EP0673547A4 - Electronic package sealed with a dispensable adhesive. - Google Patents

Electronic package sealed with a dispensable adhesive.

Info

Publication number
EP0673547A4
EP0673547A4 EP94901644A EP94901644A EP0673547A4 EP 0673547 A4 EP0673547 A4 EP 0673547A4 EP 94901644 A EP94901644 A EP 94901644A EP 94901644 A EP94901644 A EP 94901644A EP 0673547 A4 EP0673547 A4 EP 0673547A4
Authority
EP
European Patent Office
Prior art keywords
εaid
component
liquid
leadframe
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP94901644A
Other languages
German (de)
French (fr)
Other versions
EP0673547A1 (en
Inventor
Dexin Liang
George Anthony Brathwaite
Paul Robert Hoffman
German Jamlig Ramirez
Linda E Strauman
Deepak Mahulikar
Anthony M Pasqualoni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of EP0673547A1 publication Critical patent/EP0673547A1/en
Publication of EP0673547A4 publication Critical patent/EP0673547A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Definitions

  • Figure 1 shows in exploded isometric view a metal electronic package as known from the prior art.
  • Figure 2 shows in top planar view an epoxy sheet for stamping a window frame of adhesive as known from the prior art.
  • FIG. 1 shows in exploded isometric view an adhesively sealed electronic package 10 as known from the prior art.
  • the adhesively sealed electronic package 10 has a base component 12 and a cover component 14.
  • the base component 12 and cover component 14 are made from a variety of materials such as ceramics, molded plastics and metals. Metallic materials such as copper, aluminum and their alloys have proven successful. The high thermal conductivity of the metals effectively dissipate heat from an encased semiconductor device.
  • a leadframe 16 is disposed between and adhesively bonded to both the base component 12 and cover component 14.
  • a second window frame shaped adhesive sheet 20 bonds the other side of the leadframe 16 to the cover component 14.
  • the five components, the base component 12, first adhesive sheet 18, leadframe 16, second adhesive sheet 20 and cover component 14 must be accurately aligned in a machined fixture for assembly. Different fixtures are required for each size package and lead configuration.
  • Package assembly is completed as illustrated in Figure 9 by the placement of a cover component 14 on the second adhesive.
  • the package 48 i ⁇ then thermally cured.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

There is provided a method for the assembly of an electronic package (48) utilizing liquid adhesives (30, 46). A first liquid adhesive (30) is dispensed on a base (12) and a leadframe (16) is supported by the liquid adhesive (30). A second liquid adhesive (46) is dispensed, overlying the first liquid adhesive (30) and the leadframe (16), and supports a cover (14). The entire assembly is then thermally cured. Means to control the flow of the liquid adhesives (52) and to reduce the mutual inductance between leads (72) are also provided.

