EP0591313B1 - Structures amortissant les vibrations faisant appel a des materiaux amortissants a haute temperature en epoxy aromatique - Google Patents

Structures amortissant les vibrations faisant appel a des materiaux amortissants a haute temperature en epoxy aromatique Download PDF

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Publication number
EP0591313B1
EP0591313B1 EP92912991A EP92912991A EP0591313B1 EP 0591313 B1 EP0591313 B1 EP 0591313B1 EP 92912991 A EP92912991 A EP 92912991A EP 92912991 A EP92912991 A EP 92912991A EP 0591313 B1 EP0591313 B1 EP 0591313B1
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Prior art keywords
layer
damping
fluorene
construction
viscoelastic
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German (de)
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EP0591313A1 (fr
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Debra L. Wilfong
Wendy L. Thompson
William J. Schultz
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3M Co
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Minnesota Mining and Manufacturing Co
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    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/162—Selection of materials
    • G10K11/168—Plural layers of different materials, e.g. sandwiches

Definitions

  • This invention relates to vibration-damping constructions and a method useful for damping vibratory and/or noise emitting structures and component parts of devices such as automobiles, aircraft, industrial equipment, and appliances.
  • This vibration-damping construction comprising at least a single layer of aromatic epoxy high temperature damping materials.
  • U.S. Patent No. 3,640,836 discloses a vibration-damping laminate in which the viscoelastic layer is a polymer comprised of ethylene, vinyl acetate and acrylic and/or methacrylic acid.
  • U.S. Patent No. 3,847,726 discloses a viscoelastic adhesive composition of a polyepoxide, a polyether amine, a heterocyclic amine, and a phenol useful as vibration-damping material over a -25° to +60°C range. Such compositions, however, are not effective for vibration-damping over prolonged periods of time at elevated temperatures.
  • U.S. Patent No. 3,833,404 discloses viscoelastic damping compositions comprising an interpenetrating polymer network composition consisting essentially of 5-95% by weight of a polyalkyl acrylate elastomer, for example, polyethyl acrylate or polybutyl acrylate, polyvinyl acetate, polyurethane, polybutadiene, natural rubber, silicone rubber, butyl rubber, chloroprene, ethylenepropylene terepolymer elastomers, polyvinyl alcohol, thiol rubber, and copolymers thereof; and 95-5% by weight of a plastic, such as polystyrene, poly- ⁇ -methyl styrene, polyalkyl acrylates, for example, polymethyl methacrylate or polyethyl methacrylate, poly-1-alkenes, for example, polypropylene, polyacrylic acid, and copolymers thereof, together with an outer plastic constraining layer.
  • Epoxies have traditionally been used as constraining layers in damping constructions since they do not exhibit any significant damping due to their highly crosslinked networks.
  • U.S. Patent No. 3,833,404 considers epoxy for the constraining layer, epoxy is not considered alone or in combination with other polymers as a potential viscoelastic damping material in this document, contrary to the previously cited US-A-3847726.
  • U.S. Patent No. 4,385,139 discloses a synthetic resin composition composed of at least two different polymers and a filler for use as starting material for vibration-damping sheets.
  • a synthetic resin composition composed of at least two different polymers and a filler for use as starting material for vibration-damping sheets.
  • at least one acrylic acid ester at least one vinyl ester and inorganic filler, 1 to 10% by weight of an epoxide resin is added to the mixture relative to the sum total of the first 3 components.
  • Epoxy resins with fluorenes are not disclosed in this document.
  • U.S. Patent No. 4,304,694 discloses a damping composite comprising a resin matrix of about 20 to 43% by weight of a flexible epoxy, about 12 to 35% by weight of a stiff epoxy, about 35 to 61% by weight of a flexible crosslinking agent and about 20 to 50% by weight of a high modulus graphite fiber.
  • the crosslinking agent described comprises a long chain amine-fatty acid amide.
