EP0689558A1

EP0689558A1 - Phosphorus-modified epoxy resins, process for producing them and their use

Info

Publication number: EP0689558A1
Application number: EP94911148A
Authority: EP
Inventors: Wolfgang Von Gentzkow; Jürgen Huber; Heinrich Kapitza; Wolfgang Rogler; Hans-Jerg Kleiner; Uwe Schönamsgruber
Original assignee: Hoechst AG; Siemens AG
Current assignee: Hoechst AG; Siemens AG
Priority date: 1993-03-15
Filing date: 1994-03-10
Publication date: 1996-01-03
Also published as: CA2158361A1; CN1119446A; HU9502640D0; HUT73148A; FI954291A0; CN1051325C; KR960701117A; WO1994021704A1; FI954291A; RU2129570C1; SG72674A1; CZ240195A3; HU214503B; US5756638A; JPH08507812A; PL310628A1

Abstract

The present invention pertains to phosphorus-modified epoxy resins with an epoxy value of 0 to 1 mol/100 g, containing structural units that derive: (A) from polyepoxy compounds with at least two epoxy groups per molecule and (B) from phosphinic acid anhydrides and/or phosphonic acid anhydrides. The invention further concerns a process for producing these phosphorus-modified epoxy resins and their use in producing moldings, coatings or laminates.

Description

Phosphorus-modified epoxy resins, process for their preparation and their use

The present invention deals with novel phosphorus-containing epoxy resins, a process for their preparation and their use. In addition to their flame retardancy, the new phosphorus-containing epoxy resins are particularly notable for their processing-friendly behavior, since they have, among other things, good storage stability.

Today epoxy resins are widely used for the production of reactive resin molding materials and coatings with a high level of thermal, mechanical and electrical properties as well as for the production of laminates. The low molecular weight or oligomeric starting components can be used in a wide variety of ways

Convert hardeners, such as carboxylic acid anhydrides, amines, phenols or isocyanates, or by ionic polymerization, to high-quality thermosetting materials. Another advantage of epoxy resins is their processing behavior. In the initial state, they are low molecular weight or oligomeric and show low viscosity at processing temperatures. They are therefore very suitable for potting complex electrical or electronic components as well as for impregnation and impregnation processes. In the presence of suitable reaction accelerators, they have sufficient pot lives. They are also highly fillable with the usual inorganic inert fillers.

In order to protect people in the event of a fire or malfunction and to maintain their function in electrical or electronic devices for a certain period of time, epoxy resin molded materials are used today in electrical engineering (hardened epoxy resins) often made the demand for flame retardancy. This means that epoxy resin molding materials must be self-extinguishing and must not spread the fire. The detailed requirements are specified in the standards relating to the respective product. The flammability test according to UL 94V mainly applies to epoxy resin molding materials used in electronics or electrical engineering.

A compilation of the possible methods for flame retardant adjustment of epoxy resins can be found in the literature (e.g. Troitzsch, J., "International Plastics Flammability Handbook", 2nd edition, Carl Hanser Verlag, Munich,

1990; Yehaskel, A., "Fire and Flame Retardant Polymers, Noyes Data Corporation, New Jersey, USA, 1979).

Epoxy resin molding materials are generally made flame-retardant today using halogen-containing, especially bromine-containing aromatic components. These are mostly storage components, e.g. Filler or glass fabric containing molding materials that often contain antimony trioxide as a synergist. The problem here is that in the event of a malfunction, smoldering or burning causes corrosive decomposition products which are ecologically or toxicologically questionable under unfavorable conditions. For a safe one

Disposal by incineration requires considerable technical effort.

There is therefore a considerable need for epoxy resins that achieve the flame resistance required by the standards without the addition of halogenated components.

The use of organic phosphorus compounds has proven to be an effective way of achieving flame retardancy in the case of resinous substrates. Attempts have already been made to use epoxy resins with additives based on

To modify phosphoric acid esters such as triphenyl phosphate (DE 1 .287.312). However, these compounds migrate from the molded materials to the surface, especially at elevated temperatures, and have an influence on the dielectric properties and on E-corrosion.

Epoxy resins with chemically bound phosphorus could be obtained by reacting commercially available epoxy resins with P-OH groups of various phosphoric acids, the P-OH group being added to the oxirane ring and at the same time partially causing epoxy polymerization. This results in phosphorus-modified epoxy resins that are still reactive and that are integrated into the network when hardened.

Examples of the crosslinking of epoxy resins with phosphoric acid, acidic phosphoric acid esters and pyrophosphate diesters as acidic crosslinking agents are described in US Pat. No. 2,541,027. In some cases, corresponding reaction products are initially produced, which are then crosslinked. These reaction products are not storage-stable products. Similar products are even used in catalytic amounts as accelerators for epoxy curing (FR patent specification 2.008.402).