Description

ELECTRONIC PACKAGE SEALED WITH A DISPENSABLE ADHESIVE
This invention broadly relates to packages for encapsulating electronic devices, such as integrated circuits. More particularly, the invention relates to an electronic package having a base and cover bonded together with a liquid adhesive.
Adhesively sealed electronic packages as disclosed in U.S. Patent No. 4,105,861 to Hascoe, are used to encase electronic devices such as silicon based semiconductor integrated circuits. Adhesively sealed packages are low cost and provide a level of reliability acceptable for all but the most stringent military applications. One type of package has a metallic base and cover as disclosed in U.S. Patent Nos. 4,897,508 and 4,939,316, to Mahulikar et al.
The 4,939,316 patent discloses aluminum or aluminum alloy base and cover components. A polymer adhesive, such as an epoxy resin, seals the leadframe to both. The polymer adhesive is provided as a flexible sheet of a desired thickness. A window frame shaped preform is mechanically stamped from the sheet. Using a fixture, separate polymer window frames are aligned on the base and cover, respectively. The package assembly is then heated to cure the polymer sealants. The resultant package has high reliability and excellent thermal dissipation through the metallic components.One disadvantage with the use of a sheet adhesive is the stamping scrap which remains after stamping the window frame. The polymer is difficult to recycle and because the window frame is narrow walled, up to 90% of the adhesive may end up as stamping scrap. The large volume of scrap also contributes to the cost of the package. A further disadvantage of sheet adhesives is the assembly process requires precise tooling to insure proper alignment. Specially designed fixtures for each package size and leadframe configuration also contribute to the cost of the package.
Accordingly, there is a need to improve the method for supplying a polymer sealant to electronic package components. It is an object of the present invention to provide a method for dispensing a liquid adhesive about the perimeter of package components. It is a feature of the invention that the viscosity of the liquid adhesive is regulated to control the package thickness and minimize adhesive squeeze out. Another feature of the invention iε that the cure cycle of the liquid adhesives iε shorter than that of an adhesive film, reducing process time.
One advantage of the present invention is that the amount of scrap is minimized, reducing the cost of the electronic package and the need to recycle or dispose scrap. Another advantage of the invention is that paper interleaving is not required minimizing contamination of the adhesive. Still another advantage of the present invention is that thinner adhesives are utilized so the leadframe iε closer to the metallic base and cover improving the dissipation of heat from the leadframe. The mutual inductance between adjacent leads of the leadframe is significantly reduced and the thinner adhesive improves lead coplanarity.
In accordance with the invention, there is provided both a method for the assembly of an electronic package and the packages so assembled. The method of assembling the package includes the steps of dispensing a first liquid adhesive onto a base component. A leadframe is supported on the first liquid adhesive and a second liquid adhesive dispensed on the opposite side of the leadframe overlying the first adhesive. A cover component is then placed over the leadframe and supported by the second liquid adhesive. The package assembly is then heated to cure the liquid sealant.
In one embodiment of the invention, at least one of the base and cover has a channel adjacent the perimeter of the component to support the liquid adhesive. A leadframe is disposed between the base and cover and adhesively bonded to both.
The above stated objects, features and advantages of the invention will become more apparent from the specification and drawings which follow.
Figure 1 shows in exploded isometric view a metal electronic package as known from the prior art. Figure 2 shows in top planar view an epoxy sheet for stamping a window frame of adhesive as known from the prior art.
Figure 3 shows in top planar view an electronic base having a dispensed liquid adhesive. Figure 4 shows in cross-sectional representation the base of Figure 3.
Figure 5 shows in top planar view a leadframe supported by a first liquid adhesive. Figure 6 shows in cross-sectional representation the package assembly of Figure 5.
Figure 7 shows in top planar view the package assembly including a second liquid adhesive.
Figure 8 shows in cross-sectional representation the assembly of Figure 7.Figure 9 shows an electronic package assembled according to the method of the invention. Figure 10 shows in cross-sectional representation a package base having an adhesive retaining channel.
