this can therefore only have different dimensions with differently guided bond wires for different applications, which means that larger value ranges for the inductance values can be developed in cooperation with the ferromagnetic material.
  • the arrangement of the bond wires 22, 23 shown in FIG. 3 shows a further possibility of connecting the coils 20, 21, namely a transformer.
  • the connection areas A to D can preferably be connected separately from one another to external components, in particular to electronic switches, by means of which these different interconnections can optionally be carried out.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

The inductance has at least one essentially spiral shaped coil (2, 3) formed on a flat substrate (1). A layer of ferromagnetic material (13) is arranged on the substrate (1). The ferromagnetic material (13) is applied to the substrate (1) in a coating process, within an insulation window (12) fastened to the substrate (1). The window (12) is preferably fastened to the substrate (1) by adhesive. The ferromagnetic material may be a coating material mixed with a ferromagnetic admixture, eg. ferrite powder. The value of the induction of the coil(s) (2,3) and/or the coupling between the coils (2, 3) may be determined by the alignment and/or the contour of the insulation window (12) and/or by the layer depth and/or combination of the ferromagnetic material (13).

Description

Die Erfindung bezieht sich auf eine planare Induktivität mit wenigstens einer auf einem flächigen Träger aufgebrachten, im wesentlichen spiralförmigen Spule und mit einem auf diesem Träger angeordneten, im wesentlichen schichtförmigen, ferromagnetischen Material.The invention relates to a planar inductor with at least one essentially spiral coil applied to a flat carrier and with an essentially layered, ferromagnetic material arranged on this carrier.

Aus der DE-OS 24 41 317 ist ein Verfahren zum Induktivitätsabgleich von Flachspulen bekannt, die in Schichttechnik hergestellt sind. Bei diesem Verfahren wird je nach der Abweichung des Induktivitäsistwertes vom Sollwert ein mehr oder minder großer Teil der Flachspule mit einer Paste, bestehend aus einem mit einem Bindemittel vermengten magnetisierbaren Pulver, bedeckt bzw. die Dicke der aufgetragenen Paste erhöht wird. Dabei wird zum Abgleich der Induktivität der Flachspule ein durch einen Bedeckungswinkel definierter Teil der Spulenoberfläche mit der Paste bedeckt. Der Bedeckungswinkel soll linear mit der Änderung der Induktivität verknüpft sein; die Schichtdicke der Paste weist jedoch einen nichtlinearen Einfluß auf die Änderung der Induktivität auf. Der durch das Bestreichen der Flachspule mit der Paste vorgenommene Abgleichvorgang für die Induktivität ist dabei als automatisierbar angegeben.From DE-OS 24 41 317 a method for inductance matching of flat coils is known, which are made in layer technology. In this method, depending on the deviation of the actual inductance value from the nominal value, a more or less large part of the flat coil is covered with a paste consisting of a magnetizable powder mixed with a binder, or the thickness of the applied paste is increased. To adjust the inductance of the flat coil, a part of the coil surface defined by an angle of coverage is covered with the paste. The coverage angle should be linearly linked to the change in inductance; however, the layer thickness of the paste has a non-linear influence on the change in inductance. The adjustment process for the inductance which is carried out by brushing the flat coil with the paste is specified as being automatable.

Aus der EP-OS 310 396 ist eine planare Induktivität mit spiralförmigen Leitern bekannt, die in sogenannter Sandwichbauweise zwischen ferromagnetischen Schichten mit dazwischen angeordneten Isolierschichten eingesetzt sind. Die spiralförmigen Leiter bilden zwei Spulen der gleichen Kontur, die fluchtend zueinander und dicht nebeneinander angeordnet sind. Ferner sind die beiden spiralförmigen Spulen derart elektrisch miteinander verbunden, daß Ströme unterschiedlicher Richtungen durch die einzelnen Spulen fließen. Weiterhin weisen die ferromagnetischen Schichten eine flächige Ausdehnung auf, die größer ist als die Summe der Flächen der beiden Leiterspulen. Durch eine solche Anordnung soll eine Verringerung der Induktivität bei der Zusammenfügung der einzelnen Teile verhindert und eine Vergrößerung des Induktivitätswertes je Volumeneinheit erzielt werden.EP-OS 310 396 discloses a planar inductance with spiral conductors which are used in a so-called sandwich construction between ferromagnetic layers with insulating layers arranged between them. The spiral-shaped conductors form two coils of the same contour, which are aligned and close to each other. Furthermore, the two spiral coils are electrically connected to one another in such a way that currents flow in different directions through the individual coils. Furthermore, the ferromagnetic layers have a planar extent which is greater than the sum of the areas of the two conductor coils. Such an arrangement is intended to prevent a reduction in the inductance when the individual parts are put together and to increase the inductance value per unit volume.

