EP0607843B1 - One piece insulating part, especially injection molded part - Google Patents

One piece insulating part, especially injection molded part Download PDF

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Publication number
EP0607843B1
EP0607843B1 EP94100303A EP94100303A EP0607843B1 EP 0607843 B1 EP0607843 B1 EP 0607843B1 EP 94100303 A EP94100303 A EP 94100303A EP 94100303 A EP94100303 A EP 94100303A EP 0607843 B1 EP0607843 B1 EP 0607843B1
Authority
EP
European Patent Office
Prior art keywords
elevation
insulating part
conductor
electrically conductive
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP94100303A
Other languages
German (de)
French (fr)
Other versions
EP0607843A1 (en
Inventor
Eduard Dipl.-Ing. Schönberger (FH)
Stefan Dipl.-Ing. Gruber (Fh)
Hermann Dipl.-Ing. Kasowski (Fh)
Heinz Dipl.-Ing. Schmidt (Fh)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
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Siemens AG
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Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0607843A1 publication Critical patent/EP0607843A1/en
Application granted granted Critical
Publication of EP0607843B1 publication Critical patent/EP0607843B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09281—Layout details of a single conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S174/00—Electricity: conductors and insulators
    • Y10S174/34—PCB in box or housing

Definitions

  • the present invention relates to an insulating part according to the preamble of claim 1.
  • an insulating part is known for example from EP 0 465 692 A1.
  • Such an insulating part is also used as the rear wall of the housing of the SIMATIC S5-95 U automation device from Siemens AG.
  • a second object of the present invention is therefore to provide a possibility for the simple shielding of assemblies or assembly parts.
  • the first object is achieved in that the insulating part between the conductor tracks has an elevation, for example a rib, and / or a recess, e.g. B. has a channel with the conductor tracks facing conductor tracks, the elevation is free of electrically conductive coatings.
  • the effective distance between two tracks is increased considerably, so that the direct distance between the tracks can be reduced without sacrificing safety.
  • the insulating part has an elevation, e.g. has a rib with the conductor sides facing the conductor lines, at least one of the conductor sides having an electrically conductive coating.
  • the electrically conductive coating in fact shields the two conductor tracks or the components arranged on the two conductor tracks or generally the regions of the insulating part side which are separated from one another by the elevation.
  • the one-piece injection molded part 1 has a plurality of elongated ribs 2, between which electronic components 3, z. B. resistors, pads and tracks 4 run.
  • the ribs 2 are free of electrically conductive Coatings.
  • a non-metallic coated groove can also be arranged between the conductor tracks 4, since the prescribed air gap is considerably smaller than the prescribed creepage distance.
  • the injection molded part 1 according to FIG. 2 is also made in one piece and has ribs 2.
  • the rib 2 has on at least one of the conductor sides 2 ', 2 ⁇ , an electrically conductive coating, for. B. on the conductor side 2 '. By means of this coating, the circuit located between the ribs 2 is shielded from its surroundings.
  • the injection molding has a circumferential rib 2, as shown in FIG 2, so that the rib 2 forms the side walls of a box.
  • a cover 6 is connected to the rib 2 via a taper 5 and closes off the box at the top.
  • the bottom of the box is formed by the base of the plastic part 1 itself.
  • both the outside 2 'of the rib 2 and the outside 6' of the cover 6 are provided over a large area with metal coatings 7, 7 '.
  • the coatings 7, 7 ' are connected to each other by a conductor 8 running diagonally across the taper 5.
  • the diagonal connection of the coatings 7, 7 ' ensures that when the cover 6 is actuated, the conductor track 8 is not interrupted, which could happen if the conductor 8 would connect the coatings 7, 7 'to each other in the shortest possible way.
  • the taper 5 can also be fully metallized.
  • the injection molded part 1 is first injection molded in a known manner and is then metallized over a large area in a likewise known manner.
  • the conductor tracks 4, 8 and the uncoated elements are produced by removing the metal layer at the points where the metal layer is undesirable.
  • another one-piece circuit carrier which is initially electrically insulating on its surface can also be used, for.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulators (AREA)
  • Insulating Bodies (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Electrostatic Charge, Transfer And Separation In Electrography (AREA)

Abstract

Injection-moulded parts (1) having integrated conductor runs (4) are known. The injection-moulded part (1) has projections (2) between conductor runs (4). If the projections (2) are uncoated, that is to say electrically insulating, they increase the effective voltage separations between the conductor runs (4) and the components (3) arranged close to the conductor runs (4). The geometrical separations can then be reduced. If the projections (2) are electrically conductively coated, electrical and magnetic screening is achieved in a simple manner. <IMAGE>