Figure 11 shows in cross-sectional representation a metal electronic package assembled from a base and cover containing an adhesive retaining channel.
Figure 12 shows in top planar view an electronic package base having both an adhesive retaining channel and εecondary channelε to support the leadframe.
Figure 13 shows in crosε-sectional representation the package base of Figure 12.
Figure 14 shows in edge view a metal electronic package incorporating a base and cover in accordance with the embodiment of Figure 12 illustrating electrical isolation of the leads.
Figure 1 shows in exploded isometric view an adhesively sealed electronic package 10 as known from the prior art. The adhesively sealed electronic package 10 has a base component 12 and a cover component 14. The base component 12 and cover component 14 are made from a variety of materials such as ceramics, molded plastics and metals. Metallic materials such as copper, aluminum and their alloys have proven successful. The high thermal conductivity of the metals effectively dissipate heat from an encased semiconductor device. A leadframe 16 is disposed between and adhesively bonded to both the base component 12 and cover component 14. A first adhesive sheet 18, generally window frame shaped, bonds the base component 12 to one side of the leadframe 16. A second window frame shaped adhesive sheet 20 bonds the other side of the leadframe 16 to the cover component 14. In the assembly of the adhesively sealed electronic package 10, the five components, the base component 12, first adhesive sheet 18, leadframe 16, second adhesive sheet 20 and cover component 14 must be accurately aligned in a machined fixture for assembly. Different fixtures are required for each size package and lead configuration.
The first adhesive sheet 18 and second adhesive sheet 20 are relatively thick, on the order of 0.13mm (.005 inch) to 0.51mm (.020 inch). When heated during sealing, the adhesive sheets become fluid, but do not flow without the application of an external force such as a weight or spring clip. Excessive flow may coat the inner leads 22 of the leadframe 16 with the adhesive. The adhesive on the inner leads 22 interferes with electrical interconnection of a semiconductor device (not shown) by wire bonding. Excesεive flow may also coat the outer leads of the leadframe 16 with the adhesive. The adhesive on the outer leads interferes with lead trimming and forming, with the package assembly fitting into test sockets, and with solder plating of the outer leads.
A critical balance in the pressure applied to the base and cover is required in the prior art assembly process. Inadequate pressure results in inadequate flow of the adhesive and pores at the component/adhesive interface for the ingress of contaminants. Exceεs pressure results in uncontrolled flow of the adhesive and the potential for adhesive coating on the inner and/or outer leads.
One solution to the problem of excess adhesive flow is reducing the thickness of the adhesive sheets. This solution has had limited success. Referring to Figure 2, a portion of an adhesive εheet ribbon 24 iε εhown in top planar view. The adhesive εheet ribbon 24 iε supplied in long lengths, ie. 30-75 meterε (100-250 feet) with a width slightly larger than an adhesive window frame 26, i.e. 2.5cm (1 inch). A window frame 26 is mechanically stamped from the adhesive sheet ribbon 24. The thickness of the adhesive sheet ribbon must be sufficient that tension applied to the adhesive sheet ribbon does not stretch it. Also, the thickness muεt be sufficient that the window frames 26 may be mechanically handled during assembly. Generally, a minimal thickness of 0.13mm (0.005 inch) iε required. Each package has two window frameε 26, reεulting in a polymer thickness of at least 0.25mm (0.010 inch).
The adhesive sheet ribbon 24 is provided for stamping as a coil. To prevent the adhesive sheet ribbon 24 from sticking to itself, an interleaf iε usually coiled along with the adhesive. The interleaf, typically a coated paper, may cause problems. Some contamination of an assembled package has been traced back to the interleaf material.
Figure 3 illustrates the first step in the asεembly process of the invention. This assembly procesε eliminates the problems of the prior art. A die-paddle attach 28 is applied to a central portion of the base component 12. Dependent on whether the leadframe includes a centrally positioned paddle, the die-paddle attach 28 may be for direct bonding of a semiconductor die to the base component 12 or for affixing the paddle to the base. In certain electronic packages, the paddle is mechanically contacted against the base component 12 without a bonding agent. In this embodiment, the die-paddle attach 28 is omitted. If the die-paddle attach 28 iε for attaching a εemiconductor die to the package base component 12, any suitable die attach material may be used such as a solder, sealing glass or polymer adhesive. Suitable solderε include alloyε of lead-tin and gold-tin. The dielectric sealants such as sealing glasses and polymer adhesives are typically filled with a thermally conductive material such as silver flakes to enhance the dissipation of heat. When the base component 12 is a metal with a high coefficient of thermal expansion εuch as copper and aluminum alloyε, the die-paddle attach 28 iε usually a compliant polymer to compenεate for the coefficient of thermal expanεion mismatch between the εilicon based semiconductor die and the package base. Alternatively, a buffered die attach such as diεclosed in U.S. Patent No. 4,872,047 to Fister et al. can be utilized.