  • U.S. Patent No. 4,447,493 discloses a constrained-layer damping construction containing a viscoelastic polymer that is the reaction product of (a) 25 to 75 weight percent of an acryloyl or methacryloyl derivative of at least one oligomer having a T g of less than 25°C and a molecular weight per oligomer of 600 to 20 000 and (b) 75 weight percent of a monomer whose homopolymer has a T g of at least 50°C, the copolymer being suitable for damping vibrations at relatively high temperature, for example, 50° to 150°C. It appears that the 50°-150°C damping regime was measured at a frequency of 1000 Hz. Since damping temperatures generally decrease about 6 to 7°C with every decreasing decade of frequency, the copolymers described in the '493 patent would be expected to damp between about 30° and 130°C at 1 Hz.
  • U.S. Patent No. 4,684,678 discloses epoxy resin compositions that on curing yield cured resins having a high glass transition temperature, high ductility, and low moisture pick-up. 9,9-bis(aminophenyl)fluorenes are used as the curing agents. It discloses some of the fluorene containing epoxy resins of the present invention which have glass transition temperatures in the range presently claimed in claim 2.
  • U.S. Patent No. 4,707,534 discloses diglycidyl ethers of ortho-substituted-4-hydroxyphenylfluorenes curable compositions comprising diglycidyl ethers, and cured resins thereof.
  • the cured resins have a high glass transition temperature and improved modulus of elasticity.
  • a method of using cured fluorene-containing epoxy resins as vibration-damping materials comprises providing a viscoelastic layer construction with at least one layer of a cured fluorene-containing epoxy resin.
  • a damping construction comprising at least one layer of viscoelastic material applied to a vibratory solid article, such that the viscoelastic material comprises a cured fluorene-containing epoxy resin.
  • the cured fluorene-containing epoxy resin is bonded to a vibratory solid article that is to be damped.
  • This application is referred to as a "free” viscoelastic layer, sometimes referred to as “extensional” damping. See Kerwin and Ungar, “Sound and Vibration Damping with Polymers," No. 424 ACS Symposium Series, Chapt. 17, (1989).
  • a cured fluorene-containing epoxy resin is used in a three layer laminate comprising a base layer (vibratory solid object) to be damped, a viscoelastic layer, and a constraining layer.
  • a base layer vibratory solid object
  • a viscoelastic layer a viscoelastic layer
  • a constraining layer a viscoelastic layer
  • This application is referred to as a "constrained” viscoelastic layer, sometimes referred to as "shear” damping (Kerwin and Ungar, supra .).
  • Cured fluorene-containing epoxy resins are also useful in variations of the constrained viscoelastic layer configuration, such as a segmented constraining layer, multiple constrained layer treatments, and multiple, overlapping segmented layers.
  • Fluorene epoxies provide a class of materials that exhibit high performance damping capabilities for use at operating temperatures between about 120 to 275°C (at 1 Hz) and provide toughness over a much broader temperature range. In addition, these resins exhibit ductility and are resistant to moisture.
  • EP-A-439197 shows that heterogeneous compositions comprising low to medium crosslinked aromatic epoxides can be used as the viscoelastic component in many vibration damping constructions.
  • the present invention as defined in claims 1 and 6 shows that such compositions, if they exhibit a microheterogeneous morphology and include in particular cured fluorene-containing epoxy resins, can be used as the viscoelastic component in both free and constrained-layer high temperature (> 100°C) damping constructions. Damping performance for these compositions can be further enhanced by controlling the degree of crosslinking and fluorene content.
  • other plastic and elastic components may be added to control the degree of crosslinking and fluorene content.
  • due to the intrinsic low water uptake of the fluorene containing epoxide materials they can advantageously be used in hot, humid environments.
  • Aromatic epoxides and in particular fluorene-containing networks exhibit good high temperature damping behavior from about 120°C to about 275°C measured at 1 Hz, and as such are suitable as the viscoelastic component in both free-layer and constrained-layer damping constructions.
  • the temperature range and extent of damping of these compositions are dependent upon the particular aromatic epoxy selected and the fluorene content.
  • the addition of thermosets, thermoplastics and elastomers may also affect performance of the compositions.
  • the preferred polymer damping materials may comprise a combination of polymers and exhibit a microheterogeneous morphology where phase boundaries are diffuse and the minor phase (present in a lesser amount) has a size on the order of hundreds of angstroms.
