Classifications

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  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
  • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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  • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
  • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
  • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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  • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
  • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
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  • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
  • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
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  • H01L2224/10—Bump connectors; Manufacturing methods related thereto
  • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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  • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
  • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
  • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
  • H01L2224/29001—Core members of the layer connector
  • H01L2224/29099—Material
  • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
  • H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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  • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
  • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
  • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
  • H01L2224/29001—Core members of the layer connector
  • H01L2224/29099—Material
  • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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  • H01L2224/732—Location after the connecting process
  • H01L2224/73251—Location after the connecting process on different surfaces
  • H01L2224/73253—Bump and layer connectors
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  • H01L2924/10—Details of semiconductor or other solid state devices to be connected
  • H01L2924/11—Device type
  • H01L2924/14—Integrated circuits
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  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/151—Die mounting substrate
  • H01L2924/153—Connection portion
  • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
  • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
• • H—ELECTRICITY
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  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/151—Die mounting substrate
  • H01L2924/156—Material
  • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
  • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
• • H—ELECTRICITY
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  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/161—Cap
  • H01L2924/1615—Shape
  • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Definitions

• This invention relates to heat conducting mechanisms; and more particularly, it relates to such mechanisms in integrated circuit packages, which conduct heat away from the integrated circuit chips that lie therein.
• thermal grease a material respectively known as a "thermal grease” and a “liquid metal paste” have been developed. These materials are placed in the joint to fill any voids which may lie therein; and they are described in US patent 5,056,706 by T. Dolbear , C. Mackay, and R. Nelson entitled “Liquid Metal Paste For Thermal And Electrical Connections”.
• a drawback of the thermal grease is that it's thermal conductivity, in comparison to the thermal conductivity of a liquid metal, is relatively low. See patent 5,056,706 at column 2, lines 24-29.
• the relative portions of the constituent materials can be changed.
• the degree to which it fills the voids in the joint decreases; and thus the thermal conductivity through the joint decreases.
• Figure 5 of patent 5,056,706 shows a phase diagram of a liquid metal paste which is a mixture of Al and Ga; and column 8, lines 44-47 says that "any mixtures of the Al and Ga between the lines 30 and 32 at the temperatures involved will remain a paste and be suitable for the applications herein discussed.”
• a mixture at one extreme of 65% Ga and 35% Al is nearly a liquid (which will require a separate barrier to hold it in place); and a mixture of the other extreme of 1% Ga and 99% Al is essentially a solid (which is too stiff to fill voids or gaps in a joint.
• liquid metal paste has an ideal viscosity, it still often requires a separate physical barrier to hold it in place. This occurs when the width of the gap which the paste is to fill varies significantly due to dimensional tolerances. In that case, a portion of the paste can get squeezed out of the gap and cause a short or other defect in the package.
• a primary object of the invention is to provide an integrated circuit package in which the above problems are overcome.
• an integrated circuit package is comprised of an integrated circuit chip, a substrate which holds the chip, and a heat conduction mechanism which is coupled to the chip and which provides a path for conducting heat from the chip to a fluid medium.
• this heat conduction mechanism further includes a) a compliant body, having microscopic voids throughout, which is disposed in and fills a gap in the heat conducting path, and b) a liquid metal alloy that is absorbed in the microscopic voids of the compliant body and partially fills them.
• the compliant body is continuous and porous, and the liquid metal alloy adheres to the surfaces but does not fill most of the pores.
• the compliant body is a mesh of multiple interval fibers, and the liquid metal alloy adheres to the surfaces but does not fill the mesh.
• the thermal conductivity through the body is high. Also, due to the voids in the body being only partially filled with the liquid metal alloy, the body can be compressed by dimensional variations within the integrated circuit package without squeezing out any of the liquid metal alloy that is held therein. Consequently, the need for a separate barrier for the liquid metal alloy within the integrated circuit package is eliminated.
• Fig. 1 is a pictorial view, at approximately actual size, of an integrated circuit package which is a first preferred embodiment of the invention
• Fig. 2 is a greatly enlarged sectional view of the Fig. 1 embodiment taken along section lines 2-2;
• Fig. 3 shows the microscopic structure of a compliant spongy member within the embodiment of FIG's. 1 and 2;
• FIG's. 4A - 4F are a set of sketches and microphotographs which together illustrate the steps of a preferred process for fabricating the embodiment of FIG's. 1-3;
• Fig. 5 is a sectional view of an integrated circuit package which is a second preferred embodiment of the invention.