Attempts have also been described to crosslink epoxy resins with phosphonic acids (ZA patent 6805283).

From US Pat. No. 4,613,661, reaction products of phosphoric acid monoesters and epoxy resins are also known which still contain free epoxy groups and are curable with conventional crosslinking agents.

These products are important for certain paint and coating systems.

The object of the invention was therefore to provide phosphorus-modified epoxy resins which, in addition to being flame-retardant, have high storage stability, permit variations in the phosphorus content, are simple and inexpensive to produce and are also particularly suitable for use in electronics and electrical engineering, where high filler contents are common . The present invention now relates to phosphorus-modified epoxy resins with an epoxy value of 0 to about 1 mol / 100 g, containing structural units which are derived

(A) of polyepoxide compounds with at least two epoxy groups, preferably terminal epoxy groups, per molecule and (B) of phosphine and / or phosphonic anhydrides.

Furthermore, the invention relates to methods for producing such phosphorus-modified epoxy resins and to their use for producing moldings, coatings and laminates (composite materials) and these objects themselves.

Depending on the epoxy resin, the phosphorus-modified epoxy resins according to the invention generally have a phosphorus content of about 0.5 to 13% by weight, based on the resin. This phosphorus content can be adjusted as required by the molar ratio of polyepoxide compound to phosphinic anhydride / phosphonic anhydride. Due to the functionality of the epoxy resin used, the requirement can further be met that at least one epoxy group per molecule of the phosphorus-modified epoxy resin should preferably be contained on average.

The phosphorus-modified epoxy resins according to the invention preferably have a phosphorus content of about 1 to 8% by weight, in particular about 2 to 5% by weight, based on the resin. They are preferably curable. in the

Agents preferably contain at least one epoxy group, in particular 1 to 3 epoxy groups per molecule; the average functionality is accordingly preferably at least 1, in particular 1 to 3. The epoxy value is preferably approximately 0.02 to 1 mol / 100 g, particularly preferably approximately 0.02 to 0.6 mol / 100 g. Furthermore, the phosphorus-modified epoxy resins according to the invention generally have an average molecular weight M _n (number average; determined by means of gel chromatography; Polystyrene standard) of up to about 10,000, preferably from about 20 to 5000 and in particular from about 400 to 2000.

The average molecular weight M _n (number average; likewise determined by means of gel chromatography; polystyrene standard) of the building blocks (A) is generally up to about 9000 and is preferably between about 150 and 4000, in particular between about 300 and 1800; they are preferably derived from polyepoxide compounds with an average of 2 to 6 epoxy groups per molecule (a functionality of 2 to 6). These polyepoxide compounds are preferably polyglycidyl ethers based on aromatic amines, polyhydric phenols, hydrogenation products of these phenols and / or novolaks (see below for this).

The structural units (B) are preferably derived from phosphinic anhydrides of the formulas (I) and / or (II)

in which mean

R and R independently of one another have a hydrocarbon radical of 1 to 20 carbon atoms, preferably 1 to 10 carbon atoms, of aliphatic and / or aromatic character and which can be interrupted by heteroatoms or heteroatom groups, preferably a saturated or unsaturated, straight-chain or branched aliphatic Rest, such as alkyl, alkenyl, Cycloalkyl, preferably having 1 to 8 carbon atoms, in particular 1 to 6 carbon atoms, such as methyl, ethyl, n- and i-propyl, n-, i- and tert-butyl, the various pentyls and hexyls, or one Aryl or an aralkyl radical, such as unsubstituted or phenyl or naphthyl which is preferably substituted by 1 to 3 alkyl radicals having 1 to 6 C atoms or phenylalkyl having 1 to 6 C atoms in the alkyl radical, for example benzyl;

A has a divalent hydrocarbon radical with 1 to 10 C atoms, preferably 1 to 6 C atoms and in particular 1 to 4 C atoms, which has an aliphatic and / or aromatic character and can be interrupted by heteroatoms or heteroatom groups, preferably a divalent saturated or unsaturated, straight-chain or branched aliphatic radical and in particular an alkylene radical, such as methylene, propylene and the like. y is an integer from at least 1, preferably from 1 to 100 and in particular from 1 to 30, the bridge member A preferably being at least 2 carbon atoms when y = 1. Possesses atoms.