  • Damping materials that consist of two or more polymers and have macroscopically phase separated morphologies (on the order of micrometers) display damping performance at temperatures associated with the T g 's of the individual polymers.
  • two or more polymers that are mutually soluble and form a single phase exhibit damping over a narrow temperature range, the same as a single polymer.
  • a multicomponent system is required.
  • damping materials are applied to structures and component parts in devices to attenuate resonant vibrations thereby reducing noise and vibrational fatigue. This is often accomplished by attaching a viscoelastic material of appropriate damping characteristics to the vibrating structure. Vibrational forces cause the viscoelastic material to undergo shear deformation where some of its inelastic deformation energy is converted to heat and then dissipated (mechanical hysteresis). Under cyclic loading, heat generated results in a temperature rise until heat generated per cycle is equal to heat dissipated through conduction, convection and radiation. The ability of a material to damp is measured by its ability to convert vibrational energy to heat energy.
  • fluorene structures or fluorene segments into an epoxy produces a family of high performance epoxy resins that meet these requirements and are useful in high temperature damping applications.
  • the fluorene moiety may be introduced into an epoxy via addition of a fluorene-containing epoxy or using a fluorene amine or a combination of both.
  • Fluorene is a large rigid planar structure of tricyclic hydrocarbon, and it is believed this backbone structure contributes to producing tough, high T g resins.
  • thermosetting resins require high levels of crosslinking to achieve enhanced T g characteristics. Consequently, those resins exhibit a reduction in toughness and damping performance.
  • the curable composition of the invention contains at least 25 percent by weight (i.e., 25 to 100 weight percent), preferably 50 to 100 weight percent, of the above defined glycidyl ether and up to 75 percent, and more preferably 0 to 50 weight percent by weight, of other aromatic polyepoxide.
  • aromatic polyepoxides are well known and are compounds in which there is present at least one aromatic ring structure, e.g. a benzene ring, and more than one epoxy group, e.g. In the composition, monoepoxide compounds may also be included.
  • the aromatic polyepoxides preferably are the polyglycidyl ethers of polyhydric phenols, glycidyl esters of aromatic carboxylic acids, N-glycidylaminobenzenes, and glycidylamino-glycidyloxy-benzenes. More preferably the aromatic polyepoxides are the polyglycidyl ethers of polyhydric phenols.
  • U.S. Patent No. 4,707,534 describes additional illustrative examples of diglycidyl epoxy resins.
  • FEP fluorene epoxy
  • Epoxy resins that display good damping characteristics can be prepared, in part, from fluorene epoxy.
  • fluorene can be introduced into the epoxy backbone through an amine curative.
  • the following composition demonstrates a conventional epoxy cured with a fluorene amine curative.
  • polyepoxide means a molecule that contains more than one group and the term “aromatic polyepoxide” means a molecule that contains more than one group that are attached directly or indirectly to an aromatic nucleus such as a benzene, diphenyl, diphenyl-methane, diphenylpropane, or naphthalene nucleus, etc.
  • aromatic polyepoxide means a molecule that contains more than one group that are attached directly or indirectly to an aromatic nucleus such as a benzene, diphenyl, diphenyl-methane, diphenylpropane, or naphthalene nucleus, etc.
  • the process aspect of the invention comprises the steps of (1) mixing the aromatic polyepoxides and the curing agent or agents and catalysts as described below to form a substantially uniform mixture and (2) heating the mixture for a time and at a temperature sufficient to cure the composition. While the curing reaction may take place slowly at room temperature, it preferably is brought about by heating the mixture to a temperature between 50°C and 300°C for a period of time from about one to about 18 hours or more. Furthermore, it is desirable to cure the mixture by heating in cycles such as, for example, 50° to 150°C for a time period of between 0.25 to 1.0 hour, 150° to 200°C for a time period of between 0.5 to 2.0 hours, and 175° to 250°C for a time period of between 1.0 to 5.0 hours.