The same materials used for die attach are suitable for paddle attach. If the coefficient of thermal expansion of the leadframe is similar to that of a base, then a solder such as a lead-tin alloy can be used. If a significant coefficient of thermal expansion mismatch is present, a compliant polymer iε preferred.
A first liquid adhesive 30 is dispensed adjacent the perimeter 31 of the base 12. The adhesive can be any suitable material such as a thermoplastic or thermosetting polymer. One preferred adhesive is a thermoεetting epoxy. The dispensed thickness iε preferably the minimum which iε effective to prevent the leadframe from contacting metallic package componentε. Typically, the adheεive thickneεε will be from about .025mm to about .25mm (.001-.010 inch) and preferably from about .025mm to about .076mm (.001-.003 inch). The first liquid adhesive 30 can extend to the perimeter 31, but it iε preferred that a gap 32 of from about 0.13mm to about 1.3mm (.005-.05 incheε) εeparate the adhesive from the perimeter. Preferably, the gap iε from about 0.25mm to about 0.64mm (.01-.025 incheε). The gap 32 preventε misaligned first liquid adhesive 30 from contaminating the sides of the package and provides a region for flow of the adhesive following dispensing and package seal.
Figure 4 shows in cross-sectional representation the base component 12 following deposition of a die-paddle attach 28 and a firεt liquid adhesive 30. The first liquid adhesive 30 iε deposited by any suitable means such as screen printing or direct writing. Direct writing is disclosed in an article by Mathias in Hybrid Circuit Technology, April 1989. The base component 12 is placed on a writing platform isolated from vibration and other external motion. The writing platform iε a precision X-Y table capable of 0.0025 mm (0.0001 inch) accuracy and repeatability. A pump delivers adhesive having a desired viscosity to a dispensing εyεtem such as a hypodermic needle or writing pen. A computer aided design system positions the X-Y table with the base component 12 under the dispensing means and a deεired thickneεε and pattern of the first liquid adhesive 30 is dispensed.
When a leadframe 16, as illustrated in Figure 5, is placed on the firεt liquid adhesive 30, the leadframe sinks a controlled distance based on the viεcoεity of the adhesive. The firεt liquid adhesive 30 has a room temperature viscosity of from about 10 pascal second (10,000 centipoise) to about 500 Pa«S (500,000 centipoiεe). More preferably, the viεcoεity iε from about 20 Pa*S (20,000 centipoiεe) to about 100 Pa«S (100,000 centipoise) . Applicants have determined that for a liquid adhesive having a thicknesε of 0.15 mm (0.006 incheε), a copper alloy leadframe will not sink at all when the viscoεity iε above about 200 Pa*S (200,000 centipoiεe). When the viεcoεity iε about 40 Pa«S (40,000 centipoise), the leadframe sinks about 0.1 mm (0.004 inches) such that the spacing between the baεe component 12 and the leadframe is about 0.51 mm (0.002 inches). It is desirable to minimize the spacing between the leadframe and metallic package components to reduce mutual induction between adjacent leads of the leadframe. With a viscosity below about 20 Pa*S (20,000 centipoise), the leadframe sinks completel y through the dispensed firεt liquid adhesive 30 and may contact the metallic base component 12 causing an electrical short circuit. A dielectric layer may be deposited on the surfaces 34 of the base component 12 to prevent an electrical short circuit. It is preferred that at least a minimal thickness of first liquid adhesive 30 effective to electrically isolate the leadframe from the base remain disposed between the leadframe and the base.
The leadframe 16, optionally including, a die attach paddle 36 is aligned such that a central portion 38 of the leads contacts the first liquid adhesive 30. At least one semiconductor device 40 is bonded to the die attach paddle and electrically interconnected to the inner leads 22. Electrical interconnection is by wire bonds 42 or thin stripε of metallic foil such as in tape automated bonding. If a die attach paddle 36 is not utilized, the semiconductor device 40 is bonded directly to the base component 12 with a die attach adhesive or buffered die attach system. Figure 6 illuεtrateε the aεεembly of Figure 5 in cross-εectional repreεentation. The die-paddle attach 28 and the firεt liquid adhesive 30 are not cured at thiε time. The viεcoεity of the firεt liquid adhesive 30 maintains a desired gap 44 between the leadframe and the surface 34 of the base component 12.