The structural units (B) are preferably also derived from phosphonic anhydrides of the formula (III)

in which R ^{3 has} the same meaning as R / R ¹ according to formulas (I) or (II) and z represents at least 3, preferably 3 to 100 and in particular 20 to 60. In addition to these structural units, there may also be those which are derived from phosphinic anhydrides of the above formulas (I) and / or (II). According to a preferred embodiment of the invention, the phosphorus-modified epoxy resin of the invention essentially has the structure expressed by the formulas (IV), (V) and / or (VI) below

(IV)

in which mean

R, R ¹ and R ^{3 have the} same meaning as under the above formulas (I) to (III); R ^{2 is} the residue of a polyepoxide compound reduced by the glycidyl groups; n = integers from 1 to 5, preferably 1 to 3; m = integers from 1 to 5, preferably 1 to 3, the sum n + m being an integer from 2 to 6, preferably 2 to 4.

For example, R ² stands for the (n + m) -valent radical reduced by the glycidyl groups

- a polyether, a polyether polyol, a polyester or a polyester polyol;

- A hydrocarbon radical, the saturated or unsaturated aliphatic character and / or aromatic character and by heteroatoms, such as oxygen and nitrogen, and by

Heteroatom groups, such as -NR ¹ CO- (R ^{1 has the} same meaning as above), and / or can contain them, this hydrocarbon radical, which generally contains at least 6, preferably at least 12 to 30, carbon atoms, preferably aryl groups, in particular Contains phenyl groups which may be substituted but are preferably unsubstituted;

- A reaction product of an epoxy compound with polyamines, polyols, polycaprolactone polyols, polyesters containing OH groups, polyethers, polyglycols, hydroxy, carboxyl and amino functional Polymer oils, polycarboxylic acids, hydroxy- or amino-functional polytetrahydrofurans.

R ² can also represent various of these residues.

R ² preferably denotes the corresponding radical of a bisphenol A diglycidyl ether, a bisphenol F diglycidyl ether or of their oligomers, a polyglycidyl ether of phenol / formaldehyde or cresol / formaldehyde novolak, a diglycidyl ester of tetrahydrophthalic, phthalic, isophthalic - or terephthalic acid and mixtures of these residues.

Some of these R 2 radicals are given below as formulas:

CH, - CH - CH, - 0 (V I I f)

CH ₂ -R -CH ₂ - (R ^; (CH ₂ ) _r , or Cy c I ohβ xy I en) (VII g)

in which R ^{4 is} hydrogen and / or the Z-- to C ₁₀ -alkyl radical, and the indices n and m have the meaning according to the formulas (IV) to (VI), the index p for 0 or 1, the Index q stands for integers from 0 to 40, preferably 0 to 10 and the index r stands for integers from 4 to 8.

Depending on the type of preparation and purity of the phosphinic anhydrides / phosphonic anhydrides used, the phosphorus-modified epoxy resins according to the invention can, if appropriate, still contain certain amounts, usually not more than 20% by weight, preferably not more than 15% by weight and in particular not more than 5 to 10% by weight. %, based on the total mixture, contained in other structural units.

Such by-products do not significantly influence the property profile of the products according to the invention in the amounts stated. As already mentioned above, the phosphorus-modified epoxy resins according to the invention are distinguished in particular by good storage stability.

The storage stability, expressed by the change in the epoxy value after 96 hours at room temperature and a relative atmospheric humidity of at most 50%, generally does not fall below the value of 90% and is preferably in the range from about 95% to 100%, based on the Initial value with 100%.

The phosphorus-modified epoxy resins according to the invention can be prepared, for example, by reacting the polyepoxide compounds according to (A) with the phosphinic and / or phosphonic anhydrides according to (B), preferably in an inert solvent (diluent) or, if the reaction is adapted, also in bulk.

The polyepoxide compounds used for this purpose according to the invention, which are preferably not halogen-modified, can be saturated or unsaturated and also aliphatic, cycloaliphatic, aromatic and / or heterocyclic. They can furthermore contain substituents which do not cause any undesirable side reactions under the mixing or reaction conditions, for example alkyl or aryl substituents, ether groups or the like. Mixtures of different polyepoxide compounds can also be used.

These polyepoxide compounds preferably have the formula (VIII)

in which R ² and the indices n and m have the meaning given by the formulas (IV) to (VI) have.

For example, these polyepoxide compounds are polyglycidyl ethers based on polyhydric, preferably dihydric alcohols, phenols, hydrogenation products of these phenols and / or novolaks (reaction products of mono- or polyhydric phenols, such as phenol and / or cresols, with aldehydes, especially formaldehyde in Presence of acidic catalysts), which are obtained in a known manner, for example by reacting the respective polyols with epichlorohydrin.

