EP0715322A1 - Transformatoren - Google Patents
Transformatoren Download PDFInfo
- Publication number
- EP0715322A1 EP0715322A1 EP95308585A EP95308585A EP0715322A1 EP 0715322 A1 EP0715322 A1 EP 0715322A1 EP 95308585 A EP95308585 A EP 95308585A EP 95308585 A EP95308585 A EP 95308585A EP 0715322 A1 EP0715322 A1 EP 0715322A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layers
- transformer
- insulating material
- conductor tracks
- planar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 24
- 239000011810 insulating material Substances 0.000 claims abstract description 12
- 238000004804 winding Methods 0.000 claims description 26
- 229910000859 α-Fe Inorganic materials 0.000 claims description 14
- 239000012212 insulator Substances 0.000 description 21
- 238000010586 diagram Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000005204 segregation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2819—Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit
Definitions
- This invention relates to transformers and is particularly concerned with planar intrinsically safe transformers.
- Intrinsically safe transformers must comply with various standard which are set down for intrinsically safe equipment, in order to guarantee the integrity of the isolation between the electronic circuits.
- En 50 020 is such a standard and it defines a need for a minimum of lmm of solid insulation between individual circuits and therefore between the windings of a transformer which straddle the circuits. There is also a need to maintain 6mm clearance through air, and 10mm over surfaces between the exposed conductors of circuits.
- EP-A-0267108 describes a miniaturised transformer in which a plurality of substrate boards are stacked on top of each other, with conductors on the boards, and with the boards separated from each other by insulator layers.
- the conductors are arranged in the shape of a spiral so as to serve as the turns of the transformer windings.
- the substrate boards and the insulation layers are all very thin and the aim is to maximise magnetic coupling.
- GB-A-2087656 describes another miniaturised planar transformer using an E-core format with spiral windings printed on a ceramic printed circuit board. Two or more of these stacked inside the ferrite constitute the transformer.
- the aim here is a rugged, compact construction. It is not concerned with creepage and clearance distances with safety considerations in mind.
- EP-A-0608127 describes a transformer where the winding means consists of a number of individual annular turns deposited on a flexible polyimide substrate and then stacked to form the whole winding.
- EP-A-0542445 describes a flat transformer having planar windings of which at least one is contained in an electrically-insulating flat box sealed everywhere except at the exit points for the lead-out wires. It is designed particularly for switched mode power supplies.
- WO88/09042 describes a high coupling transformer with a plurality of layers of printed circuits which carry conducting tracks.
- PCB printed circuit board
- the transformer in accordance with the present invention requires very simple constructional techniques, thus making it easy to manufacture and avoiding the need for winding consolidation.
- the design also optimises the core ferrite cross-section and therefore the magnetic properties of the transformer.
- planar, intrinsically safe transformer comprising:
- the multilayer PCB itself consists of bonded layers of conductor tracks and insulators. If the insulators are made of standard PCB material, e.g. fibreglass, of sufficient thickness, then one can achieve the necessary standard for the isolation of the windings and also satisfy the criteria for the transformer to be intrinsically safe.
- standard PCB material e.g. fibreglass
- each face of the bonded assembly may comprise a conductor track or may be a layer of insulating material.
- the said first-mentioned layers are preferably at least 1mm thick.
- none of the conductor tracks extends to within lmm of the edge of the multilayer printed circuit board.
- Fig. 1 shows the general construction of the planar transformer.
- the design is based upon the use of a multilayer printed circuit board, indicated generally at 10, and low profile RM ferrite cores, indicated generally at 12.
- the PCB is made as a multilayer product, with more than one layer giving more than one winding and hence forming a transformer.
- the transformers of the present invention use low profile RM cores. This style of core maintains a large winding window, sufficient to make it 3 port (i.e. 3 isolated windings) with the full 1mm circuit separation and printed circuit windings.
- the RM core has two large openings in the ferrite which encloses the windings, through which the winds of the isolated circuits can be brought while still maintaining the necessary circuit segregation.
- Each of the core pieces 12 has a cylindrical stub 14 which extends into a hole 16 formed centrally through the multilayer PCB 10. The core pieces 12 are held in place in relation to the PCB 10 by a pair of securing members 18 which fit around the core pieces and snap into place thereon.
- FIG. 2 shows a section through an 8-track layer PCB set within the ferrite core 12.
- the PCB is here made up of three lmm thick layers of insulator 20a, 20b, 20c. Between each of these insulator layers and on the outer face of the outer layers 20a and 20c there is provided a thin insulator 22a, 22b, 22c, 22d. These thin layers are kept as thin as possible.