As shown in Figure 7, a second liquid adhesive 46 is dispensed, such as by εcreen printing or direct writing, overlying the first liquid adhesive and central portion of the leads. The alignment of the first dispensed liquid adhesive 30 and second dispensed liquid adhesive 46 iε illustrated in Figure 8. It is not necesεary for the second liquid adhesive 46 to be compositionally identical with the first liquid adhesive. Using the same adhesive, however, does minimize the number of adhesives required and simplifies the assembly process. Applicants have determined that adhesion between two polymer adhesives is poor when one has been precured. Adhesion iε improved when both the firεt and εecond diεpenεed liquid adhesives are cured in the same assembly step.
Package assembly is completed as illustrated in Figure 9 by the placement of a cover component 14 on the second adhesive. The package 48 iε then thermally cured.
A preferred adhesive for the firεt and εecond liquid adhesives is an epoxy such as E9459 manufactured by the Hysol Diviεion of the Dexter Company (Pittεburgh, California) . The epoxy is cured by heating to 175°C-225°C for 1-10 minutes. The cure cycle of the liquid adhesive significantly reduces the thermal exposure of the package compared to assembly using epoxy sheet adhesive. The epoxy sheet of the prior art typically requires a cure temperature of about 180°C for in excess of 90 minutes. Both the reliability of the adhesive seal and the integrity of the semiconductor device is improved when thermal exposure is minimized. A poεt cure bake (εuch as 160°C-190°C for about 30 minutes-2 hourε) may be required if the cure cycle for the dispensed liquid adhesives is insufficient to cure the die-paddle attach.
It is preferred that the spacing between the leadframe and metallic base and cover components be minimized to reduce mutual inductance between adjacent leads. One method of achieving this objective is to utilize the base component 50 illustrated in Figure 10. A liquid adhesive retaining channel 52 is formed in the base. The liquid adhesive retaining channel 52 may be molded into the baεe, milled or formed by other eanε. One preferred meanε iε embossing. During embossing, metal is displaced without subtractive machining avoiding the formation of metallic εcrap. The preferred materials for metallic base componentε, copper and aluminum alloyε are ductile and amenable to a deformation proceεs such as embossing.
The liquid adhesive retaining channel 52 has a width of from about 0.63mm to about 5.1mm
(0.025-0.200 inch). It is desired to minimize the seal width so the area 54 for mounting a semiconductor device is maximized. The preferred width of the liquid adhesive retaining channel 52 iε from about 1.3 mm to about 2.55 mm (0.050 - 0.100 inches) . The depth of the channel iε that εufficient to provide an effective amount of adhesive to bond the leadframe and package components. Preferably, the depth is from about 0.127mm to about 2.54mm (0.005 - 0.10 inch). A preferred depth is from about 0.127mm to about 1.27mm (0.005 - 0.05 inch).
As shown in Figure 11, the cover component 56 iε formed with a similar liquid adhesive retaining channel 52. Both channels are filled with a liquid adhesive 58 and bonded to a leadframe 16.
The liquid adhesive 58 only contactε the central portion of the leadframe 16 and by capillary forceε extendε to the edge of the aεsembly and inner edge of the lid cavity, but no further. Wire bonding is unimpeded by the presence of a polymer adhesive. If the baεe and cover are a polymer, ceramic or other dielectric, the package 60 iε suited for electronic package applications. When the baεe component 50 and cover component 56 are metallic, a dielectric means 62 must be disposed on at least thoεe εurfaces which contact the leadframe 16. The dielectric means 62 may be a polymer layer or an oxide layer. When the base and cover are formed from aluminum or an aluminum alloy, a preferred dielectric is an anodization layer. When the base and cover are formed from a metal such aε copper which does not form a refractory oxide layer, the copper co ponentε may be coated with another metal which formε a refractory oxide, such as nickel as disclosed in U.S. Patent No. 4,888,499 to Crane et al.
The dielectric layer 62 is aε thin as effectively possible to electrically isolate the leads. For an anodization layer, the thickness is typically from about .0075mm to about .051mm (.0003-.002 inch).
While the liquid adhesive retaining channel 52 is primarily intended to retain a liquid adhesive. A window frame εheet adheεive or other type of adhesive may similarly be partially retained in the channel εuch that adheεive flow along the leadε iε limited to by capillary action.