  • Epoxy resin curing typically involves dispersing amine curatives in the epoxy resin. Curatives need only be added in an amount sufficient to affect curing of the epoxy resin composition.
  • the curative may be added in stoichiometric excess or may be used in less than stoichiometric amounts in combination with a catalyst, such as, Lewis acids, tertiary amines and imidazoles.
  • Amine curatives suitable for use in the present invention include:
  • diprimary and disecondary amines act as chain extenders and tend to produce a linear polymer while diprimary amines contribute to crosslinking.
  • Fluorene content in the epoxy resin composition can be controlled by curing with varying ratios of diglycidyl ether of bisphenol-A (DGEBA) and a fluorene containing resin as well as by using fluorene amine curatives.
  • T g can be controlled via cure chemistry, such as adjusting the extent of crosslinking with the diprimary amine and/or by changing the fluorene concentration.
  • Fluorene-containing epoxy compositions may also be modified by the addition of thermoplastics, thermosets, and elastomers.
  • Thermoplastics that are suitable may include for example, polyphenylene sulfone, polybenzimidazole, polyether sulfone, polyester, polyimide, polyetherimide, polyphenylene oxide, polysulfone, acrylate, and methacrylate.
  • polyetherimide ULTEMTM, General Electric
  • FEP compositions can be rubber toughened by dispersing conventional rubber-toughening agents, such as core/shell rubber in the epoxy prior to adding the curatives, see U.S. Patent No. 4,684,678. This potentially improves the composite's low-end temperature damping characteristics. It is this flexibility in cure chemistry that allows formulation of compositions to address specific high temperature damping needs.
  • compositions include, but are not limited to, fillers, pigments, fibers, woven and nonwoven fabrics, foaming agents, antioxidants, stabilizers, fire retardants, and viscosity adjusting agents.
  • a free layer damping construction may be prepared according to processes known to those in the art and may comprise the following steps:
  • a free layer damping construction may be prepared as follows:
  • the viscoelastic layer generally has some adhesive properties, the cured epoxy resin could be readily adhered to the vibratory article without the use of an adhesive. However, it is sometimes desirable to use a thin layer (for example, 20-50 ⁇ m) of a high-modulus adhesive, such as an acrylic adhesive or an epoxy adhesive, to bond the viscoelastic layer to the vibratory article.
  • a high-modulus adhesive such as an acrylic adhesive or an epoxy adhesive
  • the layer thickness of a free-layer damping construction is generally greater than for a constrained layer construction, since damping performance of the free-layer construction is a function of the layer thickness, see Kerwin and Ungar, supra .
  • Vibration damping laminates containing fluorene-containing networks may be prepared according processes well known in art, for example, according to the steps of either Method I or Method II as described in U.S. Patent No. 4,447,493.
  • Method I provides the following steps:
  • Method II provides the following steps:
  • the constrained-layer construction can be mechanically or adhesively affixed to the vibratory article that is to be damped. Since the viscoelastic layer generally has some adhesive properties, the cured resin can usually be adhered to a stiff layer or substrate without the use of an adhesive. It is sometimes desirable, however, to use a thin layer (for example, 20-50 ⁇ m) of high-modulus adhesive, such as an acrylic adhesive or an epoxy adhesive, to bond the viscoelastic layer to a solid article which can be, for example, an oil pan, a valve cover, or a transmission housing.
  • high-modulus adhesive such as an acrylic adhesive or an epoxy adhesive
  • the viscoelastic layer is a coating having a thickness of at least 0.01 mm up to about 100 mm, preferably 0.025 to 100 mm, and most preferably 0.05 to 100 mm.
  • the coating can be applied by any of the techniques known in the art such as by spray, dip, knife, or curtain coating.
  • a stiff layer or a substrate is an essential part of constrained-layer vibration-damping constructions.
  • a suitable material for a substrate has a stiffness of 0.40 (relative to stainless steel) as defined in "Handbook of Tables for Applied Engineering Science", ed. Bolz, R. E. et al., CRC Press, Cleveland, Ohio, page 130 (1974).
  • the desired stiffness of the substrate is varied by adjusting the thickness of the layer, for example from about 25 micrometers to 5 centimeters, depending on the modulus of the substrate.