Die in dieser Druckschrift dargestellten Induktivitäten sind jedoch aus zahlreichen schicht- oder quaderförmigen Isolierstoffstücken oder ferromagnetischen Bauteilen in verhältnismäßig komplizierter Weise zusammengesetzt. Dies verteuert einerseits die Herstellung beträchtlich und gibt andererseits keine Möglichkeit zu einer Variation der magnetischen Kopplung während der Fertigung, d.h. auch nicht für einen Abgleich.However, the inductors shown in this document are composed of numerous layers or cuboid insulating pieces or ferromagnetic components in a relatively complicated manner. On the one hand, this considerably increases the cost of production and, on the other hand, there is no possibility of varying the magnetic coupling during production, i.e. also not for a comparison.

Die Erfindung hat die Aufgabe, eine planare Induktivität derart auszugestalten, daß ihr Induktivitätswert mit einfachen Mitteln während der Fertigung präzise abgleichbar bzw. einstellbar ist und/oder daß die magnetische Kopplung mehrerer Spulen bzw. Wicklungen einer Induktivität entsprechend einfach und genau eingestellt werden kann.The object of the invention is to design a planar inductor in such a way that its inductance value can be precisely adjusted or adjusted with simple means during manufacture and / or that the magnetic coupling of several coils or windings of an inductor can be set accordingly simply and precisely.

Diese Aufgabe wird bei einer planaren Induktivität der gattungsgemäßen Art dadurch gelöst, daß das ferromagnetische Material innerhalb eines auf dem Träger befestigten Isolierstoffensters im Coatingverfahren auf dem Träger aufgebracht ist.This object is achieved with a planar inductor of the generic type in that the ferromagnetic material is applied to the carrier within an insulating material window fastened to the carrier in the coating process.

Planare Induktivitäten der erfindungsgemäßen Art sind vorteilhaft in der Hybridtechnik oder der Multichip-Modultechnik einsetzbar, bei der eine Mehrzahl von elektronischen Bauelementen, die ihrerseits integrierte Schaltkreise sein können, auf einem flächigen Träger, beispielsweise einer Platine, angordnet sind. Dieser flächige Träger ist mit einer leitenden Schicht versehen, aus der vorzugsweise durch Ätztechnik vorbestimmte Leiterstrukturen herausgearbeitet worden sind. Diese (elektrisch leitenden) Leiterstrukturen dienen der elektrischen Verbindung der auf dem Träger angeordneten Baulemente. Aus ihnen können darüber hinaus vorzugsweise auch planare Induktivitäten geformt werden, die einfach, präzise und robust herstellbar sind. Zum mechanischen Schutz derartiger, flächiger, mit Bauelementen bestückter Träger wird abschließend in einem sogenannten Coatingverfahren eine Schutzschicht aufgebracht, bestehend aus einer aushärtbaren Abdeckmasse, durch die die Bauelemente und ihre Anschlüsse eingehüllt werden.Planar inductors of the type according to the invention can advantageously be used in hybrid technology or multichip module technology, in which a plurality of electronic ones Components, which in turn can be integrated circuits, are arranged on a flat carrier, for example a circuit board. This flat support is provided with a conductive layer, from which predetermined conductor structures have preferably been worked out by etching technology. These (electrically conductive) conductor structures serve for the electrical connection of the components arranged on the carrier. They can also preferably be used to form planar inductors that are simple, precise and robust to manufacture. For the mechanical protection of such flat supports equipped with components, a protective layer is finally applied in a so-called coating process, consisting of a curable covering compound through which the components and their connections are encased.