The electronic package 60 reduces mutual inductance compared to prior art packageε. Further improvement iε obtained with the package embodiment illuεtrated in Figureε 12-14. Any electronic package having multiple leadε in series in a plane is limited in performance due to the inductive and capacitive coupling of any given lead to its neighboring leads. This is especially true of multiple signal leads in εerieε. Thiε coupling leadε to voltage noise on non switched interconnect leads which in turn can cauεe unwanted εwitching of silicon chip circuits and limitε the number of εilicon chip circuitε, i.e. driverε, that can switch simultaneously. This limitation impedes the overall performance of the εilicon chip.
In this embodiment, the package base component 70 iε either an active or a floating ground plane beneath the leadε. The ground plane, the package baεe, extendε between the leadε. The extension between leads may be between each individual signal lead as illuεtrated in Figure 12 or between groupε of leads. The base component 70 may be an active ground, i.e. soldered or bolted to a grounding means, or electrically coupled to a ground plane.
The base component 70 containε a liquid adheεive retaining channel 52 and intersecting leadframe receiving channels 72. Sufficient liquid adhesive is dispensed in the liquid adheεive retaining channel 52 such that when the base and cover are brought together, liquid adheεive flowε from the liquid adheεive retaining channel 52 into the leadframe channelε 72 εurrounding the leadframe to provide electrical iεolation. Aε εhown in Figure 14, the leadε 16 are εurrounded by interdigitated protruεionε 76 such that a ground extendε between each lead and mutual inductance iε εignificantly reduced or eliminated.
The interdigitated base iε not limited to liquid adheεiveε and iε equally applicable to adhesive sheets and sealing glasses. The interdigitated protrusionε 76 may extend from only the baεe or the cover or both.
The height of the protruεionε 76 should be less than or equal to the thicknesε of the adheεive to prevent the formation of pores in the adhesive which could cause gross leak failures and provide a means for contaminant ingress. If the protrusions are the same height as the leadframe, the protruεionε could electrically interconnect the base and cover placing both at the same voltage potential, this arrangement iε advantageouε in preventing electromagnetic interference from effecting device operation aε disclosed in U.S. Patent No. 5,043,534 to Mahulikar et al.
By modelling, the package of Figure 9 has a thermal performance improvement of up to 2°C per watt θj,. 8μ measures the temperature difference between an electronic device and the ambient air surrounding the electronic package per unit of power supplied to the device. The Figure 9 package according to the model would improve electrical performance with a 14% reduction in mutual inductance. The package illustrated in Figure 11 is modelled to provide a thermal performance improvement of up to 2°C per Watt θj, with an electrical performance improvement of 20% reduction in inductance.
The package illustrated in Figure 14 is modelled to provide a thermal performance improvement of up to 2°C per Watt e^ with an improved electrical performance of 25% reduction in inductance.
The suitability of the liquid adhesive procesε iε demonstrated by the Example which follows. The Example is intended to be illustrative and not to limit the scope of the invention.
EXAMPLE
A liquid epoxy (Hysol E-9459) was dispensed on the surface of anodized aluminum base and cover components by a programmable air pressurized syringe and aligned by an X-Y table positioning system. The liquid adhesive had a width of 3.8mm, a thickneεε of about .051mm (.002 inch) for each of the firεt and second liquid adhesives. More accurately, the thicknesε of the two adheεive layerε and the leadframe (.15mm (.006 inch) thick) waε .25mm (.010 inch) . The room temperature viεcoεity of the adheεive waε 45 Pa»S (45,000 centipoiεe). A quad leadframe having 240 leads (60 leads per εide) was disposed between the base and cover and adhesively bonded to both. The cure cycle was 200°C for 3 minutes in air.
Five packages were evaluated in a presεure cooker at 121°C, 0.1 MPa (15 pεi) and 100% relative humidity for 96 hourε. One package showed a groεε leak failure when immerεed in a fluorocarbon liquid apparently due to inεufficient epoxy at a corner. The remaining four packages pasεed the fluorocarbon groεε leak teεt. It iε apparent that there haε been provided in accordance with thiε invention, a method for the aεsembly of an electronic package utilizing a liquid adheεive which εatisfies the objects, meanε and advantages set forth hereinabove. While the invention haε been deεcribed in combination with the embodimentε thereof, it iε evident that many alternatives, modifications and variationε will be apparent to thoεe εkilled in the art in light of the foregoing deεcription. Accordingly, it is intended to embrace all such alternatives, modifications and variations as fall within the εpirit and broad εcope of the appended claimε.