Examples of polyhydric phenols which may be mentioned here are: resorcinol, hydroquinone, 2,2-bis (4-hydroxyphenyl) propane (bisphenol A), isomer mixtures of dihydroxydiphenylmethane (bisphenol F), 4,4'-dihydroxydiphenylcyclohexane, 4,4 ' -Dihydroxy-3,3'-dimethyldiphenylpropane, 4,4'-dihydroxydiphenyl, 4,4'-dihydroxybenzophenone, bis- (4-hydroxyphenyl) -

1,1-ethane, bis- (4-hydroxyphenyl) -1,1'-isobutane, bis- (4-hydroxy-tert-butylphenyl) -2,2-propane, bis- (2-hydroxynaphthyl) methane, 1,5-dihydroxynaphthalene, tris- (4-hydroxyphenyl) methane, bis- (4-hydroxyphenyl) -1,1 'ether. Bisphenol A and bisphenol F are preferred.

The polyglycidyl ethers of polyhydric aliphatic alcohols are also suitable as the polyepoxide compound. Examples of such polyhydric alcohols are 1,4-butanediol, 1,6-hexanediol, polyalkylene glycols, glycerol, trimethylolpropane, bis- (4-hydroxycylohexyl) -2,2-propane and pentaerythritol.

Also suitable as polyepoxide compounds are (poly) glycidyl esters, which are obtained by reacting epichlorohydrin or similar epoxy compounds with an aliphatic, cycloaliphatic or aromatic polycarboxylic acid, such as oxalic acid, adipic acid, glutaric acid,

Phthalic, isophthalic, terephthalic, tetrahydrophthalic or hexahydrophthalic acid, 2,6-naphthalenedicarboxylic acid and dimerized fatty acids. examples for this are Diglycidyl terephthalate and diglycidyl hexahydrophthalate.

Also polyepoxide compounds which contain the epoxy groups in a statistical distribution over the molecular chain and which by emulsion copolymerization using olefinically unsaturated containing these epoxy groups

Connections can be made, e.g. Glycidyl esters of acrylic or methacrylic acid can be used advantageously in some cases.

Other usable polyepoxide compounds are, for example, those based on heterocyclic ring systems, such as Hydantoine epoxy resins,

Triglycidyl isocyanurate and / or its oligomers, triglycidyl-p-aminophenol, triglycidyl-p-aminodiphenyl ether, tetraglycidyl diaminodiphenyl methane, tetraglycidyl diaminodiphenyl ether, tetrakis (4-glycidoxyphenylolepinoloxidine) epoxidized, urethane. Furthermore, polyepoxides based on aromatic amines, such as aniline, for example

N, N-diglycidylaniline, diaminodiphenylmethane and N, N'-dimethylaminodiphenylmethane or sulfone. Other suitable polyepoxide compounds are in the "Handbook of Epoxy Resins" by Henry Lee and Kris Neville, McGraw-Hill Book Company, 1967, in the monograph by Henry Lee "Epoxy Resins", American Chemical Society, 1970, in Wagner / Sarx,

"Lackkunstharze", Carl Hanser Verlag (1971), pp. 174 ff, in "Angew., Makromol. Chemie", Vol. 44 (1975), pages 151 to 163, in DE-Offenlegungsschrift 2,757,733 and in EP 0 384 939, to which reference is hereby made.

Preferred polyepoxide compounds are bisglycidyl ethers based on bisphenol A, bisphenol F and bisphenol S (reaction products of these bisphenols and epichlor (halogen) hydrine) or their oligomers, polyglycidyl ethers of phenol / formaldehyde and / or cresol / formaldehyde novolaks and diglycidyl esters of phthalene , Isophthalic, terephthalic, tetrahydrophthalic and / or

Hexahydrophthalic acid. The ospic acid anhydrides used for the reaction with the polyepoxide compound preferably have the formulas (I) and / or (II). Representatives here are: dimethylphosphinic anhydride, ethylmethylphosphinic anhydride, diethylphosphinic anhydride, dipropylphosphinic anhydride, ethylphenylphosphinic anhydride and

Diphenylphosphinic anhydride. Examples of suitable ones

Bisphosphinic anhydrides are: ethane-1, 2-bismethylphosphinic anhydride, ethane-1, 2-bisphenylphosphinic anhydride, propane-1, 3-bismethylphosphinic anhydride, butane-1, 4-bismethylphosphinic anhydride, hexane-1, 6-bismethyl bisphosphinic anhydride, hexane .

Examples of suitable phosphonic anhydrides which have the formula (III) are: methanephosphonic anhydride, ethanephosphonic anhydride, n- and / or i-propanephosphonic anhydride,

Hexanephosphonic anhydride, octanephosphonic anhydride, decanephosphonic anhydride and benzenephosphonic anhydride.