Werden bei bestimmter Ausbildung einer derart hergestellten elektronischen Schaltungsanordnung nur einzelne Bereiche des Trägers mit Bauelementen bestückt, wohingegen andere Bereiche des Trägers allenfalls Leiterstrukturen (Leiterbahnen) tragen, ist es vorteilhaft, nur die mit Bauelementen bestückten Bereiche des Trägers mit einer Abdeckmasse zu überziehen. Für ein definiertes Aufbringen dieser Abdeckmasse werden dann zuvor auf den Träger Isolierstoffenster aufgebracht, z.B. aufgeklebt, die wie ein Rahmen die mit Bauelementen bestückten Teilflächen des Trägers umgrenzen. In diese Isolierstoffenster wird dann im Coatingverfahren die Abdeckmasse eingebracht.If only certain areas of the carrier are equipped with components, while other areas of the carrier at most carry conductor structures (conductor tracks), it is advantageous to cover only the areas of the carrier equipped with components with a covering compound in the case of a specific design of an electronic circuit arrangement produced in this way. For a defined application of this covering compound, insulating material windows are then applied beforehand, e.g. glued on, which, like a frame, delimit the partial surfaces of the carrier equipped with components. The covering compound is then introduced into this insulating material window in the coating process.

Bei der erfindungsgemäßen planaren Induktivität wird über der Spule bzw. den Spulen ebenfalls ein Isolierstoffenster angeordnet. Dieses kann die gesamte planare Induktivität umgrenzen, jedoch auch diese nur teilweise überlappen. Auch die Höhe des Isolierstoffensters senkrecht zur Oberfläche des Trägers kann unterschiedlich gewählt werden; vorzugsweise wird hierfür jedoch eine Höhe verwendet, wie sie auch für die Abdeckung der übrigen, genannten Bauelemente verwendet wird, so daß eine Vereinfachung und Vereinheitlichung bei der Fertigung erzielt wird. Durch die Abmessungen des Isolierfensters parallel zur Oberfläche des Trägers und durch die Positionierung des Isolierstoffensters über einem mehr oder weniger großen Anteil der insgesamt von der planaren Induktivität bedeckten Fläche des Trägers kann der Induktivitätswert bzw. die Kopplung zwischen mehreren Spulen der planaren Induktivität eingestellt werden. Das Isolierstoffenster wird im Coatingverfahren mit ferromagnetischem Material aufgefüllt. Dabei werden prinzipiell dieselben Fertigungsschritte und -anlagen wie bei der Abdeckung der im vorstehenden genannten Bauteile verwendet, wodurch die Fertigung sehr vereinfacht wird. Auch wird weitgehend dieselbe Abdeckmasse verwendet; lediglich wird ihr zur Erhöhung der magnetischen Kopplung bzw. der Induktivitätswerte eine ferromagnetische Beimengung hinzugefügt. Somit läßt sich das ferromagnetische Material in sehr einfacher Weise aus der Abdeckmasse, die auch als Coatingmaterial bezeichnet wird, gewinnen, wobei zur Einstellung der Kopplung bzw. Induktivitäten das Mischungsverhältnis der ferromagnetischen Beimengung zum Coatingmaterial und die Menge des im jeweiligen Isolierstoffenster aufgebrachten Materials wählbar sind. Vorzugsweise können diese Parameter derart bestimmt werden, daß für eine bestimmte zu fertigende planare Induktivität Größe, Form und Lage des Isolierstoffensters sowie die Zusammensetzung des ferromagnetischen Materials fest vorgegeben werden. Durch Dosierung der Menge des ferromagnetischen Materials beim Aufbringen auf den Träger innerhalb des Isolierstofffensters kann dann die genaue Einstellung auf die gewünschten Werte für die Induktivitäten bzw. die Kopplung erfolgen, ggf. in Form eines Abgleichs bei während des Aufbringens des ferromagnetischen Materials erfolgender elektrischer Messung. Durch das Isolierstoffenster wird dabei der Fertigungsvorgang mechanisch sehr einfach beherrschbar, d.h. mit geringem Aufwand werden sehr enge Toleranzen einhaltbar.In the planar inductance according to the invention, an insulating material window is also arranged above the coil or coils. This can delimit the entire planar inductance, but only partially overlap it. Also the height of the insulating material window perpendicular to The surface of the carrier can be chosen differently; however, a height is preferably used for this, as is also used for covering the other components mentioned, so that simplification and standardization is achieved during production. The inductance value or the coupling between several coils of the planar inductor can be set by the dimensions of the insulating window parallel to the surface of the carrier and by the positioning of the insulating material window over a more or less large portion of the total area of the carrier covered by the planar inductor. The insulating material window is filled with ferromagnetic material in the coating process. In principle, the same manufacturing steps and systems are used as for covering the components mentioned above, which greatly simplifies manufacturing. Largely the same masking compound is used; only a ferromagnetic admixture is added to increase the magnetic coupling or the inductance values. The ferromagnetic material can thus be obtained in a very simple manner from the covering compound, which is also referred to as coating material, the mixing ratio of the ferromagnetic admixture to the coating material and the amount of material applied in the respective insulating material window being selectable for setting the coupling or inductances. These parameters can preferably be determined in such a way that the size, shape and position of the insulating material window and the composition of the ferromagnetic material are predetermined for a specific planar inductance to be manufactured. The exact setting to the desired values for the inductances or the coupling can then be made by metering the amount of the ferromagnetic material when it is applied to the carrier within the insulating window take place, possibly in the form of an adjustment during electrical measurement taking place during the application of the ferromagnetic material. The manufacturing process is mechanically very easy to control through the insulating material window, ie very narrow tolerances can be maintained with little effort.