  • suitable materials include metals such as iron, steel, nickel, aluminum, chromium, cobalt and copper, and alloys thereof; stiff thermoplastic materials, such as polystyrene, polyvinyl chloride, polyurethane, polyphenyl sulfide, and polycarbonate; stiff thermoset materials; fiber-reinforced thermoplastics; fiber-reinforced thermosets, such as epoxies, phenolics; ceramic fiber; and metal fiber-reinforced polyester, glasses, and ceramics.
  • stiff thermoplastic materials such as polystyrene, polyvinyl chloride, polyurethane, polyphenyl sulfide, and polycarbonate
  • stiff thermoset materials such as fiber-reinforced thermoplastics; fiber-reinforced thermosets, such as epoxies, phenolics; ceramic fiber; and metal fiber-reinforced polyester, glasses, and ceramics.
  • Dynamic mechanical analysis (DMA) results are outlined below and illustrate a number of fluorene-containing networks that exhibited good high temperature damping characteristics. As a result, they are suitable as the viscoelastic component in both free-layer and constrained-layer damping constructions.
  • DMA Dynamic mechanical analysis
  • G' is generally observed to be less than 1GPa (10 10 dynes/cm 2 ) in the glassy state and greater than about 1MPa (10 7 dynes/cm 2 ) in the rubbery region.
  • the Tables listed below show the effect of compositional and cure chemistry changes on the amplitude of Tan( ⁇ ), on the temperature where Tan( ⁇ ) is a maximum and on the temperature interval where Tan( ⁇ ) is equal to 0.6.
  • Nomenclature and chemical structures used to identify the compositions are as follows: DGEBA (diglycidylether of bisphenol-A) (DER 332TM, available from Dow Chemical) CAF (diprimary amine curative) FEP (fluorene epoxy) (HPT 1079, available from Shell Chemical) PDAB (diprimary amine curative) (available from Air Products) OTBAF (diprimary amine curative) BMAF (disecondary amine curative) DDS (diprimary amine curative) HPT-1062TM (diprimary amine curative) (available from Shell Chemical)
  • compositions useful in the present invention include the following:
  • the equivalent weight of the preferred compounds are as follows: Epoxy equivalent weight DGEBA 175 grams/equivalents FEP 250 (average) MFEB 252 (theoretical) MY0510 100 NH equivalent weights DDS 62 PDAB 78.5 CAF 108 HPT 1062TM 100 OTBAF 94
  • the epoxy resin has an equivalent of 1.
  • the weight in grams for the constituents of the composition for preparing the following examples can be calculated as follows:
  • compositions tested below were prepared by dispersing crystalline amine curatives in the epoxy resin composition with a high speed mixer. The dispersion was then heated to 177°C for approximately four hours. See U.S. Patent 4,684,678, for specific details.
  • Damping behavior of the epoxide resins can be further enhanced with the addition of high T g thermoplastics.
  • Table 5 the effect of adding polyetherimide (ULTEMTM, available from General Electric) on the damping characteristics of the epoxy composition is shown.
  • the major effect of adding 6% polyetherimide to the epoxy resin was a doubling of the temperature interval where effective damping was observed. Additionally, some increase in magnitude of Tan( ⁇ ) was observed with addition of polyetherimide. An unusually large amplitude was observed for the composition containing 12% polyetherimide.
  • Soluble elastomers that phase separated during the curing process and core/shell rubber particles were added to epoxy resin compositions to improve their adhesive characteristics and toughness. This also improved the low-end temperature characteristics of the cured resins. Incorporation of these elastomers tends to reduce high temperature damping performance of resin when the weight percent of the elastomers is too high. However, as shown in Tables 7 and 8, good damping performances were observed for cured resins having an elastomer content up to 15% by weight. As discussed above, crosslink density was controlled by adjusting the ratio of diprimary to disecondary amine curative.
  • a constrained layer construction was then prepared by placing a layer of hot melt coated film on the surface of a 153 mm by 330 mm (6 inch by 13 inch) steel sheet. The steel sheets where sandwiched together after placing a thin nylon scrim on one surface. The scrim was used only to prevent the resin from flowing out of the sandwich during the curing process. The sandwich construction was placed in an oven and cured at 177°C for approximately two hours. The resulting constrained layer construction had 0.203 mm (8 mils) of resin bonded to the steel sheets. The shear strength of the construction was 6.89 MPa (1000 pounds/square inch).