- Eight track layers TL1 to TL8, indicated by broken lines in Fig. 2, are provided.
- the track layers TL1, TL2 and TL7, TL8 arranged on each side of the thin insulators 22a and 22d respectively constitute a split primary, for low leakage inductance.
- the track layers TL3 to TL6 associated with the thin insulators 22b and 22c constitute buried secondaries.
- no track extends to within a predetermined distance from the edge of the board, here 1mm from the edge of the PCB, in order to give the necessary segregation. This predetermined distance is indicated as t in Fig. 2.
- the tracks TL3 to TL6 forming the winding can extend up to 1mm from the edge of the PCB provided that the layers of insulation are sufficiently bonded.
- the relatively thick insulator layers 20a, 20b and 20c which carry conductor tracks on both sides, have a thickness which is at least equal to said predetermined distance between the edge of the board and any buried conductor track TL3 to TL6, here 1mm.
- the conductor tracks TL1, TL2. TL7 and TL8 which constitute the primary can approach more closely to the edge of the board.
- Fig. 3 shows a modified structure, again utilising three thick insulator layers 20a, 20b and 20c and four thin insulators 22a, 22b, 22c and 22d, and with eight track layers TL1 to TL8.
- a further insulator layer 24a, 24b is provided at the top and at the bottom respectively of the PCB.
- These insulator layers 24a, 24b have a minimum thickness of 0.5mm.
- the printed circuit board has the windings etched as copper spirals around the central core.
- the track layers indicated at TL1, TL2, TL7 and TL8 typically have tracks which are 0.15mm in width with 0.15mm gaps separating the turns of the spiral.
- the track layers indicated at TL3, TL4, TL5 and TL6 typically have 0.3mm width tracks with 0.2mm gaps.
- the PCB shown in Fig. 3 contains four buried vias, from TL1 to TL2, from TL3 to TL4, from TL5 to TL6 and from TL7 to TL8. Again, as in Fig. 2, the buried track layers do not extend to within the distance t from the edge of the board.
- Fig. 4 there is shown a PCB comprising a 1mm insulator layer 26 with two outer insulator layers 28a and 28b each 0.5mm thick. Between layers 26 and 28a are two track layers TL1 and TL2 separated by a thin insulator 29a, and between insulator layers 26 and 28b are two further track layers TL3 and TL4, again separated by a thin insulator 29b. No track is provided on the outside of the outer insulator layers 28a and 28b.
- the PCB incorporates four buried vias (not shown).
- Fig. 5 shows the configuration of the PCB, with the central non-plated hole 16 for the core and with six plated holes for track connections.
- Fig. 6 shows a typical track 30 and indicates the orientation of the PCB relative to the RM ferrite core 12.
- Figs. 7 to 9 show an alternative design.
- This embodiment of PCB has two buried vias and two blind vias.
- Fig. 8 shows the configuration of the PCB with its different configuration of plated connection holes 34.
- the PCB is generally L-shaped.
- a typical track 36 is indicated in Fig. 9, together with the outline of the associated RM ferrite core 12. It is to be noted that in each of the embodiments the conductor track terminations 34 are positioned as far apart as possible from each other and from the ferrite core.
- the ferrite does not form one of the isolated circuits, it can be electrically floating and then the outermost insulation of the multilayer PCB need only be 0.5mm thick, as in Figs. 3 and 4.
- the predetermined distance between the edge of the board and any buried conductor track can be reduced, so that the winding tracks can run up to for example 0.5mm from the edge of the PCB. Close coupled windings can be formed by adjacent layers if they are not isolated, but a better arrangement is for two tracks to be wound together to form a bifilar winding, and even a centre tap configuration.
- planar equivalent which can be used in the embodiments of the present invention is to have the PCB spiral tracks etched as a concentric pair with two buried vias. This principle can be extended to produce centre-tapped windings by laying out a bifilar winding on the PCB and connecting the terminations in an appropriate manner.