Die Unteransprüche zeigen vorteilhafte Ausgestaltungen der erfindungsgemäßen planaren Induktivität.The subclaims show advantageous configurations of the planar inductance according to the invention.

Durch die erfindungsgemäße Ausgestaltung der planaren Induktivität kann - insbesondere bei vollständiger Abdeckung der Spule(n) - mit dem ferromagnetischen Material zugleich ein mechanischer Schutz der Leiterstrukturen, insbesondere von Anschlußdrähten, erhalten werden. Da das ferromagnetische Material bevorzugt nichtleitend ist, können ggf. damit in einem Arbeitsgang außer der planaren Induktivität auch benachbarte elektronische Bauelemente zum mechanischen Schutz mit abgedeckt werden. Der Einfluß des ferromagnetischen Materials auf die Leiterstrukturen und deren Übertragungseigenschaften muß dann entsprechend berücksichtigt werden.The inventive configuration of the planar inductance means that mechanical protection of the conductor structures, in particular of connecting wires, can be obtained with the ferromagnetic material, in particular when the coil (s) are completely covered. Since the ferromagnetic material is preferably non-conductive, adjacent electronic components for mechanical protection can also be covered in one work step in addition to the planar inductance. The influence of the ferromagnetic material on the conductor structures and their transmission properties must then be taken into account accordingly.

Mit den derzeit bekannten Abdeckmassen und ferromagnetischen Beimengungen ist bei einer planaren Induktivität der erfindungsgemäßen Art außer einer Einstellung und insbesondere Erhöhung der magnetischen Kopplung bzw. der Induktivitätswerte bei unveränderter kompakter Leiterstruktur auch eine Steigerung der Güte der Induktivitäten, d.h. der Verhältnisse der Induktivitätswerte zu den ohmschen Widerstandswerten der Leiterstrukturen, erzielbar. Bei einem Einsatz z.B. in frequenzselektiven Schaltungsanordnungen für die Nachrichtentechnik kann dies zu einer Verbesserung des Übertragungsverhaltens der Schaltungsanordnung beitragen.With the currently known masking compounds and ferromagnetic admixtures, in the case of a planar inductance of the type according to the invention, in addition to an adjustment and, in particular, an increase in the magnetic coupling or the inductance values with an unchanged compact conductor structure, there is also an increase in the quality of the inductances, i.e. the ratios of the inductance values to the ohmic resistance values of the ladder structures, achievable. When used, for example, in frequency-selective circuit arrangements for communications technology, this can contribute to an improvement in the transmission behavior of the circuit arrangement.

In der Zeichnung, in der im übrigen übereinstimmende Elemente mit denselben Bezugszeichen versehen sind, zeigen

  • Fig. 1 ein erstes Ausführungsbeispiel einer erfindungsgemäßen planaren Induktivität in der Draufsicht,
  • Fig. 2 einen Schnitt durch die planare Induktivität nach Fig. 1 und
  • Fig. 3 ein zweites Ausführungsbeispiel einer erfindungsgemäßen planaren Induktivität.
Show in the drawing, in which otherwise the same elements are provided with the same reference numerals
  • 1 shows a plan view of a first exemplary embodiment of a planar inductance according to the invention,
  • Fig. 2 shows a section through the planar inductance according to Fig. 1 and
  • Fig. 3 shows a second embodiment of a planar inductor according to the invention.