Claims

IN THE CLAIMS :
1. A method for the asεembly of an electronic package (48) , characterized by the εteps of: a) providing a base component (12) , a cover component (14) and a lead frame (16) ; b) diεpensing a first liquid adheεive (30) adjacent the perimeter (31) of εaid base component (12); c) supporting said leadframe (16) on said first liquid adhesive (30) ; d) dispensing a second liquid adhesive (46) overlying εaid leadframe (16) and εaid firεt liquid adheεive (30) ; e) εupporting said cover (14) on said second liquid adheεive (46) ; and f) simultaneously curing said firεt (30) and εecond (46) liquid adheεiveε.
2. The method of claim 1 characterized in that both εaid firεt (30) and said second (46) liquid adhesives are selected from the group consiεting of thermoεetting and thermoplastic polymers.
3. The method of claim 2 characterized in that said firεt (30) and εecond (46) liquid adheεiveε have a thickneεε of at least that effective to prevent said leadframe (16) from contacting said base component (12) or εaid cover component (14) .
4. The method of claim 3 characterized in that εaid firεt (30) and εecond (46) liquid adheεiveε have a thickness of from about .025mm to about .076mm. 5. The method of claim 3 characterized in that εaid firεt (30) and εecond (46) liquid adhesives have a room temperature viscoεity of from about 20 Pa»S to about 500 Pa*S (20,000-500,000 centipoiεe).
6. The method of claim 5 characterized in that εaid firεt liquid adheεive (30) iε εpaced from about .13mm to about 1.3mm from εaid perimeter (31) of εaid baεe component (12) .
7. An electronic package (60), characterized by: a baεe component (50) ; a cover component (56) ; a leadframe (16) ; an adheεive retaining channel (52) adjacent the perimeter of at leaεt one of εaid baεe component (50) and εaid cover component (56) ; an adheεive (58) bonding εaid base component (50) to εaid cover component (56) with εaid leadframe (16) diεpoεed therebetween.
8. The electronic package (60) of claim 7 characterized in that εaid adheεive retaining channel (52) haε a width of from about .63mm to about 5.1mm and a depth of from about 0.127mm to about 2.54mm and a portion of εaid adheεive (58) iε retained by said adhesive retaining channel (52) .
9. The electronic package (60) of claim 8 characterized in that said base component (50) and εaid cover component (56) are both metallic and both contain an adhesive retaining channel (52) . 10. The electronic package (60) of claim 9 characterized in that said base component (50) and said cover component (56) contain a dielectric layer (62) on those surfaces contacting εaid leadframe (16).
11. The electronic package (60) of claim 10 characterized in that εaid baεe component (50) and said cover component (56) are aluminum or an aluminum alloy and said dielectric layer (62) is an anodization layer.
12. The electronic package (60) of claim 10 characterized in that said base component (50) and said cover component (56) are copper or a copper alloy coated with a metal capable of forming a refractory oxide layer.
13. An electronic package, characterized by: a base component (70) and a cover component (74) , at least one of which is metallic; a leadframe (16) having a plurality of leads, diεposed between said base component (70) and εaid cover component (74) ; metallic protruεionε (76) extending from at least one of said metallic base (70) or cover (74) component between at least some of said leads; and an adheεive bonding εaid baεe component
(70) to εaid cover component (74) with said leadframe (16) and metallic protrusionε (76) therebetween, said adhesive electrically isolating said leadε from εaid protruεions (76) . 14. The electronic package of claim 13 characterized in that said metallic component with protruεionε (76) iε directly connected to a grounding meanε.
15. The electronic package of claim 13 characterized in that a liquid adheεive retaining channel (52) iε adjacent the perimeter of at leaεt one of εaid baεe component (70) and εaid cover component (74) .
16. The electronic package of claim 15 characterized in that leadframe channels (72) intersect said a liquid adhesive retaining channel (52).
_ 17. The electronic package of claim 13 characterized in that εaid protruεionε (76) electrically interconnect said base component (70) and said cover component (76) .
EP94901644A 1992-12-09 1993-11-22 Electronic package sealed with a dispensable adhesive. Withdrawn EP0673547A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US98786792A 1992-12-09 1992-12-09
US987867 1992-12-09
PCT/US1993/011337 WO1994014193A1 (en) 1992-12-09 1993-11-22 Electronic package sealed with a dispensable adhesive

Publications (2)

Publication Number Publication Date
EP0673547A1 EP0673547A1 (en) 1995-09-27
EP0673547A4 true EP0673547A4 (en) 1996-03-13

Family

ID=25533645

Family Applications (1)

Application Number Title Priority Date Filing Date
EP94901644A Withdrawn EP0673547A4 (en) 1992-12-09 1993-11-22 Electronic package sealed with a dispensable adhesive.

Country Status (5)

Country Link
EP (1) EP0673547A4 (en)
JP (1) JPH08505266A (en)
AU (1) AU5616194A (en)
CA (1) CA2150569A1 (en)
WO (1) WO1994014193A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE508139C2 (en) * 1996-12-20 1998-08-31 Ericsson Telefon Ab L M Method and apparatus for connecting electrical component to circuit board
SE508138C2 (en) * 1996-12-20 1998-08-31 Ericsson Telefon Ab L M Method and apparatus for connecting electrical component to circuit board
KR100697624B1 (en) * 2005-07-18 2007-03-22 삼성전자주식회사 Package substrate having surface structure adapted for adhesive flow control and semiconductor package using the same
JP6888114B2 (en) * 2017-11-09 2021-06-16 Ｎｇｋエレクトロデバイス株式会社 Lid and electronics
JP6929210B2 (en) * 2017-12-11 2021-09-01 株式会社ブリヂストン tire