Description

Die vorliegende Erfindung betrifft ein Isolierteil gemäß dem Oberbegriff des Anspruchs 1. Ein derartiges Isolierteil ist beispielsweise aus der EP 0 465 692 A1 bekannt. Auch beim Automatisierungsgerät SIMATIC S5-95 U der Siemens AG wird ein derartiges Isolierteil als Gehäuserückwand verwendet.The present invention relates to an insulating part according to the preamble of claim 1. Such an insulating part is known for example from EP 0 465 692 A1. Such an insulating part is also used as the rear wall of the housing of the SIMATIC S5-95 U automation device from Siemens AG.

Bei Verwendung höherer Spannungen, z.B. 230 V, ist es nötig, die Leiterzüge relativ weit voneinander entfernt anzuordnen, damit vorgeschriebene Spannungsabstände zwischen benachbarten Leiterbahnen und Lötaugen eingehalten werden. Der Schaltungsträger kann daher aufgrund elektrischer Sicherheitsvorschriften nur zu einem erheblich geringeren Maß ausgenützt werden als bestückungstechnisch bzw. leiterbahntechnisch möglich wäre. Eine Aufgabe der vorliegenden Erfindung besteht folglich darin, eine Möglichkeit zu schaffen, Bauelemente, Leiterbahnen und Lötaugen näher aneinander anzuordnen und so den zur Verfügung stehenden Platz besser auszunützen.When using higher voltages, e.g. 230 V, it is necessary to arrange the conductor tracks relatively far apart so that the prescribed voltage distances between adjacent conductor tracks and solder eyes are observed. Due to electrical safety regulations, the circuit carrier can therefore only be used to a considerably lesser extent than would be possible in terms of assembly technology or conductor track technology. It is therefore an object of the present invention to create a possibility of arranging components, conductor tracks and soldering pads closer to one another and thus making better use of the available space.

Weiterhin stellt sich bei elektronischen Baugruppen das Problem der elektrischen Schirmung, sei es bezüglich emittierter oder immittierter elektromagnetischer Störstrahlung. Eine zweite Aufgabe der vorliegenden Erfindung besteht also darin, eine Möglichkeit zur einfachen Schirmung von Baugruppen bzw. Baugruppenteilen zu schaffen.Furthermore, the problem of electrical shielding arises in the case of electronic assemblies, be it with regard to emitted or emitted electromagnetic interference radiation. A second object of the present invention is therefore to provide a possibility for the simple shielding of assemblies or assembly parts.

Die erste Aufgabe wird dadurch gelöst, daß das Isolierteil zwischen den Leiterzügen eine Erhebung, z.B. eine Rippe, und/oder eine Vertiefung, z. B. ein Rinne, mit den Leiterzügen zugewandten Leiterzugseiten aufweist, wobei die Erhebung frei von elektrisch leitenden Beschichtungen ist. Dadurch wird nämlich der wirksame Abstand zwischen zwei Leiterzügen beträchtlich erhöht, so daß der direkte Abstand zwischen den Leiterzügen ohne Sicherheitseinbußen verringert werden kann.The first object is achieved in that the insulating part between the conductor tracks has an elevation, for example a rib, and / or a recess, e.g. B. has a channel with the conductor tracks facing conductor tracks, the elevation is free of electrically conductive coatings. As a result, the effective distance between two tracks is increased considerably, so that the direct distance between the tracks can be reduced without sacrificing safety.

Die zweite Aufgabe wird dadurch gelöst, daß das Isolierteil zwischen den Leiterzügen eine Erhebung, z.B. eine Rippe mit den Leiterzügen zugewandten Leiterzugseiten aufweist, wobei mindestens eine der Leiterzugseiten eine elektrisch leitende Beschichtung aufweist. Durch die elektrisch leitende Beschichtung wird nämlich eine Abschirmung der beiden Leiterzüge bzw. der auf den beiden Leiterzügen angeordneten Bauelemente bzw. allgemein der durch die Erhebung voneinander getrennten Gebiete der Isolierteilseite voneinander erreicht.The second object is achieved in that the insulating part has an elevation, e.g. has a rib with the conductor sides facing the conductor lines, at least one of the conductor sides having an electrically conductive coating. The electrically conductive coating in fact shields the two conductor tracks or the components arranged on the two conductor tracks or generally the regions of the insulating part side which are separated from one another by the elevation.