In der schematischen Darstellung nach Fig. 1 ist mit dem Bezugszeichen ein Ausschnitt aus einem flächigen Träger bezeichnet, wie er bevorzugt in der Hybridtechnik oder Multichip-Modultechnik verwendet wird. Auf diesem flächigen Träger sind zwei flächige, im wesentlichen spiralförmige Spulen 2 und 3 angeordnet, die vorzugsweise in Form einer sogenannten gedruckten Leiterstruktur auf den flächigen Träger aufgebracht sind. Bonddrähte 4 bzw. 5 bilden Anschlußbrücken zwischen Anschlußflächen 6, 7 bzw. 8, 9 und stellen so eine leitende Verbindung zwischen den Spulenenden in den Zentren der Spiralen und außerhalb der Spiralen angeordneten Leiterstrukturen 10 bzw. 11 her. Auf dem flächigen Träger 1 sind - in Fig. 1 nicht dargestellt - weitere Bauelemente, auch integrierte Schaltungen in Form von dotierten Halbleiterkörpern, angeordnet, deren elektrische Anschlüsse über Leiterstrukturen hergestellt werden, die denjenigen der Spulen 2 bzw. 3 oder den Leiterstrukturen 10, 11 entsprechen und im selben Fertigungsgang herstellbar sind.In the schematic representation according to FIG. 1, the reference symbol denotes a section from a flat carrier, as is preferably used in hybrid technology or multichip module technology. Two flat, essentially spiral coils 2 and 3 are arranged on this flat support, which are preferably applied to the flat support in the form of a so-called printed conductor structure. Bond wires 4 and 5 form connecting bridges between connection surfaces 6, 7 and 8, 9 and thus establish a conductive connection between the coil ends in the centers of the spirals and conductor structures 10 and 11 arranged outside the spirals. On the flat carrier 1 - not shown in FIG. 1 - further components, including integrated circuits in the form of doped semiconductor bodies, are arranged, the electrical connections of which are made via conductor structures that correspond to those of the coils 2 or 3 or the conductor structures 10, 11 correspond and can be produced in the same production process.

Auf dem flächigen Träger 1 ist - die Spulen 2 und 3 teilweise überdeckend - ein Isolierstoffenster 12 aufgebracht und mit dem Träger 1 verklebt. Die Montage dieses Isolierstoffensters 12 kann bevorzugt in den Arbeitsschritt der Montage der genannten übrigen, nicht dargestellten Bauelemente einbezogen werden. Der vom Isolierstoffenster 12 berandete Teil der Oberfläche des Trägers 1 ist mit einem ferromagnetischen Material 13 bedeckt, einem Gemisch aus einer Abdeckmasse (Coatingmaterial) mit ferromagnetischer Beimengung, welches in flüssigem Zustand in das Isolierstoffenster einbringbar ist und dann in diesem aushärtet.An insulating material window 12 is applied to the flat carrier 1 - partially covering the coils 2 and 3 - and glued to the carrier 1. The assembly of this insulating material window 12 can preferably be carried out in the assembly step of the other mentioned, not shown Components are included. The part of the surface of the carrier 1 which is bordered by the insulating material window 12 is covered with a ferromagnetic material 13, a mixture of a covering compound (coating material) with ferromagnetic admixture, which can be introduced into the insulating material window in the liquid state and then hardens in the latter.

Fig. 2 zeigt die planare Induktivität auf dem flächigen Träger im Längsschnitt entlang der Schnittlinie Z - Z. Auch diese Darstellung gibt insbesondere die Materialstärken nur schematisch wieder.FIG. 2 shows the planar inductance on the flat carrier in a longitudinal section along the section line Z - Z. This illustration also shows the material thicknesses only schematically.