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4622433A (en) * 1984-03-30 1986-11-11 Diacon, Inc. Ceramic package system using low temperature sealing glasses
US4629824A (en) * 1984-12-24 1986-12-16 Gte Products Corporation IC package sealing technique
US4704626A (en) * 1985-07-08 1987-11-03 Olin Corporation Graded sealing systems for semiconductor package
US5023398A (en) * 1988-10-05 1991-06-11 Olin Corporation Aluminum alloy semiconductor packages
US5043534A (en) * 1990-07-02 1991-08-27 Olin Corporation Metal electronic package having improved resistance to electromagnetic interference
EP0447884A2 (en) * 1990-03-23 1991-09-25 Motorola, Inc. Semiconductor device having a low temperature UV-cured epoxy seal and method for making the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4139726A (en) * 1978-01-16 1979-02-13 Allen-Bradley Company Packaged microcircuit and method for assembly thereof
US5013871A (en) * 1988-02-10 1991-05-07 Olin Corporation Kit for the assembly of a metal electronic package
US5098864A (en) * 1989-11-29 1992-03-24 Olin Corporation Process for manufacturing a metal pin grid array package

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4622433A (en) * 1984-03-30 1986-11-11 Diacon, Inc. Ceramic package system using low temperature sealing glasses
US4629824A (en) * 1984-12-24 1986-12-16 Gte Products Corporation IC package sealing technique
US4704626A (en) * 1985-07-08 1987-11-03 Olin Corporation Graded sealing systems for semiconductor package
US5023398A (en) * 1988-10-05 1991-06-11 Olin Corporation Aluminum alloy semiconductor packages
EP0447884A2 (en) * 1990-03-23 1991-09-25 Motorola, Inc. Semiconductor device having a low temperature UV-cured epoxy seal and method for making the same
US5043534A (en) * 1990-07-02 1991-08-27 Olin Corporation Metal electronic package having improved resistance to electromagnetic interference

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO9414193A1 *

Also Published As

Publication number Publication date
CA2150569A1 (en) 1994-06-23
JPH08505266A (en) 1996-06-04
EP0673547A1 (en) 1995-09-27
WO1994014193A1 (en) 1994-06-23
AU5616194A (en) 1994-07-04

Similar Documents

Publication Publication Date Title
US5458716A (en) Methods for manufacturing a thermally enhanced molded cavity package having a parallel lid
US5312508A (en) Attaching crimped wire mesh to an object requiring heat transfer
EP0712153B1 (en) Methods of soldering, for example, for use in packaging electrical circuits
US5506446A (en) Electronic package having improved wire bonding capability
US5218229A (en) Inset die lead frame configuration lead frame for a semiconductor device having means for improved busing and die-lead frame attachment
US5972736A (en) Integrated circuit package and method
US20020150740A1 (en) Cover with gapped adhesive preform
US20020195701A1 (en) Electronic component and method for producing the electronic component
EP0664924A4 (en) Metal electronic package with reduced seal width.
JP2001237361A (en) Lead frame having small lifting mount pad
EP0729644A1 (en) Multi-chip electronic package module utilizing an adhesive sheet
US6339875B1 (en) Method for removing heat from an integrated circuit
EP0673547A1 (en) Electronic package sealed with a dispensable adhesive
US20220199502A1 (en) Multiple substrate package systems and related methods
US6525411B1 (en) Semiconductor package and method of fabricating the same
KR100495644B1 (en) Method for manufacturing semiconductor devices
JPH0815165B2 (en) Method for manufacturing resin-insulated semiconductor device
JP2770947B2 (en) Resin-sealed semiconductor device and method of manufacturing the same
JPH08139218A (en) Hybrid integrated circuit device and its manufacture
US7705437B2 (en) Semiconductor device
JP2772828B2 (en) Die bonding method
US20020064900A1 (en) Semiconductor device and method of fabricating the same
CN117524892B (en) Packaging technology and IC chip
US20020190363A1 (en) Semiconductor device package and method of die attach
JPH0745663A (en) Semiconductor device with heat sink and its manufacture

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 19950608

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE FR GB IT NL

A4 Supplementary search report drawn up and despatched
AK Designated contracting states

Kind code of ref document: A4

Designated state(s): DE FR GB IT NL

17Q First examination report despatched

Effective date: 19971006

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 19990601