The preparation of the phosphinic anhydrides according to formula (I) is described, for example, in DE Offenlegungsschrift 2.1 29.583, while the preparation of the

Alkane-bis-alkylphosphinic anhydrides (II) and the phosphonic anhydrides (III) can be seen, for example, from European patent application 0 004 323. With regard to the latter, Houben-Weyl, Meth. D. Organ. Chem. (1963), Vol. XII / 1, page 61 2 as well as to the German laid-open publications 2 758 580 and 4 126 235. In the case of formulas (II) and (III) have the corresponding

Anhydride ring structure and / or chain structure.

The anhydrides used according to the invention can contain certain amounts of free acids, depending on their type of preparation, but generally not more than 20% by weight, preferably not more than 15% by weight and in particular not more than 10% by weight. The phosphorus content of the phosphorus-modified epoxy resin according to the invention can be adjusted by varying the equivalent ratio of polyepoxide compound to phosphinic anhydride / phosphonic anhydride. The equivalent ratio between polyepoxide compound and phosphinic and / or phosphonic anhydride is usually 1: 0.1 to 1: 1, preferably 1: 0.1 to 0.8 and in particular 1: 0.1 to 1: 0.4.

If solution (dilution) is in the middle! are used in the process according to the invention, they are aprotic and preferably polar in character. Examples include: N-methylpyrrolidone; Dimethylformamide; Ethers, such as diethyl ether, tetrahydrofuran, dioxane, ethylene glycol mono- or diether, propylene glycol mono- or diether, butylene glycol mono- or diether of monoalcohols with an optionally branched alkyl radical of 1 to 6 carbon atoms; Ketones such as acetone, methyl ethyl ketone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone and the like; Esters such as ethyl acetate, butyl acetate, ethyl glycol acetate, methoxypropyl acetate; halogenated hydrocarbons; (Cyclo) aliphatic and / or aromatic hydrocarbons, such as hexane, heptane, cyclohexane, toluene, the various xylenes and aromatic solvents in the boiling range from approx. 1 50 to 1 80 ° C (higher-boiling mineral oil fractions, such as ^® Solvesso). The solvents can be used individually or in a mixture.

The reaction of the polyepoxide compound with the phosphinic and / or phosphonic anhydride generally takes place at temperatures from -20 to 130 ° C., preferably 20 to 90 ° C.

According to another variant of the process according to the invention, the phosphorus-modified epoxy resins, where the structural units (B) are derived only from phosphonic anhydrides, can be prepared by using phosphorus-modified epoxides (IX) containing structural units which are derived (A) from polyepoxide compounds at least two epoxy groups per Molecule and (C) of phosphonic acid half-esters, alcohol at temperatures of at least 80 ° C.

Alcohol is preferably split off at temperatures from 80 to 250 ° C., in particular at 100 to 150 ° C., and under reduced pressure, preferably 100 to 0.1 torr, in particular 5 to 0.5 torr.

The alcohol can be split off discontinuously or continuously, the latter, for example, using a thin-film evaporator.

The elimination of alcohol can be accelerated by adding transesterification catalysts. Titanium and tin acid esters, metal salts of carboxylic acids, metal cyanides, alcoholates, organic acids and mineral acids and metal oxides are usually used. For example, are suitable

Tetrabutyl titanate, tetraisopropyl stannate, sodium, potassium, zinc, magnesium, calcium, cobalt and cadmium salts of acetic acid and other carboxylic acids, sodium and potassium cyanide, sodium and potassium alcoholates of aliphatic alcohols, toluenesulfonic acid and sulfuric acid as well as antimony and germanium oxides. The catalysts are in a concentration of 0.01 to

2 wt .-%, preferably 0.05 to 1 wt .-%, used, each based on the phosphorus-modified epoxy resin.

The phosphorus-modified epoxy resins (IX) used as starting materials for this variant of the process according to the invention generally have a phosphorus content of 0.5 to 13% by weight, preferably 1 to 8% by weight and in particular 2 to 5% by weight on the resin. Their epoxy content is usually between 0 to 1 mol / 100 g, preferably 0.02 to 1 mol / 100 g, in particular 0.02 to 0.6 mol / 100 g, and their average molecular weight M _n (number average, determined by means of gel chromatography; polystyrene standard ) of up to about 10,000, preferably from about 900 to 5000 and in particular from about 400 to 2000. This preferably contains phosphorus-modified Epoxy resin (IX) at least one epoxy group, in particular 1 to 3

Epoxy groups, per molecule.

The average molecular weight M _n (number average; likewise determined by means of gel chromatography; polystyrene standard) of the structural units (A) is generally up to about 9000 and is preferably between about 150 and 4000, in particular between about 300 and 1800; they are preferably derived from polyepoxide compounds with an average of 2 to 6 epoxy groups per molecule (a functionality of 2 to 6). These polyepoxide compounds are preferably polyglycidyl ethers based on aromatic

Amines, polyhydric phenols, hydrogenation products of these phenols and / or of novolaks (see below for this).