Bei dem Ausführungsbeispiel gemäß Fig. 2 wird vom ferromagnetischen Material 13 nur ein Teil der planaren Induktivität überdeckt; insbesondere bleiben die Bonddrähte 4, 5 ungeschützt. Zu ihrem mechanischen Schutz ist es vorteilhaft, daß Isolierstoffenster 12 in seinen Abmessungen derart auszubilden, daß möglichst die gesamte planare Induktivität einschließlich der zugehörigen Bonddrähte und Anschlüsse umgeben ist und mit ferromagnetischem Material abgedeckt werden kann. Eine solche Anordnung zeigt beispielsweise die Fig. 3 schematisch in Draufsicht, in der ferner eine veränderte Form mit ineinander verschachtelten spiralförmigen Spulen gewählt ist. Dabei umgibt eine erste Spule 20 zwischen Anschlußflächen A und B eine zweite Spule 21 zwischen Anschlußflächen C und D. Bonddrähte 22, 23 verbinden die Anschlußflächen B und C bzw. D mit Leiterstrukturen 24 zum Anschluß der inneren Spulenanschlüsse der planaren Induktivität an außerhalb gelegene, in Fig. 3 nicht dargestellte Teile einer auf dem Träger 1 befindlichen Schaltungsanordnung. Das ferromagnetische Material 13 überdeckt dann die gesamte planare Induktivität.In the exemplary embodiment according to FIG. 2, only a part of the planar inductance is covered by the ferromagnetic material 13; in particular, the bond wires 4, 5 remain unprotected. For their mechanical protection, it is advantageous for the dimensions of the insulating material window 12 to be such that, as far as possible, the entire planar inductor, including the associated bonding wires and connections, is surrounded and can be covered with ferromagnetic material. Such an arrangement is shown schematically in FIG. 3, for example, in top view, in which a modified shape with spiral coils nested one inside the other is also selected. In this case, a first coil 20 between connection areas A and B surrounds a second coil 21 between connection areas C and D. Bonding wires 22, 23 connect the connection areas B and C or D to conductor structures 24 for connecting the inner coil connections of the planar inductance to outside, in Fig. 3 parts of a circuit arrangement not shown on the carrier 1. The ferromagnetic material 13 then covers the entire planar inductance.

Insbesondere kann beim Ausführungsbeispiel gemäß Fig. 3 die Anordnung der Spulen 20 und 21 für unterschiedliche Funktionen bzw. Dimensionierungen herangezogen werden. Durch entsprechende Veränderung der Bonddrähte 22, 23 können dabei wahlweise die erste Spule 20 bzw. die zweite Spule 21 allein, eine gleichsinnig gewendelte Reihenschaltung der Spulen 20, 21 oder eine gegensinnig gewendelte Reihenschaltung der Spulen 20, 21 die gewünschte Induktivität bilden. Diese kann daher bei unveränderter Geometrie der planaren Induktivitäten nur mit unterschiedlich geführten Bonddrähten für unterschiedliche Anwendungen verschiedene Dimensionierungen erfahren, wodurch im Zusammenwirken mit dem ferromagnetischen Material größere Wertebereiche für die Induktivitätswerte erschlossen werden können. Die in Fig. 3 dargestellte Anordnung der Bonddrähte 22, 23 zeigt eine weitere Möglichkeit der Beschaltung der Spulen 20, 21, nämlich einen Übertrager. Vorzugsweise können die Anschlußflächen A bis D getrennt voneinander mit externen Bauelementen verbunden sein, insbesondere mit elektronischen Schaltern, durch die diese unterschiedlichen Zusammenschaltungen wahlweise vorgenommen werden können.In particular, in the exemplary embodiment according to FIG. 3, the arrangement of the coils 20 and 21 can be used for different functions or dimensions. By appropriately changing the bonding wires 22, 23, the first coil 20 or the second coil 21 alone, a coiled series connection of the coils 20, 21 or an oppositely coiled series connection of the coils 20, 21 can form the desired inductance. If the geometry of the planar inductors remains unchanged, this can therefore only have different dimensions with differently guided bond wires for different applications, which means that larger value ranges for the inductance values can be developed in cooperation with the ferromagnetic material. The arrangement of the bond wires 22, 23 shown in FIG. 3 shows a further possibility of connecting the coils 20, 21, namely a transformer. The connection areas A to D can preferably be connected separately from one another to external components, in particular to electronic switches, by means of which these different interconnections can optionally be carried out.