- Figs. 10 and 11 show assembled transformers, each of a different configuration but embodying the principles described above. Again, low profile RM ferrite cores 12 are used. In Fig. 10 the ferrite is equally segregated from the primary and from the secondary, as shown in the circuit diagram. In Fig. 11 the ferrite is not isolated from the primary, but the two secondaries are fully segregated, again as can be seen from the circuit diagram.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9424349A GB9424349D0 (en) | 1994-12-02 | 1994-12-02 | Transformers |
GB9424349 | 1994-12-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0715322A1 true EP0715322A1 (de) | 1996-06-05 |
EP0715322B1 EP0715322B1 (de) | 1998-04-08 |
Family
ID=10765326
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19950308585 Expired - Lifetime EP0715322B1 (de) | 1994-12-02 | 1995-11-29 | Transformatoren |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0715322B1 (de) |
DE (1) | DE69502006T2 (de) |
GB (1) | GB9424349D0 (de) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999031681A1 (de) * | 1997-12-17 | 1999-06-24 | Trw Nelson Bolzenschweiss-Technik Gmbh & Co. Kg | Leistungsübertrager für ein leistungsschaltnetzteil, insbesondere für bolzenschweissgeräte |
US8258910B2 (en) | 2009-12-11 | 2012-09-04 | Krohne Messtechnik Gmbh | Planar transformer |
DE102012003364A1 (de) | 2012-02-22 | 2013-08-22 | Phoenix Contact Gmbh & Co. Kg | Planarer Übertrager |
DE102012003365A1 (de) | 2012-02-22 | 2013-08-22 | Phoenix Contact Gmbh & Co. Kg | Planarer Übertrager mit Schichtaufbau |
WO2013124048A1 (de) | 2012-02-22 | 2013-08-29 | Phoenix Contact Gmbh & Co. Kg | Planarer übertrager mit schichtaufbau |
DE102012016568A1 (de) | 2012-08-22 | 2014-02-27 | Phoenix Contact Gmbh & Co. Kg | Planarer Übertrager mit Schichtaufbau |
DE102012016570A1 (de) | 2012-08-22 | 2014-02-27 | Phoenix Contact Gmbh & Co. Kg | Planarer Übertrager |
DE102012111069A1 (de) | 2012-11-16 | 2014-05-22 | Phoenix Contact Gmbh & Co. Kg | Planarübertrager |
US20150235757A1 (en) * | 2014-02-19 | 2015-08-20 | General Electric Company | System and method for reducing partial discharge in high voltage planar transformers |
US9508485B1 (en) | 2012-10-04 | 2016-11-29 | Vlt, Inc. | Isolator with integral transformer |
US9967984B1 (en) | 2015-01-14 | 2018-05-08 | Vlt, Inc. | Power adapter packaging |
US20200211754A1 (en) * | 2018-12-30 | 2020-07-02 | Texas Instruments Incorporated | Galvanic isolation of integrated closed magnetic path transformer with bt laminate |
US10998903B1 (en) | 2016-04-05 | 2021-05-04 | Vicor Corporation | Method and apparatus for delivering power to semiconductors |
WO2022189603A1 (de) | 2021-03-12 | 2022-09-15 | Phoenix Contact Gmbh & Co.Kg | Übertrager mit nichtgeschlossenem magnetkern |
DE102022113571A1 (de) | 2022-05-30 | 2023-11-30 | Phoenix Contact Gmbh & Co. Kg | Kernloser planarer Übertrager |
WO2023232458A1 (de) | 2022-05-30 | 2023-12-07 | Phoenix Contact Gmbh & Co.Kg | Kernloser planarer übertrager |
US11990848B1 (en) | 2010-03-09 | 2024-05-21 | Vicor Corporation | Fault tolerant power converter |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2087656A (en) | 1980-11-14 | 1982-05-26 | Analog Devices Inc | Miniaturized transformer construction |
GB2163603A (en) * | 1984-08-25 | 1986-02-26 | Stc Plc | Miniature transformer or choke |
EP0267108A1 (de) | 1986-10-31 | 1988-05-11 | Digital Equipment Corporation | Miniaturisierter Transformator |
EP0267822A1 (de) * | 1986-10-15 | 1988-05-18 | Electronique Serge Dassault | Hochfrequenztransformator mit gedruckter Schaltungswicklung, insbesondere für sehr hohe Spannungsquelle |
WO1988009042A1 (fr) | 1987-05-15 | 1988-11-17 | Bull S.A. | Transformateur a fort couplage adapte a un circuit d'alimentation a decoupage et circuit d'alimentation a decoupage comportant un tel transformateur |
US4873757A (en) * | 1987-07-08 | 1989-10-17 | The Foxboro Company | Method of making a multilayer electrical coil |
WO1991015861A1 (en) * | 1990-03-30 | 1991-10-17 | Multisource Technology Corporation | Low-profile planar transformer for use in off-line switching power supplies |