The structural units (C) of the starting compounds for this process variant are derived from phosphonic acid semiesters of the formula (X)

II

R ⁶ POR ^{7 (x)}

O H

in the mean

R ^{6 is} a hydrocarbon radical of 1 to 20 carbon atoms, preferably 1 to

6 carbon atoms, and R ^{7 is} a hydrocarbon radical of 1 to 10 carbon atoms, preferably 1 to 4 carbon atoms.

The hydrocarbon radical in R ⁶ / R ⁷ can have an aliphatic and / or aromatic character and can be interrupted by heteroatoms or heteroatom groups. It is preferably a saturated or unsaturated, straight-chain or branched aliphatic radical, such as

Alkyl, alkenyl, cycloalkyl, preferably having 1 to 8 carbon atoms, in particular 1 to 6 carbon atoms, such as methyl, ethyl, n- and i-propyl, n-, i- and tert-butyl, the various pentyls and hexyls, or an aryl or an aralkyl radical, such as unsubstituted or phenyl which is preferably substituted with 1 to 3 alkyl radicals with 1 to 6 C atoms or such as phenylalkyl with 1 to 6 C atoms in the alkyl radical, for example benzyl.

The starting compounds (IX) used for this process variant are prepared by reacting polyepoxide compounds corresponding to (A) with phosphonic acid semiesters (X) corresponding to (C) at temperatures from -20 ° C. to 150 ° C., preferably 10 ° C. to 100 ° C. and an equivalent ratio of polyepoxide compound to

Phosphonic acid semiesters from 1: 0.1 to 1: 1, preferably 1: 0.1 to 1: 0.8. This reaction is preferably carried out in the presence of a solvent which does not hinder the reaction. The solvents mentioned above for the other process variant come into consideration as such.

The polyepoxide compounds used for the preparation of the starting compounds (IX) are also the same as those described above.

Examples of suitable phosphonic acid semiesters (X) are: methyl methanephosphonate, monoethyl ethanephosphonate,

Monoethyl propanephosphonate and monomethyl benzenephosphonate. The preparation of these phosphonic acid half-esters is known, for example, from J. Organometallic Chem. Vol. 1 2 (1960), page 459.

The phosphorus-modified epoxy resins according to the invention can advantageously be used as reactive resins in many fields of application for the production of moldings, prepregs, coatings or laminates (composite materials), in particular for insulation purposes in electrical engineering. They are suitable, for example, for covering, coating and enveloping electronic components, for insulating electrical windings, for

Manufacture of insulating components and composite materials with fibrous Einlac. πjngskompcnenten, especially of laminates for the

PCB technology.

The invention is explained in more detail below by examples.

example 1

Production of phosphorus-modified epoxy resins by adding phosphinic anhydrides to epoxidized novolak

350 parts by weight (MT) of an epoxidized novolak with an epoxide value of 0.56 mol / 100 g are dissolved in 86 parts by weight of ethyl methyl ketone and mixed with different parts by weight of ethyl methyl or dimethylphosphinic anhydride (see Table 1 below). The solutions obtained are first stirred at room temperature for 60 minutes and then at an oil bath temperature of 100 ° C. under reflux for 90 minutes. The epoxy values of the reaction products are determined immediately after production and after a storage time of 96 h and can be seen from Table 1. The epoxy value after 96 h shows that the reaction products are sufficiently stable.

Table 1

1): calculated on the solid components

Example 2

Production of phosphorus-modified epoxy resins by adding n-propanephosphonic anhydride to various epoxy resins

Various epoxy resins (see Table 2 below) are dissolved in 140 parts by weight of ethyl methyl ketone, and parts of a 50% solution of propanephosphonic anhydride in ethyl acetate shown in Table 2 are added. The solution obtained is first stirred at room temperature for 60 minutes and then at an oil bath temperature of 100 ° C. under reflux for 90 minutes. The epoxy values of the reaction products are determined after production and after a storage time of 96 h and are summarized in Table 2.