Die in den Figuren dargestellten Beispiele können in vielerlei Hinsicht abgewandelt werden. So können auf der Rückseite des Trägers 1 weitere Leiterstrukturen oder Bauelemente angeordnet werden. Es können auch flächige Träger zum Einsatz kommen, die einen mehrschichtigen Aufbau aus wechselweise einer Leiterstruktur und einer Isolierschicht aufweisen. Die Flächen des Trägers 1 außerhalb der Isolierstoffenster 12 können mit Abdeckmasse bzw. Coatingmaterial bedeckt werden, welches keine ferromagnetische Beimengung enthält. In jedem Fall sind selbst komplizierte Schaltungsanordnungen mit einfachen Fertigungsschritten herstellbar. Dabei werden zusätzlich zu den für die Hybridtechnik bzw. die Multichip-Modultechnik bereits eingesetzten Fertigungsanordnungen keine weiteren Maschinen, Geräte oder Vorrichtungen benötigt, da Herstellung und Abgleich der erfindungsgemäßen planaren Induktivitäten unmittelbar innerhalb der üblichen Fertigungsschritte für die Hybridtechnik bzw. die Multichip-Modultechnik erfolgen können.The examples shown in the figures can be modified in many ways. In this way, further conductor structures or components can be arranged on the back of the carrier 1. Flat supports can also be used which have a multilayer structure consisting of alternating conductor structures and an insulating layer. The surfaces of the carrier 1 outside the insulating material window 12 can be covered with masking compound or coating material which does not contain any ferromagnetic admixture. In any case, even complicated circuit arrangements can be produced with simple manufacturing steps. In addition to the No further machines, devices or devices are required for the manufacturing arrangements already used for the hybrid technology or the multichip module technology, since the planar inductors according to the invention can be produced and adjusted directly within the customary manufacturing steps for the hybrid technology or the multichip module technology.

Claims (5)

Planare Induktivität mit wenigstens einer auf einem flächigen Träger (1) aufgebrachten, im wesentlichen spiralförmigen Spule (23;20,21) und mit einem auf diesem Träger (1) angeordneten, im wesentlichen schichtförmigen, ferromagnetischen Material (13),
dadurch gekennzeichnet, daß das ferromagnetische Material (13) innerhalb eines auf dem Träger (1) befestigten Isolierstofffensters (12) im Coatingverfahren auf dem Träger (1) aufgebracht ist.Planar inductance with at least one essentially spiral coil (23; 20, 21) applied to a flat carrier (1) and with an essentially layered, ferromagnetic material (13) arranged on this carrier (1),
characterized in that the ferromagnetic material (13) is applied within an insulating material window (12) attached to the carrier (1) in a coating process on the carrier (1). Planare Induktivität nach Anspruch 1,
dadurch gekennzeichnet, daß das Isolierstoffenster (12) mit dem Träger (1) verklebt ist.Planar inductance according to claim 1,
characterized in that the insulating material window (12) is glued to the carrier (1). Planare Induktivität nach Anspruch 1 oder 2,
dadurch gekennzeichnet, daß das ferromagnetische Material (13) im wesentlichen aus einem mit einer ferromagnetischen Beimengung versetzten Coatingmaterial besteht.Planar inductance according to Claim 1 or 2,
characterized in that the ferromagnetic material (13) consists essentially of a coating material mixed with a ferromagnetic admixture. Planare Induktivität nach Anspruch 3,
dadurch gekennzeichnet, daß die ferromagnetische Beimengung im wesentlichen aus einem Ferritpulver besteht.Planar inductance according to claim 3,
characterized in that the ferromagnetic admixture consists essentially of a ferrite powder. Planare Induktivität nach einem der vorhergehenden Ansprüche,
dadurch gekennzeichnet, daß die Größe des (der) Induktivitätswerte(s) der Spule(n) (2,3; 20,21) und/oder die Kopplung zwischen den Spulen (2,3; 20,21) durch die Ausrichtung und/oder die Kontur des Isolierstoffensters (12) und/oder durch die Schichthöhe und/oder die Zusammensetzung des ferromagnetischen Materials (13) bestimmt ist.Planar inductance according to one of the preceding claims,
characterized in that the size of the inductance value (s) of the coil (s) (2, 3; 20, 21) and / or the coupling between the coils (2, 3; 20, 21) by the alignment and / or the contour of the insulating material window (12) and / or by the layer height and / or the composition of the ferromagnetic material (13) is determined.
EP95203290A 1994-12-02 1995-11-29 Planar inductor Expired - Lifetime EP0716432B1 (en)

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DE4442994A DE4442994A1 (en) 1994-12-02 1994-12-02 Planar inductance
DE4442994 1994-12-02

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US20040004525A1 (en) 2004-01-08
EP0716432B1 (en) 2000-02-23
US6722017B2 (en) 2004-04-20
JP3548643B2 (en) 2004-07-28

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