EP0624416A3 - Procédé et appareil pour déterminer et restituer pondabilité. - Google Patents
Procédé et appareil pour déterminer et restituer pondabilité. Download PDFInfo
- Publication number
- EP0624416A3 EP0624416A3 EP93113688A EP93113688A EP0624416A3 EP 0624416 A3 EP0624416 A3 EP 0624416A3 EP 93113688 A EP93113688 A EP 93113688A EP 93113688 A EP93113688 A EP 93113688A EP 0624416 A3 EP0624416 A3 EP 0624416A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- assessing
- solderability
- restoring
- restoring solderability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/416—Systems
- G01N27/4161—Systems measuring the voltage and using a constant current supply, e.g. chronopotentiometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/416—Systems
- G01N27/42—Measuring deposition or liberation of materials from an electrolyte; Coulometry, i.e. measuring coulomb-equivalent of material in an electrolyte
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Pathology (AREA)
- Molecular Biology (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/060,328 US5425859A (en) | 1991-05-28 | 1993-05-11 | Method and apparatus for assessing and restoring solderability |
US60328 | 1993-05-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0624416A2 EP0624416A2 (fr) | 1994-11-17 |
EP0624416A3 true EP0624416A3 (fr) | 1995-03-22 |
Family
ID=22028814
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP93113688A Withdrawn EP0624416A3 (fr) | 1993-05-11 | 1993-08-26 | Procédé et appareil pour déterminer et restituer pondabilité. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5425859A (fr) |
EP (1) | EP0624416A3 (fr) |
JP (1) | JP3184375B2 (fr) |
CA (1) | CA2105493C (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6214210B1 (en) * | 1994-11-08 | 2001-04-10 | Rockwell Technologies, Llc | Electrochemical surface analysis using deoxygenated gel electrolyte |
US6360935B1 (en) | 1999-01-26 | 2002-03-26 | Board Of Regents Of The University Of Texas System | Apparatus and method for assessing solderability |
US20040122456A1 (en) * | 2002-12-11 | 2004-06-24 | Saadat Vahid C. | Methods and apparatus for gastric reduction |
US6331237B1 (en) * | 1999-09-01 | 2001-12-18 | International Business Machines Corporation | Method of improving contact reliability for electroplating |
US20020067486A1 (en) * | 2000-09-25 | 2002-06-06 | S. Forney Leroy | Solderability assessment |
JP6144532B2 (ja) * | 2013-05-01 | 2017-06-07 | 株式会社デンソー | ブレージングシートのろう付け方法、及び熱交換器の製造方法 |
CN104849554B (zh) * | 2014-02-14 | 2018-01-05 | 快捷半导体(苏州)有限公司 | 阻抗检测电路、方法及集成电路 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1569772A (fr) * | 1968-03-20 | 1969-06-06 | ||
US3684679A (en) * | 1969-06-05 | 1972-08-15 | John R Smith | Apparatus for testing the corrosion resistance of tinplate |
FR2560797A1 (fr) * | 1985-03-06 | 1985-09-13 | Asm Fico Tooling | Procede et appareil pour le nettoyage par pulverisation inverse sous vide des fiches de connexion et similaires avant des operations de soudage |
US4725339A (en) * | 1984-02-13 | 1988-02-16 | International Business Machines Corporation | Method for monitoring metal ion concentrations in plating baths |
US5104494A (en) * | 1991-07-02 | 1992-04-14 | Rockwell International Corp. | Method of restoring solderability |
US5262022A (en) * | 1991-05-28 | 1993-11-16 | Rockwell International Corporation | Method of assessing solderability |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2390591A (en) * | 1941-11-08 | 1945-12-11 | Nat Carbon Co Inc | Electrolytic method for producing oxygen |
NL240441A (fr) * | 1958-06-27 | |||
NL259614A (fr) * | 1959-12-31 | |||
US3421989A (en) * | 1964-11-24 | 1969-01-14 | Beckman Instruments Inc | Mercury pool electrode |
US3309233A (en) * | 1964-12-30 | 1967-03-14 | Charles C Mcpheeters | Solid electrolyte electrochemical cell |
GB1434199A (en) * | 1972-10-19 | 1976-05-05 | Wilkinson Sword Ltd | Selective electrolytic dissolution of predetermined metals |
US3838021A (en) * | 1973-07-18 | 1974-09-24 | United Nuclear Corp | Method and apparatus for in situ calibration of electrochemical sensors |
US4132605A (en) * | 1976-12-27 | 1979-01-02 | Rockwell International Corporation | Method for evaluating the quality of electroplating baths |
US4427496A (en) * | 1980-01-25 | 1984-01-24 | Rca Corporation | Method for improving the inspection of printed circuit boards |
EP0194103B1 (fr) * | 1985-02-28 | 1990-02-07 | C. Uyemura & Co Ltd | Procédé et appareillage pour déceler le déclenchement d'un dépôt chimique |
US4654126A (en) * | 1985-10-07 | 1987-03-31 | International Business Machines Corporation | Process for determining the plating activity of an electroless plating bath |
-
1993
- 1993-05-11 US US08/060,328 patent/US5425859A/en not_active Expired - Lifetime
- 1993-08-26 EP EP93113688A patent/EP0624416A3/fr not_active Withdrawn
- 1993-09-03 CA CA002105493A patent/CA2105493C/fr not_active Expired - Lifetime
- 1993-09-16 JP JP23013793A patent/JP3184375B2/ja not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1569772A (fr) * | 1968-03-20 | 1969-06-06 | ||
US3684679A (en) * | 1969-06-05 | 1972-08-15 | John R Smith | Apparatus for testing the corrosion resistance of tinplate |
US4725339A (en) * | 1984-02-13 | 1988-02-16 | International Business Machines Corporation | Method for monitoring metal ion concentrations in plating baths |
FR2560797A1 (fr) * | 1985-03-06 | 1985-09-13 | Asm Fico Tooling | Procede et appareil pour le nettoyage par pulverisation inverse sous vide des fiches de connexion et similaires avant des operations de soudage |
US5262022A (en) * | 1991-05-28 | 1993-11-16 | Rockwell International Corporation | Method of assessing solderability |
US5104494A (en) * | 1991-07-02 | 1992-04-14 | Rockwell International Corp. | Method of restoring solderability |
Also Published As
Publication number | Publication date |
---|---|
JP3184375B2 (ja) | 2001-07-09 |
JPH06331598A (ja) | 1994-12-02 |
CA2105493A1 (fr) | 1994-11-12 |
CA2105493C (fr) | 2004-04-20 |
US5425859A (en) | 1995-06-20 |
EP0624416A2 (fr) | 1994-11-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): DE FR GB |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
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AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): DE FR GB |
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17P | Request for examination filed |
Effective date: 19950817 |
|
17Q | First examination report despatched |
Effective date: 19980421 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 19981103 |