Weitere Vorteile und Einzelheiten ergeben sich aus der nachfolgenden Beschreibung eines Ausführungsbeispiels, anhand der Zeichnungen und in Verbindung mit den weiteren Unteransprüchen. Dabei zeigen:

FIG 1
ein Kunststoffteil mit unbeschichteten Erhebungen,
FIG 2
ein Kunststoffteil mit elektrisch leitend beschichteten Erhebungen und
FIG 3
ein Detail einer Erhebung.
Further advantages and details emerge from the following description of an exemplary embodiment, using the drawings and in conjunction with the further subclaims. Show:
FIG. 1
a plastic part with uncoated elevations,
FIG 2
a plastic part with electrically conductive coated elevations and
FIG 3
a detail of a survey.

Gemäß FIG 1 weist das einstückige Spritzgießteil 1 mehrere längliche Rippen 2 auf, zwischen denen elektronische Bauelemente 3, z. B. Widerstände, Lötaugen und Leiterzüge 4 verlaufen. Die Rippen 2 sind frei von elektrisch leitenden Beschichtungen. Dadurch wird der wirksame Abstand zwischen benachbarten Bauelementen 3 bzw. benachbarten Leiterzügen 4, vergrößert, so daß trotz Betrieb der Schaltung mit einer hohen Spannung, z. B. 230 Volt, die Leiterzüge 4 und die Bauelemente 3 nah aneinander angeordnet werden können.According to FIG 1, the one-piece injection molded part 1 has a plurality of elongated ribs 2, between which electronic components 3, z. B. resistors, pads and tracks 4 run. The ribs 2 are free of electrically conductive Coatings. As a result, the effective distance between adjacent components 3 or adjacent tracks 4 is increased, so that despite operation of the circuit with a high voltage, for. B. 230 volts, the conductor tracks 4 and the components 3 can be arranged close to each other.

Anstelle einer nicht metallisch beschichteten Rippe 2 kann auch eine nicht metallisch beschichtete Rinne zwischen den Leiterzügen 4 angeordnet sein, da die vorgeschriebene Luftstrecke erheblich kleiner als die vorgeschriebene Kriechstrecke ist.Instead of a non-metallic coated rib 2, a non-metallic coated groove can also be arranged between the conductor tracks 4, since the prescribed air gap is considerably smaller than the prescribed creepage distance.

Auch das Spritzgießteil 1 gemäß FIG 2 ist einstückig ausgebildet und weist Rippen 2 auf. Die Rippe 2 weist auf mindestens einer der Leiterzugseiten 2′, 2˝, eine elektrisch leitende Beschichtung auf, z. B. auf der Leiterzugseite 2′. Mittels dieser Beschichtung wird die zwischen den Rippen 2 befindliche Schaltung von ihrer Umgebung abgeschirmt.The injection molded part 1 according to FIG. 2 is also made in one piece and has ribs 2. The rib 2 has on at least one of the conductor sides 2 ', 2˝, an electrically conductive coating, for. B. on the conductor side 2 '. By means of this coating, the circuit located between the ribs 2 is shielded from its surroundings.

Die Abschirmung ist besonders gut, wenn sie allseitig erfolgt. Hierzu weist das Spritzgießteil eine umlaufende Rippe 2 auf, wie in FIG 2 dargestellt, so daß die Rippe 2 die Seitenwände eines Kastens bildet. Über eine Verjüngung 5 ist ein Deckel 6 mit der Rippe 2 verbunden, der den Kasten oben abschließt. Der Boden des Kastens wird durch die Grundfläche des Kunststoffteils 1 selbst gebildet.The shielding is particularly good if it is done on all sides. For this purpose, the injection molding has a circumferential rib 2, as shown in FIG 2, so that the rib 2 forms the side walls of a box. A cover 6 is connected to the rib 2 via a taper 5 and closes off the box at the top. The bottom of the box is formed by the base of the plastic part 1 itself.

Gemäß FIG 3 sind sowohl die Außenseite 2′ der Rippe 2 als auch die Außenseite 6′ des Deckels 6 großflächig mit Metallbeschichtungen 7, 7′ versehen. Die Beschichtungen 7, 7′ sind durch einen diagonal über die Verjüngung 5 verlaufenden Leiterzug 8 miteinander verbunden. Durch die diagonale Verbindung der Beschichtungen 7, 7′ wird erreicht, daß bei einem Betätigen des Deckels 6 der Leiterzug 8 nicht unterbrochen wird, was geschehen könnte, wenn der Leiterzug 8 die Beschichtungen 7, 7′ auf dem kürzestmöglichen Weg miteinander verbinden würde. Alternativ zu dem diagonal verlaufenden Leiterzug 8 kann die Verjüngung 5 jedoch auch voll metallisiert sein.According to FIG 3, both the outside 2 'of the rib 2 and the outside 6' of the cover 6 are provided over a large area with metal coatings 7, 7 '. The coatings 7, 7 'are connected to each other by a conductor 8 running diagonally across the taper 5. The diagonal connection of the coatings 7, 7 'ensures that when the cover 6 is actuated, the conductor track 8 is not interrupted, which could happen if the conductor 8 would connect the coatings 7, 7 'to each other in the shortest possible way. As an alternative to the diagonally running conductor 8, the taper 5 can also be fully metallized.