• Fig. 6 is a sectional view of an integrated circuit package which is a third preferred embodiment of the invention.
• Fig. 7 shows the microscopic structure of a compliant spongy member, which is an alternative to the compliant spongy member of Fig.3 in the integrated circuit packages of FIG's. 2, 5 and 6.
• This integrated circuit package 10 includes an integrated circuit chip 11 having input/output terminals 11a, a ceramic substrate 12 having input/output terminals 12a, a lid 13, a heatsink 14, and a spongy compliant member 15 which lies between the chip 11 and the lid 14.
• Each of the chip terminals 11a is a solder bump which is soldered to a signal pad (not shown) on the top surface of the substrate 12; and each of the substrate terminals 12a is a metal pin which is brazed to a signal pad (not shown) on the bottom surface of the substrate 12.
• the lid 13 is attached by solder or epoxy 13a to the substrate 12, and the heat sink 14 is attached by solder or a thermally conductive epoxy to the lid 13.
• member 15 is held in place simply by being squeezed between the chip 11 and the lid 13.
• the chip 11 includes thousands of microscopic electronic circuits (not shown) which can be of any type, such as digital logic circuits. Electrical signals and power are sent to and received from these circuits over signal lines which run through the substrate 12 and interconnect the chip terminals 11a to the substrate terminals 12a. One such signal line is indicated as an example by reference numeral 12b.
• the chip 11 While the circuits on the chip 11 are sending and receiving signals as described above, the chip 11 dissipates heat. And the primary function which is performed by the components 13, 14, and 15 in combination is to provide a highly efficient heat conduction mechanism which carries heat away from the chip 11. Now in order for the heat conduction path through the components 13, 14, and 15 to have a high thermal conductivity, it is critical that the gap G between the chip 11 and the lid 13 be completely filled by member 15, and that member 15 itself have a high thermal conductivity. These two requirements are met in accordance with the present invention by providing member 15 with a microscopic structure as shown in Fig. 3.
• Reference numeral 15a in Fig. 3 indicates a porous spongy body; and, reference numeral 15b indicates a coating of a liquid metal alloy on the surface of the pores in the body 15a. These pores, with the liquid metal alloy 15b, run throughout the body 15a; and thus the liquid metal provides a continuous heat conducting path through the body.
• the thermal conductivities of items 15a, 15b, and 15 respectively are 0.01 watts /(meter-degree C), 30-100 watts /(meter-degree C), and 5-20 watts /(meter-degree C).
• Another important feature of member 15 is that due to its spongy body 15a, it accommodates variations in the width of the gap G between the chip 11 and the lid 13.
• a numerical example of the types of tolerances which member 15 accommodates is as follows: flatness variations in the top surface of substrate 12 of 2 mils per inch; height variations in the lid bond 13a of ⁇ 2 mil; height variations in the lid 13 itself of ⁇ 3 mils when the lid is formed by stamping; and , chip thickness variations of ⁇ 1 mil. These dimensional tolerances, with a substrate that is two inches long, give rise to a gap width variation of ⁇ 10 mils.
• member 15 eliminates the need for a separate physical barrier around the perimeter of the top surface of the chip 11 in order to hold the liquid metal alloy 15b in place. This feature is achieved because the liquid metal alloy 15b is held in place by the high surface tension of the liquid metal alloy, and the adhesive forces between the liquid metal alloy and the surfaces of the porous body 15a. Also, since the liquid metal alloy 15b does not completely fill the pores, the porous body 15a can be squeezed to accommodate variations in the gap G without causing the liquid metal alloy 15a to ooze out.
• member 15 eliminates the need to provide the lid 13 with any fill hole through which the liquid metal alloy can be entered behind the barrier; and, it also eliminates the step of entering the liquid metal and subsequently plugging the fill hole.
• FIG. 4A a tub 20 of the liquid metal alloy 15b is provided as shown in Fig. 4A.
• the spongy porous body 15a is placed in the tub 20 and mixed with the liquid metal alloy 15b as shown in Fig. 4B. Due to the Fig. 4B step, the spongy porous body 15a becomes saturated with the liquid metal alloy 15b.
• Figs. 4C and 4D which respectively show the spongy porous body before (15a) and after (15a') it is mixed with the liquid metal alloy 15b.
• FIG. 5 Another integrated circuit package 30 which constitutes a second embodiment of the invention is shown in Fig. 5.