Table 2

Mixture of epoxy resin (MT) ¹ 'Propanphosphon¬ products

No acid anhydride

ABCD solution epoxy value ² 'epoxy value ² ' phosphorus content ² '(MT) after 0 h after 96 h (mol / 100 g) (mol / 100 g) (%)

3,400 - - - 100 0.34 0.34 3.2

4 - 400 - - 100 0.32 0.31 3.2

5 - - 300 - 60 0.30 0.27 2.7

6 - - - 300 60 0.37 0.35 2.7

A bisphenol-F-diglycidyl ether, epoxy value 0.61 (mol / 100 g) B epoxidized novolak, epoxy value 0.56 (mol / 100 g), functionality 3.6 C epoxidized novolak, epoxy value 0.51 (mol / 100 g) , Functionality 5.5 D epoxidized novolak, epoxy value 0.55 (mol / 100 g), functionality 4, 1

1): MT of pure resin 2): calculated on the solid components

Example 3

Production of phosphorus-modified epoxy resins by adding various phosphonic anhydrides to epoxidized novolak

To a 75% solution of different parts by weight of an epoxy resin (see Table 3 below), in ethyl methyl ketone, a 50% solution of various phosphonic anhydrides in ethyl acetate (see also Table 3 below) is added. The solution obtained is first stirred at room temperature for 60 minutes and then at an oil bath temperature of 100 ° C. under reflux for 90 minutes. The epoxy values of the reaction products were determined after production and a storage time of 96 h and are listed in Table 3.

Table 3

1): Epoxidized novolak, epoxy value of the pure resin 0.56 mol / 100 g, functionality 3.6

2): calculated on the solid components

Example 4 a) Preparation of the phosphorus-modified epoxy resin (IX)

200 MT (= parts by weight) of an epoxidized novolak (epoxy value: 0.56 mol / 100 g, average functionality: 3.6) and 50 MT methyl ethyl ketone

Heated to 40 ° C. Now 27.5 MT of methyl methanephosphonate were added dropwise with stirring in 30 minutes. After one hour, the mixture was kept under reflux for 1.5 hours, then the mixture was cooled and the solvent was removed in vacuo at a bath temperature of 60 ° C. 227.5 MT of compound (IX) were obtained.

b) Preparation of the phosphorus-modified epoxy resin according to the invention

227.5 MT of compound (IX) according to a) were heated at 0.5 torr to an internal temperature of 150 ° C. Methanol split off, which was collected in a cold trap downstream of the apparatus. After the cleavage was complete, the reaction mixture was cooled to 80.degree. The result was 220 MT of a phosphorus-modified epoxy resin. By adding 36 MT of methyl ethyl ketone and 18.5 MT of ethyl acetate at 80 ° C, an 80% solution was obtained: epoxy value (after 0 h or 96 h): 0.29 mol / 100 g; Phosphorus content:

2.83%.

Example 5 a) Preparation of the phosphorus-modified epoxy resin (IX)

200 MT of an epoxidized novolak (epoxy value: 0.56 mol / 100 g, average functionality: 3.6) and 50 MT of methyl ethyl ketone were heated to 40 ° C. Now a mixture of 36 MT monomethyl propanephosphonate and 29 MT ethyl acetate was added dropwise with stirring over 40 minutes; the mixture was then stirred for an hour and then heated to reflux for 1.5 hours.

The mixture was then cooled and the solvents were distilled off in vacuo at a bath temperature of 60 ° C. 236 MT of compound (IX) were obtained. b) Production of the phosphorus-modified epoxy resin

236 MT of compound (IX) according to a) were heated at 0.8 torr to an internal temperature of 150 ° C. The split off methanol collected in a cold trap downstream of the apparatus. After the cleavage was complete, the reaction mixture was cooled. 227 MT of the phosphorus-modified epoxy resin were obtained. The addition of 37 MT methyl ethyl ketone and 16 MT ethyl acetate resulted in an 80% solution: epoxy value (after 0 h and 96 h, respectively): 0.28 mol / 100 g; Phosphorus content: 2.9%.

Claims

Claims:

1 . Phosphorus-modified epoxy resin with an epoxy value of 0 to 1 mol / 100 g, containing structural units that are derived

(A) polyepoxide compounds with at least two epoxy groups per molecule and

(B) of phosphinic and / or phosphonic anhydrides.

2. Phosphorus-modified epoxy resin according to claim 1, characterized in that the phosphorus content is 0.5 to 13 wt .-%, based on the resin.

3. Phosphorus-modified epoxy resin according to claim 1 or 2, characterized in that the epoxy value is between 0.02 and 1 mol / 100 g.

4. Phosphorus-modified epoxy resin according to one or more of claims 1 to 3, characterized in that it contains on average at least one epoxy group per molecule.

5. Phosphorus-modified epoxy resin according to one or more of claims 1 to 4, characterized in that the average molecular weight

M _{n of} the resin has values between 200 and 5,000.

6. Phosphorus-modified epoxy resin according to one or more of claims 1 to 5, characterized in that the average molecular weight M _{n of} the building blocks (A) is 150 to 4,000.

