EP0714773B1 - Procédé de liaison pour puces au silicium pour jet d'encre - Google Patents

Procédé de liaison pour puces au silicium pour jet d'encre Download PDF

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Publication number
EP0714773B1
EP0714773B1 EP19950308614 EP95308614A EP0714773B1 EP 0714773 B1 EP0714773 B1 EP 0714773B1 EP 19950308614 EP19950308614 EP 19950308614 EP 95308614 A EP95308614 A EP 95308614A EP 0714773 B1 EP0714773 B1 EP 0714773B1
Authority
EP
European Patent Office
Prior art keywords
epoxy resin
chip
pen body
coupling agent
thin coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP19950308614
Other languages
German (de)
English (en)
Other versions
EP0714773A3 (fr
EP0714773A2 (fr
Inventor
Robert Arnold Christiansen
Peter Jon Eisele
Tonya Harris Jackson
Gary Raymond Williams
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lexmark International Inc
Original Assignee
Lexmark International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lexmark International Inc filed Critical Lexmark International Inc
Publication of EP0714773A2 publication Critical patent/EP0714773A2/fr
Publication of EP0714773A3 publication Critical patent/EP0714773A3/fr
Application granted granted Critical
Publication of EP0714773B1 publication Critical patent/EP0714773B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1635—Manufacturing processes dividing the wafer into individual chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14362—Assembling elements of heads

Definitions

  • the present invention is concerned with a process for bonding a silicon chip to the pen body of an ink jet printer.
  • the present invention is concerned with a solution for one such demand, namely a process for bonding the silicon chip to the pen body of the ink jet printer.
  • the bond between the ink jet silicon chip and the pen body of the ink jet printer is subject to very severe attack, especially because in usage the temperature is very high and the bond is exposed to aqueous-base liquid inks commonly containing organic cosolvents and also having very high (alkaline) pH. Not only does the bond have to serve to attach the chip to the pen body, but it also has to form a leak resistant bond around the chip to prevent ink transfer to the user.
  • the bonding material also must be such that it does not change the properties of the ink used in the system, and in modern color printers three different inks are commonly used. Additionally, the cure temperature of the adhesive material must be below the glass transition temperature of the plastic which forms the pen body.
  • the vias in the chip must be separated, generally by an adhesive, which serves as a barrier or sealant around each via to prevent ink mixing. Furthermore, the adhesive must serve as a gasket around the chip to prevent ink mixing. Furthermore, the adhesive must serve as a gasket around the chip to prevent inks from leaking to outside the body. Increasingly closer via spacing to provide ever-higher dots-per-inch (dpi) print resolution puts extreme demands on an adhesive to make a reliable bond in a very harsh environment.
  • dpi dots-per-inch
  • a method for improving adhesion at the adhesive to silicon interface is necessary to prevent two failure possibilities. If an adhesive failure occurs at that interface, then the primary colors will flow freely, thereby resulting in ink mixing. Secondly, if the adhesive to chip interface fails at the perimeter, the ink will leak, and ink can be transferred to the user through routine handling. Both types of failures would be considered reliability failures.
  • the silicon chip is first covered with a thin coating of a silane coupling agent. This coating is applied on the side of the chip that does not contain the electronic circuitry.
  • the coating of the silane coupling agent is in turn coated with a thin (about 0.5 to about 5.0 ⁇ m (microns)) layer of an epoxy resin, which is then cured at a temperature of about 175°C.
  • the above steps are carried out on a multi-chip silicon wafer, which can then be subjected to subsequent manufacturing operations. Hundreds of chips can be treated on a single silicon wafer.
  • the chip is attached to the pen body using an epoxy which cures at a temperature of 100°C or less.
  • a preferred silane coupling agent is Dow Corning Z6032, a vinylbenzylamine functional silane.
  • the commercial material is prehydrolyzed by adding 5% water by weight to the silane solution. It is then diluted to a 1% functional silane solution using ethanol. This solution is spread on the non-circuitry bearing side of the stationary silicon wafer and allowed to sit for 20-30 seconds. The wafer is then spun for 45 seconds at 2,000 RPM to remove the excess and dry the wafer surface.
  • a preferred high temperature cure epoxy is a tertiary amine cured compound such as Ablebond 968, from the Ablestik Co. This material is used without filler. It is first diluted with gamma butyrolactone in a 1 to 1 ratio. Approximately 2 mL of this solution is deposited in the center of the wafer after the silane has been deposited. The wafer is spun at 2,500 RPM for 45 seconds. This results in a uniform film of epoxy approximately 0.8 ⁇ m (microns) thick on the wafer. The wafer is then baked for 2 hours at 175°C to cure the epoxy.
  • the wafer is cut into individual chips, which are attached to the pen body by means of a polybenzimidazole low temperature curing epoxy, such as Emerson-Cuming LA3032-78, an epoxy which is cured at about 100°C.
  • a polybenzimidazole low temperature curing epoxy such as Emerson-Cuming LA3032-78, an epoxy which is cured at about 100°C.
  • Pen bodies are most commonly injection molded thermoplastic materials such as modified polyphenylene oxide (PPO).
  • PPO modified polyphenylene oxide
  • the elevated temperature resistance of such material sets a maximum cure temperature allowable for subsequent processes, such as attachment of the inkjet chip and nozzle assembly to the body.
  • the process of the present invention is characterized by the use of two different epoxy resins, the first of which cures at a temperature above the heat distortion temperature of the plastic pen body, and the second of which cures at a temperature below the heat distortion temperature of the plastic pen body.
  • the chips When attached to the pen body, the chips have an ink via extending into the chips bounded by the coupling agent, the first epoxy resin and the second epoxy resin.