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Abstract

Des résines époxy aromatiques à niveaux réduits de réticulation, et en particulier des résines époxy vulcanisées contenant du fluorène présentent des propriétés d'amortissement à haute température. Ces matériaux permettent d'amortir les vibrations dans les structures et les composants de dispositifs où des températures élevées sont atteintes, par exemple les automobiles, les avions, l'équipement et les appareils industriels.

Claims (14)

  1. Un procédé pour amortir les vibrations d'un article solide vibrant à des températures dans la gamme de 120 à 275°C à 1 Hz, ce procédé consistant à prévoir dans une construction à couche viscoélastique au moins une couche d'un matériau d'amortissement, caractérisé en ce qu'il présente une morphologie microhétérogène dans laquelle la phase mineure présente une dimension de l'ordre de quelques dixièmes de nanomètres (centaines d'Angstroms) et comportant une résine époxy, réticulée, renfermant du fluorène.
  2. Le procédé selon la revendication 1, dans lequel ladite résine époxy réticulée, renfermant du fluorène, présente une température de transition vitreuse dans la gamme de 120 à 275°C à 1 Hz.
  3. Le procédé selon la revendication 1, dans lequel la construction à couche viscoélastique est une construction à couche libre.
  4. Le procédé selon la revendication 1, dans lequel ladite construction à couche viscoélastique est une construction à couche contrainte, qui comporte au moins un substrat présentant une rigidité relative par rapport à l'acier inoxydable d'au moins 0,4, revêtu d'au moins une couche continue d'une résine époxy réticulée, qui renferme du fluorène.
  5. Le procédé selon la revendication 4, dans lequel le substrat est choisi dans le groupe constitué des métaux, des matériaux thermoplastiques rigides, des matériaux thermo-durcis rigides, des matériaux thermoplastiques renforcés par des fibres, des matériaux thermodurcis renforcés par des fibres, des fibres céramiques, du verre, des produits céramiques et des polyesters renforcés par des fibres métalliques.
  6. Une construction d'amortissement pour l'amortissement des vibrations mécaniques comportant au moins une couche de matériau viscoélastique, qui présente une morphologie microhétérogène dans laquelle la phase mineure présente une dimension de l'ordre de quelques dixièmes de naonomètres (centaines d'Angstroms), qui est appliquée sur un article solide vibratoire, ce matériau viscoélastique comportant une résine réticulée, renfermant du fluorène, qui comporte facultativement une matière thermoplastique, une matière thermodurcie ou un élastomère.
  7. La construction d'amortissement selon la revendication 6, dans laquelle un substrat est appliqué sur ledit matériau viscoélastique, ce substrat étant choisi parmi le groupe constitué des métaux, des matériaux polymères rigides, des matières thermoplastiques renforcés par des fibres, des matières thermodurcies renforcées par des fibres, des fibres céramiques, du verre, des produits céramiques et des polyesters renforcés par des fibres métalliques.
  8. La construction d'amortissement selon la revendication 6, dans laquelle ledit matériau viscoélastique est le produit de réaction d'une composition réticulable, renfermant du fluorène, qui comporte:
    a. un époxyde glycidylique, cet époxyde glycidylique pouvant renfermer du fluorène; et
    b. une amine aromatique, apte à réticuler, en une quantité suffisante pour réticuler le mélange, ladite amine susceptible de réticuler pouvant renfermer du fluorène, sous la condition qu'au moins un parmi ledit époxyde glycidylique et ladite amine aromatique apte à réticuler renferme du fluorène.
  9. La construction d'amortissement selon la revendication 6, dans laquelle ladite matière thermoplastique est choisie dans le groupe constitué d'une polyphénylène sulfone, d'un polybenzimidazole, d'une polyéther sulfone, d'un polyester, d'un polyimide, d'un oxyde polyphénylène/polyétherimide, d'une polysulfone, d'un acrylate et d'un méthacrylate.
  10. La construction d'amortissement selon la revendication 6, dans laquelle ledit élastomère est un agent de vulcanisation du caoutchouc.
  11. Un procédé selon la revendication 3, comportant:
    a. le revêtement d'une couche amovible par une couche d'une composition de résine époxy, qui renferme du fluorène;
    b. la réticulation de ladite composition en une couche viscoélastique;
    c. le montage solide de ladite couche viscoélastique sur un article vibratoire qui doit être amorti; et
    d. l'élimination du revêtement amovible.
  12. Un procédé selon la revendication 3, comportant:
    a. le revêtement d'un article vibrant qui doit être amorti au moyen d'une couche d'une composition de résine époxy renfermant du fluorène, et
    b. la réticulation de ladite composition en une couche viscoélastique in situ afin de former une construction d'amortissement des vibrations à couche libre.
  13. Un procédé selon la revendication 1, dans lequel ladite construction à couche viscoélastique est une construction à couche contrainte, comportant:
    a. le revêtement d'une couche amovible au moyen d'une couche d'une composition de résine époxy renfermant du fluorène;
    b. la réticulation de ladite composition en une couche viscoélastique;
    c. le transfert de ladite couche viscoélastique à partir dudit revêtement amovible sur un substrat, de façon à faire adhérer ladite couche viscoélastique sur ledit substrat afin de réaliser ladite construction d'amortissement des vibrations à couche contrainte; et
    d. le montage solide de ladite construction d'amortissement des vibrations à couche contrainte sur un article vibrant qui doit être amorti.
  14. Un procédé selon la revendication 1, dans lequel ladite construction à couche viscoélastique est une construction à couche contrainte comportant:
    a. le revêtement d'un substrat au moyen d'une couche d'une composition de résine epoxy;
    b. la réticulation de la composition en une couche viscoélastique, in situ, sur un substrat afin de réaliser la construction d'amortissement des vibrations à couche contrainte; et
    c. le montage solide de la construction d'amortissement des vibrations à couche contrainte sur un article vibrant devant être amorti.
EP92912991A 1991-06-27 1992-05-11 Structures amortissant les vibrations faisant appel a des materiaux amortissants a haute temperature en epoxy aromatique Expired - Lifetime EP0591313B1 (fr)