Abschließend sei darauf hingewiesen, daß das Spritzgießteil 1 zunächst in bekannter Weise spritzgegossen wird und sodann in ebenfalls bekannter Weise großflächig metallisch beschichtet wird. Die Leiterzüge 4, 8 sowie die unbeschichteten Elemente entstehen durch Entfernen der Metallschicht an den Stellen, an denen die Metallschicht unerwünscht ist.In conclusion, it should be pointed out that the injection molded part 1 is first injection molded in a known manner and is then metallized over a large area in a likewise known manner. The conductor tracks 4, 8 and the uncoated elements are produced by removing the metal layer at the points where the metal layer is undesirable.

Ferner kann anstelle eines Spritzgießteils auch ein anderer einstückiger, auf seiner Oberfläche zunächst elektrisch isolierender Schaltungsträger verwendet werden, z. B. ein auf seiner gesamten Oberfläche in geeigneter Weise eloxiertes Aluminium-Druckgußteil.Furthermore, instead of an injection molded part, another one-piece circuit carrier which is initially electrically insulating on its surface can also be used, for. B. an appropriately anodized aluminum die-cast part on its entire surface.

Claims (6)

  1. One-piece insulating part, for example plastics part, in particular injection-moulded part, having at least one plastics part side on which at least two printed conductors are arranged, characterised in that the plastics part (1) between the printed conductors (4) has an elevation (2), for example a rib (2), and/or a depression, for example a groove, with printed conductor sides (2′, 2˝) facing the printed conductors (4).
  2. Insulating part according to claim 1, characterised in that the elevation (2) is free of electrically conductive coatings.
  3. Insulating part according to claim 1, characterised in that at least one printed conductor side (2′) has an electrically conductive coating (7).
  4. Insulating part according to claim 3, characterised in that the elevation (2+6) has a base elevation (2), which is directly connected with the plastics part side, and an additional elevation (6), with the additional elevation (6) being connected with the base elevation (2) by way of a tapered portion (5) which acts as a film hinge.
  5. Insulating part according to claim 4, characterised in that the base elevation (2) and the additional elevation (6) each have a coating (7, 7′) which is electrically conductive over a large area and in that the coatings (7, 7′) are connected with each other by way of a printed conductor (8) which extends diagonally across the tapered portion (5).
  6. Insulating part according to one of the above claims, characterised in that it is formed as a metal part, for example as an anodized aluminium die-cast part, which is provided with an insulating layer.
EP94100303A 1993-01-22 1994-01-11 One piece insulating part, especially injection molded part Expired - Lifetime EP0607843B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE9300868U 1993-01-22
DE9300868U DE9300868U1 (en) 1993-01-22 1993-01-22 One-piece insulating part, in particular injection molded part

Publications (2)

Publication Number Publication Date
EP0607843A1 EP0607843A1 (en) 1994-07-27
EP0607843B1 true EP0607843B1 (en) 1995-10-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP94100303A Expired - Lifetime EP0607843B1 (en) 1993-01-22 1994-01-11 One piece insulating part, especially injection molded part

Country Status (5)

Country Link
US (1) US5965843A (en)
EP (1) EP0607843B1 (en)
JP (1) JP2694742B2 (en)
AT (1) ATE129117T1 (en)
DE (2) DE9300868U1 (en)

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JPH11220234A (en) * 1998-01-29 1999-08-10 Smk Corp Circuit board
US6092281A (en) 1998-08-28 2000-07-25 Amkor Technology, Inc. Electromagnetic interference shield driver and method
JP2002134843A (en) * 2000-10-19 2002-05-10 Daikin Ind Ltd Resin molded wiring board
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JP2694742B2 (en) 1997-12-24
ATE129117T1 (en) 1995-10-15
EP0607843A1 (en) 1994-07-27
DE9300868U1 (en) 1994-05-26
US5965843A (en) 1999-10-12
JPH06244517A (en) 1994-09-02
DE59400027D1 (en) 1995-11-16

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