EP0542445A1 (de) | 1991-11-14 | 1993-05-19 | Electrotech Instruments Limited | Flacher Transformator |
US5321380A (en) * | 1992-11-06 | 1994-06-14 | Power General Corporation | Low profile printed circuit board |
EP0608127A1 (de) | 1993-01-22 | 1994-07-27 | AT&T Corp. | Isolierungsanordnung für Magnetwindungen mit gestapelten flachen Leitern |
-
1994
- 1994-12-02 GB GB9424349A patent/GB9424349D0/en active Pending
-
1995
- 1995-11-29 DE DE1995602006 patent/DE69502006T2/de not_active Expired - Lifetime
- 1995-11-29 EP EP19950308585 patent/EP0715322B1/de not_active Expired - Lifetime
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2087656A (en) | 1980-11-14 | 1982-05-26 | Analog Devices Inc | Miniaturized transformer construction |
GB2163603A (en) * | 1984-08-25 | 1986-02-26 | Stc Plc | Miniature transformer or choke |
EP0267822A1 (de) * | 1986-10-15 | 1988-05-18 | Electronique Serge Dassault | Hochfrequenztransformator mit gedruckter Schaltungswicklung, insbesondere für sehr hohe Spannungsquelle |
EP0267108A1 (de) | 1986-10-31 | 1988-05-11 | Digital Equipment Corporation | Miniaturisierter Transformator |
WO1988009042A1 (fr) | 1987-05-15 | 1988-11-17 | Bull S.A. | Transformateur a fort couplage adapte a un circuit d'alimentation a decoupage et circuit d'alimentation a decoupage comportant un tel transformateur |
US4873757A (en) * | 1987-07-08 | 1989-10-17 | The Foxboro Company | Method of making a multilayer electrical coil |
WO1991015861A1 (en) * | 1990-03-30 | 1991-10-17 | Multisource Technology Corporation | Low-profile planar transformer for use in off-line switching power supplies |
EP0542445A1 (de) | 1991-11-14 | 1993-05-19 | Electrotech Instruments Limited | Flacher Transformator |
US5321380A (en) * | 1992-11-06 | 1994-06-14 | Power General Corporation | Low profile printed circuit board |
EP0608127A1 (de) | 1993-01-22 | 1994-07-27 | AT&T Corp. | Isolierungsanordnung für Magnetwindungen mit gestapelten flachen Leitern |
Cited By (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999031681A1 (de) * | 1997-12-17 | 1999-06-24 | Trw Nelson Bolzenschweiss-Technik Gmbh & Co. Kg | Leistungsübertrager für ein leistungsschaltnetzteil, insbesondere für bolzenschweissgeräte |
US8258910B2 (en) | 2009-12-11 | 2012-09-04 | Krohne Messtechnik Gmbh | Planar transformer |
US11990848B1 (en) | 2010-03-09 | 2024-05-21 | Vicor Corporation | Fault tolerant power converter |
DE102012003365B4 (de) * | 2012-02-22 | 2014-12-18 | Phoenix Contact Gmbh & Co. Kg | Planarer eigensicherer Übertrager mit Schichtaufbau |
WO2013124048A1 (de) | 2012-02-22 | 2013-08-29 | Phoenix Contact Gmbh & Co. Kg | Planarer übertrager mit schichtaufbau |
WO2013124049A1 (de) | 2012-02-22 | 2013-08-29 | Phoenix Contact Gmbh & Co. Kg | Planarer übertrager |
DE102012003365A1 (de) | 2012-02-22 | 2013-08-22 | Phoenix Contact Gmbh & Co. Kg | Planarer Übertrager mit Schichtaufbau |
US9508484B2 (en) | 2012-02-22 | 2016-11-29 | Phoenix Contact Gmbh & Co. Kg | Planar transmitter with a layered structure |
DE102012003364A1 (de) | 2012-02-22 | 2013-08-22 | Phoenix Contact Gmbh & Co. Kg | Planarer Übertrager |
US9460844B2 (en) | 2012-02-22 | 2016-10-04 | Phoenix Contact Gmbh & Co. Kg | Planar transmitter with a layered structure |
DE102012016568A1 (de) | 2012-08-22 | 2014-02-27 | Phoenix Contact Gmbh & Co. Kg | Planarer Übertrager mit Schichtaufbau |
DE102012016570A1 (de) | 2012-08-22 | 2014-02-27 | Phoenix Contact Gmbh & Co. Kg | Planarer Übertrager |
US9508485B1 (en) | 2012-10-04 | 2016-11-29 | Vlt, Inc. | Isolator with integral transformer |
US9711271B2 (en) | 2012-11-16 | 2017-07-18 | Phoenix Contact Gmbh & Co. Kg | Planar transformer |
DE102012111069A1 (de) | 2012-11-16 | 2014-05-22 | Phoenix Contact Gmbh & Co. Kg | Planarübertrager |
US20150235757A1 (en) * | 2014-02-19 | 2015-08-20 | General Electric Company | System and method for reducing partial discharge in high voltage planar transformers |
US10236113B2 (en) | 2014-02-19 | 2019-03-19 | General Electric Company | System and method for reducing partial discharge in high voltage planar transformers |