Claims (9)

  1. Procédé de liaison d'une puce au silicium pour jet d'encre à la tête d'impression plastique d'une imprimante à jet d'encre, ledit procédé comprenant les étapes :
    1) d'application sur le côté ne contenant pas de circuits de ladite puce d'un mince revêtement d'un agent de couplage de type silane ;
    2) d'application sur ledit agent de couplage d'un mince revêtement d'une première résine époxy;
    3) de durcissement de ladite première résine époxy à une température supérieure à la température de déformation à la chaleur de la tête d'impression plastique;
    4) de fixation de la puce revêtue à la tête d'impression plastique au moyen d'une seconde résine époxy qui est durcie à une température inférieure à la température de déformation à la chaleur de la tête d'impression plastique.
  2. Procédé de liaison d'une puce au silicium pour jet d'encre à la tête d'impression plastique d'une imprimante à jet d'encre, ledit procédé comprenant les étapes :
    1) d'application sur le côté ne contenant pas de circuits de ladite puce d'un mince revêtement d'un agent de couplage de type silane ;
    2) d'application sur ledit agent de couplage d'un mince revêtement d'une première résine époxy;
    3) de durcissement de ladite première résine époxy à une température d'environ 175°C; et
    4) de fixation de la puce revêtue à la tête d'impression plastique au moyen d'une seconde résine époxy qui est durcie à une température de 100°C ou moins.
  3. Procédé suivant la revendication 1, dans lequel le mince revêtement de l'agent de couplage de type silane et le mince revêtement de la première résine époxy sont appliqués chacun par un traitement centrifuge.
  4. Procédé suivant la revendication 1, dans lequel l'application du mince revêtement d'un agent de couplage de type silane et l'application du mince revêtement de la première résine époxy sont réalisées sur une plaquette de silicium multipuce.
  5. Procédé suivant la revendication 1, dans lequel le mince revêtement de la première résine époxy a une épaisseur d'environ 0,5 à environ 5,0 µm.
  6. Procédé suivant la revendication 1, dans lequel l'agent de couplage de type silane est un silane fonctionnel vinylbenzylamine.
  7. Procédé suivant l'une quelconque des revendications précédentes, dans lequel ladite puce, lors qu'elle est attachée à la tête d'impression, comprend un passage pour l'encre qui se prolonge dans ladite puce liée par ledit agent de couplage, ladite première résine époxy et ladite seconde résine époxy.
  8. Procédé de liaison pour puces au silicium pour jet d'encre à la tête d'impression plastique d'une imprimante à jet d'encre, ledit procédé comprenant les étapes :
    1) d'application centrifuge sur le côté ne contenant pas de circuits d'une plaquette de silicium multipuce d'un mince revêtement d'un silane fonctionnel vinylbenzylamine ;
    2) d'application centrifuge sur ledit mince revêtement d'un revêtement d'environ 0,8 µm d'épaisseur d'une première résine époxy;
    3) de durcissement de ladite première résine époxy à une température d'environ 175°C;
    4) de séparation de ladite plaquette de silicium multipuce en puces individuelles; et
    5) de fixation desdites puces individuelles à la tête d'impression au moyen d'une seconde résine époxy qui est durcie à une température de 100°C ou moins.
  9. Procédé suivant la revendication 8, dans lequel les puces, lorsqu'elles sont attachées à la tête d'impression, comprennent un passage pour l'encre qui se prolonge dans lesdites puces liées par ledit agent de couplage, ladite première résine époxy et ladite seconde résine époxy.
EP19950308614 1994-12-01 1995-11-29 Procédé de liaison pour puces au silicium pour jet d'encre Expired - Lifetime EP0714773B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US347634 1989-05-05
US34763494A 1994-12-01 1994-12-01

Publications (3)

Publication Number Publication Date
EP0714773A2 EP0714773A2 (fr) 1996-06-05
EP0714773A3 EP0714773A3 (fr) 1997-04-16
EP0714773B1 true EP0714773B1 (fr) 1999-10-13

Family

ID=23364570

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19950308614 Expired - Lifetime EP0714773B1 (fr) 1994-12-01 1995-11-29 Procédé de liaison pour puces au silicium pour jet d'encre

Country Status (3)

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EP (1) EP0714773B1 (fr)
JP (1) JP3718731B2 (fr)
DE (1) DE69512743T2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6257703B1 (en) * 1996-07-31 2001-07-10 Canon Kabushiki Kaisha Ink jet recording head
CN1197008A (zh) * 1997-03-27 1998-10-28 莱克斯马克国际公司 软性电路与蓄墨容器连接的方法以及形成密封层的方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4326238A (en) * 1977-12-28 1982-04-20 Fujitsu Limited Electronic circuit packages
US5030308A (en) * 1986-07-14 1991-07-09 National Starch And Chemical Investment Holding Corporation Method of bonding a semiconductor chip to a substrate
US4783428A (en) * 1987-11-23 1988-11-08 Motorola Inc. Method of producing a thermogenetic semiconductor device
US5013383A (en) * 1989-07-11 1991-05-07 Hewlett-Packard Company Epoxy adhesive for use with thermal ink-jet printers

Also Published As

Publication number Publication date
JP3718731B2 (ja) 2005-11-24
JPH08227914A (ja) 1996-09-03
DE69512743T2 (de) 2000-05-04
DE69512743D1 (de) 1999-11-18
EP0714773A3 (fr) 1997-04-16
EP0714773A2 (fr) 1996-06-05

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