7. Phosphorus-modified epoxy resin according to one or more of the

Claims 1 to 6, characterized in that the building block (A) is derived from polyepoxide compounds with 2 to 6 epoxy groups per molecule.

8. Phosphorus-modified epoxy resin according to one or more of claims 1 to 7, characterized in that the building block (A) is derived from polyglycidyl ethers based on polyhydric phenols, hydrogenation products of these phenols and / or from novolaks.

9. phosphorus-modified epoxy resin according to one or more of claims 1 to 8, characterized in that the structural units (B) are derived from phosphinic anhydrides of the formulas (I) and / or (II)

in which mean

R and R ¹ independently of one another are a hydrocarbon radical of 1 to 20 C -

Atoms, preferably 1 to 6 carbon atoms,

A is a divalent hydrocarbon radical with 1 to 10 C atoms, preferably 1 to 6 C atoms and y is an integer of at least 1, preferably 1 to 100.

10. Phosphorus-modified epoxy resin according to claim 9, characterized in that the structural units (B) alternatively or additionally derived from phosphonic anhydrides of the formula (III)

in which R ^{3 has} the same meaning as R / R ¹ according to the formulas (I) or and z is at least 3, preferably 3 to 100.

1 1. Phosphorus-modified epoxy resin according to one or more of claims 1 to 10, characterized in that it is essentially the

Has formulas (IV), (V) and / or (VI)

(IV)

- (V)

in which mean

R, R ¹ and R ^{3 have the} same meaning as under the above formulas (I) to (IM); R ^{2 is} the residue of a polyepoxide compound reduced by the glycidyl groups; n = integers from 1 to 5; m = integers from 1 to 5, where the sum n + m should be an integer from 2 to 6.

12. Phosphorus-modified epoxy resin according to claim 1 1, characterized in that it has essentially only the formula (VI).

13. A process for the preparation of the phosphorus-modified epoxy resin according to one or more of claims 1 to 12, characterized in that polyepoxide compounds according to (A) and phosphine and / or

Phosphonic anhydrides according to (B) in an inert diluent or in bulk.

14. The method according to claim 13, characterized in that the reaction takes place at temperatures from -20 to 130 ° C.

15. The method according to claim 13 or 14, characterized in that the equivalent ratio between polyepoxide compound and phosphine and / or

Phosphonic anhydride is 1: 0.1 to 1: 0.8.

16. A process for the preparation of the phosphorus-modified epoxy resin as claimed in one or more of claims 1 to 12, the structural units (B) here being derived only from phosphonic acid semiesters, characterized in that phosphorus-modified epoxides (IX) containing structural units which are derived

(A) from polyepoxide compounds with at least two epoxy groups per molecule and (C) from phosphonic acid semiesters, splits off alcohol at temperatures of at least 80 ° C.

17. The method according to claim 16, characterized in that the elimination of alcohol takes place at temperatures of 80 to 250 ° C, preferably 100 to 150 ° C.

18. The method according to claim 16 or 17, characterized in that the alcohol elimination takes place under reduced pressure, preferably at 100 to 0.1 Torr.

19. The method according to at least one of claims 16 to 18, characterized in that the phosphorus content of the phosphorus-modified epoxy resin (IX) is 0.5 to 13 wt .-%, based on the resin.

20. The method according to at least one of claims 16 to 19, characterized in that the epoxy value of the phosphorus-modified epoxy resin (IX) is between 0.02 and 1 mol / 100 g.

21. Process according to at least one of Claims 1 6 to 20, characterized in that the average molecular weight M _{n of} the phosphorus-modified epoxy resin (IX) has values between 200 and 5,000.

22. The method according to at least one of claims 1 6 to 21, characterized in that the elimination of alcohol takes place in the presence of transesterification catalysts.

23. The method according to at least one of claims 16 to 22, characterized in that the building block (B) of the phosphorus-modified epoxy resin (IX) is derived from phosphonic acid semiesters of the formula (X)

0

(x) II p- 0 R

O H

in which R ^{6 is} a hydrocarbon radical of 1 to 20 carbon atoms, preferably 1 to

6 carbon atoms, and R ^{7 is} a hydrocarbon radical of 1 to 10 carbon atoms, preferably 1 to

4 carbon atoms.

24. The method according to claim 23, characterized in that R ⁶ and R ⁷ each represent an alkyl radical.

25. Use of the phosphorus-modified epoxy resin according to one or more of claims 1 to 12 or obtained according to one or more of claims 1 3 to 24 for the production of moldings, coatings or

Laminates, preferably for electrical engineering.

26. Moldings, coatings or laminates, produced using the phosphorus-modified epoxy resin according to one or more of claims 1 to 12 or obtained according to one or more of claims 13 to 24.