US9967984B1 (en) | 2015-01-14 | 2018-05-08 | Vlt, Inc. | Power adapter packaging |
US10398040B1 (en) | 2015-01-14 | 2019-08-27 | Vlt, Inc. | Power adapter packaging |
US11101795B1 (en) | 2016-04-05 | 2021-08-24 | Vicor Corporation | Method and apparatus for delivering power to semiconductors |
US10998903B1 (en) | 2016-04-05 | 2021-05-04 | Vicor Corporation | Method and apparatus for delivering power to semiconductors |
US11876520B1 (en) | 2016-04-05 | 2024-01-16 | Vicor Corporation | Method and apparatus for delivering power to semiconductors |
US11756718B2 (en) * | 2018-12-30 | 2023-09-12 | Texas Instruments Incorporated | Galvanic isolation of integrated closed magnetic path transformer with BT laminate |
US20200211754A1 (en) * | 2018-12-30 | 2020-07-02 | Texas Instruments Incorporated | Galvanic isolation of integrated closed magnetic path transformer with bt laminate |
WO2022189603A1 (de) | 2021-03-12 | 2022-09-15 | Phoenix Contact Gmbh & Co.Kg | Übertrager mit nichtgeschlossenem magnetkern |
DE102021106057A1 (de) | 2021-03-12 | 2022-09-15 | Phoenix Contact Gmbh & Co. Kg | Übertrager mit nichtgeschlossenem Magnetkern |
DE102022113571A1 (de) | 2022-05-30 | 2023-11-30 | Phoenix Contact Gmbh & Co. Kg | Kernloser planarer Übertrager |
WO2023232458A1 (de) | 2022-05-30 | 2023-12-07 | Phoenix Contact Gmbh & Co.Kg | Kernloser planarer übertrager |
BE1030569A1 (de) | 2022-05-30 | 2024-01-03 | Phoenix Contact Gmbh & Co | Kernloser planarer Übertrager |
Also Published As
Publication number | Publication date |
---|---|
DE69502006T2 (de) | 1998-07-23 |
EP0715322B1 (de) | 1998-04-08 |
DE69502006D1 (de) | 1998-05-14 |
GB9424349D0 (en) | 1995-01-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0715322B1 (de) | Transformatoren | |
US4313151A (en) | Flat electric coil with tap | |
US7342477B2 (en) | Inductor | |
US6867678B2 (en) | Transformer structure | |
US5321380A (en) | Low profile printed circuit board | |
EP0267108A1 (de) | Miniaturisierter Transformator | |
US5017902A (en) | Conductive film magnetic components | |
US6952153B2 (en) | Electrical transformer | |
JP2006516829A5 (de) | ||
US6307457B1 (en) | Planar transformer | |
GB2531354A (en) | An embedded magnetic component Device | |
US5479146A (en) | Pot core matrix transformer having improved heat rejection | |
US11450472B2 (en) | Electromagnetic device and method for manufacturing the same | |
GB2163603A (en) | Miniature transformer or choke | |
GB2087656A (en) | Miniaturized transformer construction | |
US5134770A (en) | Method of fabricating a high-frequency transformer | |
JPS61156802A (ja) | 小型トランス | |
CN108235572B (zh) | 具有磁性部件的电路板组件 | |
EP1211701A1 (de) | Planar-Induktivität mit einem ferromagnetischen Kern und Verfahren zu ihrer Herstellung | |
US11488763B2 (en) | Integrated transformer and electronic device | |
US20190333682A1 (en) | Transformer, method for manufacturing the same and electromagnetic device | |
GB2295728A (en) | Transformers | |
US5534838A (en) | Low profile high power surface mount transformer | |
US7113066B2 (en) | Electronic inductive and capacitive component | |
JPH0888122A (ja) | 多層プリントコイル基板及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE FR IT |
|
17P | Request for examination filed |
Effective date: 19970214 |
|
17Q | First examination report despatched |
Effective date: 19970320 |
|
GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
ITF | It: translation for a ep patent filed |
Owner name: DE DOMINICIS & MAYER S.R.L. |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): DE FR IT |
|
REF | Corresponds to: |
Ref document number: 69502006 Country of ref document: DE Date of ref document: 19980514 |
|
ET | Fr: translation filed | ||
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed | ||
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20141201 Year of fee payment: 20 Ref country code: FR Payment date: 20141027 Year of fee payment: 20 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: IT Payment date: 20141117 Year of fee payment: 20 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R071 Ref document number: 69502006 Country of ref document: DE |