• This integrated circuit package 30 includes an integrated circuit chip 31, input/output wire bond terminals 31a, a ceramic substrate 32 having input/output terminals 32a, a lid 33, a heat sink 34, a retainer 35, and a spongy compliant member 36 which lies between the substrate 32 and the heat sink 34.
• Chip 31 is soldered to the substrate 32, and the lid 33 is also soldered to the substrate 32.
• the heat sink 34 and spongy compliant member 36 are held is place by the retainer 35 which acts as a spring that squeezes all of the components 32, 34, and 36 together.
• the spongy compliant member 36 has the same structure and is made by the same process as the previously described member 15. Consequently, the integrated circuit package 30 has all of the features that were previously described in conjunction with member 15.
• This integrated circuit package 40 includes two integrated circuit chips 41 and 42 having solder bumps 41a and 42a for input/output terminals, a ceramic substrate 43 having pins 43a for input/output terminals, a conduit 44 which carries a liquid coolant 45 (such as water), a retainer 46, and a spongy compliant member 47 which lies between the conduit 44 and the chips 41 and 42.
• Each of the chips 41 and 42 are soldered via their solder bumps 41a and 42a to signal pads (not shown) on the substrate 43; and, the retainer 46 also is soldered or epoxied to the substrate 43.
• Member 47 is held at spots with an adhesive 48, such as two-sided sticky tape, to the conduit 44. Since the area of the adhesive spots 48 is very small relative to top surface area of the chips 41 and 42, any lowering of the thermal conductivity through member 47 is negligible.
• the conduit 44 and member 47 are held in place by the retainer 46 which squeezes member 47 against the chips 41 and 42.
• member 47 has the same structure and is made by the same process as member 15 of Figs. 2-4F; and thus, the integrated circuit package 40 has all of the features that were described in conjunction with member 15.
• FIG. 7 shows the microscopic structure of a member 50 which is alternative embodiment of the previously described members 15, 36, and 47.
• member 50 is structured as a mesh of multiple interwoven fibers 50a; and these fibers are coated with a liquid metal alloy 50b.
• An example of two specific materials that were used by the present inventors to actually construct the fibrous mesh 50a with the liquid metal alloy respectively are cellulose and Ga, Sn, Zn (82%, 12%, 6%).
• the liquid alloy 50b is again held on the fibrous mesh 50a by the high surface tension of the liquid metal alloy, and the adhesive forces between the liquid metal alloy and the surfaces of the porous body 15a.
• the fibrous mesh 50a makes the member 50 compliant and spongy; and, all of the spaces between the fibers are not completely full of the liquid metal alloy.
• member 50 has all of the features of member 15. These features include a) a high thermal conductivity through the liquid metal alloy 50b, and b) an ability to be squeezed by dimensional variations within an integrated circuit package and/or by a springy retainer without losing hold of the liquid metal. Thus, the need for a separate barrier for the liquid metal within the integrated circuit package is eliminated.
• step 4E can change such that excess liquid metal alloy is removed from the mesh 50a and porous body 15a by either by vacuuming or shaking or centrifuging those components.
• the above described compliant members 15 of Fig. 3 and 50 of Fig. 7 can be constructed of a wide variety of materials. A listing of suitable materials which is not all inclusive is given below.
• Organic Plastics for example - Polyurethane, Polyethlene, Neoprene,
• Ga, In, Sn, Zn (50%-70%, 15%-35%, 5%-20%, 0.1%-5%) Ga, In, Sn (50%-70%, 15%-35%, 5%-20%)
• the members 15 of Fig. 3 and 50 of Fig. 7 can be used to conduct heat in heat conducting mechanisms of any kind. That is, although the members 15 and 50 were originally developed to satisfy a need to adequately cool integrated circuits as has been described above, those same members can likewise be used to carry heat away from a variety of other hot objects - such as a power transistor, or a lamp, etc.

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• 1994
  • 1994-03-24 JP JP6522186A patent/JPH08508611A/ja active Pending
  • 1994-03-24 CA CA002158255A patent/CA2158255A1/en not_active Abandoned
  • 1994-03-24 WO PCT/US1994/003204 patent/WO1994023450A1/en not_active Application Discontinuation
  • 1994-03-24 EP EP94912859A patent/EP0692142A1/de not_active Withdrawn
  • 1994-03-24 KR KR1019950703994A patent/KR960701470A/ko not_active Application Discontinuation

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