Applications Claiming Priority (3)

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US72212491A 1991-06-27 1991-06-27
PCT/US1992/003814 WO1993000675A1 (fr) 1991-06-27 1992-05-11 Structures amortissant les vibrations faisant appel a des materiaux amortissants a haute temperature en epoxy aromatique
US722124 2000-11-24

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EP0591313A1 EP0591313A1 (fr) 1994-04-13
EP0591313B1 true EP0591313B1 (fr) 1997-04-02

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EP92912991A Expired - Lifetime EP0591313B1 (fr) 1991-06-27 1992-05-11 Structures amortissant les vibrations faisant appel a des materiaux amortissants a haute temperature en epoxy aromatique

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EP (1) EP0591313B1 (fr)
JP (1) JPH06508938A (fr)
KR (1) KR940701574A (fr)
DE (1) DE69218771D1 (fr)
WO (1) WO1993000675A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10011679B2 (en) 2014-12-02 2018-07-03 Cytec Industries Inc. Modified amine curing agents, their preparation and use in curable compositions

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2326476A (en) * 1997-06-17 1998-12-23 Hypoguard Reagent comprising polymeric binder, chromogen, catalyst system which initiates colour change, and sulphonate or buffer
CN114930448A (zh) * 2019-12-27 2022-08-19 三菱化学株式会社 隔音结构体

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Publication number Priority date Publication date Assignee Title
US4447493A (en) * 1982-07-26 1984-05-08 Minnesota Mining And Manufacturing Company Vibration-damping constrained-layer constructions
CA1241586A (fr) * 1983-10-13 1988-09-06 Nobuo Fukushima Materiau antivibrations se pretant bien a la mise en forme
US4684678A (en) * 1985-05-30 1987-08-04 Minnesota Mining And Manufacturing Company Epoxy resin curing agent, process, and composition
EP0439197B1 (fr) * 1990-01-26 1999-04-07 Nec Corporation Matériau composite renforcé par des fibres

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10011679B2 (en) 2014-12-02 2018-07-03 Cytec Industries Inc. Modified amine curing agents, their preparation and use in curable compositions
US10196479B2 (en) 2014-12-02 2019-02-05 Cytec Industries Inc. Modified amine curing agents, their preparation and use in curable compositions

Also Published As

Publication number Publication date
KR940701574A (ko) 1994-05-28
DE69218771D1 (de) 1997-05-07
WO1993000675A1 (fr) 1993-01-07
EP0591313A1 (fr) 1994-04-13
JPH06508938A (ja) 1994-10-06

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